JP4453038B2 - Continuous sticking method of molded parts - Google Patents

Continuous sticking method of molded parts Download PDF

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JP4453038B2
JP4453038B2 JP2007025715A JP2007025715A JP4453038B2 JP 4453038 B2 JP4453038 B2 JP 4453038B2 JP 2007025715 A JP2007025715 A JP 2007025715A JP 2007025715 A JP2007025715 A JP 2007025715A JP 4453038 B2 JP4453038 B2 JP 4453038B2
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pressure
adhesive
transfer
molded part
sticking
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JP2008189356A (en
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義浩 豊田
増美 後藤
亮太 竹本
寛次 小川
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JPTEC COMPANY LIMITED
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Description

本発明は成形部品の連続貼付方法に係り、数ミリの厚みがある、小型のゴムシートや樹脂スポンジ成形部品を、連続してワークの所定位置に貼付するようにした成形部品の連続貼付方法に関する。   The present invention relates to a method for continuously sticking molded parts, and relates to a method for continuously sticking molded parts in which a small rubber sheet or resin sponge molded part having a thickness of several millimeters is continuously stuck to a predetermined position of a workpiece. .

従来、連続したシート状の台紙(剥離紙)上に並べて貼付されたフィルム、シール等を台紙から剥離して、貼付の対象となる製品等のワークの所定位置に連続して貼付する貼付装置が種々開発されている。これらのフィルムやシートは積層された基材厚と粘着材層厚の厚さが十分薄いため、あらかじめロール状にしたものを貼付装置にセットして、ワーク(被着体)としての製品の所定位置に連続貼付することが可能である。   Conventionally, there is a pasting device that peels off films, stickers, etc., which are placed side by side on a continuous sheet-like mount (release paper) from the mount, and continuously sticks them to a predetermined position of a workpiece such as a product to be pasted. Various developments have been made. Since these films and sheets are sufficiently thin in the thickness of the laminated base material and adhesive material layer, rolls are set in advance in the pasting device, and the product as a workpiece (adhered body) is predetermined. It is possible to affix continuously to the position.

ところが、成形部品には、厚みが数ミリ程度の合成ゴムシートや樹脂スポンジ部材等の成形部品が多種存在する。これらの成形部品は、例えば携帯電話等の小型製品内のパッキンやクッション材等に用いられたりしている。通常の貼付作業では、図7に示したように、成形部品50の裏面にあらかじめ台紙としての両面粘着シート51を貼付し、所定形状にプレス加工して、ハーフカットされた台紙52上に複数個の成形部品Pが縦横に配列された台紙52付きの部品シート53が提供されている。このような成形部品Pを製品としてのワークの所定位置に貼付するためには、作業員が、図7(a),(b)に示したように、ピンセット等を使って部品シート53の台紙52から成形部品Pを剥がして、被着物(ワーク)60の所定位置に直接手作業で貼付しているのが現状である。   However, there are various types of molded parts such as synthetic rubber sheets and resin sponge members having a thickness of several millimeters. These molded parts are used, for example, as packings and cushion materials in small products such as mobile phones. In a normal pasting operation, as shown in FIG. 7, a double-sided pressure-sensitive adhesive sheet 51 as a mount is previously pasted on the back surface of the molded part 50, pressed into a predetermined shape, and a plurality of pieces are placed on the half-cut mount 52. A component sheet 53 with a mount 52 in which the molded components P are arranged vertically and horizontally is provided. In order to attach such a molded part P to a predetermined position of a workpiece as a product, an operator mounts the component sheet 53 using tweezers or the like as shown in FIGS. 7 (a) and 7 (b). The present situation is that the molded part P is peeled off from 52 and directly attached to a predetermined position of the adherend (work) 60 by hand.

ところで、図8各図に示したようなボタンあるいはプレート状の樹脂成形品50(同図(a))や、あらかじめカットされた比較的大きな形状の軟質スチレンフォーム等からなる樹脂成形品56(同図(b))等では、同一寸法にカットした粘着シート57をこれらの成形部品55,56の貼着面55a、56aに手作業で貼り付け、さらにその剥離紙58を剥がして対象製品60の所定位置に貼付するようになっている。これらの作業のために、成形部品Pの形状にあわせて両面テープ(図示せず)をカットし、その切断片としての粘着シート57を貼り付けるという複数工程の作業に手間がかかり、作業性がきわめて悪い。   By the way, a button or plate-shaped resin molded product 50 (FIG. 8 (a)) as shown in FIGS. In FIG. (B)) and the like, the pressure-sensitive adhesive sheet 57 cut to the same size is manually affixed to the affixing surfaces 55a and 56a of these molded parts 55 and 56, and the release paper 58 is peeled off to remove the target product 60. Affixed at a predetermined position. For these operations, it takes time and labor to cut a double-sided tape (not shown) according to the shape of the molded part P, and affix the adhesive sheet 57 as a cut piece. Very bad.

一方、粘着材を所定のパターンで基材上に塗工し、糊切れ性能の向上を図った感圧転写粘着テープが開示されている。この感圧転写粘着テープでは、所定のドットパターンとすることにより、粘着対象に転写される粘着材量が少なくなるため、止着性能が低下するため、粘着材成分およびドットパターンを工夫することにより、その粘着性能の向上を図っている(特許文献1)。
特開2006−206657号公報参照。
On the other hand, a pressure-sensitive transfer pressure-sensitive adhesive tape is disclosed in which an adhesive material is applied on a substrate in a predetermined pattern to improve the debonding performance. In this pressure-sensitive transfer adhesive tape, by setting the predetermined dot pattern, the amount of the adhesive material transferred to the adhesive object is reduced, so that the fastening performance is lowered. By devising the adhesive material component and the dot pattern The adhesive performance is improved (Patent Document 1).
See JP-A-2006-206657.

ところが、特許文献1に開示された粘着テープは、たとえば封筒の封緘用の文具としての利用を目的としており、感圧転写粘着テープを収納した転写具も合わせて開示されている。したがって、粘着材は転写対象に対して所定幅の帯状に転写させることを意図したものであり、たとえばテープ幅に応じた各種の成形部品に応じて、成形部品の一面にドットパターンからなる粘着層を形成することは意図していない。そこで、本発明の目的は上述の問題点を解消し、上述したようなドットパターンを有する感圧転写粘着テープや、所定の形状にハーフカットされた両面テープを用いて、小さな成形部品の接着面に粘着材層を形成し、その粘着層が形成された成形部品を、所定位置にセットされたワークまで把持移動させ、連続的に供給される各ワークに対して、連続して成形部品を貼付できるようにした成形部品の連続貼付方法を提供することにある。   However, the pressure-sensitive adhesive tape disclosed in Patent Document 1 is intended for use as, for example, a stationery for sealing an envelope, and a transfer tool containing a pressure-sensitive transfer pressure-sensitive adhesive tape is also disclosed. Therefore, the adhesive material is intended to be transferred in a band shape having a predetermined width with respect to the transfer target. For example, according to various molded parts corresponding to the tape width, the adhesive layer made of a dot pattern on one surface of the molded part Is not intended to form. Therefore, the object of the present invention is to solve the above-mentioned problems, and use a pressure-sensitive transfer adhesive tape having a dot pattern as described above, or a double-sided tape half-cut into a predetermined shape, so that an adhesive surface of a small molded part is used. The adhesive layer is formed, and the molded part on which the adhesive layer is formed is gripped and moved to the workpiece set at a predetermined position, and the molded component is continuously applied to each workpiece that is continuously supplied. It is an object of the present invention to provide a method for continuously sticking molded parts.

上記目的を達成するために、本発明は基材表面に転写可能な粘着材が形成された感圧転写粘着テープを、供給リールから転写位置に繰り出す一方、部品供給手段から貼付ヘッドに保持された成形部品を、前記転写位置に移送し、該転写位置で前記成形部品を前記感圧転写粘着テープの粘着材に押圧して前記成形部品の貼着面に前記粘着材を転写し、前記感圧転写粘着テープの巻き取り速度と同期をとって、前記感圧転写粘着テープから前記粘着材を剥離する剥離エッジを超えて前記貼付ヘッドを水平移動させて、前記剥離エッジにて前記感圧転写粘着テープを屈曲させて、前記感圧転写粘着テープから前記成形部品に転写された粘着材を剥離し、前記貼付ヘッドの移動により、前記成形部品を貼付対象のワーク位置まで保持移送し、前記粘着材を介して前記ワークの所定位置に前記成形部品を貼付することを特徴とする。
In order to achieve the above-mentioned object, the present invention feeds a pressure-sensitive transfer adhesive tape having a transferable adhesive material formed on the surface of a base material from a supply reel to a transfer position, while being held on a sticking head from a component supply means. The molded part is transferred to the transfer position, and at the transfer position, the molded part is pressed against the adhesive material of the pressure-sensitive transfer adhesive tape to transfer the adhesive material to the adhesive surface of the molded part, and the pressure sensitive In synchronization with the winding speed of the transfer adhesive tape, the pressure-sensitive transfer adhesive is moved horizontally at the peeling edge by horizontally moving the pasting head beyond the peeling edge for peeling the adhesive material from the pressure-sensitive transfer adhesive tape. The tape is bent, the adhesive material transferred to the molded part from the pressure-sensitive transfer adhesive tape is peeled off, and the molded part is held and transferred to the work position to be pasted by moving the sticking head, and the adhesive Through, characterized in that affixing the molded parts to a predetermined position of the workpiece.

このとき、前記感圧転写粘着テープは、基材表面に所定のドットパターンからなる転写可能な粘着が形成され、前記ドットパターンの粘着材を前記成形部品の貼着面に合わせて押圧転写させることが好ましい。
At this time, in the pressure-sensitive transfer adhesive tape, a transferable adhesive material having a predetermined dot pattern is formed on the surface of the base material, and the dot pattern adhesive material is pressed and transferred in accordance with the bonding surface of the molded part. It is preferable.

台紙を残すように成形部品の貼着面形状に相応する形状をカットすることで、転写可能な粘着材基材が形成された両面テープを、供給リールから転写位置に繰り出す一方、部品供給手段から貼付ヘッドに保持された前記成形部品を、前記転写位置に移送し、該転写位置で前記成形部品を前記両面テープの前記粘着材基材に押圧して前記成形部品の貼着面に前記粘着材基材を転写し、前記両面テープの巻き取り速度と同期をとって、前記両面テープから前記粘着材基材を剥離する剥離エッジを超えて前記貼付ヘッドを水平移動させて、前記剥離エッジにて前記両面テープを屈曲させて、前記両面テープから前記成形部品に転写された前記粘着材基材を剥離し、前記貼付ヘッドの移動により、前記成形部品を貼付対象のワーク位置まで保持移送し、前記粘着材基材を介して前記ワークの所定位置に前記成形部品を貼付することを特徴とする。
By cutting the shape corresponding to the shape of the molding part's sticking surface so as to leave the mount , the double-sided tape on which the transferable adhesive base material is formed is fed from the supply reel to the transfer position, while from the component supply means. The molded part held by the sticking head is transferred to the transfer position, and the molded part is pressed against the adhesive base material of the double-sided tape at the transfer position, and the adhesive material is applied to the sticking surface of the molded part. Transfer the base material, synchronize with the winding speed of the double-sided tape, move the sticking head horizontally beyond the peeling edge to peel the adhesive material base material from the double-sided tape, and at the peeling edge The double-sided tape is bent, the adhesive material base material transferred to the molded part from the double-sided tape is peeled off, and the molded part is held and transferred to the work position to be pasted by moving the sticking head. Characterized by affixing the molded parts to a predetermined position of the workpiece via the adhesive base material.

以上に述べたように、本発明によれば、厚みのある種々の平面形状からなる成形部品の接着面に応じた粘着材層を形成し、連続して供給される各製品の所定位置に、前記成形部品を高精度に貼付することができるという効果を奏する。   As described above, according to the present invention, the pressure-sensitive adhesive layer corresponding to the adhesive surface of a molded part having various thicknesses is formed, and at a predetermined position of each product continuously supplied, There is an effect that the molded part can be attached with high accuracy.

以下、本発明の成形部品の連続貼付方法の実施するための最良の形態として、以下の実施例について添付図面を参照して説明する。   Hereinafter, as the best mode for carrying out the method for continuously sticking molded parts of the present invention, the following examples will be described with reference to the accompanying drawings.

図1は成形部品の連続貼付方法に用いられる貼付装置の全体構成を示した概略正面図である。同図に示したように、本発明の成形部品Pの連続貼付方法に用いる貼付装置1は、図2(b)に示したような、基材11上にテープ幅の全幅にわたり、ドットパターンからなる粘着材12が形成され、ロール状に巻回された感圧転写粘着テープ10が装着される供給リール3と、感圧転写粘着テープ10を供給リール3から繰り出し、感圧転写粘着テープ10の移動経路上で、感圧転写粘着テープ10の基材11上のドットパターンの粘着材面に成形部品Pを押圧し、粘着材12を転写する粘着材転写部20と、粘着材12が所定形状に剥離した台紙シート10bが巻き取られる巻取リール4とからなる本体部1Aと、貼付物としての成形部品Pが収容され、取り出し口5から成形部品Pが整列して供給される部品供給フィーダ1Bと、取り出し口5に整列した成形部品Pを吸引保持して、粘着材転写部20まで移動させ、さらに粘着材12が転写された成形部品Pを、本体部1Aの前方に位置する貼付ステージ6まで移動する貼付ヘッド15と、この貼付ヘッド15を所定の経路で往復移送可能な移送装置(図示せず)を有し、貼付ステージ6上に載置された貼付対象の製品等のワーク7の所定位置に成形部品Pを貼付する成形部品貼付部1Cとから構成されている。
なお、本明細書では、貼付対象物としてのワーク7に貼付される貼付物を「成形部品」と総称し符号Pを付しているが、成形部品Pとしては、上述した厚みのあるゴム成形品、樹脂スポンジ成形製品等、クッション材、仕切材等、種々の用途に用いられる部品を代表して呼ぶものであり、所定の貼着面を有し、その貼着面に、上述の粘着材を転写できる部品であれば、その材質や成形手段、成形形状は、様々であることは言うまでもない。
FIG. 1 is a schematic front view showing the overall configuration of a sticking device used in a method for continuously sticking molded parts. As shown in the figure, the sticking device 1 used for the continuous sticking method of the molded part P according to the present invention has a dot pattern over the entire width of the tape 11 on the substrate 11 as shown in FIG. The pressure-sensitive transfer adhesive tape 10 is formed, and the supply reel 3 to which the pressure-sensitive transfer adhesive tape 10 wound in a roll shape is mounted, and the pressure-sensitive transfer adhesive tape 10 is unwound from the supply reel 3. On the movement path, the pressure-sensitive transfer adhesive tape 10 is pressed against the adhesive material surface of the dot pattern on the base material 11 to transfer the adhesive material 12, and the adhesive material 12 has a predetermined shape. A component supply feeder in which a main body 1A composed of a take-up reel 4 on which a backing sheet 10b peeled off is wound, and a molded part P as a sticking material are accommodated and the molded part P is aligned and supplied from a take-out port 5 1B and take The molded part P aligned with the opening 5 is sucked and held and moved to the adhesive transfer part 20, and the molded part P with the adhesive 12 transferred is further moved to the pasting stage 6 located in front of the main body 1A. And a predetermined position of a work 7 such as a product to be pasted placed on the pasting stage 6, which has a pasting head 15 and a transfer device (not shown) capable of reciprocating the pasting head 15 along a predetermined path. And a molded part sticking part 1C for sticking the molded part P to the head.
In addition, in this specification, the sticking thing stuck to the workpiece | work 7 as a sticking target object is named generically, and the code | symbol P is attached | subjected as the molding part P. Products, resin sponge molded products, cushion materials, partition materials, etc., which are representatively referred to as parts used in various applications, have a predetermined sticking surface, and the sticking surface has the above-mentioned adhesive material Needless to say, there are various materials, molding means, and molding shapes as long as the part can transfer the material.

図1に示したように、本体部1Aの供給リール3は、本体装置から外方に張り出すように取り付けられたアーム8の上端に形成された回転支持軸3aに着脱自在に取り付けられるようになっている。この供給リール3には、ロール状の感圧転写粘着テープ10が回転支持軸3aに装架される。一方、本体部1Aの中央側面には回転支持軸4aが突設されており、この回転支持軸4aに巻取リール4が着脱自在に装架される。それぞれの回転支持軸3a,4aは、運転制御部(図示せず)により、巻き取り量に応じた回転速度に調整可能な駆動モータ(図示せず)によって、同期をとって回転可能に制御されている。   As shown in FIG. 1, the supply reel 3 of the main body 1 </ b> A is detachably attached to a rotation support shaft 3 a formed at the upper end of an arm 8 attached so as to project outward from the main body device. It has become. On the supply reel 3, a roll-shaped pressure-sensitive transfer adhesive tape 10 is mounted on the rotation support shaft 3a. On the other hand, a rotation support shaft 4a projects from the central side surface of the main body 1A, and the take-up reel 4 is detachably mounted on the rotation support shaft 4a. Each of the rotation support shafts 3a and 4a is controlled to be rotatable in synchronization by a drive motor (not shown) that can be adjusted to a rotation speed corresponding to the winding amount by an operation control unit (not shown). ing.

感圧転写粘着テープ10は、このように供給リール3、巻取リール4間の移動経路上に掛け渡され、複数のローラ30を介して粘着材転写部20に導かれ、粘着材12が転写された後の台紙シート10bが送りローラ31,ガイドローラ32によって巻取リール4に巻き取られる。   The pressure-sensitive transfer adhesive tape 10 is thus laid on the moving path between the supply reel 3 and the take-up reel 4 and guided to the adhesive material transfer unit 20 via the plurality of rollers 30, and the adhesive material 12 is transferred. The mounted sheet 10 b after being wound is wound around the take-up reel 4 by the feed roller 31 and the guide roller 32.

粘着材転写部20の構成について、図2(a)を参照して説明する。同図に示したように、粘着材転写部20は、本実施例では、側面視して鋭角な先端部を有するステンレススチール製マニホールドからなる剥離エッジ21を備えている。この剥離エッジ21は、水平上面が先端側となる角度(たとえば30°)をなす鋭角部を有する側面形状からなる。このとき、先端部21aには丸面取りがなされている。このため、所定の張力が付与された状態で感圧転写粘着テープ10が先端部で屈曲された場合にも、裂けたり、切れたりすることはない。なお、剥離エッジ21部分の材質としては、ステンレススチールの他特殊鋼、アルミニウム、セラミックス等、平滑表面加工でき、耐摩耗性の優れた材料が好ましい。   The configuration of the adhesive material transfer unit 20 will be described with reference to FIG. As shown in the figure, the adhesive material transfer portion 20 includes a peeling edge 21 made of a stainless steel manifold having a sharp tip when viewed from the side in this embodiment. The peeling edge 21 has a side surface shape having an acute angle portion that forms an angle (for example, 30 °) with the horizontal upper surface being the tip side. At this time, the tip 21a is rounded. For this reason, even when the pressure-sensitive transfer pressure-sensitive adhesive tape 10 is bent at the tip end with a predetermined tension applied, it does not tear or break. In addition, as a material of the peeling edge 21 part, the material which can carry out smooth surface processing, such as special steel, aluminum, ceramics other than stainless steel, and the material excellent in abrasion resistance is preferable.

剥離エッジ21内部には、図2(a)に示したように、表面に貫通した丸細孔22が平面視して縦横に所定間隔をあけて穿設され、すべての丸細孔22は連絡孔により水平吸引孔23に集約、連通され、真空装置(図示せず)に接続されている。   As shown in FIG. 2A, round pores 22 penetrating the surface are drilled at predetermined intervals in the vertical and horizontal directions in the peeling edge 21, and all the round pores 22 communicate with each other. The holes are aggregated and communicated with the horizontal suction hole 23 and connected to a vacuum device (not shown).

部品フィーダ1Bは、容器内に成形部品Pが多数収容されており、図示しない整列機構により、取り出し口5において成形部品Pは整列され、所定の保持状態で貼付ヘッド15に引き渡すことが可能な公知の材料供給装置である。   The parts feeder 1B contains a large number of molded parts P in a container, and the molded parts P are aligned at the take-out port 5 by an alignment mechanism (not shown) and can be delivered to the pasting head 15 in a predetermined holding state. This is a material supply device.

貼付ヘッド15は、先端(下面)に吸着面15a(図3(a))が形成された可動ヘッドで、本実施例では、図1に示したように、本体装置内の天井部16に設置された水平リニアガイド(図示せず)に沿ってサーボモータの駆動により高精度に水平矢印方向に移動するとともに、吊持ロッド17により鉛直矢印方向へ伸縮でき、部品フィーダ1Bの部品取り出し口5〜粘着材転写部20〜貼付ステージ6間を、所定の制御ルーチンで高精度に移動することができる。   The sticking head 15 is a movable head having a suction surface 15a (FIG. 3 (a)) formed at the tip (lower surface). In this embodiment, the sticking head 15 is installed on the ceiling 16 in the main unit as shown in FIG. The servomotor is driven along a horizontal linear guide (not shown) that moves in the direction of the horizontal arrow with high accuracy, and can be extended and contracted in the direction of the vertical arrow by the suspension rod 17. It is possible to move between the adhesive material transfer unit 20 and the pasting stage 6 with high accuracy by a predetermined control routine.

ここで、本発明で利用する感圧転写粘着テープ10の特徴について、簡単に説明する。感圧転写粘着テープ10は、基材11にポリエチレン,ポリエチレンテレフテレート,ポリプロピレン,ポリ塩化ビニル等、粘着材の剥離作用が有効に得られる素材の樹脂シートが用いることが好ましい。テープ幅は、成形部品Pの寸法に応じて決定すればよいが、粘着材12を成形部品Pの貼着面に均一に転写できるとともに、転写後のロス分が少ないテープ幅とすることが好ましい。基材11に塗工する粘着材12としては、一般的なアクリル系粘着材が好ましく、ドットパターンを基材11上に形成するには、公知の各種印刷方法を利用することができる。ドットパターンのドット径、高さとしては数十μm〜1,2mm程度等とし、平面形状は○形以外に◇形等など適宜の形状を選択することができ、ドット間隔も感圧転写粘着テープ10の単位面積あたりの占有面積との関係と、ドット径との関係とから適切に設定することが好ましい。   Here, the characteristics of the pressure-sensitive transfer adhesive tape 10 used in the present invention will be briefly described. In the pressure-sensitive transfer adhesive tape 10, it is preferable to use a resin sheet made of a material that can effectively obtain a peeling action of an adhesive material such as polyethylene, polyethylene terephthalate, polypropylene, and polyvinyl chloride for the base material 11. The tape width may be determined according to the dimensions of the molded part P, but it is preferable to make the tape width such that the adhesive material 12 can be uniformly transferred to the sticking surface of the molded part P and the loss after transfer is small. . As the adhesive material 12 applied to the substrate 11, a general acrylic adhesive material is preferable, and various known printing methods can be used to form a dot pattern on the substrate 11. The dot diameter and height of the dot pattern is set to several tens of μm to 1 mm, etc., and the planar shape can be selected from other shapes such as ◇ in addition to ○, and the dot spacing is also pressure sensitive transfer adhesive tape It is preferable to set appropriately from the relationship with the occupied area per unit area of 10 and the relationship with the dot diameter.

ここで、図1,図3(a)〜(d)を参照して感圧転写粘着テープ10を用いた成形部品Pの連続貼付方法について説明する。
成形部品Pは、貼付可能な所定の形状に切断加工され、公知の部品フィーダ1B(図1参照)内に供給され、部品フィーダ1B内で所定の整列機構(図示せず)を経て、取り出し口5の所定位置に、向きを揃えた状態で整列される。そして貼付ヘッド15がこの取り出し口5まで移動し、成形部品Pを所定の保持機構で貼付ヘッド15の下面の所定位置に保持する。本実施例では、貼付ヘッド15の保持機構として下面に真空吸着面15aが形成されている。この貼付ヘッド15の保持機構としては、真空引きによる吸着機構や各種形状のチャック等のメカニカルな公知の把持機構等を保持機構として適宜採用できる。このとき保持対象である成形部品Pが柔らかい部品の場合、部品を傷めないように、対象物の材質に適した保持機構を採用することが好ましい。
Here, with reference to FIG. 1, FIG. 3 (a)-(d), the continuous sticking method of the molded component P using the pressure-sensitive transfer adhesive tape 10 is demonstrated.
The molded part P is cut and processed into a predetermined shape that can be pasted, supplied into a known part feeder 1B (see FIG. 1), passed through a predetermined alignment mechanism (not shown) in the part feeder 1B, and taken out. 5 are aligned in a state where their orientations are aligned. Then, the sticking head 15 moves to the take-out port 5, and the molded part P is held at a predetermined position on the lower surface of the sticking head 15 by a predetermined holding mechanism. In this embodiment, a vacuum suction surface 15 a is formed on the lower surface as a holding mechanism for the sticking head 15. As a holding mechanism for the sticking head 15, a mechanically known gripping mechanism such as a vacuum suction mechanism or various shapes of chucks can be appropriately employed as the holding mechanism. At this time, when the molded part P to be held is a soft part, it is preferable to employ a holding mechanism suitable for the material of the object so as not to damage the part.

本実施例では、図8(a)に示した合成樹脂成形品であるプレート55の貼着面55aに粘着材12を転写し、ワーク7の所定位置に貼付する例について説明する。図3(a)は、下面にプレート55を吸着した貼付ヘッド15が粘着材転写部20の剥離エッジ21直前位置に到達し、感圧転写粘着テープ10の粘着材面12(図1)に押圧された状態が示されている。このとき、感圧転写粘着テープ10は、供給リール3から新たな粘着材12の塗工面が剥離エッジ21の位置まで送られ、剥離エッジ21内に供給される吸引負圧で固定されている(図3(b))。そして貼付ヘッド15が降下してプレート55の貼着面55aで剥離エッジ21位置の感圧転写粘着テープ10が押圧される。この押圧力により、感圧転写粘着テープ10上のドットパターンの個々のドット状の粘着材12はプレート55の貼着面50の範囲のみが転写される。その後、負圧を減圧し、感圧転写粘着テープ10の浮き上がりを防止した状態で、剥離エッジ21側では台紙シート10bを巻き取るとともに、この剥離エッジ21上での巻き取り速度と同期をとって貼付ヘッド15を、図3(c),(d)に示したように、矢印方向に水平移動させる。これにより、貼着面55aにドットパターンの粘着材12が転写されたプレート55は貼付ステージ6(図1)に移動する。なお、この感圧転写粘着テープ10では、ドットパターンを形成する粘着材12は台紙テープ10bとの間の粘着力が、成形部品P(プレート55の貼着面55a)との間の粘着力より小さくなるように設定されている。   In the present embodiment, an example will be described in which the adhesive material 12 is transferred to the attachment surface 55a of the plate 55, which is the synthetic resin molded product shown in FIG. FIG. 3A shows that the sticking head 15 having the plate 55 adsorbed on the lower surface reaches the position immediately before the peeling edge 21 of the adhesive transfer portion 20 and presses against the adhesive material surface 12 (FIG. 1) of the pressure-sensitive transfer adhesive tape 10. The state is shown. At this time, the pressure-sensitive transfer pressure-sensitive adhesive tape 10 is fixed by suction negative pressure supplied from the supply reel 3 to the position of the peeling edge 21 where the new adhesive material 12 is applied to the peeling edge 21 ( FIG. 3 (b)). And the sticking head 15 descend | falls and the pressure sensitive transfer adhesive tape 10 of the peeling edge 21 position is pressed by the sticking surface 55a of the plate 55. FIG. With this pressing force, only the range of the sticking surface 50 of the plate 55 is transferred to the individual dot-like adhesive material 12 of the dot pattern on the pressure-sensitive transfer adhesive tape 10. Thereafter, in a state where the negative pressure is reduced and the pressure-sensitive transfer adhesive tape 10 is prevented from being lifted, the backing sheet 10b is wound on the peeling edge 21 side, and the winding speed on the peeling edge 21 is synchronized. As shown in FIGS. 3C and 3D, the sticking head 15 is moved horizontally in the direction of the arrow. As a result, the plate 55 having the dot pattern adhesive material 12 transferred to the sticking surface 55a moves to the sticking stage 6 (FIG. 1). In this pressure-sensitive transfer adhesive tape 10, the adhesive force between the adhesive material 12 forming the dot pattern and the mount tape 10b is greater than the adhesive force between the molded part P (the attachment surface 55a of the plate 55). It is set to be smaller.

さらに、図1に示したように、貼付ヘッド15は、プレート55を下面に保持した状態で貼付対象のワーク7が載置されている貼付ステージ6まで搬送経路(リニアガイド等)に沿って前進する。そして貼付ヘッド15が貼付ステージ6のワーク7位置に到達し、ヘッド下面に保持されたプレート55とワーク7の貼付位置との位置決めが完了し、プレート55の貼着面55aをワーク7に押圧することで、プレート55がワーク7の対象位置に貼付される。その後、貼付ヘッド15は搬送経路を介して、部品フィーダ1Bの部品取り出し口5の定位置まで移動し、1サイクルが完結する。   Further, as shown in FIG. 1, the sticking head 15 advances along a conveyance path (such as a linear guide) to the sticking stage 6 on which the work 7 to be stuck is placed with the plate 55 held on the lower surface. To do. Then, the sticking head 15 reaches the position of the work 7 on the sticking stage 6, positioning of the plate 55 held on the lower surface of the head and the sticking position of the work 7 is completed, and the sticking surface 55 a of the plate 55 is pressed against the work 7. Thus, the plate 55 is attached to the target position of the workpiece 7. Thereafter, the pasting head 15 moves to a fixed position of the component take-out port 5 of the component feeder 1B through the conveyance path, and one cycle is completed.

図4は、図3(c)の白抜き矢印方向に見た感圧転写粘着テープ10である。このように感圧転写粘着テープ10は、全面に形成されたドットパターンの粘着材面から成形部品P(プレート55)の面積に相当するドットパターンの粘着材12が連続して転写され、転写後に巻き取りリール4(図1)に巻き取られる。図5は、異種形状の成形部品P等を連続してワーク7に貼付するようにした際の、転写後の感圧転写粘着テープ10のドットパターン面(粘着材12が転写された跡を符号13で示している。)を模式的に示した説明図である。このように、感圧転写粘着テープ10のドットパターンは、成形部品Pの転写面(貼付面)がどのような形状でも、転写面範囲全面にわたってドットパターンの粘着材12を転写させることができる。したがって、部品フィーダ1Bに備えられた切替手段(図示せず)によって、異なる形状の成形部品Pを供給することで、貼付ヘッド15は、図5に示したような丸形(13a)と四角形(13b)の成形部品Pを交互に連続して移動して、剥離エッジ21位置で各部品形状に応じて、感圧転写粘着テープ10のドットパターンの粘着材12を成形部品Pの貼着面に転写することができる。   FIG. 4 shows the pressure-sensitive transfer adhesive tape 10 viewed in the direction of the white arrow in FIG. In this way, the pressure-sensitive transfer adhesive tape 10 has the dot pattern adhesive 12 corresponding to the area of the molded part P (plate 55) continuously transferred from the dot pattern adhesive surface formed on the entire surface, and after the transfer. It is wound up on a take-up reel 4 (FIG. 1). FIG. 5 shows the dot pattern surface of the pressure-sensitive transfer pressure-sensitive adhesive tape 10 after transfer when the molded part P or the like having a different shape is continuously attached to the work 7 (reference marks indicating the transfer of the adhesive material 12). It is explanatory drawing which showed typically. In this manner, the dot pattern of the pressure-sensitive transfer adhesive tape 10 can transfer the dot pattern adhesive 12 over the entire transfer surface range, regardless of the shape of the transfer surface (sticking surface) of the molded part P. Therefore, by supplying the molded part P having a different shape by the switching means (not shown) provided in the part feeder 1B, the sticking head 15 can have a round shape (13a) and a rectangular shape (13a) as shown in FIG. 13b) The molded parts P of the pressure sensitive transfer pressure-sensitive adhesive tape 10 are applied to the sticking surface of the molded part P by moving the molded parts P alternately and continuously and depending on the shape of each part at the peeling edge 21 position. Can be transferred.

図6各図は、他の実施例として、両面テープ40に対して台紙41側のみを残すように、成形部品Pの貼着面より、わずかに小さい面積の粘着材基材42を、レーザー切断機(図示せず)で加工した両面テープ40が、転写エッジ21に掛け渡され粘着材基材42が所定の転写位置にくるように停止し、その粘着材基材42に、貼付ヘッド15下面の成形部品Pが押圧された状態が示されている(図6(a),(b))。その後、図6(c),(d)に示したように、上述と同様に両面テープ40の巻き取りと貼付ヘッド15の矢印方向への水平移動とを同期をとって行うことにより、両面テープ40の粘着材基材42は成形部品Pの貼着面に転写される。本実施例の場合には、両面テープ40を台紙41を残した状態でカットすることによって形成された粘着材基材42を、精度よく成形部品Pの下面に転写するために、位置決め機構の精度を確保することが必要である。これに対して上述の感圧転写粘着テープ10のドットパターンの粘着材12を転写する場合には、感圧転写粘着テープ10の幅内に転写面が位置すればよいので、転写位置の位置ズレ等の問題はほとんど発生しないという利点がある。 6A and 6B, as another embodiment, the adhesive base material 42 having a slightly smaller area than the sticking surface of the molded part P is laser-cut so as to leave only the mount 41 side with respect to the double-sided tape 40. machine sided tape 40 obtained by processing (not shown) is passed over to the transfer edge 21 is adhesive base material 42 is stopped so as to come to a predetermined transfer position, the viscosity Chakuzaimotozai 42 of that, application head 15 shows a state in which the molded part P on the lower surface is pressed (FIGS. 6A and 6B). After that, as shown in FIGS. 6C and 6D, the double-sided tape 40 is synchronously wound and the horizontal movement of the sticking head 15 in the direction of the arrow is performed in the same manner as described above. Forty adhesive material bases 42 are transferred to the sticking surface of the molded part P. In the case of the present embodiment, in order to accurately transfer the adhesive base material 42 formed by cutting the double-sided tape 40 while leaving the mount 41, to the lower surface of the molded part P, the accuracy of the positioning mechanism It is necessary to secure On the other hand, when transferring the dot pattern adhesive 12 of the pressure-sensitive transfer adhesive tape 10 described above, the transfer surface only needs to be positioned within the width of the pressure-sensitive transfer adhesive tape 10, so that the transfer position is misaligned. There is an advantage that problems such as these hardly occur.

本発明の成形部品の連続貼付方法に使用される貼付装置の構成を示した模式構成図。The schematic block diagram which showed the structure of the sticking apparatus used for the continuous sticking method of the molded component of this invention. 図1に示した装置の転写エッジでの感圧転写粘着テープによる粘着材転写状態を示した断面図、平面図。Sectional drawing and the top view which showed the adhesive material transfer state by the pressure-sensitive transfer adhesive tape in the transfer edge of the apparatus shown in FIG. 図2に示した転写エッジでの感圧転写粘着テープから成形部品へのドットパターンの転写状態を示した説明図。Explanatory drawing which showed the transfer state of the dot pattern from the pressure-sensitive transfer adhesive tape in a transfer edge shown in FIG. 2 to a molded component. ドットパターンが転写され、巻き取り状態にある感圧転写粘着テープの一部を示した説明図。Explanatory drawing which showed a part of pressure-sensitive transfer adhesive tape which a dot pattern was transcribe | transferred and is in a winding state. 感圧転写粘着テープから転写された粘着層のドットパターンの一例を示したテープの部分平面図。The partial top view of the tape which showed an example of the dot pattern of the adhesion layer transcribe | transferred from the pressure-sensitive transfer adhesive tape. 図1に示した装置の転写エッジでの両面テープによる粘着基材の転写状態を示した断面図、平面図。Sectional drawing and the top view which showed the transfer state of the adhesive base material by the double-sided tape in the transfer edge of the apparatus shown in FIG. 厚みのある成形部品の従来の貼付方法の一例を示した説明図。Explanatory drawing which showed an example of the conventional sticking method of the molded component with thickness. 厚みのある他の形状からなる成形部品の従来の貼付方法の一例を示した説明図。Explanatory drawing which showed an example of the conventional sticking method of the molded part which consists of another shape with thickness.

符号の説明Explanation of symbols

1 貼付装置
1A 本体部
1B 部品フィーダ
1C 成形部品貼付部
5 取り出し口
6 貼付ステージ
7 ワーク
10 感圧転写粘着テープ
11 基材
12 粘着材
15 貼付ヘッド
20 粘着材転写部
21 剥離ヘッド
DESCRIPTION OF SYMBOLS 1 Sticking apparatus 1A Main body part 1B Parts feeder 1C Molded part sticking part 5 Taking out port 6 Sticking stage 7 Work 10 Pressure-sensitive transfer adhesive tape 11 Base material 12 Adhesive material 15 Adhesive head 20 Adhesive material transfer part 21 Peeling head

Claims (3)

基材表面に転写可能な粘着材が形成された感圧転写粘着テープを、供給リールから転写位置に繰り出す一方、部品供給手段から貼付ヘッドに保持された成形部品を、前記転写位置に移送し、
該転写位置で前記成形部品を前記感圧転写粘着テープの粘着材に押圧して前記成形部品の貼着面に前記粘着材を転写し、
前記感圧転写粘着テープの巻き取り速度と同期をとって、前記感圧転写粘着テープから前記粘着材を剥離する剥離エッジを超えて前記貼付ヘッドを水平移動させて、
前記剥離エッジにて前記感圧転写粘着テープを屈曲させて、前記感圧転写粘着テープから前記成形部品に転写された粘着材を剥離し、
前記貼付ヘッドの移動により、前記成形部品を貼付対象のワーク位置まで保持移送し、
前記粘着材を介して前記ワークの所定位置に前記成形部品を貼付することを特徴とする成形部品の連続貼付方法。
The pressure-sensitive transfer adhesive tape on which a transferable adhesive material is formed on the surface of the substrate is fed from the supply reel to the transfer position, while the molded part held by the application head from the component supply means is transferred to the transfer position,
The pressure-sensitive transfer adhesive tape is pressed against the pressure-sensitive transfer adhesive tape at the transfer position to transfer the pressure-sensitive adhesive material to the surface of the molded component,
In synchronization with the winding speed of the pressure-sensitive transfer pressure-sensitive adhesive tape, horizontally moving the sticking head beyond the peeling edge for peeling the pressure-sensitive adhesive material from the pressure-sensitive transfer pressure-sensitive adhesive tape,
Bending the pressure-sensitive transfer adhesive tape at the peeling edge to release the adhesive material transferred from the pressure-sensitive transfer adhesive tape to the molded part,
By moving the sticking head, the molded part is held and transferred to the work position to be stuck,
A method for continuously pasting molded parts, wherein the molded parts are pasted to predetermined positions of the workpiece via the adhesive material.
前記感圧転写粘着テープは、基材表面に所定のドットパターンからなる転写可能な粘着材が形成され、
前記ドットパターンの粘着材を前記成形部品の貼着面に合わせて押圧転写させることを特徴とする請求項1に記載の成形部品の連続貼付方法。
The pressure-sensitive transfer adhesive tape is formed with a transferable adhesive material consisting of a predetermined dot pattern on the substrate surface,
The method for continuously sticking molded parts according to claim 1, wherein the adhesive material having the dot pattern is pressed and transferred in accordance with the sticking surface of the molded parts.
台紙を残すように成形部品の貼着面形状に相応する形状をカットすることで、転写可能な粘着材基材が形成された両面テープを、供給リールから転写位置に繰り出す一方、部品供給手段から貼付ヘッドに保持された前記成形部品を、前記転写位置に移送し、
該転写位置で前記成形部品を前記両面テープの前記粘着材基材に押圧して前記成形部品の貼着面に前記粘着材基材を転写し、
前記両面テープの巻き取り速度と同期をとって、前記両面テープから前記粘着材基材を剥離する剥離エッジを超えて前記貼付ヘッドを水平移動させて、
前記剥離エッジにて前記両面テープを屈曲させて、前記両面テープから前記成形部品に転写された前記粘着材基材を剥離し、
前記貼付ヘッドの移動により、前記成形部品を貼付対象のワーク位置まで保持移送し、前記粘着材基材を介して前記ワークの所定位置に前記成形部品を貼付することを特徴とする成形部品の連続貼付方法。
By cutting the shape corresponding to the shape of the surface of the molded part to leave the mount , the double-sided tape on which the transferable adhesive base material is formed is fed from the supply reel to the transfer position, while from the component supply means. Transferring the molded part held by the sticking head to the transfer position;
At the transfer position, the molded part is pressed against the adhesive material base of the double-sided tape to transfer the adhesive material base to the sticking surface of the molded part,
In synchronization with the winding speed of the double-sided tape, horizontally moving the sticking head beyond the peeling edge for peeling the adhesive base material from the double-sided tape,
Bending the double-sided tape at the peeling edge to peel off the adhesive material substrate transferred from the double-sided tape to the molded part,
The molding part is continuously transferred to the position of a workpiece to be pasted by moving the sticking head, and the molded part is stuck to a predetermined position of the workpiece via the adhesive base material. Pasting method.
JP2007025715A 2007-02-05 2007-02-05 Continuous sticking method of molded parts Expired - Fee Related JP4453038B2 (en)

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JP7204204B2 (en) * 2019-04-16 2023-01-16 北川工業株式会社 Sticking device
JP7227608B2 (en) * 2019-04-16 2023-02-22 北川工業株式会社 Adhered body holding member
JP6919911B2 (en) * 2019-08-30 2021-08-18 株式会社サンテック Pasting sheet supply device

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