JP4443883B2 - Chip pickup method - Google Patents

Description

The present invention relates to method of picking up the pickup to Ruchi-up the placed chips to the chip mounting portion by lifting head.

2. Description of the Related Art An apparatus that mounts or transfers a semiconductor chip such as a flip chip (hereinafter simply referred to as “chip”) includes a pickup device that picks up a mounted chip with a mounting head, a transfer head, or the like ( For example, see Patent Document 1). That is, in this patent document example, a pick-up head for taking out a chip from the component supply unit, a pick-up head for transferring in the process of transferring the taken-out chip to the substrate, and the chip to the substrate. A plurality of pickup devices for different uses such as a pickup head for mounting are provided.
Japanese Patent No. 3399260

  By the way, with the demand for productivity improvement and the miniaturization of electronic components, the above-described chip pickup device is required to realize high-speed operation for thin, small, and fragile micro components. However, in the prior art examples including the above-mentioned patent documents, if an attempt is made to increase the operation speed, there is a risk of excessive damage when the pickup head descends and contacts the upper surface of the chip during the pickup operation. There was a limit to speeding up the operation. Therefore, a new technology that enables high-speed operation while avoiding excessive damage to the chip has been demanded.

It is an object of the present invention to provide a method of picking up Ruchi-up to enable the high-speed operation while avoiding excessive damage to the chip.

Furthermore, the chip pick-up method of the present invention is a chip pick-up method for picking up a chip mounted on the chip mounting section by a lifting head that moves up and down relatively with respect to the chip mounting section. An elevating part that raises and lowers the mounting part along the sliding guide part, an abutting element provided on the elevating head, an abutted part that abuts on the abutting element, and the abutted part descends A chip pickup device comprising: a contact member that moves downward with a movement amount smaller than a movement amount of the contacted portion; and a force transmission member that pushes down the lifting portion when the contact member contacts. Before the elevating head is lowered and comes into contact with the chip placed on the chip placement portion, the contact member comes into contact with the contacted portion so that the contact member transmits the force. Abut against the member Pressed down, the to start lowering of the elevating unit with a smaller amount of movement than the movement amount of the contact portion, picks up the chip by the lifting head by the falling thereafter the elevating head catches up with the descent of the elevating unit To do.

  According to the present invention, before the elevating head descends and comes into contact with the chip placed on the chip placing unit, the elevating unit that holds the chip placing unit starts to descend, or comes into contact with the chip. In addition to the first urging means for buffering the time, the second urging means transmits an urging force including an upward urging force component to the elevating part to hold the elevating part with a sufficient urging force. In addition, by canceling the transmission of the urging force of the second urging means to the elevating part in the descending operation of the elevating head, the impact force when the elevating head abuts on the chip is alleviated, High speed operation can be enabled while avoiding damage.

(Embodiment 1)
1 is a front view of an electronic component mounting apparatus according to Embodiment 1 of the present invention, FIG. 2 is a front view of a component supply unit of the electronic component mounting apparatus according to Embodiment 1 of the present invention, and FIGS. FIG. 6 is an operation explanatory diagram of a chip pickup operation in the component supply unit of the electronic component mounting apparatus according to the first embodiment.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIG. The electronic component mounting apparatus includes a chip pickup device that picks up a chip, which is an electronic component mounted on the chip mounting portion, by a lifting head that moves up and down relatively with respect to the chip mounting portion. The formed chip is transferred and mounted on the substrate. A movable table 3 is installed on a column 2 that is erected on the base 1, and a head lifting mechanism 4 is mounted on the movable table 3 so as to be horizontally movable.

  A pickup head 5, which is a lifting head provided with a suction tool 5 a, is attached to the lower end portion of the head lifting mechanism 4, and the pickup head 5 can be raised and lowered by the head lifting mechanism 4. In the movement range of the pickup head 5 on the base 1, a component supply unit 6 and a substrate holding unit 8 are disposed. A chip 7 is accommodated in the component supply unit 6, and the pickup head 5 takes out the chip 7 from the component supply unit 6 and mounts it on the substrate 9 held by the substrate holding unit 8.

  Next, the structure of the component supply unit 6 will be described with reference to FIG. Two sliding guide portions 11 are provided upright on the base portion 10, and a horizontal lifting table 13 (lifting portion) is coupled to a sliding shaft 11 a slidably fitted to the sliding guide portion 11. ing. The lifting table 13 is urged upward by a first spring member 12 (first urging means) mounted on the sliding shaft 11a. The upper surface of the lifting / lowering table 13 serves as a chip mounting portion for mounting the chip 7, and a large number of chips 7 are mounted on the chip mounting portion. The lifting table 13 moves the chip mounting part up and down along the sliding guide part 11.

  A support post 14 and a guide shaft 17 are erected on the upper surface of the base portion 10. A stopper 17 a is provided at the upper end of the guide shaft 17. An L-shaped rotary lever member 15 is pivotally supported on a support shaft 14a provided at the upper end portion of the support post 14, and the rotary lever member 15 is rotatable around the support shaft 14a. The guide shaft 17 is provided at a distance from the support post 14, and the movement in the vertical movement direction when the rotary lever member 15 rotates is guided by the guide shaft 17.

A second spring member 18 (second urging means) is mounted on the guide shaft 17, whereby the rotating lever member 15 is urged counterclockwise by the second spring member 18. The stopper 17a comes into contact with the upper surface of the rotating lever member 15, so that the rotating lever member 15 is fixed at the upper limit position. Here, the second spring member 18 is selected to have a stronger spring strength than the first spring member 12.

  The right end portion of the rotary lever member 15 is bent upward to form a contacted portion 15a, and a contact 5b provided on the pickup head 5 contacts the contacted portion 15a. A roller-like contact member 16 is provided at the center of the horizontal portion of the rotary lever member 15, and a force transmission member 13 a extending downward from the lifting table 13 corresponding to the position of the contact member 16 is provided. ing.

  When the pickup head 5 is lowered during the chip pickup operation, the contact 5b comes into contact with the contacted portion 15a and pushes down the rotary lever member 15 against the urging force of the guide shaft 17. As a result, the rotating lever member 15 rotates in the clockwise direction with the support shaft 14a as a fulcrum, and the contact member 16 contacts the force transmission member 13a and pushes down. As a result, the lifting table 13 coupled to the force transmission member 13 a is pushed down against the urging force of the first spring member 12. That is, the force transmission member 13a applies the force in the downward direction of the pickup head 5 to the rotary lever member 15 and the contact member 16 before the pickup head 5 is lowered and contacts the chip 7 placed on the chip placement portion. Is transmitted to the lifting table 13 through the head and lowered.

  At this time, the lever length indicating the distance from the support shaft 14a to each portion in the rotating lever member 15 is smaller than the lever length of the contacted portion 15a because the lever length of the contact member 16 is smaller. When the rotary lever member 15 performs the same movement operation, the movement amount of the contact member 16 is smaller than the movement amount of the contacted portion 15a. For this reason, the lifting table 13 is also lowered in the process of lowering the pickup head 5, but the suction tool 5 a catches up with the lowering of the lifting table 13, approaches the chip 7 on the lifting table 13 and holds it by suction.

  Next, the chip pickup operation by the pickup head 5 will be described with reference to FIG. FIG. 3A shows a state in which the pickup head 5 having the suction tool 5a on the lower surface is positioned immediately above the component supply unit 6. A plurality of chips 7 are placed on the chip mounting unit on the upper surface of the lifting table 13. It is placed. When the pickup head 5 starts to descend from this state, the abutment 5b abuts against the abutted portion 15a during the descent and is pushed downward.

  Then, the pickup head 5 is further lowered, and the abutting member 16 provided at the central portion of the rotary lever member 15 is lowered to abut against the force transmission member 13a, so that the lifting table 13 is pushed down via the force transmission member 13a. It is done. The lowering of the pickup head 5 catches up with the lowering of the lifting table 13 and the suction tool 5a comes into contact with the upper surface of the chip 7 so that the chip 7 is sucked and held. Thereafter, when the pickup head 5 is raised, the chip 7 is picked up from the chip mounting portion on the lifting table 13.

  At this time, the relative speed when the suction tool 5a abuts on the chip 7 on the lifting table 13 is lower than that when the pickup head 5 is simply lowered with respect to the stopped chip 7. While the speed is reduced by the speed, the first spring member 12 is compressed when the suction tool 5a comes into contact, and the lifting table 13 further sinks. When the pickup head 5 is raised, the lifting table 13 is pushed up by the urging force of the first spring member 12 and the second spring member 18 so that the lifting table 13 returns to its original position.

In the above configuration, the contact 5b, the contacted portion 15a, the contact member 16 and the force transmission member 13a are moved up and down before the pickup head 5 is lowered and contacts the chip 7 placed on the lift table 13. It is a descent start means before contact for starting the descent of the table 13. The first spring member 12 is a first urging means for urging the lifting table 13 upward, and the rotating lever member 15 and the abutting member 16 are second urging means. An urging force transmission mechanism for transmitting an urging force including an upward urging force component to the lift table 13 by the spring member 18 is provided.

  Further, the abutting element 5b, the abutted part 15a, the rotating lever member 15, and the abutting member 16 are provided in the urging force transmission mechanism with the abutting element 5b provided on the pickup head 5 when the pickup head 5 is lowered. The urging force transmission releasing mechanism releases the transmission of the urging force to the lifting table 13 by the second urging means by contacting the abutted portion 15a.

  By adopting such a configuration in the chip pickup device, even when the pickup head 5 is lowered with respect to the component supply unit 6 at a high speed, the relative speed at the time of contact is reduced by the lowering of the first lifting table 13. In addition, the impact of the first spring member 12 on the tip 7 can be reduced by the buffering action of the first spring member 12 to prevent excessive damage.

  When the pickup head 5 is raised, the first elevating table 13 is pushed up by the second spring member 18 via the rotating lever member 15 and the contact member 16 and returns to the original position. At this time, as described above, the second spring member 18 having a stronger spring strength than that of the first spring member 12 is selected. It becomes possible. Thereby, when setting the strength of the first spring member 12, only the degree of buffering when the suction tool 5a comes into contact with the chip 7 needs to be considered.

  Further, since the dynamic friction coefficient is much smaller than the static friction coefficient, the lifting table 13 starts to descend before the pickup head 5 comes into contact with the chip 7, so that the sliding guide section 11 that guides the lifting of the lifting section. The frictional resistance (sliding resistance) is significantly reduced. As a result, the chip mounting portion on which the chip 7 with which the pickup head 5 is in contact is smoothly guided by the sliding guide portion 11 with reduced frictional resistance. It can be mitigated to prevent excessive damage.

  2 and 3, instead of mounting the first spring member 12 on the sliding shaft 11 a of the sliding guide portion 11, force is applied as shown in FIG. A similar spring member 12A may be mounted directly under the transmission member 13a. Even with such a configuration, it is possible to transmit the upward biasing force to the first elevating table 13 via the force transmitting member 13a.

  In the pickup operation, as shown in FIG. 4 (b), the contact of the contact 5b with the contacted portion 15a starts the rotational movement of the rotary lever member 15. As shown in FIG. 4C, when the pickup head 5 is further lowered, the abutting member 16 abuts on the force transmission member 13a to depress the elevating table 13 and to compress the spring member 12A. Thereby, similarly to the example shown in FIGS. 2 and 3, the impact when the suction tool 5 a comes into contact with the chip 7 when the pickup head 5 is lowered in the pickup operation can be reduced.

(Embodiment 2)
FIG. 5 is a front view of the component mounting stage of the electronic component mounting apparatus according to the second embodiment of the present invention, and FIG. 6 is a chip pickup operation in the component mounting stage of the electronic component mounting apparatus according to the second embodiment of the present invention. It is operation | movement explanatory drawing.

  The second embodiment shows an example in which the present invention is applied to the configuration of a component mounting stage for delivering a chip taken out from a component supply unit to a mounting head in an electronic component mounting apparatus. This component placement stage is a chip pickup device that picks up a chip, which is an electronic component placed on a chip placement portion, by a lifting head that moves up and down relatively with respect to the chip placement portion.

  In FIG. 5, the chip delivery unit 20 has a configuration in which each element described below is disposed at the lower end of a vertical base 21. Two sliders 23a and 23b are slidably fitted to a guide rail 22 provided in the vertical direction on the side surface of the vertical base 21, and a lift block 24 is slidably attached to the slider 23a, and a connecting member 28 is provided to the slider 23b. Is fixed.

  The elevating block 24 is urged upward by a second spring member 26 coupled to the vertical base 21 via a post 27, and a contacted portion 24 a and a second abutting portion are provided on the side surface of the elevating block 24. A portion 24b is provided extending laterally. In the pickup operation by the pickup head 25 (elevating head), a contact piece 25b provided in the pickup head 25 contacts the contacted portion 24a.

  A substantially frame-shaped connecting member 28 is fixed to the slider 23b, and the connecting portion 28b in which the connecting member 28 is connected to the slider 23b is urged upward by a first spring member 31 connected to the vertical base 21. Has been. The first contact portion 28a in which the right end portion of the connecting member 28 extends upward is supported from below by the end portion of the second contact portion 24b.

  A horizontal elevating table 29 (elevating part) is coupled to the lower surface of the connecting member 28. The lifting table 29 is urged upward by the second spring member 26 via the connecting member 28, the second contact portion 24 b, and the lifting block 24, and a stopper 29 b provided at the end is below the vertical base 21. The position is fixed by contacting the end face.

  The end of the lift table 29 extending below the pickup head 25 is a chip mounting part 29a for mounting the chip 7, and the chip 7 taken out from the component supply part is mounted on the chip mounting part 29a. Placed. The chip 7 on the chip mounting portion 29a is sucked and held by the suction tool 25a of the pickup head 25. The lifting table 29 lifts and lowers the chip mounting portion 29 a along the slider 23 b and the guide rail 22 that are sliding guide portions.

  A force transmission member 30 is pivotally supported on the vertical base 21 so as to be rotatable around a support shaft 21a. The force transmission member 30 is provided with a push-down portion 30a and a transmission portion 30b. The push-down portion 30a is positioned below the second contact portion 24b, and the second contact portion 24b pushes down the push-down portion 30a when the pickup head 5 is lowered. Further, the transmission portion 30b is always pressed against the upper surface of the coupling portion 28b by the third spring member 32, so that the posture of the force transmission member 30 is kept stable.

  When the second contact portion 24 b pushes down the push-down portion 30 a, the transmission portion 30 b pushes down the coupling portion 28 b, so that the lift table 29 is lowered against the urging force of the first spring member 31. That is, the force transmission member 30 applies the force in the downward direction of the pickup head 25 to the contacted portion 24a and the lifting block before the pickup head 25 is lowered and contacts the chip 7 mounted on the chip mounting portion 29a. 24, transmitted to the lifting table 13 via the second contact portion 24b and lowered.

  The operation when picking up the chip 7 on the chip mounting portion 29a by the pickup head 25 will be described with reference to FIG. FIG. 6A shows a state in which the pickup head 25 provided with the suction tool 25a is positioned above the chip placement portion 29a. At this time, the chip 7 taken out from the component supply unit is placed on the chip placement unit 29a.

When the pickup operation starts and the pickup head 25 is lowered, the contact 25b comes into contact with the contacted portion 24a as shown in FIG. 6 (b), whereby the elevating block 24 is attached to the second spring member 26. It is pushed down against the power. At this time, the second abutting portion 24b is lowered and separated from the lower surface of the first abutting portion 28a, but the connecting member 28 and the lifting table 29 remain in their positions due to the urging force of the first spring member 31. keep.

  After the pickup head 25 is further lowered to push down the lifting block 24 and the second contact portion 24b comes into contact with the push-down portion 30a as shown in FIG. 4B, as shown in FIG. 4C. Then, the connecting member 28 and the lifting table 29 start to descend. That is, when the push-down portion 30a is pushed down and the force transmission member 30 rotates around the support shaft 21a, the transmission portion 30b pushes down the coupling portion 28b.

  At this time, in the force transmission member 30, the lever length indicating the distance from the support shaft 21a to each part is smaller than the lever length of the push-down part 30a because the lever length of the transmission part 30b is smaller than the lever length. When the member 30 performs the same operation, the amount of movement of the transmission unit 30b is smaller than the amount of movement of the push-down unit 30a. For this reason, while the pickup head 25 is lowered, the lifting table 29 is also lowered, but the suction tool 25a catches up with the lowering of the lifting table 29 and approaches and holds the chip 7 on the chip mounting portion 29a. Thereafter, when the pickup head 25 is raised, the chip 7 is picked up from the chip mounting portion 29 a on the lifting table 29.

  At this time, the relative speed when the suction tool 25a abuts on the chip 7 of the chip mounting portion 29a is higher than that in the case where the pickup head 25 is simply lowered with respect to the chip 7 in the stopped state. While being reduced by the descending speed, the elevating table 29 is further depressed by the extension of the first spring member 31 when the suction tool 25a is in contact. When the pickup head 25 is raised, the lifting table 29 is pulled up by the urging force of the first spring member 31 and the second spring member 26 so that the lifting table 29 returns to the original height.

  In the above configuration, the abutment element 25b, the abutted part 24a, the second abutting part 24b, the push-down part 30a, and the transmission part 30b are moved down to the chip placement part 29a of the lifting table 29 when the pickup head 25 is lowered. Before coming into contact with the chip 7 placed, it is a pre-contact lowering start means for starting the lowering of the lifting table 29.

  The first spring member 31 is a first urging means for urging the elevating table 29 upward via the connecting member 28. The elevating block 24 and the second abutting portion 24b An urging force transmission mechanism that transmits an urging force including an upward urging force component to the lifting table 29 via the first abutting portion 28a is provided by the second spring member 26 that is an urging means.

  Further, the contact 25b, the contacted portion 24a, and the second contact portion 24b are provided in the urging force transmission mechanism with the contact 25b provided on the pickup head 25 when the pickup head 25 is lowered. By abutting against the abutted portion 24a, an urging force transmission releasing mechanism for releasing the transmission of the urging force to the lifting table 29 by the second urging means is provided.

  Even in the configuration shown in the second embodiment, even when the pickup head 25 is lowered with respect to the chip mounting portion at a high speed, the lifting table 29 is lowered to reduce the relative speed at the time of contact, The impact on the chip 7 at the time of contact can be reduced by the buffering action of the first spring member 31. Similarly to the first embodiment, when the pickup head 25 is raised, the lifting table 29 is pulled up by the second spring member 26 via the second contact portion 24b and the first contact portion 28a. The stopper 29b comes into contact with the vertical base 21 and returns to the original position.

  At this time, by appropriately setting the spring strengths of the second spring member 26 and the first spring member 31, the cushioning effect at the time of contact of the suction tool 25 a is ensured, and the return operation of the lifting table 29 is performed. Can be ensured.

  Further, since the dynamic friction coefficient is much smaller than the static friction coefficient, the lifting table 29 starts to descend before the pickup head 25 abuts on the chip 7, so that the sliding guide that guides the lifting and lowering of the lifting unit table 29 is performed. The frictional resistance (sliding resistance) of the part is significantly reduced. Accordingly, the chip mounting portion on which the chip 7 with which the pickup head 25 abuts is placed is smoothly guided by the sliding guide portion with reduced frictional resistance. Thus, excessive damage can be prevented.

The chip pickup method of the present invention has the effect that the impact force when the elevating head comes into contact with the chip can be relaxed, and high speed operation can be performed while avoiding excessive damage to the chip. This is useful for picking up a chip placed on a chip placement unit by a lifting head in a component mounting apparatus or the like.

The front view of the electronic component mounting apparatus of Embodiment 1 of this invention The front view of the component supply part of the electronic component mounting apparatus of Embodiment 1 of this invention Operation explanatory diagram of chip pickup operation in the component supply unit of the electronic component mounting apparatus according to the first embodiment of the present invention. Operation explanatory diagram of chip pickup operation in the component supply unit of the electronic component mounting apparatus according to the first embodiment of the present invention. The front view of the component mounting stage of the electronic component mounting apparatus of Embodiment 2 of this invention Operation explanatory diagram of chip pickup operation in the component mounting stage of the electronic component mounting apparatus according to the second embodiment of the present invention.

Explanation of symbols

5, 25 Pickup head 5a, 25a Adsorption tool 5b, 25b Contact 7 Tip 12, 31 First spring member 13, 29 Lifting table 13a, 30 Force transmission member 15a, 24a Contacted portion 16 Contact member 18 First 2 spring members 28 connecting members

Claims (1)

A chip pick-up method for picking up a chip mounted on a chip mounting unit by a lifting head that moves up and down relative to the chip mounting unit,
An elevating part that elevates and lowers the chip mounting part along the sliding guide part, an abutting element provided on the elevating head, an abutted part against which the abutting element abuts, and the abutted part include A chip having a contact member that moves downward by a movement amount smaller than a movement amount of the contacted portion by lowering, and a force transmission member that pushes down the lifting portion by contacting the contact member Using a pickup device,
Before the elevating head is lowered and comes into contact with the chip placed on the chip placement portion, the contact member comes into contact with the contacted portion, so that the contact member contacts the force transmission member. The tip of the lift is started with a movement amount smaller than the amount of movement of the abutted portion by being pressed down in contact with the tip, and then the tip of the lift head catches up with the drop of the lift portion so that the chip is moved by the lift head. A method for picking up a chip, characterized by picking up a chip.

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