JP4451530B2 - Film forming method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a film forming method and apparatus, and more particularly to a film forming method and apparatus for forming a non-film forming portion on the inner periphery of a donut-shaped substrate such as an optical disk.
[0002]
[Prior art]
For example, an optical disc has a recording and reproducing function by providing a recording film, a protective film, and the like on a donut-shaped polycarbonate substrate. Further, the inner peripheral portion of the optical disc is provided with a non-film formation region because it is necessary for handling in manufacturing and use and ensuring recording / reproducing characteristics.
[0003]
For this reason, when a thin film of an optical disk is formed using a sputtering apparatus or the like, the film is formed with the inner peripheral mask attached to the inner peripheral part of the disk, and the inner peripheral mask is removed after the film formation. A film formation region is formed.
[0004]
Hereinafter, a process for forming an optical disk using a conventional sputtering apparatus will be described with reference to FIGS. In FIG. 8, the sputtering apparatus 30 includes an inner peripheral mask attaching / detaching chamber 31 and a plurality of film forming chambers 1 around a central transfer chamber 32, and carries a substrate into and out of the inner peripheral mask attaching / detaching chamber 31. A substrate carry-in / out mechanism 33 is provided.
[0005]
First, an unformed doughnut-shaped substrate 2 is carried into the inner peripheral mask attaching / detaching chamber 31 by the substrate carry-in / out mechanism 33, and the inner peripheral mask 10 is mounted in the inner peripheral mask attaching / detaching chamber 31. The substrate 2 on which the inner peripheral mask 10 is mounted is sequentially transferred to each film forming chamber 1 by a transfer means (not shown) disposed in the transfer chamber 32 as indicated by broken line arrows, and sputter film formation is performed in each. Is done. After the film formation is completed, the inner peripheral mask 10 is removed in the inner peripheral mask attaching / detaching chamber 31, and then the substrate 2 is carried out to the outside by the substrate carry-in / out mechanism 33. Mounted on the substrate 2.
[0006]
Since the inner peripheral mask 10 is repeatedly used in this way, a film is deposited on the inner peripheral mask 10, and the deposited film is peeled off due to an increase in deformation due to film stress or a defect growth as the thickness increases. As a result, it becomes dust and is taken into the film during film formation, resulting in a product defect. Therefore, the inner peripheral mask 10 is periodically replaced before the dust is peeled off, and the inner peripheral mask 10 on which the film is deposited is reused after the film is removed by a mechanical or chemical method.
[0007]
The film forming process in the film forming chamber 1 will be described with reference to FIG. 9. The film forming chamber 1 has a target 3 connected to a DC or AC high voltage power source 6, a gas supply line 4, and an exhaust. The exhaust line 5 is provided, and the substrate 2 on which the inner peripheral mask 10 is mounted is arranged to face the target 3.
[0008]
In such a configuration, when a gas such as argon is introduced from the gas supply line 4 while exhausting the gas using the exhaust line 5 and a high voltage is applied to the target 3 by the high voltage power source 6, a discharge occurs and argon is introduced. Such gas is ionized into ions and electrons, and plasma 50 is generated. The ions collide with the target 3 biased to a negative predetermined voltage, knock out target atoms, and the target 3 is sputtered. Sputtered target atoms (hereinafter referred to as sputtered particles) adhere to the substrate 2, and a thin film 20 is formed on the substrate 2. At this time, the thin film 20 is also formed on the portion of the inner peripheral mask 10 facing the target 3.
[0009]
Next, a process of removing the inner peripheral mask 10 from the substrate 2 in the inner peripheral mask attaching / detaching chamber 31 will be described with reference to FIG. The substrate 2 and the inner peripheral mask 10 are symmetric with respect to the central axis 9 common to them. A part of the inner peripheral mask 10 is made of a magnetic material such as iron. The inner peripheral mask attaching / detaching chamber 31 is provided with an attaching / detaching arm 12 that can move toward and away from the front surface of the inner peripheral mask 10 along an extension of the central axis 9, and an electromagnet 21 is provided at the tip thereof. Yes.
[0010]
In this configuration, first, in a state where no current flows through the electromagnet 21, the detachable arm 12 is moved so that the electromagnet 21 approaches the substrate 2 as shown in FIG. 10A, and then as shown in FIG. The electromagnet 21 is brought into contact with the inner peripheral mask 10 and a current is passed through the electromagnet 21 to hold the inner peripheral mask 10 by magnetic attraction. Further, as shown in (c), the detachable arm 12 is moved away from the substrate 2 while the current is passed through the electromagnet 21, and the inner peripheral mask 10 is removed from the substrate 2. The process of mounting the inner peripheral mask 10 on the substrate 2 is the reverse of the above process.
[0011]
[Problems to be solved by the invention]
However, in the above conventional configuration, the surface of the inner peripheral mask 10 to which the thin film 20 is adhered is held and the inner peripheral mask 10 is removed. The thin film 20 is peeled off and dust is generated. Since dust is taken into the film during film formation and becomes a product defect, it is necessary to frequently replace the inner peripheral mask 10 so as not to generate dust, and the regeneration cost of the inner peripheral mask 10 is high. At the same time, there is a problem that the operating rate of the apparatus is lowered.
[0012]
Japanese Patent Laid-Open No. 7-235085 discloses a method of reducing impact by interposing an elastic body on the attracting surface. However, in recent years, the track pitch of optical disks has been narrowed, and there is a demand for dust reduction. Because of the strictness, this method is not enough.
[0013]
In view of the above-described conventional problems, the present invention provides a film forming method and apparatus capable of extending the period during which the inner peripheral mask can be used continuously, reducing the regeneration cost of the inner peripheral mask, and improving the operating rate of the apparatus. The purpose is that.
[0014]
[Means for Solving the Problems]
The film forming method of the present invention is a film forming method in which a target is disposed in a film forming chamber, and a non-film forming portion is formed on the inner peripheral portion of the substrate provided facing the target. perform deposition on the substrate in a state of mounting the inner peripheral mask, and in that to remove the inner circumference mask holding a non-deposition portion formed on the inner peripheral mask which with common features, the inner peripheral When holding the mask, there is no impact on the part where the thin film is attached, so the peeling of the thin film is suppressed, the period during which the inner peripheral mask can be used continuously is lengthened, the regeneration cost of the inner peripheral mask is reduced, and the operating rate of the device is reduced. Improvements can be realized.
[0015]
Specifically, a notch groove is formed on a side surface, and an end of the notch groove is located inside a virtual cone connecting an outer peripheral edge of the target and an opening edge of the notch groove. Using the divided inner peripheral mask, the thin film can be easily and completely removed at the time of reproducing the inner peripheral mask.
[0016]
Further, an inner peripheral mask having a mask portion covering the inner peripheral portion of the substrate and a support portion that supports the mask portion in a state of being separated from the substrate is used, and after the film formation, the mask portion is separated from the substrate. The inner peripheral mask can be removed while holding the non-film-forming portion of the support portion.
[0017]
At that time, using an inner peripheral mask with a built-in magnet, the mask part is separated from the substrate in a non-contact manner by magnetic attraction, and then the inner peripheral mask is attached and detached while holding the non-film forming part of the support part. You can also.
[0018]
Also, an arm that can be detachably coupled to the inner peripheral mask that covers the inner peripheral portion of the substrate from the back side of the substrate, and that can move the inner peripheral mask between a position in contact with the substrate and a spaced position. After the film is formed, the inner peripheral mask is separated from the substrate by the arm, and then the inner peripheral mask can be attached and detached while holding the non-film forming portion of the inner peripheral mask.
[0020]
Further, the film forming apparatus of the present invention has a target placed in the film forming chamber, and an inner peripheral mask is attached to the inner peripheral portion of the substrate provided to face the target to form a film, and the inner peripheral portion of the substrate A film forming apparatus for forming a non-film forming portion on the inner peripheral mask is formed with a notch groove structure for forming the non-film forming portion on a side surface of the inner peripheral mask, and an end of the notch groove is formed between the outer peripheral edge of the target and the notch groove. Is located inside the virtual cone connecting the opening edge of the two, and is divided into two by the notch groove, provided with a holding part for holding the non-film forming part on the detachable arm for attaching and detaching the inner peripheral mask , The thin film can be easily and completely removed when the inner peripheral mask is reproduced.
[0021]
In addition, the inner peripheral mask is provided with a mask part that covers the inner peripheral part of the substrate and a support part that supports the mask part in a state of being separated from the substrate, and a magnet is built in the inner peripheral mask, and the inner peripheral mask is attached and detached. Even if an electromagnet that attracts the magnet to the detachable arm and separates the mask portion from the substrate, a position detection sensor for the inner peripheral mask, and a holding portion that holds the non-film forming portion, the above-described method is implemented and its effects are achieved. Can play.
[0022]
In addition, an arm that can be detachably coupled to the inner peripheral mask from the back side of the substrate and can move the inner peripheral mask between a position in contact with the substrate and a separated position is provided. Even if the attaching / detaching arm is provided with a holding part for holding the non-film-forming portion of the inner peripheral mask, the above-described method can be carried out to achieve its effects.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the film forming method and apparatus of the present invention will be described with reference to FIGS.
[0025]
(First embodiment)
First, a first embodiment of the present invention will be described with reference to FIGS. In FIG. 1 showing a film forming process, reference numeral 1 denotes a film forming chamber, to which a supply line 4 for supplying gas and an exhaust line 5 for exhausting gas are connected. Reference numeral 2 denotes a substrate formed in a donut shape from a material such as polycarbonate. Reference numeral 3 denotes a target disposed on one side wall of the film forming chamber 1, and a DC or AC high voltage power source 6 is connected thereto. Reference numeral 7 denotes an insulator that insulates the film forming chamber 1 from the target 3. Reference numeral 10 denotes an inner peripheral mask mounted on the inner peripheral portion of the substrate 2. The inner peripheral mask 10 is formed with a cut groove 11 in an annular shape on the outer peripheral side surface, and the cut end 11a is located inside a virtual cone 60 that connects the outer peripheral edge 3a of the target 3 and the opening edge 11b of the cut groove 11. It is located and it is constituted so that sputtered particles may not adhere to the cut end 11a.
[0026]
In FIG. 2 showing the process of attaching and detaching the inner peripheral mask 10, 9 is a central axis common to the substrate 2 and the inner peripheral mask 10, and 12 moves along the central axis 9 in the perspective direction with respect to the substrate 2. It is an attachment / detachment arm for attaching / detaching the peripheral mask 10 to / from the substrate 2, and includes a holding mechanism 13 that holds the inner peripheral mask 10 by holding the cut end 11 a of the inner peripheral mask 10.
[0027]
In the film forming process in the above configuration, first, the substrate 2 on which the inner peripheral mask 10 is mounted is placed in the film forming chamber 1 so as to face the target 3. Next, a gas such as argon gas is supplied from the supply line 4 while exhausting the gas in the film forming chamber 1 from the exhaust line 5. Next, when a high voltage of direct current or alternating current is applied to the target 3 from the high voltage power source 6, discharge occurs, the gas is ionized into ions and electrons, and a plasma 50 is generated. The ions collide with the target 3 biased to a predetermined negative voltage and knock out sputtered particles. The sputtered particles adhere to the surface of the substrate 2 facing the target 3 to form a thin film 20 on the substrate 2. At this time, sputtered particles also fly to the surface of the inner peripheral mask 10 facing the target 3 to form the thin film 20, but the sputtered particles are formed at the cut end 11a of the cut groove 11 formed on the side surface of the inner peripheral mask 10. There is almost no adhesion.
[0028]
When the formation of the thin film 20 on the substrate 2 is completed, the substrate 2 is transported to the inner peripheral mask 10 attaching / detaching step. In this attaching / detaching step, first, as shown in FIG. 2A, the attaching / detaching arm 12 moves so as to approach the substrate 2 along the central axis 9 with the holding mechanism 13 opened, and the inner peripheral mask 10 is moved. It stops at a position where the clamping mechanism 13 faces the cut groove 11. Next, as shown in (b), the clamping mechanism 13 is closed to clamp the cut end 11a of the cut groove 11 to which the sputter particles of the inner peripheral mask 10 are not attached, and the inner peripheral mask 10 is held. Thereafter, as shown in (c), the detachable arm 12 is moved in the direction away from the substrate 2 along the central axis 9 with the clamping mechanism 13 closed, and the inner peripheral mask 10 is removed from the substrate 2. The process of attaching the inner peripheral mask 10 to the substrate 2 is the reverse of the above.
[0029]
By forming the cut groove 11 on the side surface of the inner peripheral mask 10 and providing the cut end 11a that does not face the target 3, the sputter particles do not adhere to the cut end 11a. By holding the cut end 11a, it is not necessary to give an impact to the part to which the sputtered particles are attached, the peeling of the thin film 20 can be suppressed, and the continuous use period of the inner peripheral mask 10 can be prolonged.
[0030]
The inner peripheral mask 10 shown in FIG. 1 and FIG. 2 is shown as a whole. However, as shown in FIG. 3, the inner peripheral mask 10 is divided at the notch groove 11 and the inner peripheral mask body is divided. You may comprise by 101 and the upper mask 102 fastened and fixed with the screw | thread 103 on it. The upper mask 102 is configured by forming a large-diameter flange 102b at the tip of a small-diameter shaft portion 102a to be joined to the inner peripheral mask body 101, and the outer periphery of the small-diameter shaft portion 102a becomes the cut end 11a and the outer periphery of the large-diameter flange 102b. Constitutes the opening edge 11 b of the cut groove 11.
[0031]
If the inner peripheral mask 10 is configured to be disassembled at the cut groove 11 in this way, it can be easily and completely removed when removing the thin film 20 that has entered the cut groove 11 when the inner mask 10 is regenerated. There is an advantage that you can.
[0032]
(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. In the following description of the embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only differences are described.
[0033]
In FIG. 4, the inner peripheral mask 10 has a mask portion 10 a that covers the inner peripheral portion of the surface of the substrate 2 facing the target 3 and a support shaft portion 10 b that supports the mask portion 10 a while being separated from the substrate 2. A magnet 14 is embedded in the vicinity of the mask portion 10a of the support shaft portion 10b.
[0034]
Further, an electromagnet 15 is disposed at the tip of the detachable arm 12 together with the clamping mechanism 13, and a position detection sensor 16 for determining the position of the inner peripheral mask 10 is disposed in the clamping mechanism 13. The position detection sensor 16 is configured to be turned on when the support shaft portion 10b of the inner peripheral mask 10 can be held by the clamping mechanism 13 and the mask portion 10a is in a position where it does not contact the detachable arm 12. Has been.
[0035]
In the attaching / detaching process of the inner peripheral mask 10, first, as shown in FIG. 4A, the holding mechanism 13 is opened, and the attaching / detaching arm 12 approaches the substrate 2 along the central axis 9 in a state where no current flows through the electromagnet 15. The support shaft 10b is stopped at a position where it can be held by the clamping mechanism 13. Next, as shown in (b), the inner peripheral mask 10 is pulled out from the substrate 2 by passing a current through the electromagnet 15. Next, when the position detection sensor 16 is turned on, as shown in (c), the clamping mechanism 13 is closed to hold the support shaft portion 10b which is a portion not facing the target 3 of the inner peripheral mask 10, and the electromagnet Turn off the current flowing through Next, as shown in (d), the detachable arm 12 is moved away from the substrate 2 while the clamping mechanism 13 is closed, and the inner peripheral mask 10 is removed from the substrate 2. The process of attaching the inner peripheral mask 10 to the substrate 2 is the reverse of the above.
[0036]
Thus, since the sputter particles are not attached to the support shaft portion 10b that does not oppose the target 3 of the inner peripheral mask 10, the support shaft portion 10b is held at the time of attachment / detachment, so that the thin film adheres at the time of attachment / detachment. The applied portion is not impacted, thin film peeling is suppressed, and the continuous use period of the inner peripheral mask 10 can be extended.
[0037]
(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. In FIG. 5, on the back surface side opposite to the surface on which the thin film 20 of the substrate 2 is formed, a position where the mask portion 10a is in contact with the substrate 2 in a state where the inner peripheral mask 10 is separably held, and a separated position. An extrusion arm 17 for moving the inner peripheral mask 10 between them is disposed. The inner peripheral mask 10 and the pushing arm 17 are detachably coupled by magnetic attraction of magnets 18 a and 18 b attached to the tip of the mounting shaft portion 10 c of the inner peripheral mask 10 and the tip of the pushing arm 17.
[0038]
In the attaching / detaching step of the inner peripheral mask 10, first, as shown in FIG. 5 (a), the holding mechanism 13 of the attaching / detaching arm 12 is opened, and then the pushing arm 17 is moved as shown in FIG. 10 is pushed out to a position where the mounting shaft portion 10c can be held by the clamping mechanism 13. Next, as shown in (c), the clamping mechanism 13 is closed to hold the mounting shaft portion 10c which is a portion not facing the target 3 of the inner peripheral mask 10. Next, as shown in (d), the push-out arm 17 is returned while the clamping mechanism 13 is closed, so that the magnet 18a, 18b is desorbed and separated from the push-out arm 17, and the inner peripheral mask 10 is separated from the substrate 2. The operation of removing the inner peripheral mask 10 from the substrate 2 is completed. The process of attaching the inner peripheral mask 10 to the substrate 2 is the reverse of the above.
[0039]
As described above, the mounting shaft portion 10c of the inner peripheral mask 10 is a portion that does not face the target 3, and since sputtered particles flying from the target 3 are not attached, the mounting shaft portion 10c is held during mounting and dismounting. An impact is not given to the part to which the thin film 20 adheres, the peeling of the thin film 20 is suppressed, and the continuous use period of the inner peripheral mask 10 can be prolonged.
[0040]
(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIGS. In FIG. 6, an inner mask 19 that covers the central portion of the inner peripheral mask 10 is disposed in the film forming chamber 1. The inner mask 19 may be supported on the wall surface of the film forming chamber 1 by the bridge 19a or may be supported from the target 3 side. When film formation is performed on the substrate 2 in the film formation chamber 1 having such a configuration, the thin film 20 is not formed in the central portion of the mask portion 10a of the inner peripheral mask 10 as shown in FIG. A film forming portion 10d is formed.
[0041]
In the step of attaching and detaching the inner peripheral mask 10, as shown in FIG. 7A, the inner peripheral mask 10 can move in the perspective direction with respect to the substrate 2 along the extension line of the common central axis 9 of the substrate 2 and the inner peripheral mask 10. An electromagnet 21 is provided at the tip of the detachable arm 12. The front end surface 21a of the electromagnet 21 is set to a size that can enter the non-deposition portion 10d of the inner peripheral mask 10.
[0042]
When attaching / detaching the inner peripheral mask 10, first, the attachment / detachment arm 12 is moved closer to the substrate 2 as shown in FIG. Next, as shown in (b), after the electromagnet 21 is brought into contact with the non-film-forming portion 10d of the inner peripheral mask 10, a current is passed through the electromagnet 21 to hold the inner peripheral mask 10. Next, as shown in (c), the detachable arm 12 is moved away from the substrate 2, and the inner peripheral mask 10 is removed from the substrate 2. The process of mounting the inner peripheral mask 10 is the reverse of the above.
[0043]
By holding the non-film-deposited portion 10d formed by the inner mask 19 in this way, when the inner peripheral mask 10 is attached or detached, the portion to which the thin film 20 is attached is not impacted, and peeling of the thin film 20 is suppressed, and the inner peripheral mask is suppressed. Ten continuous use periods can be extended.
[0044]
Comparing the above-described embodiments, the first embodiment is advantageous in that the configuration can be simplified, and the second and third embodiments are advantageous in that a portion where the thin film 20 is not completely formed can be retained. It is. Comparing the second and third embodiments, the second embodiment is advantageous when a cooling mechanism or the like is disposed on the back surface of the substrate 2, and the third embodiment is advantageous in that the position detection sensor is unnecessary and the reliability is high. This embodiment is advantageous. The fourth embodiment is advantageous in that the attaching / detaching mechanism of the inner peripheral mask 10 can be made as simple as the conventional one. When the inner mask 19 becomes a problem with respect to the uniformity of the film thickness, the first to first embodiments are advantageous. The third embodiment is advantageous.
[0045]
Note that the present invention is not limited to the sputtering apparatus shown in the above embodiment, and can be applied to the case where a non-film forming portion is formed on the inner peripheral portion of the substrate in another film forming apparatus.
[0046]
【The invention's effect】
According to the film forming method and apparatus of the present invention, when the inner peripheral mask is attached / detached as described above, it can be attached / detached without giving an impact to the portion to which the thin film is attached, so that peeling of the thin film can be suppressed, and the inner peripheral mask can be suppressed. The continuous use period can be prolonged, and the mask regeneration cost can be reduced and the operating rate of the apparatus can be improved.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a film forming chamber showing a film forming process in a first embodiment of the present invention.
FIG. 2 is an explanatory diagram of an inner peripheral mask attaching / detaching step in the same embodiment;
FIG. 3 is a cross-sectional view of a modified example of the inner peripheral mask in the same embodiment.
FIG. 4 is an explanatory diagram of an inner peripheral mask attaching / detaching step according to a second embodiment of the present invention.
FIG. 5 is an explanatory diagram of an inner peripheral mask attaching / detaching step according to a third embodiment of the present invention.
FIG. 6 is a configuration diagram of a film forming chamber showing a film forming process in a fourth embodiment of the present invention.
FIG. 7 is an explanatory diagram of an inner peripheral mask attaching / detaching step in the same embodiment;
FIG. 8 is a schematic configuration diagram of a sputtering apparatus for forming an optical disk.
FIG. 9 is a configuration diagram of a film forming chamber showing a film forming process in a conventional example.
FIG. 10 is an explanatory diagram of an inner peripheral mask attaching / detaching step in the conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Deposition chamber 2 Substrate 10 Inner peripheral mask 10a Mask part 10b Support shaft part 10d Non-deposition part 101 Inner peripheral mask main body 102 Upper mask 11 Cut groove 12 Removable arm 13 Holding mechanism (holding part)
14 Magnet 15 Electromagnet 16 Position detection sensor 17 Extrusion arms 18a, 18b Magnet 19 Inner mask 20 Thin film

Claims (7)

The target was placed in a deposition chamber, during the formation of the non-deposition portion on the inner peripheral portion of the substrate provided to face the target, on the substrate in a state of mounting the inner periphery mask to the inner peripheral portion of the substrate perform film formation, a film forming method of detaching the inner peripheral mask holding a non-deposition portion formed on an inner peripheral mask,
Grooves cut into the side surface is formed, the cut end of the groove The rewritable located inside the imaginary cone which connects the opening edges of the groove cut the outer peripheral edge of the target, among which 2 divided by the cut groove A film forming method characterized in that a peripheral mask is used, and an inner peripheral mask is attached and detached while holding a non-film forming portion formed by a cut structure.  In a film forming method for forming a non-film forming portion on an inner peripheral portion of a substrate, after forming a film in a film forming chamber with an inner peripheral mask attached to the inner peripheral portion of the substrate, a non-deformed portion formed on the inner peripheral mask is formed. A film forming method for attaching and detaching an inner peripheral mask while holding a film portion, the inner periphery having a mask portion covering the inner peripheral portion of the substrate and a support portion for supporting the mask portion while being separated from the substrate A film forming method comprising: using a mask, separating a mask part from a substrate after film formation, and attaching and detaching an inner peripheral mask while holding a non-film forming part of a support part.  Using an inner peripheral mask with a built-in magnet, the mask part is separated from the substrate in a non-contact manner by magnetic attraction, and then the inner peripheral mask is attached and detached while holding the non-deposition part of the support part. The film forming method according to claim 2.  In a film forming method for forming a non-film forming portion on an inner peripheral portion of a substrate, after forming a film in a film forming chamber with an inner peripheral mask attached to the inner peripheral portion of the substrate, a non-deformed portion formed on the inner peripheral mask is formed. A film forming method in which the inner peripheral mask is attached and detached while holding the film portion, and can be detachably coupled to the inner peripheral mask covering the inner peripheral portion of the substrate from the back side of the substrate, and the inner peripheral mask is applied to the substrate. Using an arm that can be moved between the contacted position and the separated position, after the film is formed, the inner mask is separated from the substrate by the arm, and then the non-film forming portion of the inner mask is held. Then, the film forming method is characterized in that the inner peripheral mask is attached and detached. The target was placed in a deposition chamber, said deposited with the inner peripheral mask attached to the inner peripheral portion of the substrate provided with the target and opposite, to form a non-deposition portion on the inner peripheral portion of the substrate film formation A device,
The inner peripheral mask has a cut groove that forms a non-deposition portion on the side surface, and the end of the cut groove is located inside a virtual cone connecting the outer peripheral edge of the target and the opening edge of the cut groove. be Rutotomoni, said cuts are divided into two by the groove, the film forming apparatus characterized in that a holding portion for holding the non-film portion detachable arm attaching and detaching the inner periphery mask.  A film forming apparatus for forming a film by attaching an inner peripheral mask to an inner peripheral portion of a substrate and forming a non-film forming portion on the inner peripheral portion of the substrate, wherein the inner peripheral mask covers the inner peripheral portion of the substrate. And a support portion that supports the mask portion in a state of being separated from the substrate, the magnet is built in the inner peripheral mask, and the mask portion is separated from the substrate by attracting the magnet to the detachable arm that attaches and detaches the inner peripheral mask. A film forming apparatus comprising: an electromagnet to be moved; a position detection sensor for an inner peripheral mask; and a holding unit for holding a non-film forming portion.  A film deposition system that forms a film by attaching an inner peripheral mask to the inner peripheral part of the substrate, and forms a non-deposition portion on the inner peripheral part of the substrate, which can be separated from the back side of the substrate with respect to the inner peripheral mask. And an arm that can move the inner peripheral mask between a position where it is in contact with the substrate and a position separated from the substrate, and a non-deposition portion of the inner peripheral mask is held by a detachable arm that attaches and detaches the inner peripheral mask. A film forming apparatus comprising a holding portion for performing the above operation.

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