WO2003087710A3 - Method and apparatus for stage mirror mapping - Google Patents

Method and apparatus for stage mirror mapping Download PDF

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Publication number
WO2003087710A3
WO2003087710A3 PCT/US2003/010212 US0310212W WO03087710A3 WO 2003087710 A3 WO2003087710 A3 WO 2003087710A3 US 0310212 W US0310212 W US 0310212W WO 03087710 A3 WO03087710 A3 WO 03087710A3
Authority
WO
WIPO (PCT)
Prior art keywords
datum lines
reflecting surface
stage mirror
measured
local rotations
Prior art date
Application number
PCT/US2003/010212
Other languages
French (fr)
Other versions
WO2003087710A2 (en
Inventor
Henry Allen Hill
Original Assignee
Zygo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/217,531 external-priority patent/US6700665B2/en
Application filed by Zygo Corp filed Critical Zygo Corp
Priority to JP2003584612A priority Critical patent/JP4458855B2/en
Priority to EP03714507A priority patent/EP1492994A4/en
Publication of WO2003087710A2 publication Critical patent/WO2003087710A2/en
Publication of WO2003087710A3 publication Critical patent/WO2003087710A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/02007—Two or more frequencies or sources used for interferometric measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02019—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different points on same face of object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02027—Two or more interferometric channels or interferometers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/70—Using polarization in the interferometer

Abstract

Interferometer systems are described that comprise optical assemblies (10, 20) to measure multiple degrees of freedom (X, Y, Z) of a stage mirror (50, 60) and the topography of a reflecting surface (51, 61) of a stage mirror represented by datum lines and datum lines with corresponding local rotations of the reflecting surface of the stage mirror about the datum lines with high lateral spatial resolution. The interferometer systems measure slopes of datum lines and local rotations of the reflecting surface about the datum lines using single pass interferometric measurements of angular changes of directions of beams reflected by the reflecting surfaces. Two or more datum lines on a reflecting surface with concomitant measures of local rotations may be used to characterize topographic features, and these may be measured in situ in a lithography tool (25) or measured off line either before installation or after removal from a lithography tool.
PCT/US2003/010212 2002-04-09 2003-04-04 Method and apparatus for stage mirror mapping WO2003087710A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003584612A JP4458855B2 (en) 2002-04-09 2003-04-04 Method and apparatus for stage mirror mapping
EP03714507A EP1492994A4 (en) 2002-04-09 2003-04-04 Method and apparatus for stage mirror mapping

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US37117202P 2002-04-09 2002-04-09
US60/371,172 2002-04-09
US10/217,531 US6700665B2 (en) 2001-08-20 2002-08-13 Interferometric apparatus for measuring the topography of mirrors in situ and providing error correction signals therefor
US10/217,531 2002-08-13

Publications (2)

Publication Number Publication Date
WO2003087710A2 WO2003087710A2 (en) 2003-10-23
WO2003087710A3 true WO2003087710A3 (en) 2003-12-18

Family

ID=29254154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/010212 WO2003087710A2 (en) 2002-04-09 2003-04-04 Method and apparatus for stage mirror mapping

Country Status (3)

Country Link
EP (1) EP1492994A4 (en)
JP (1) JP4458855B2 (en)
WO (1) WO2003087710A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7528962B2 (en) * 2005-06-29 2009-05-05 Zygo Corporation Apparatus and methods for reducing non-cyclic non-linear errors in interferometry
US7853067B2 (en) * 2006-10-27 2010-12-14 Asml Holding N.V. Systems and methods for lithographic reticle inspection
US8937707B2 (en) 2011-08-23 2015-01-20 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and method of calibrating a displacement measuring system
WO2019185298A1 (en) 2018-03-29 2019-10-03 Asml Netherlands B.V. Position measurement system, interferometer system and lithographic apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151749A (en) * 1989-06-08 1992-09-29 Nikon Corporation Method of and apparatus for measuring coordinate position and positioning an object
US5363196A (en) * 1992-01-10 1994-11-08 Ultratech Stepper, Inc. Apparatus for measuring a departure from flatness or straightness of a nominally-plane mirror for a precision X-Y movable-stage

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3295846B2 (en) * 1989-06-08 2002-06-24 株式会社ニコン Position measuring method, position measuring device, positioning method, positioning device, and exposure device
JPH04351905A (en) * 1991-05-30 1992-12-07 Fujitsu Ltd Xy stage possessing laser length measuring device
US5464715A (en) * 1993-04-02 1995-11-07 Nikon Corporation Method of driving mask stage and method of mask alignment
US5371588A (en) * 1993-11-10 1994-12-06 University Of Maryland, College Park Surface profile and material mapper using a driver to displace the sample in X-Y-Z directions
JPH07253304A (en) * 1994-03-15 1995-10-03 Nikon Corp Multi-axial positioning unit and length measuring method therefor
JPH09162113A (en) * 1995-12-04 1997-06-20 Nikon Corp Orthogonality measuring method, stage apparatus and aligner
WO2000022376A1 (en) * 1998-10-14 2000-04-20 Nikon Corporation Shape measuring method and shape measuring device, position control method, stage device, exposure apparatus and method for producing exposure apparatus, and device and method for manufacturing device
WO2001090686A1 (en) * 2000-05-19 2001-11-29 Zygo Corporation In-situ mirror characterization

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151749A (en) * 1989-06-08 1992-09-29 Nikon Corporation Method of and apparatus for measuring coordinate position and positioning an object
US5363196A (en) * 1992-01-10 1994-11-08 Ultratech Stepper, Inc. Apparatus for measuring a departure from flatness or straightness of a nominally-plane mirror for a precision X-Y movable-stage

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1492994A4 *

Also Published As

Publication number Publication date
JP4458855B2 (en) 2010-04-28
WO2003087710A2 (en) 2003-10-23
JP2005522683A (en) 2005-07-28
EP1492994A2 (en) 2005-01-05
EP1492994A4 (en) 2010-07-28

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