JP4442273B2 - Screen printing plate and method of manufacturing electronic component device using the same - Google Patents

Description

  The present invention relates to a screen printing plate and a method for manufacturing an electronic component device using the same, and in particular, it is possible to generate a soldering phenomenon (bridge phenomenon) due to bleeding of a flux component of solder paste. The present invention relates to a technique for reducing the power consumption.

  For example, a flip chip type bare chip mounting component (SMD) has conventionally been printed with solder paste using a screen printing plate on an electrode pad formed on a substrate such as a semiconductor wafer, and then solder bumps are formed by solder reflow processing. Some have adopted a method of forming. In this case, in recent years, the demand for narrow adjacent printing of solder paste has increased due to the reduction in mounting area accompanying the downsizing of electronic components and the expansion of printing technology for forming solder bumps using solder paste.

On the other hand, in the conventional technology, when the solder paste is screen-printed, the surface of the screen printing plate that comes into contact with the printing body is used to prevent the solder paste from bleeding and the wear of the contact surface with the printing body. Proposals that specify the roughness have also been made (see, for example, Patent Document 1).
JP 2001-277745 A

  By the way, as described above, in order to meet the demands for reducing the mounting area accompanying the recent miniaturization of electronic components, when performing narrow adjacent printing of solder paste, the flux contained in the solder paste at that time There arises a problem that a so-called bridging phenomenon occurs in which solders are joined together due to the exudation of components.

  This will be described with reference to FIG. 15, taking as an example the case where solder bumps are formed on a substrate such as a semiconductor wafer by screen printing.

  A wiring pattern (not shown) and a protective film 6 for protecting the wiring pattern are formed on the surface of the substrate 2 such as a semiconductor wafer to be printed at the time of screen printing. Connected electrode pads 7 are formed. This electrode pad 7 is formed by sequentially laminating Ti / Ni / Au or the like for improving wettability and solderability with the solder paste 3 on the connection electrode 7a formed of Au, Al, Cu or the like. An under bump metal (UBM) 7b is formed.

  Then, the screen printing plate 1 is positioned and arranged on the substrate 2 so that the paste passage hole 1a provided in the screen printing plate 1 and the electrode pad 7 of the substrate 2 coincide with each other. The solder paste 3 is supplied to the screen, and the screen printing is performed by horizontally moving the squeegee 8 on the screen printing plate 1 (see FIGS. 15A-1 and 15B-1). After printing the solder paste 3, the screen printing plate 1 is released from the substrate 2 (see (a-2) and (b-2) in the figure), and then the solder paste 2 is heated and melted by a solder reflow process. Solder bumps 9 are formed (see (a-3) and (b-3) in the figure).

  Here, when the screen printing is performed as described above, the flux component 4 contained in the solder paste 3 causes a capillary phenomenon from a slight gap between the screen printing plate 1 and the substrate 2 around the paste passage hole 1a. Oozes out. When the width w of the portion 1b located between the paste passage holes 1a of the screen printing plate 1 is relatively narrow (for example, when w = 50 μm), when the screen printing plate 1 is released from the substrate 2 The flux component 4 flows out in a large amount due to a capillary phenomenon between the solder pastes 3. At this time, since the solder particles contained in the solder paste 3 flow between the solder pastes 3 together with the outflow of the flux component, printing dripping occurs. In the following, in the screen printing plate 1, a portion located between the paste passage holes 1a is referred to as a rib 1b, and a width w of the rib 1b is referred to as a rib width.

  In particular, as described in the above-mentioned Patent Document 1, when the surface roughness of the contact surface 1c of the screen printing plate 1 with the substrate 2 is small, the oozing range of the flux component 4 is narrowed. Since the ratio of the flux component 4 contained in the solder paste 3 is not changed, the amount of the flux component 4 flowing out between the solder pastes 3 increases as the oozing range of the flux component 4 is narrower.

As described above, when the solder component 3 is heated by the solder reflow process for forming the solder bump 9 in a state where the flux component 4 flows out between the solder pastes 3 in a large amount, the viscosity of the flux component 4 that flows out is reduced. The solder particles contained in the solder paste 3 further flow out into the flux component 4 due to the decrease. As a result, as shown in FIGS. 15A -3 and 15B-3, a bridging phenomenon occurs in which the solder bumps 9 are joined to each other. When such a bridging phenomenon occurs, the product quality is remarkably impaired, for example, the solder bumps are electrically short-circuited to cause a malfunction or become inoperable.

  In addition, when the solder paste 3 is heated and melted by the solder reflow process, solder particles may flow out, so-called heating dripping may occur, but the previous stage, that is, the clean printing plate 1 is released from the substrate 2 as described above. In this case, when printing dripping in which solder particles flow out in the flux component 4 remaining between the solder pastes 3 has already occurred, the viscosity of the solder paste 3 is lowered during heating, so that a bridging phenomenon is more likely to occur. Become.

  The present invention has been made to solve the above-described problems, and in the case of performing narrow adjacent printing of a solder paste using a screen printing plate, the bridge phenomenon caused by the oozing out of the flux component contained in the solder paste. It is an object of the present invention to provide a screen printing plate capable of reducing generation as much as possible, and a method for manufacturing an electronic component device using the same.

In order to achieve the above object, the screen printing plate according to the first aspect of the present invention is a screen printing in which a plurality of paste passage holes for applying a solder paste to a substrate to be printed are formed. Version,
As for the surface roughness of the screen printing plate at the contact surface with the substrate, assuming that the maximum height is Ry and the average solder particle diameter of the solder paste is D50,
0.90μm ≦ Ry ≦ D50 / 2
Set to
And the maximum height of the surface roughness of the portion located between the paste passage holes in the contact surface with the substrate is set to be lower than the maximum height of the surface roughness of the other portions. Screen printing plate featuring.

Method for producing an electronic component device according to a second aspect of the present invention, by using a screen printing plate according to claim 1, comprising the steps of printing a solder paste to the substrate to be printing material, the printing process And a solder reflow process step of performing a solder reflow process later.

According to a third aspect of the present invention, there is provided a method of manufacturing an electronic component device, comprising: printing a solder paste wider than the electrode pad on the electrode pad of the electronic component device using the screen printing plate according to the second aspect. And a solder reflow processing step of forming solder bumps by performing solder reflow processing after the printing step.

A method of manufacturing an electronic component device according to a fourth aspect of the present invention is the method of manufacturing an electronic component device according to the second or third aspect , wherein the solder paste is depressurized between the printing step and the solder reflow processing step. And a vacuum drying step for drying.

According to a fifth aspect of the present invention, there is provided a method of manufacturing an electronic component device according to the fourth aspect of the present invention, in which the printed solder paste is applied in a low oxygen atmosphere during the period from the vacuum drying step to the solder reflow process. It is characterized by being held inside.

  According to the screen printing plate of the first aspect of the invention, since the maximum height Ry of the surface roughness on the side in contact with the substrate of the screen printing plate is set to be in the aforementioned range, the substrate and the rib The exudation range of the flux component outside the gap is widened. As a result, the amount of the flux component remaining between the solder pastes after the release is extremely small. For this reason, printing dripping in which solder particles flow into the flux component remaining between the solder pastes is effectively suppressed. Therefore, even if the solder paste is heated and melted by solder reflow processing or the like and the viscosity of the flux component decreases, the amount of the flux component remaining between the solder pastes is small, so the solder particles flow out as the flux flows between the solder pastes. As a result, the occurrence of the bridging phenomenon is suppressed.

That is, according to the screen printing plate according to the present invention, the flux component preferentially flows out to a region other than the gap between the rib and the substrate during screen printing, so that the flux component remaining between the solder paste after printing is reduced. The occurrence of the bridge phenomenon can be effectively prevented.

According to the method for manufacturing an electronic component device according to the second aspect of the present invention, when the solder paste is printed on the substrate to be printed, the screen printing having the structure according to any one of the first to fourth aspects is performed. Since the plate is used, it is possible to reliably prevent the bridge phenomenon from occurring during the solder reflow process after the solder paste is printed. For this reason, narrow adjacent printing of the solder paste is possible, and further downsizing of the electronic component device can be achieved.

According to a method for manufacturing an electronic component device according to a third aspect of the present invention, when a solder paste is printed on an electrode pad of the electronic component device, screen printing having the configuration according to any one of the first to fourth aspects is provided. Since the plate is used, it is possible to reliably prevent the occurrence of the bridge phenomenon when the solder bump is formed by the solder reflow process after the solder paste is printed. For this reason, the product yield can be improved and the reliability of the product can be increased. In addition, the mounting area can be reduced, and the electronic component device can be further downsized.

According to the method for manufacturing an electronic component device according to the fourth aspect of the present invention, since the solder paste after printing includes a reduced-pressure drying step in which the solder paste is decompressed and dried before the solder reflow process, the reduced-pressure drying step. The flux component contained in the solder paste printed by the volatilization is reduced. For this reason, when performing the solder reflow process, it is possible to further effectively prevent the solder particles from flowing into the flux component remaining between the solder pastes to cause a bridging phenomenon. Thus, the electronic component device can be further reduced in size.

According to the method for manufacturing an electronic component device according to the fifth aspect of the invention, since the printed solder paste is held in a low oxygen atmosphere during the period from the vacuum drying step to the solder reflow process, the surface of the solder particles is oxidized. Therefore, it is possible to reliably prevent the generation of voids in the solder, and to improve the reliability during solder joining.

  FIG. 1 is a perspective view showing a part of a screen printing plate according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG.

  The screen printing plate 1 of Example 1 is a flat metal mask made of a metal such as Ni and having a thickness of, for example, about 50 μm, and a plurality of pieces for applying a solder paste to a substrate to be printed. The paste passage hole 1a is formed. In this case, the paste passing holes 1a are rectangular in this example. However, the paste passing holes 1a are not limited to such rectangular shapes, and may be square, circular, elliptical, or other shapes. Good. The screen printing plate 1 is set such that the rib width w of the ribs 1b located between the paste passage holes 1a is at least 30 μm.

Further, the surface roughness of the contact surface 1c the screen printing plate 1 is in contact with the substrate, the maximum height Ry (JIS B 0601 compliant), the average solder particle size of the solder paste when the D _{50,
0.90μm ≦ Ry ≦ D 50/2} (1)
It is formed to satisfy the conditions. The method for adjusting the surface roughness in this case is not particularly limited, and treatments such as polishing, sand blasting, and etching can be appropriately employed.

  The reason why the surface roughness Ry on the contact surface 1c with the substrate of the screen printing plate 1 is set so as to fall within the range (1) will be described next.

  FIG. 3 shows the bleed distance when the flux component oozes out in a portion other than the gap between the substrate and the rib when the solder paste is screen printed using a screen printing plate having a minimum rib width w of 30 μm. The results of examining the relationship with the occurrence rate of the bridge phenomenon when the solder reflow process is performed after printing are shown.

  From this result, it can be seen that the oozing distance of the flux component necessary to make the occurrence rate of the bridge phenomenon zero is 40 μm or more.

  FIG. 4 shows the maximum height Ry of the surface roughness at the contact surface 1c of the screen printing plate 1 with the substrate and the oozing distance when the flux component oozes out in a portion other than the gap between the rib 1b and the substrate. The result of investigating the relationship is shown.

  From FIG. 4, the maximum height Ry and the oozing distance of the flux component can be organized by a linear regression equation. Therefore, when the exuding distance of 40 μm of the flux component necessary to make the above-mentioned bridging phenomenon occurrence rate zero is substituted for this result, the maximum height Ry of the surface roughness that can be achieved by the exuding distance of 40 μm is Ry = 0.90 μm. That is, if the maximum height Ry of the surface roughness of the contact surface with the substrate of the screen printing plate 1 is 0.90 μm or more, the residual amount of the flux component between the solder pastes is reduced and the occurrence of the bridge phenomenon is suppressed. can do.

  On the other hand, if the surface roughness of the contact surface 1c with the substrate of the screen printing plate 1 is too large, the solder particles easily flow out between the solder paste together with the flux component at the time of printing, causing printing dripping or a bridge phenomenon. End up. Therefore, it is necessary to set an upper limit for the maximum height Ry of the surface roughness.

Here, the particle size distribution of the solder particles contained in the solder paste is normally a normal distribution in which the left and right are line symmetric as shown in FIG. When defining the solder particle diameter corresponding to cumulative frequency of 50% in the distribution curve with an average solder particle diameter D _50, by setting so that the above Ry to D _50/2 the following values, at the time of printing Since almost no solder particles flow out between the solder pastes, it is possible to suppress the occurrence of printing dripping or bridging.

  Next, a method of forming solder bumps on a substrate when manufacturing an electronic component device using the screen printing plate having the above-described configuration will be described with reference to FIG. In addition, the board | substrate of the electronic component apparatus said below is a wide concept including the board | substrate which comprises an electronic component and a semiconductor device, board | substrate single-piece | units, such as a semiconductor wafer for electronic components and a semiconductor device, or a wiring board.

On the surface of the substrate 2, a wiring pattern (not shown) and a protective film 6 made of SiN, SiO ₂ , polyimide, etc. are formed in advance to protect the wiring pattern. Connected electrode pads 7 are formed. This electrode pad 7 is an underlayer formed by sequentially laminating Ti / Ni / Au or the like for improving wettability and solderability with the solder paste 3 on a connection electrode 7a formed of Au, Al, Cu or the like. A bump metal (UBM) 7b is formed (see FIGS. 6A-1 and 6B-1).

  Then, the screen printing plate 1 is positioned on the substrate 2 so that the paste passage hole 1a provided in the screen printing plate 1 according to the present invention and the electrode pad 7 of the substrate 2 match. In this state, the solder paste 3 is supplied onto the screen printing plate 1 and the screen printing is performed by horizontally moving the squeegee 8 on the screen printing plate 1 (FIGS. (A-2) and (b-2)). ). After the solder paste 3 is printed, the screen printing plate 1 is released from the substrate 2 (see (a-3) and (b-3) in the figure), and then the solder paste 3 is heated and melted by a solder reflow process. Solder bumps 9 are formed (see FIGS. 4A and 4B).

  When screen printing is performed, the flux component 4 contained in the solder paste 3 oozes out into a slight gap between the paste passage hole 1a and the substrate 2 around it. However, if the maximum height Ry of the surface roughness on the contact surface 1c of the screen printing plate 1 with the substrate 2 is set as in the above condition (1), the oozing range of the flux component other than the rib 1b Therefore, when the screen printing plate 1 is released from the substrate 2, the amount of the flux component 4 remaining between the solder pastes 3 becomes extremely small. For this reason, printing dripping in which solder particles flow out into the flux component 4 remaining between the solder pastes 3 is effectively suppressed.

  Therefore, even if the solder paste 3 is heated and melted by solder reflow processing thereafter, the amount of the flux component 4 remaining between the solder pastes 3 is small, so that solder particles hardly flow out into the flux 4. As a result, the solder bumps 9 are individually formed on the electrode pads 7 and no bridging phenomenon occurs. In addition, since it is possible to effectively suppress the occurrence of the bridging phenomenon when the rib width w is 30 μm or more, it is possible to sufficiently meet the current requirements for narrow adjacent printing of the solder paste 3.

A specific example of screen printing using the screen printing plate 1 having the configuration shown in FIG. 1 will be described. First, the screen printing plate 1 has a short side of the paste passage hole 1a of 100 μm and a long side of 100 μm. A rectangular shape of 180 μm, a rib width w of 50 μm at the minimum, and a maximum surface roughness Ry at the contact surface 1c with the substrate 2 of Ry = 4.5 μm were used. As the solder paste 3, one having a solder composition of Sn-3.5Ag and an average solder particle diameter of 11 μm was used. At this time, the electrode pad 7 formed on the substrate 2 has a connection electrode 7a of φ50 μm and an under bump metal (UBM) 7b of φ70 μm.

  After the screen printing plate 1 was positioned and arranged on the substrate 2 so that the paste passage hole 1a and the electrode pad 7 matched, screen printing was performed. At that time, the flux component 4 of about 200 μm oozed out on the substrate 2. Thereafter, pre-heat treatment at 160 ° C. for 90 seconds is performed as solder reflow treatment, followed by main heat treatment at 260 ° C. for 30 seconds in an atmosphere having an oxygen concentration of 200 ppm or less, followed by cooling to clean the residual flux. went. As a result, the solder bump 9 having a height of about 75 μm could be formed without causing a bridging phenomenon. Subsequently, the individual electronic components can be divided by cutting the substrate 2 with a dicing saw along dicing grooves (not shown).

  FIG. 7 is a cross-sectional view illustrating a state in which the screen printing plate according to the second embodiment is positioned on the substrate of the electronic component device.

The feature of the screen printing plate 1 in this Example 2 is that the maximum height of the surface roughness of the rib 1b portion located between the paste passage holes 1a among the surface roughness of the contact surface 1c with the substrate 2 is as follows. That is, it is set lower than the maximum height of the surface roughness of other portions. That is, when the maximum height of the surface roughness of the rib 1b portion is Ry ₁ and the maximum height of the surface roughness of other portions is Ry, Ry ₁ <Ry is set.

  According to the screen printing plate 1 in the second embodiment, the flux component preferentially flows out to a region other than the gap portion between the rib 1b and the substrate 2 during screen printing, so the flux remaining between the solder paste after printing. The component is reduced, and the occurrence of the bridge phenomenon can be effectively prevented.

  FIG. 8 is a cross-sectional view illustrating a state in which the screen printing plate according to the third embodiment is positioned on the substrate of the electronic component device.

  The feature of the screen printing plate 1 in this Example 3 is that the surface of the rib 1b portion located between the paste passage holes 1a in the contact surface 1c with the substrate 2 is subjected to water repellent treatment. As the water repellent treatment, for example, fluorine processing is performed.

  According to the screen printing plate 1 in the third embodiment, the flux component preferentially flows out to the region other than the surface of the rib 1b subjected to the water repellent treatment at the time of screen printing. The flux component remaining between the solder pastes is reduced, and the occurrence of the bridging phenomenon can be effectively prevented.

  In the first to third embodiments, after the solder paste 3 is printed using the screen printing plate 1 having the configuration shown in FIGS. 1 and 2, the solder reflow process is performed as it is to form the solder bumps 9. Yes.

  In contrast, the fourth embodiment includes a reduced-pressure drying step in which the solder paste is decompressed and dried between the step of printing the solder paste and the step of performing the solder reflow process. For example, in the case of Example 1, after the screen printing, after releasing the plate from the substrate 2 (FIGS. 6A-3 and 6B-3), the solder bumps 9 are formed by the solder reflow process. (FIGS. 6A-4 and 6B-4) Before the solder reflow process is performed, the solder paste 3 is decompressed and dried as shown in FIG.

  That is, as shown in FIG. 9A, the substrate 2 on which the solder paste 3 is printed (for example, in the state of FIGS. 6A-3 and 6B-3) is disposed in the chamber 12, The inside of the chamber 12 is depressurized by the vacuum pump 14 through the on-off valve 13, and in this state, the solder paste 3 is dried for a predetermined time to volatilize the flux component contained in the solder paste 3. For example, the chamber 12 is dried at a temperature of 25 ± 5 ° C. under a reduced pressure of about 10 Pa for a predetermined time. After the solder paste 3 is dried under reduced pressure, next, as shown in FIG. 9B, the solder bumps 9 are formed by conducting the solder reflow process by energizing and heating the upper and lower heaters 15 and 16. As the solder reflow process, for example, a pre-heat treatment of 160 ° C. × 90 seconds is performed, and then a main heat treatment of 260 ° C. × 30 seconds is performed, followed by cooling.

  FIG. 10 is a characteristic diagram showing the relationship between the rib width w of the screen printing plate 1 and the reduced pressure drying time necessary to effectively prevent the occurrence of the bridge phenomenon, and FIG. 11 is the relationship between the reduced pressure drying time and the flux component volatilization amount. FIG.

  As can be seen from FIGS. 10 and 11, the occurrence of the bridging phenomenon due to the oozing out of the flux component is caused by the distance between the adjacent solder pastes 3 (that is, the rib width w of the screen printing plate 1). Therefore, it is necessary to increase the volatilization amount of the flux component by setting the reduced-pressure drying time to be longer as the distance between adjacent portions is narrower. For example, when the rib width w is 50 μm, a reduced-pressure drying treatment of about 3 minutes is required, and the minimum volatilization amount of the flux component necessary for suppressing the bridge phenomenon is 10 wt% or more / flux component amount. In addition, as shown in FIG. 10, if the rib width w is 130 μm or more, no bridging phenomenon occurs even if the drying is not particularly performed under reduced pressure.

  As described above, the fourth embodiment includes a reduced-pressure drying step in which the solder paste 3 is dried under reduced pressure before the solder paste 3 after printing is subjected to the solder reflow process. The contained flux component volatilizes and decreases. For this reason, when the solder reflow process is performed, it is possible to effectively prevent the solder particles from flowing into the flux component remaining between the solder pastes 3 and causing a bridge phenomenon. As a result, narrow adjacent printing of the solder paste 3 becomes possible, and the electronic component device can be further miniaturized.

  In the above-described fourth embodiment, a reduced-pressure drying step of drying the solder paste 3 under reduced pressure is included between the step of printing the solder paste 3 and the step of performing the solder reflow process. The printed solder paste 3 is kept in a low oxygen atmosphere during the period from the reduced-pressure drying step after the printing of the solder paste 3 to the end of the solder reflow process.

  That is, as shown in FIG. 12A, first, the substrate 2 on which the solder paste 3 is printed (for example, in the state of FIGS. 6A-3 and 6B-3) is installed in the chamber 12. Then, the inside of the chamber 12 is depressurized by the vacuum pump 14 through the on-off valve 13, and in this state, the solder paste 3 is dried for a predetermined time to volatilize the solvent contained in the solder paste 3. For example, the chamber 12 is dried at a temperature of 25 ± 5 ° C. under a reduced pressure of about 10 Pa, for example, for 3 minutes.

  After the solder paste 3 is dried in this way, next, as shown in FIG. 12B, nitrogen gas is introduced into the chamber 12 through the on-off valve 13, and the chamber 12 is filled with a low oxygen atmosphere. Replace with. The low oxygen atmosphere in this case means an atmosphere having an oxygen content equal to or lower than the volume content corresponding to 1% by volume in a gas at atmospheric pressure, and the volume content ratio (% by volume) is under atmospheric pressure under reduced pressure. Higher than the case.

  Subsequently, with the low oxygen atmosphere maintained, as shown in FIG. 12C, the upper and lower heaters 15 and 16 are energized and heated to perform solder reflow processing to form solder bumps 9. . As the solder reflow process, for example, a pre-heat treatment of 150 ° C. × 60 seconds is performed, and then a main heat treatment of 260 ° C. × 30 seconds is performed. Thereafter, as shown in FIG. 12 (d), the substrate 2 after the formation of the solder bumps 9 is cooled and taken out from the chamber 12.

FIG. 13 shows a case where solder bumps 9 are formed by drying solder paste 3 under reduced pressure, and then once exposing it to the atmosphere and performing a solder reflow process in a N ₂ atmosphere (low oxygen atmosphere) using different equipment (reference numeral in the figure). V1) and the case where the solder paste continuously printed in the same processing section is kept in a low oxygen atmosphere between the reduced pressure drying and the solder reflow processing as in the fifth embodiment (reference numeral V2 in the figure). FIG. 5 is a characteristic diagram showing a comparison of the results of examining the difference in the number of voids generated in the solder bumps 9 using bar graphs. Here, an experimental result is shown in the case where 20 solder bumps having a height of 100 μm are formed on an electrode pad having a size of φ100 μm for each processing method.

  As can be seen from the results of FIG. 13, when the solder bump 3 is formed by drying the solder paste 3 under reduced pressure and then performing a solder reflow process in a low oxygen atmosphere of different equipment, about 80 of 20 bumps are formed. Voids are generated at a rate. Moreover, a large void having a diameter of 15 μm or more is also generated. On the other hand, when the printed solder paste 3 is held in a low oxygen atmosphere from the drying under reduced pressure to the solder reflow process, the generation rate becomes about 1/4, and the large size of φ15 μm or more. The generation of voids is also suppressed.

  Thus, in this Example 5, the printed solder paste was treated with low oxygen during the period from the reduced-pressure drying process to the end of the solder reflow process (the period shown in FIGS. 12A to 12C). Since it is kept in the atmosphere, it is possible to prevent the oxidation of the solder particle surface from being promoted by exposing the solder particles contained in the solder paste 3 to the atmosphere before the solder reflow process. As a result, the generation of water caused by the oxidation / reduction reaction between the oxide film on the surface of the solder particles and the flux component is suppressed, so that the generation of voids in the solder bumps 9 can be reduced. As a result, it is possible to improve the reliability at the time of soldering.

  In the first to fifth embodiments, the method for forming the solder bump 9 on the substrate 2 when manufacturing the electronic component device has been described. However, the present invention is not limited to this, for example, as shown in FIG. After the solder paste 3 is printed on the land pattern formed on the mounting substrate 17 using the screen printing plate 1 according to the present invention (see FIG. 5A), the solder paste 3 and the electronic component are printed. The electronic components 18 are arranged on the mounting substrate 17 in correspondence with the electrode pads formed on the substrate 18 (see FIG. 5B), and the solder paste 3 is heated and melted by a solder reflow process. The present invention can also be applied to the case of manufacturing an electronic component device by connecting.

  In this case, when the surface-mount type electronic component 18 is mounted on the substrate 17, the solder paste 3 printed on the substrate 17 is crushed and spreads in the plane direction. L corresponds to the rib width w described in the first to fifth embodiments. Therefore, regarding the reduced-pressure drying time and flux component volatilization amount necessary for suppressing the bridge generation shown in FIGS. 10 and 11, the interval L between the solder pastes 3 after being crushed is regarded as the rib width w. Can be obtained.

  In the above Examples 1 to 5, the case where the solder paste 3 is applied to the substrate 2 by a printing method such as screen printing has been described as an example, but the present invention is not limited to the supply method by printing, For example, the present invention can be applied to other supply methods such as transfer and dispenser.

It is a perspective view which cuts out and shows a part of screen printing plate in Example 1 of the present invention. It is sectional drawing which follows the AA line of FIG. It is a characteristic view showing the result of examining the relationship between the bleeding distance of the flux component during clean printing and the occurrence rate of the bridging phenomenon when the solder reflow process is performed after printing. It is a characteristic view which shows the result of having investigated the relationship between the maximum height Ry of the surface roughness in the contact surface with the board | substrate of a screen printing plate, and the bleeding distance of the flux component at the time of screen printing. It is a particle size distribution curve of the solder particle contained in a solder paste. It is explanatory drawing of the method of forming a solder bump on substrates, such as a semiconductor wafer, using a screen printing plate. It is sectional drawing which shows the state which positioned and arranged the screen printing plate in Example 2 of this invention on a board | substrate. It is sectional drawing which shows the state which positioned and arranged the screen printing plate in Example 3 of this invention on a board | substrate. It is explanatory drawing which shows the manufacturing method of the electronic component apparatus in Example 4 of this invention. It is a characteristic view showing the relationship between the rib width of the screen printing plate and the vacuum drying time necessary for effectively preventing the occurrence of bridging phenomenon. It is a characteristic view which shows the relationship between reduced-pressure drying time and flux component volatilization amount. It is explanatory drawing which shows the manufacturing method of the electronic component apparatus in Example 5 of this invention in order of a process. In Example 5 of the present invention, during the period from the reduced pressure drying to the solder reflow process, the printed solder paste was held in a low oxygen atmosphere, and after the reduced pressure drying, the solder reflow process was performed in the air. It is a characteristic view which compares the result of investigating the generation | occurrence | production number of the void of a solder bump by the case with a bar graph. It is explanatory drawing at the time of arrange | positioning a surface mounting type electronic component on the solder paste printed on the mounting board | substrate, and performing a solder reflow process. It is explanatory drawing of the method of forming a solder bump on a board | substrate using the conventional screen printing.

Explanation of symbols

1 Screen printing plate 1a Paste passage hole 1b Rib 1c Contact surface with substrate 2,17 Substrate 3 Solder paste 4 Flux component 7 Electrode pad 9 Solder bump w Rib width of screen printing plate

Claims (5)

A screen printing plate in which a plurality of paste passage holes for applying a solder paste to a substrate to be printed is formed,
As for the surface roughness of the screen printing plate at the contact surface with the substrate, the maximum height is Ry, and the average solder particle diameter of the solder paste is D50.
0.90 μm ≦ Ry ≦ D50 / 2
Set to
And the maximum height of the surface roughness of the portion located between the paste passage holes in the contact surface with the substrate is set to be lower than the maximum height of the surface roughness of the other portions. Screen printing plate featuring. A step of printing a solder paste on a substrate to be printed using the screen printing plate according to claim 1 , and a solder reflow processing step of performing a solder reflow processing after the printing step. A method for manufacturing an electronic component device. Using the screen printing plate according to claim 1, a solder bump is formed by printing a solder paste on an electrode pad of an electronic component device wider than the electrode pad, and performing a solder reflow process after the printing process. And a solder reflow process for forming the electronic component device. 4. The method of manufacturing an electronic component device according to claim 2 , further comprising a reduced-pressure drying step of drying the solder paste under reduced pressure between the printing step and the solder reflow treatment step. Device manufacturing method. 5. The method of manufacturing an electronic component device according to claim 4 , wherein the printed solder paste is held in a low oxygen atmosphere during a period from the vacuum drying step to the solder reflow process.

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