JP4432221B2 - Method for manufacturing casing for electronic device and method for manufacturing electronic device - Google Patents

Description

（以下、ＯＢＡ成分と略す）が含まれ、しかもそれが全体の５０モル％以上を占めている（例外として、このＯＢＡ成分を含んでいないものもある）。
【００２２】
このように共重合体でかつ５０モル％以上が前記ＯＢＡ成分であることが、本発明にとって好都合な有用な性質を示すことになる。
【００２３】
液晶ポリエステルの結合様式は一般にはエステル結合のみ（ポリエステル）であるが、さらに、アミド結合やイミド結合、カーボネート結合、ウレタン結合等が導入される場合もある。
【００２４】
液晶ポリマーは、エポキシ樹脂に比べてハロゲン等の環境を害する物質を用いないので、環境を損なわず、使用上の問題は生じない。
【００２５】
また、この液晶ポリマーは、成形時に分子鎖が流動方向に配向して補強効果が生じ、高い強度と弾性率が得られる。そして弾性率が高いにもかかわらず、優れた振動吸収特性を示し、特に流動方向の線膨張率は通常のプラスチックよりずっと小さく、金属に匹敵するものとなり、厚みの薄い成形品ほど表層の配向層の占める割合が大きく、薄肉になるほど、大きな強度と弾性率が得られる。その他、緻密な結晶構造をもっているので、融点が比較的低いにもかかわらず、高い荷重たわみ温度、連続使用温度、耐熱性や低い吸水率も示す（図４参照）。
【００２６】
（Ｂ）工程：
化学アルカリエッチング工程であり、液晶ポリマー筐体の表面を適度に粗らし、投錨効果により、後述の金属めっき膜の密着性を高めるのが目的である。この処理に用いるアルカリとしては、たとえば水酸化カリウムなど好ましい。なお、このエッチング処理は、筐体１の内外両面１ａ、１ｂに施されるが、このエッチングは本発明では必ずしも必要ではない。
【００２７】
（Ｃ）工程：
これは二次側成形工程であって、筐体１の内面１ａにたとえばポリビニルアルコール２を所定のマスクを用いて所望の箇所に付着させる。この材料は水や湯に溶け易い材料で、これにより被覆された部分は、後述するように触媒が付かず、従って金属めっきが付かない部分となる。
【００２８】
（Ｄ）工程：
パターンを用いて触媒処理をする工程である。これにはたとえば触媒として塩化パラジウムが用いられ、この触媒は前記ポリビニルアルコールで被われない箇所（一次材料のむき出し部分）１ｂ、１ｃに浸透する。
【００２９】
（Ｅ）工程（図２参照）：
二次側溶解の工程である。前述したように水や湯を用いてポリビニルアルコール２を溶解する。
【００３０】
（Ｆ）工程：
金属めっきを行う工程である。その方法はとくに制約を受けないが、実用上、無電解めっき法が好ましい。めっき層の構成も単層でも複数層でもよい。また、めっきする金属も当分野で公知のものでよい。たとえば３層の構成としてＡｕ／Ｎｉ／Ｃｕ／母材面とするのがよい。
【００３１】
この金属めっきを施すことによって、筐体１の内面１ａには触媒層１ｃのパターン上に回路パターン３が形成されるとともに、外面１ｂ、いわゆる体裁面が金属めっき膜４で覆われることになる。なお、上記回路パターン３の形成と上記外面１ｂのめっき膜形成工程とは個々に行なうことも可能であるが、効率面からすれば、同時に行なうことが好ましい。
【００３２】
（Ｇ）工程：
筐体内面１ａに対してレジスト処理とはんだ処理を行ない、はんだ５は前記回路パターン３上に、またレジスト６はめっき膜の被われていない部分に形成される。
【００３３】
（Ｈ）工程：
ここでは、外面１ｂ側には、金属めっき膜４上にたとえばスプレー塗装法やローラコートを行なって、塗膜７を形成する。この外面１ｂには前記（Ｆ）工程においてめっき膜４が既に形成されており、これに塗膜７が強く付着する。
【００３４】
（Ｉ）工程：
前記はんだ５の部分に電子部品、たとえば抵抗チップ８を固着させる。この際、熱を加えてはんだ５をリフローさせることが必要である。
【００３５】
（Ｊ）工程：
こうして製作した下ケース９と、上記したと同様の別の工程で体裁面に金属めっき及び塗装を施した上ケース１０とを接合する。この接合には、たとえば超音波振動ホーン（振動部）１１をあてがって、超音波溶着法を実施するのがよい。
【００３６】
以上は本発明の好ましい一実施形態を示したのにすぎず、本発明はその要旨を外れない限りにおいて、種々の実施形態とり得るものである。
【００３７】
【実施例】
次に、実施例について更に具体的に本発明を説明するが、本発明がそれに限定されることは言うまでもないことである。
【００３８】
実施例１
（１）樹脂成形体の製造
粉末状液晶ポリエステル（ポリプラスチック（株）製、ベクトラ）を押出機により温度３００〜３６０℃で溶融混練し、６ｍｍφのペレットを得た。その際、押出機のスクリュー回転数は樹脂の発熱、分解を防ぐため、５００ｒｐｍ以下とした。
【００３９】
次に、図５に示したような射出成形機（東芝社製（１Ｓ７５Ｅ）を用いて、そのホッパーに上記ペレットを投入し、射出シリンダーの温度を２５０〜３３０℃（ホッパー側から金型側にかけて段階的に昇温させた）、金型温度を１５０℃、射出圧を１４０ｋｇ／ｃｍ²に保持して、図６に示すような筐体を成形した。そして前記液晶ポリエステルの種類を変えるか、又は添加物を加えるか、更には成形品を表面処理（アルカリエッチング、本発明に基づくめっき処理等）することによって下記の７種の筐体試料を用意した。
【００４０】
（１）Ｃ８２０（表面性向上メッキグレード）
（２）Ａ４１０（低異方性グレード）
（３）Ａ９５０（無充填グレード）
（４）Ｂ１３０（ガラス繊維強化超高剛性グレード）
（５）ＬＣＸ３６４（流動性改善グレード）
（６）Ｃ８１０（標準めっき（Ｃｕ／Ｎｉ／Ａｕ）グレード）
：本発明品に相当
（７）Ｃ８１０（表面アルカリエッチング＋めっき処理品）
：本発明品に相当
【００４１】
塗装条件：
前記試料を、下記２種類の塗料を別々に用いて塗装した。なお、この塗装に先立って、その表面をイソプロピルアルコール（ＩＰＡ）で丹念に拭いた。
（イ）アクリル／シリコン系塗料（アルティパワールド、武蔵塗料社製）
配合比：主剤（アンチパワールド・ブラック７８７）：硬化剤（７８７−１０Ｂ）：シンナー（アンチパワールドシンナ−２７８８５）＝１０：１：８（重量比）
（ロ）無電解めっき用プライマー（ＭＰＣスーパープライマー）
配合比：主剤（スーパープライマークリヤー）：硬化剤（８９５４ＮＹ）：シンナー（スーパープライマーシンナー２８６８）＝１０：１：４（重量比）
注）ただし、括弧内の数値は品番を指す。
【００４２】
（３）試験項目及び条件：
下表の条件で塗膜の剥離及び付着性の試験を行った。
【表１】

【００４３】
（４）試験結果
上記試験の結果のうち、塗料としてアクリル／シリコン系塗料を用いた場合を、下表に示す。
【表２】

○…合格 ×…剥離
注）３ケの試料のうち、全てが良品の場合に「○」、１ケでも不良な場合は「×」
とした。
【００４４】
上記に明らかなように、筐体の非めっき面では塗膜が一様に剥離したが、めっき面では塗膜の付着力が強く、外装品として良好な結果を示した。なお、塗料として無電解めっき用プライマーを用いた場合も、上記と同様の結果が得られた。
【００４５】
【発明の作用効果】
本発明は上述した如く、筐体となる液晶ポリマー成形体に金属膜を無電解めっきで形成して、筐体内面に配線パターンを形成すると共に筐体外面に金属膜を形成し、この金属膜の表面に塗装を施すので、従来技術では得られなかった付着力の大きな、剥離し難い塗膜を工数少なくして得ることができる。
【００４６】
そして、特に電子、電気製品向けには、液晶ポリマー成形体の外面塗装時にその内面に配線回路用の非塗装部分を残しておくことによって、塗装部は外観向上用に、非塗装部は電子回路等の機能用と、外観と機能の一体化した商品価値の高い樹脂成形体を高い効率で提供することが可能である。
【図面の簡単な説明】
【図１】本発明に基づく筐体作製工程を順次示す縦断面図である。
【図２】同、工程の続きを示す縦断面図である。
【図３】同、工程の更に続きを示す縦断面図である。
【図４】液晶ポリマーの物性を他高分子化合物と比較して示す表である。
【図５】本発明に基づいて筐体を成形するための射出成形機とその動作を示す概略断面図である。
【図６】同、成形された筐体の斜視図である。
【符号の説明】
１…筐体、１ａ…内面、１ｂ…外面、１ｃ…触媒浸透部、
２…ポリビニルアルコール、３…回路パターン、４…金属めっき膜、
５…はんだ、６…レジスト、７…塗膜、８…チップ、９…下ケース、
１０…上ケース、１１…ホーン、１８…キャビティ、１９…スクリュー、
２０…射出成形機、２１…固定型、２２…可動型、２３…射出シリンダー、
２４…ペレット、２５…ホッパー、２６…ヒーター[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an electronic device casing and a method for manufacturing an electronic device .
[0002]
[Prior art]
Recently, electronic component casings, especially memory stick casings, have been required to be thin, and liquid crystal polyester has been used as a casing material in order to improve rigidity and mechanical strength and to ensure thin moldability. became.
[0003]
This liquid crystal polyester has various excellent properties in terms of physical properties such as heat resistance, mechanical properties, and electrical properties.
[0004]
[Problems to be solved by the invention]
However, on the other hand, since this liquid crystalline polyester is inert and has good solvent resistance, it is difficult to add a colorant to the pellets or to coat the surface of the molded product. In particular, in the latter case, there was a problem that even though the coating was possible, the adhesion of the coating film was weak and it was easy to peel off.
[0005]
As a result, many of the coated molded articles were low in commercial value and were unsuitable as exterior products. In this way, liquid crystal polyester cannot be coated with only one coat of the top coat, so it is necessary to increase the number of processes, such as etching the surface or combining a primer and top coat. It was. For example, by using chlorinated polyolefin / acrylic as a primer and coating acrylic / urethane as a top coating, the adhesion of the coating is improved, but the primer is a halogen compound and is not suitable for use from the environmental viewpoint.
[0006]
The present invention has been made to improve the above circumstances, and its purpose is to reduce the number of steps to obtain a highly adhesive coating film, and to provide both an exterior and a function particularly for use in electronic products. satisfied, and a manufacturing method of the working efficiency is high and environmentally adverse effect without resin electronics housing, and to provide a manufacturing method of an electronic device.
[0007]
[Means for Solving the Problems]
That is, the present invention is a method of forming a metal film (especially a metal plating film) on a molded body made of a liquid crystal polymer such as liquid crystal polyester and coating the surface of the metal film, and comprising a housing for an electronic device. A step of forming a main body portion with a liquid crystal polymer , a step of attaching a mask to a predetermined pattern on the inner surface of the main body portion with the outer surface of the main body portion exposed, and a step of forming the main body portion exposed at the opening of the mask. Electroless plating of the inner surface and the exposed outer surface of the main body, the step of removing the mask, the catalyst processing portion of the predetermined pattern on the inner surface of the main body and the catalytic processing portion of the outer surface of the main body And forming a wiring having the same pattern as that of the catalyst processing portion on the inner surface of the main body, forming a metal film on the outer surface of the main body, and applying a coating to the surface of the metal film. , Those relating to the manufacturing method of the child device housing.
[0008]
The present invention also relates to a method of forming a metal film (particularly a metal plating film) on the surface of a molded body made of a liquid crystal polymer such as liquid crystal polyester, and further coating the metal film. When manufacturing an electronic device constituted by a first casing connected and fixed to wiring and a second casing joined to the first casing so as to accommodate the electronic component in an internal space,
By the manufacturing method according to any one of claims 1 to 6 , the first casing is manufactured,
A step of molding the main body of the second casing with a liquid crystal polymer , a step of catalytically treating the outer surface of the main body, a step of electrolessly plating the catalytically treated portion to form a metal film, The second casing is produced by a process of coating the surface of the metal membrane,
Solder is formed on the wiring on the inner surface of the first housing, and after the electronic components are connected and fixed by the solder, the second housing is joined to the first housing;
An electronic device manufacturing method is also provided.
[0009]
According to the present invention, a metal film is formed by electroless plating on a liquid crystal polymer molded body serving as a housing, a wiring pattern is formed on the inner surface of the housing, and a metal film is formed on the outer surface of the housing. Since the coating is applied to the surface, etching treatment, primer, and top coating are applied to the liquid crystal polymer molded body with excellent solvent resistance but poor paint adhesion through a metal film with good adhesion to the paint. There is no need for only one coat, that is, with a small number of man-hours, it is possible to form a coating film that has high adhesion and is difficult to peel off, and a coated product having this coating film can be obtained efficiently.
[0010]
And especially for electronic and electrical products, by leaving the non-painted part for the wiring circuit on the inner surface when painting the outer surface of the liquid crystal polymer molded body, the painted part is used for improving the appearance and the non-painted part is used for the function. In addition, it is possible to provide a resin product with a high commercial value that integrates appearance and function with high efficiency (reduction of man-hours and assembly parts).
[0011]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, it is desirable that the liquid crystal polymer is a liquid crystal polyester excellent in fluidity during molding. In addition, when the characteristics (continuous use temperature, thermal expansion coefficient, water absorption rate) of the liquid crystal polymer (LCP) are compared with those of other polymers, they are as shown in FIG. 4, but all exhibit excellent physical properties. This makes it possible to form an ultra-thin casing having an average wall thickness of 0.3 mm or less by utilizing high fluidity, high rigidity, and the like, and the device can be reduced in size and thickness.
[0012]
Further, it is desirable that the molded body is a casing of an electronic device, and the coating is applied to the appearance surface of the casing.
[0013]
The casing is not limited by the shape, but is usually a memory stick casing or a cellular phone casing.
[0014]
In the present invention, metal plating films are respectively formed on an inner surface and an outer surface of the casing made of the liquid crystal polymer, and among these, the metal plating film on the inner surface is used for a wiring circuit, and the coating is applied to the metal plating film on the outer surface. It is preferable to apply. In this way, the wiring circuit (and the connector) and the housing (including the exterior) can be integrated, so that the number of parts, the number of assembly steps can be reduced, and the cost can be reduced.
[0015]
Furthermore, when carrying out the coating method of the present invention, a step of directly forming the wiring circuit on the inner surface of the casing by a MID (Mold interconnect device) forming method, and forming the metal plating film on the outer surface of the casing It is preferable to perform the step of performing simultaneously. That is, an electronic circuit is formed on the inner surface of the liquid crystal polymer casing by metal plating by the MID forming method, and at the same time, metal plating is also applied to the front surface on the exterior surface side. It is better to coat with a coat.
[0016]
And for electronic and electrical products, it is preferable to mount an electronic component on the wiring circuit on the inner surface of the casing.
[0017]
Next, the present invention will be described in detail with reference to the drawings as appropriate based on preferred embodiments.
[0018]
1, 2 and 3 show a flow of a preferred coating method of the present invention, and this flow comprises steps from (A) to (J).
[0019]
(A) Process:
Reference numeral 1 denotes a memory stick case (see also FIG. 6). This case 1 is made of a liquid crystal polymer such as liquid crystal polyester, and is mainly manufactured by injection molding. FIG. 5 shows an injection molding machine 20 used for this injection molding, and its operation is as follows.
[0020]
(1) Mold closing: Confirm that there is no foreign matter and close the fixed mold 21 and the movable mold 22 which are molds at a low pressure.
(2) Mold clamping: The fixed mold 21 and the movable mold 22 are clamped at a high pressure so as not to be opened by the injection pressure.
(3) Injection: The liquid crystal polymer pellets 24 introduced into the injection cylinder 23 equipped with the screw 19 through the hopper 25 are melted by the heater 26, and this melt is injected into the cavity 18 through the screw 19.
(4) Holding pressure: The pressure in the injection cylinder 23 is kept high.
(5) Cooling hardening (plasticization): The pressure in the injection cylinder 23 is lowered, and the liquid crystal polymer in the movable mold 22 is heated and plasticized.
(6) Mold opening: Opening the fixed mold 21 and the movable mold 22 (7) Mold release and molding.
[0021]
Although it does not specifically limit as a liquid crystal polymer, For example, liquid crystal polyester is preferable. This liquid crystalline polyester can be selected from various known ones, which is a copolymer of two or more types of monomers, almost all of which

(Hereinafter abbreviated as OBA component), and it occupies 50 mol% or more of the whole (except for this, there are some which do not contain this OBA component).
[0022]
Thus, it is a copolymer and more than 50 mol% is the said OBA component, The useful property convenient for this invention will be shown.
[0023]
The bonding mode of the liquid crystal polyester is generally only an ester bond (polyester), but an amide bond, an imide bond, a carbonate bond, a urethane bond, or the like may be further introduced.
[0024]
Since the liquid crystal polymer does not use an environmentally harmful substance such as halogen as compared with the epoxy resin, the environment is not impaired and a problem in use does not occur.
[0025]
Further, in this liquid crystal polymer, molecular chains are aligned in the flow direction at the time of molding to produce a reinforcing effect, and high strength and elastic modulus are obtained. Despite its high elastic modulus, it exhibits excellent vibration absorption characteristics. Especially, the linear expansion coefficient in the flow direction is much smaller than that of ordinary plastics, which is comparable to metals. The greater the proportion of the material, the greater the thickness and the greater the elastic modulus. In addition, since it has a dense crystal structure, it exhibits high load deflection temperature, continuous use temperature, heat resistance and low water absorption even though the melting point is relatively low (see FIG. 4).
[0026]
(B) Process:
It is a chemical alkali etching step, and the purpose is to moderately roughen the surface of the liquid crystal polymer casing and improve the adhesion of a metal plating film described later by the anchoring effect. As the alkali used for this treatment, for example, potassium hydroxide is preferable. This etching process is performed on the inner and outer surfaces 1a and 1b of the housing 1, but this etching is not necessarily required in the present invention.
[0027]
(C) Process:
This is a secondary side molding step, and for example, polyvinyl alcohol 2 is attached to a desired location on the inner surface 1a of the housing 1 using a predetermined mask. This material is a material that is easily dissolved in water or hot water, and the portion covered with this material is a portion not covered with a catalyst as will be described later, and therefore a portion not covered with metal plating.
[0028]
(D) Process:
This is a step of performing catalyst treatment using a pattern. For this purpose, for example, palladium chloride is used as a catalyst, and this catalyst penetrates into the portions (exposed portions of the primary material) 1b, 1c not covered with the polyvinyl alcohol.
[0029]
(E) Process (refer FIG. 2):
This is a secondary melting step. As described above, the polyvinyl alcohol 2 is dissolved using water or hot water.
[0030]
(F) Process:
This is a step of performing metal plating. The method is not particularly limited, but the electroless plating method is preferable for practical use. The configuration of the plating layer may be a single layer or a plurality of layers. Also, the metal to be plated may be one known in the art. For example, a three-layer structure may be Au / Ni / Cu / base material surface.
[0031]
By applying this metal plating, the circuit pattern 3 is formed on the pattern of the catalyst layer 1 c on the inner surface 1 a of the housing 1, and the outer surface 1 b, so-called appearance surface, is covered with the metal plating film 4. The formation of the circuit pattern 3 and the plating film forming step of the outer surface 1b can be performed individually, but are preferably performed simultaneously from the viewpoint of efficiency.
[0032]
(G) Process:
A resist process and a solder process are performed on the inner surface 1a of the housing, and the solder 5 is formed on the circuit pattern 3 and the resist 6 is formed on a portion not covered with the plating film.
[0033]
(H) Process:
Here, on the outer surface 1b side, the coating film 7 is formed on the metal plating film 4 by, for example, spray coating or roller coating. On this outer surface 1b, the plating film 4 has already been formed in the step (F), and the coating film 7 adheres strongly thereto.
[0034]
(I) Process:
An electronic component such as a resistor chip 8 is fixed to the solder 5 portion. At this time, it is necessary to reflow the solder 5 by applying heat.
[0035]
(J) Process:
The lower case 9 manufactured in this way is joined to the upper case 10 in which the appearance surface is subjected to metal plating and coating in another process similar to that described above. For this bonding, for example, an ultrasonic vibration horn (vibration unit) 11 is applied and an ultrasonic welding method is preferably performed.
[0036]
The above is only one preferred embodiment of the present invention, and the present invention can take various embodiments as long as they do not depart from the gist of the present invention.
[0037]
【Example】
Next, the present invention will be described more specifically with reference to examples. However, it goes without saying that the present invention is limited thereto.
[0038]
Example 1
(1) Production of resin molded body Powdered liquid crystal polyester (Polyplastic Co., Ltd., Vectra) was melted and kneaded at a temperature of 300 to 360 ° C. with an extruder to obtain 6 mmφ pellets. At that time, the screw speed of the extruder was set to 500 rpm or less in order to prevent heat generation and decomposition of the resin.
[0039]
Next, using the injection molding machine (Toshiba Corp. (1S75E) as shown in FIG. 5, the pellets are put into the hopper, and the temperature of the injection cylinder is 250 to 330 ° C. (from the hopper side to the mold side). The temperature was increased stepwise), the mold temperature was maintained at 150 ° C., and the injection pressure was maintained at 140 kg / cm ² to form a case as shown in FIG. Alternatively, the following seven types of casing samples were prepared by adding additives or by surface-treating the molded product (alkali etching, plating treatment based on the present invention, etc.).
[0040]
(1) C820 (surface quality improved plating grade)
(2) A410 (low anisotropic grade)
(3) A950 (unfilled grade)
(4) B130 (Glass fiber reinforced ultra-high rigidity grade)
(5) LCX364 (fluidity improving grade)
(6) C810 (standard plating (Cu / Ni / Au) grade)
: Equivalent to the product of the present invention (7) C810 (surface alkali etching + plated product)
: Equivalent to the product of the present invention
Painting conditions:
The sample was painted using the following two types of paints separately. Prior to this coating, the surface was carefully wiped with isopropyl alcohol (IPA).
(B) Acrylic / silicone paint (Altipa World, manufactured by Musashi Paint Co., Ltd.)
Mixing ratio: Main agent (Anti-World World 787): Curing Agent (787-10B): Thinner (Anti-World World 27885) = 10: 1: 8 (weight ratio)
(B) Electroless plating primer (MPC super primer)
Formulation ratio: Main agent (superprimer clear): Curing agent (8954NY): Thinner (superprimer thinner 2868) = 10: 1: 4 (weight ratio)
Note) However, the numbers in parentheses indicate product numbers.
[0042]
(3) Test items and conditions:
The coating film was peeled off and adhered under the conditions shown in the table below.
[Table 1]

[0043]
(4) Test results Of the results of the above tests, the case where an acrylic / silicone paint is used as the paint is shown in the table below.
[Table 2]

○… Pass ×… Peeling Note) Of all three samples, “○” if all are non-defective, “×” if one is defective.
It was.
[0044]
As apparent from the above, the coating film was uniformly peeled on the non-plated surface of the housing, but the adhesion of the coating film was strong on the plated surface, showing good results as an exterior product. In addition, when the electroless plating primer was used as the paint, the same result as above was obtained.
[0045]
[Effects of the invention]
In the present invention, as described above, a metal film is formed on the liquid crystal polymer molded body to be a casing by electroless plating, a wiring pattern is formed on the inner surface of the casing, and a metal film is formed on the outer surface of the casing. Since the surface is coated, it is possible to obtain a coating film having a large adhesive force that is difficult to peel off with a reduced number of man-hours.
[0046]
And especially for electronic and electrical products, by leaving the non-painted part for the wiring circuit on the inner surface of the liquid crystal polymer molded body when painting the outer surface, the painted part is used for improving the appearance and the non-painted part is used for the electronic circuit. and for features like, it is possible to provide a high resin molding commercial value obtained by integrating the appearance and function at a high efficiency.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view sequentially showing a housing manufacturing process according to the present invention.
FIG. 2 is a longitudinal sectional view showing the continuation of the process.
FIG. 3 is a longitudinal sectional view showing a further continuation of the process.
FIG. 4 is a table showing the physical properties of liquid crystal polymers in comparison with other polymer compounds.
FIG. 5 is a schematic cross-sectional view showing an injection molding machine for molding a casing and its operation according to the present invention.
FIG. 6 is a perspective view of the molded housing.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Housing | casing, 1a ... Inner surface, 1b ... Outer surface, 1c ... Catalyst penetration part,
2 ... polyvinyl alcohol, 3 ... circuit pattern, 4 ... metal plating film,
5 ... solder, 6 ... resist, 7 ... coating, 8 ... chip, 9 ... lower case,
10 ... Upper case, 11 ... Horn, 18 ... Cavity, 19 ... Screw,
20 ... injection molding machine, 21 ... fixed mold, 22 ... movable mold, 23 ... injection cylinder,
24 ... pellet, 25 ... hopper, 26 ... heater

Claims (10)

Forming a main body portion of the housing for an electronic device with a liquid crystal polymer , attaching a mask to the inner surface of the main body portion in a state where the outer surface of the main body portion is exposed, and opening the mask A step of catalyzing the exposed inner surface of the main body portion and an exposed outer surface of the main body portion; a step of removing the mask; a catalyst processing portion having a predetermined pattern on the inner surface of the main body portion; and a catalyst of the outer surface of the main body portion. Electroless plating of the treatment portion to form a wiring having the same pattern as the catalyst treatment portion on the inner surface of the main body portion, and forming a metal film on the outer surface of the main body portion; and coating the surface of the metal film The manufacturing method of the housing | casing for electronic devices which has the process of giving. Wherein an inner surface and an outer surface of the main body portion after molding the main body portion is roughened by etching to further attach the mask to the inner surface of the main body, the manufacturing method according to claim 1. Wherein while the inner and outer surfaces of the main body portion to expose without mask, the electroless plating method according to claim 1 or 2.   The manufacturing method according to claim 3, wherein the formation of the wiring and the formation of the metal film are simultaneously performed by the electroless plating.   The manufacturing method of Claim 4 which forms the solder for connecting and fixing an electronic component on the said wiring. The manufacturing method according to claim 1 , wherein a memory stick casing or a mobile phone casing is manufactured. An electronic device constituted by a first housing in which an electronic component is connected and fixed to the wiring on the inner surface, and a second housing joined to the first housing so as to accommodate the electronic component in an internal space A method of manufacturing
By the manufacturing method according to any one of claims 1 to 6 , the first casing is manufactured,
A step of molding the main body of the second casing with a liquid crystal polymer , a step of catalytically treating the outer surface of the main body, a step of electrolessly plating the catalytically treated portion to form a metal film, The second casing is produced by a process of coating the surface of the metal membrane,
Solder is formed on the wiring on the inner surface of the first housing, and after the electronic components are connected and fixed by the solder, the second housing is joined to the first housing;
Manufacturing method of electronic equipment. The manufacturing method according to claim 7 , wherein after forming the main body portion of the second casing, the outer surface of the main body portion is roughened by etching, and the catalyst treatment is further performed on the outer surface of the main body portion. The manufacturing method according to claim 7 or 8 , wherein the electroless plating is performed with the outer surface of the main body exposed. The manufacturing method according to claim 7 , which is applied to manufacture of a memory stick or a mobile phone.

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