JP4424733B2 - Coil unit, electromagnetic actuator, exposure apparatus and device manufacturing method - Google Patents

Description

  The present invention relates to a coil unit, an electromagnetic actuator, an exposure apparatus, and a device manufacturing method.

  In a lithography process for manufacturing a device such as a semiconductor device or a liquid crystal display device, an exposure apparatus that transfers a pattern formed on an original to a photosensitive agent on a substrate via a projection optical system is known.

  A nanometer-order positioning apparatus used in such an exposure apparatus or a high-precision processing apparatus is required to have high performance. Recently, in order to position a positioning object such as a substrate at a higher speed without being affected by the accuracy of the mechanical guide surface, etc. A positioning device has been developed that drives a table on which a positioning object is placed in a two-dimensional direction without contact. A planar motor is known as a drive source of such a non-contact drive type positioning device.

FIG. 6 is an explanatory diagram of the stage apparatus described in Patent Document 1. A mold member 49 is attached to a corner portion of the armature coil 44. The mold member 49 is provided with terminal pins 65a and 65b respectively connected to both ends 64a and 64b of the coil winding. Further, the coil support member 12 is provided with a socket 22 to which each of the terminal pins 65a and 65b can be detachably connected.
Japanese Patent Laid-Open No. 2001-037201

  In the above configuration, when a current is supplied to the coil to move the stage, the coil generates heat. In order to prevent an increase in coil resistance and damage to the coil wire due to the temperature rise of the coil, it is necessary to cool the coil. However, in an actual device, it is difficult to reduce the temperature rise of the coil to zero due to restrictions on the maximum flow rate of the chiller and restrictions on the flow path design of the refrigerant. Therefore, a certain temperature rise of the coil is inevitable and thermal expansion occurs. In particular, in the case of an oval coil, the thermal expansion in the longitudinal direction is large, and a large stress is applied to the socket and the terminal pin inserted in the socket, which may cause damage.

Moreover, in the structure which inserts a terminal pin in a socket, since the position of a coil is restrained by a terminal pin and a socket, the request | requirement of the dimensional accuracy of a coil and attachment accuracy is severe with respect to a supporting member .

  The present invention has been made on the basis of recognition of the above problems. For example, in an apparatus including a coil, stress applied to a component member due to thermal expansion can be relaxed and / or high-precision positioning of the coil can be easily performed. An object of the present invention is to prevent the position of the coil from being constrained by a terminal for supplying power to the coil.

The coil unit of the present invention has a shape having a longitudinal direction and a short direction and a coil having an air-core part, a power receiving part fixed to the coil, a support body that supports the coil, and the support body. The power receiving unit has a power receiving terminal electrically connected to the coil, the power feeding unit has a power feeding terminal, and the power receiving terminal is connected to the power feeding terminal. The support body is arranged in a slidable state so as to allow thermal expansion in the longitudinal direction, and the support body is disposed on the surface plate and the air core portion, in a direction orthogonal to the longitudinal direction and the short side direction. and a supporting member fixed to the surface plate while extending from the plate, said support member supports said coil by said coil and said supporting member is brought into contact with the lateral direction, the A gap between the coil and the support member in the longitudinal direction It is provided.
According to a preferred embodiment of the present invention, a spacer is fixed to the air core portion of the coil, and the support member supports the coil by contacting the spacer and the support member in the lateral direction. In addition, a gap is provided between the spacer and the support member in the longitudinal direction .

According to a preferred embodiment of the present invention, the shape having the long direction and the short direction is preferably a substantially oval shape or a substantially rectangular shape .

According to a preferred embodiment of the present invention, it is preferable that an elastic member for pressing the power receiving terminal and the power feeding terminal is provided.

According to a preferred embodiment of the present invention, the coil unit includes a plurality of the coils, and the plurality of coils includes a first coil group arranged such that each longitudinal direction thereof is along the first direction. .

According to a preferred embodiment of the present invention, the plurality of coils include a second coil group arranged such that each longitudinal direction thereof is along a second direction orthogonal to the first direction.

The electromagnetic actuator of the present invention is relative to the first element by electromagnetic interaction between a first element having the coil unit and a magnetic field generated when a current is passed through the coil unit of the first element. and a second element moves, the when current flows in the first coil group, the second element moves relative to the widthwise direction with respect to the first element.

The exposure apparatus of the present invention includes a substrate stage, and the original version of the stage, and a projection system for projecting a pattern of the original plate from the original plate stage substrate held by the substrate stage, the substrate stage and At least one of the original plate stage is driven by the electromagnetic actuator.

  An exposure apparatus according to another aspect of the present invention includes a substrate stage and a projection system, and exposes a substrate held on the substrate stage to irradiate exposure energy via the projection system to form a latent image pattern. The apparatus is configured as an apparatus, and the substrate stage is driven by the electromagnetic actuator.

The device manufacturing method of the present invention includes a step of applying a photosensitive agent to a substrate, a step of forming a latent image pattern on the photosensitive agent on the substrate by the above exposure apparatus, and a step of developing the latent image pattern. Including.

According to the present invention, for example, in an apparatus including a coil, any or all of alleviating the stress applied to the component member due to thermal expansion and alleviating the dimensional accuracy and mounting accuracy of the coil with respect to the support member is achieved. Can do.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[First Embodiment]
FIG. 1 is a diagram showing a schematic configuration of a planar motor as a preferred embodiment of the electromagnetic actuator of the present invention. The planar motor 100 includes a stage 116 as a mover and a surface plate 107 as a stator. The stage 116 has a magnet unit 117. The surface plate 107 is configured as a coil unit or a structure including the coil unit.

  The surface plate 107 includes coil groups 101a and 101b stacked in the vertical direction (Z direction). Here, the coil group 101a is configured by arranging coils whose longitudinal directions are along the X direction and arranged in a plane in the Y direction, and the coil group 101b is a coil whose longitudinal direction is along the Y direction. Are arranged side by side in a plane. Although FIG. 1 shows a two-layer coil group, a coil group having three or more layers may be employed.

  The coils constituting the coil groups 101a and 101b can have, for example, a substantially oval shape or a substantially rectangular shape. Here, the substantially oval shape may include a shape in which rounded portions such as a semicircle or a semi-ellipse are added to two opposite sides of the rectangle. By controlling the current flowing through the coil groups 101a and 101b of each layer, the stage 116 can be controlled in six axes by Lorentz force (electromagnetic interaction).

  FIG. 2 is a cross-sectional view of the planar motor 100 shown in FIG. 1A cut along the Y-axis direction. Depending on the arrangement of the magnet groups constituting the magnet unit 117 of the stage 116, for example, the driving force in the Y, ωX, Z, and ωZ directions is applied to the first layer coil group 101a, and the X, ωY, Driving force in the Z and ωZ directions can be generated, and the stage 116 can be controlled in six axes. The number of layers of the coil group and the allocation of the driving force can be changed as appropriate.

  The spacers 104a and 104b are fixed to the coil groups 101a and 101b by a method such as adhesion, and the spacers 104a and 104b are fitted into the first studs 103 arranged on the stator surface plate 107, whereby the coil group 101a. , 101b can be stacked while being accurately arranged two-dimensionally. In addition, the spring group 105 is disposed between the lowermost coil group 101b and the stator base plate 107, and the second stud 102 is fixed by a fastening member (for example, a bolt) 106, whereby the coil groups 101a and 101b are fixed. Can be fixed with accuracy also in the Z direction.

  The coil groups 101a and 101b arranged with respect to the first stud 103 are respectively fixed with power receiving portions 109a and 109b for receiving a coil driving current (only 109b is shown). Power supply units 110a and 110b (101b) for supplying coil drive currents to power reception units 109a and 109b are fixed to the stator surface plate 107, respectively. In FIG. 2, for the convenience of drawing, only a pair of current transmission units including the power reception unit 109b and the power supply unit 110b are shown. The power receiving units 109a and 109b have conductive power receiving terminals 119a and 119b (only 119b is shown), and the power feeding units 110a and 110b have conductive power feeding terminals 120a and 120b (only 120b is shown). The power receiving terminal 119a is electrically connected to the corresponding terminal (leading portion) of the corresponding coil of the coil group 101a, and the power receiving terminal 119b is electrically connected to the corresponding terminal (leading portion) of the corresponding coil of the coil group 101b. Connected to. Each coil is typically provided with two terminals.

  When the power receiving terminals 119a and 119b and the power feeding terminals 120a and 120b are in contact with each other, a current path for flowing a current through the coil groups 101a and 101b is formed. At least one of the power receiving unit 109 (109a, 109b) or the power feeding unit 110 (110a, 110b) includes an elastic member for pressing the power receiving terminal 119 (119a, 119b) and the power feeding terminal 120 (120a, 120b). Yes. In the configuration example illustrated in FIG. 1, the power feeding unit 110 (110a, 110b) includes a spring 115 (115a, 115b) for pressing the power feeding terminal 120 (120a, 120b) against the power receiving terminal 119 (119a, 119b). (Only 115b is shown). Instead of or in addition to such a configuration, the power receiving unit 109 (109a, 109b) may be provided with a spring. Further, the elastic member is not limited to a spring such as a coil spring or a leaf spring, and may be composed of another member (for example, a stretchable member such as rubber).

  According to the configuration in which the power receiving terminal 119 and the power feeding terminal 120 are press-contacted by an elastic member such as a spring, the dimensional accuracy and attachment of the coil group 101, the power receiving unit 109 (or the power receiving terminal 119), and the power feeding unit 110 (or the power feeding terminal 120). The poor accuracy (for example, tolerances in the X, Y, and Z directions) can be absorbed, and stable conduction (electrical contact) between the power receiving terminal 119 and the power feeding terminal 120 can be enabled.

  The power receiving terminal 119 is slidable with respect to the power feeding terminal 120. Thereby, even when the coil groups 101a and 101b generate heat due to the drive current, the thermal expansion of the coil groups 101a and 101b can be absorbed by the sliding (movement) of the power receiving terminal 119 with respect to the power supply terminal 120. A current can be stably supplied to the coil while reducing the stress applied to the coil.

  For example, when the movable range of the wafer stage of the semiconductor exposure apparatus is 1000 millimeters and the coil (length in the longitudinal direction is 1000 millimeters) rises in temperature by 25 ° C., the coil expands in the longitudinal direction by about 0.4 millimeters. The expansion force is about several hundred kilograms, and in the configuration using the conventional fitting type connector, the connector may be damaged due to a very large load, and the coil may not be energized. By absorbing this thermal expansion by sliding between the power receiving terminal and the power feeding terminal, the reliability is greatly improved. For the sliding operation between the power receiving terminal and the power feeding terminal, sufficient stability can be achieved by adjusting the pressing force acting between the power receiving terminal and the power feeding terminal, the contact surface shape and surface accuracy of both terminals. Obtainable.

  With the above configuration, even when the coil groups 101a and 101b are thermally expanded, power can be stably supplied to the coil groups 101a and 101b. However, if the heat generation of the coil becomes excessive, the fused layer or insulating layer of the coil may melt and the coil may be damaged. The melting temperature of the fusion layer or the insulating layer depends on the material, but is typically about 100 ° C. When the coil exceeds this temperature, the coil shape change due to melting of the fusion layer or the insulation layer Problems such as short-circuiting due to melting of the metal occur.

  Moreover, when the temperature of the coil becomes excessive, the temperature rises in other constituent members due to heat conduction or the like. For example, the problem that the surface (the upper surface of the stator upper cover 108) on which the stage (movable element) 116 moves due to thermal expansion of the stator surface plate 107 and the stator upper cover 108 is distorted also occurs.

  Therefore, the planar motor 100 includes a cooling mechanism that cools the coils of the coil groups 101a and 101b. As a cooling method of the coil, for example, a cooling jacket that seals a space in which the coil groups 101a and 101b are arranged is constituted by the stator base plate 107 and the stator upper lid 108, and the refrigerant is circulated therein. Is preferred.

  The power feeding unit 110 (110a, 110b) includes a seal portion 112 to prevent the refrigerant in the jacket from leaking between the opening of the stator base plate 107 and the power feeding unit 110 disposed therein. . The seal portion 112 can include an O-ring between the power feeding portion 110 and the opening of the stator base plate 107. Sealing between the main body of the power supply unit 110 and the power supply terminal 120 can be performed by, for example, glass sealing, an adhesive, an O-ring, or the like.

  Further, the seal between the stator surface plate 107 and the stator upper lid 108 can be performed by, for example, an O-ring (not shown), and the seal between the stator surface plate 107 and the fastening member 106 is a seal washer. 111 or the like. In this way, the inside of the jacket can be completely sealed and the refrigerant can be circulated safely. The refrigerant is circulated through a refrigerant flow path provided in the stator surface plate 107.

  FIG. 3 is an enlarged view of a part of FIG. The power receiving unit 109 can be disposed in the vicinity of the two terminals (drawing units) of each coil of the coil group 101 (101a, 101b). The terminals of the coil are typically placed on the inside and outside of the coil. The terminal of the coil and the power receiving terminal 119 of the power receiving unit 109 can be joined by soldering, for example. By arranging the outer terminals of the coils at the ends in the longitudinal direction of the coils, it is possible to prevent the interference of the terminals between adjacent coils and arrange the coils at a high density.

  Further, in order to prevent interference between each terminal of the upper coil group 101 and the lower coil group 101b, the end portion (portion where the terminal is provided) of the upper coil group 101a is placed outside the region where the lower coil group 101b is arranged. It is possible to secure a region where the power receiving terminals 119 (119a, 119b) are arranged. In the region where the lower coil group 101b does not exist in the arrangement region of the upper coil group 101a (the end of the upper coil group 101a), a dummy spacer 113 that compensates for the thickness of the lower coil 101b is provided as shown in FIG. By providing, the positional accuracy of the upper layer coil group 101a can be ensured. Further, the size of the dummy spacer 113 in the width direction may be equal to the coil width of the lower layer coil 101b. Thereby, a refrigerant flow path is made uniform over all coil fields, and cooling efficiency improves. Furthermore, by fixing the power receiving units 109a and 100b to the coil groups 101a and 101b with an adhesive or the like, it is possible to give sufficient rigidity to the pressing force received from the spring 115 and the flow of the refrigerant.

  The spacer 104a preferably has a long hole along the longitudinal direction of each coil of the coil group 101a as a hole through which the stud 103 is passed. According to such a configuration, each coil of the coil group 101a is given a degree of freedom to move in the longitudinal direction (direction in which the absolute amount of thermal expansion is large), that is, the X direction during thermal expansion. The thermal expansion in the short direction (Y direction) of each coil of the coil group 101a is generally negligible because the total amount is small.

  Based on the same idea, the spacer 104b preferably has a long hole along the longitudinal direction of each coil of the coil group 101b as a hole through which the stud 103 is passed. According to such a configuration, each coil of the coil group 101b is given a degree of freedom to move in the longitudinal direction (direction in which the absolute amount of thermal expansion is large), that is, the Y direction during thermal expansion. Note that the thermal expansion in the short direction (X direction) of each coil of the coil group 101b is generally negligible because the total amount is small.

  For the direction of the driving force generated by the coil group coils 101a and 101b (the Y direction in the case of the upper layer coil 101a, the X direction in the case of the lower layer coil 101b, that is, their respective short directions), the stud 103 and the spacer 104a, The coil thrust characteristics for controlling the stage (movable element) 116 can be kept constant by fitting with 104b.

  As described above, the coil groups 101a and 101b are supported by the stator surface plate (support body) 107 through the stud 103 and the spacers 104a and 104b so as to allow thermal expansion in the respective longitudinal directions. . Here, it is preferable that the positions of the coil groups 101a and 101b are regulated by the stud 103 and the spacers 104a and 104b with respect to the respective short directions from the viewpoint of keeping the coil thrust characteristics constant.

  The power supply terminal 120 is connected to a driver unit that supplies current to the coil via a conductive wire 114. For example, the conductive material 114 may be soldered to the lower end of the power supply terminal 120 or the like, or may be pressed into contact with the power supply terminal 120 using an elastic member such as a spring, or the power supply terminal 120 via a fitting type connector. May be connected.

[Second Embodiment]
FIG. 4 is a view schematically showing a configuration of an exposure apparatus as a second embodiment of the present invention in which the electromagnetic actuator of the present invention exemplarily shown as the first embodiment is adopted as a component of the stage apparatus. .

An exposure apparatus 500 shown in FIG. 4 is used for manufacturing a device including a fine pattern, such as a semiconductor device, a liquid crystal display device, a micromachine, and a thin film magnetic head. The exposure apparatus 500 projects exposure energy (for example, visible light, ultraviolet light, EUV light, X-rays, electron beams, charged particle beams, etc.) from an illumination system unit 501 onto a substrate such as a wafer via an original plate such as a reticle. By irradiating via a refractive lens, a reflective lens, a catadioptric lens system, a charged particle lens, etc., a latent image pattern is formed on a photosensitive agent on a substrate mounted on a substrate stage 504 such as a wafer stage. . Here, in a method using a charged particle beam such as an electron beam may also original version is not required.

Holding a substrate (target) on the chuck mounted on the substrate stage 504, the illumination system unit 501, the step pattern of installed original onto the original plate stage 502 to each region on the substrate-and-repeat or step-and-scan Transfer by various methods. The electromagnetic actuator of the first embodiment, less of the substrate stage 504 and the original version of the stage 502 is also suitable as one part.

[Third Embodiment]
Next, as a third embodiment of the present invention, a semiconductor device manufacturing method will be described as an example of a device manufacturing method to which the exposure apparatus exemplarily described as the second embodiment is applied. FIG. 5 is a diagram showing a flow of an entire manufacturing process of a semiconductor device. In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (mask fabrication), a mask is fabricated based on the designed circuit pattern.

  On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by using the above-described exposure apparatus and lithography technology using the above-described mask and wafer. The next step 5 (assembly) is called a post-process, which is a process for forming a semiconductor chip using the wafer produced in step 5, and is an assembly process (dicing, bonding), packaging process (chip encapsulation), etc. Process. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. A semiconductor device is completed through these processes, and is shipped in Step 7.

  The wafer process in step 4 includes the following steps. An oxidation step for oxidizing the surface of the wafer, a CVD step for forming an insulating film on the wafer surface, an electrode formation step for forming electrodes on the wafer by vapor deposition, an ion implantation step for implanting ions on the wafer, and applying a photosensitive agent to the wafer A resist processing step, an exposure step in which a circuit pattern is transferred to the photosensitive agent on the wafer by the above exposure apparatus to form a latent image pattern, and a development step in which the latent image pattern formed on the photosensitive agent on the wafer in the exposure step is developed. An etching step for removing portions other than the resist image developed in the development step, and a resist stripping step for removing the resist that has become unnecessary after the etching. By repeating these steps, multiple circuit patterns are formed on the wafer.

It is a figure which shows schematic structure of the planar motor as suitable embodiment of the electromagnetic actuator of this invention. It is sectional drawing which cut | disconnected the planar motor 100 shown in FIG. 1 along the Y-axis direction. It is the figure which expanded a part of FIG. It is a figure which shows schematically the structure of the exposure apparatus as 2nd Embodiment of this invention which employ | adopted the electromagnetic actuator of this invention exemplarily shown as 1st Embodiment as a component of a stage apparatus. It is a figure which shows the flow of the whole manufacturing process of a semiconductor device. It is explanatory drawing of the stage apparatus described in patent document 1. FIG.

Explanation of symbols

101, 101a, 101b Coil group 102 Stud 103 Stud 104 Spacer 105 Bleed spring 106 Fastening member (bolt)
107 Stator plate 108 Upper lid 109, 109a, 109b Power receiving unit 110, 110a, 110b Power feeding unit 111 Seal washer 112 Seal unit (O-ring)
113 Dummy spacer 114 Conductor 115 Elastic member (spring)
116 stage (plane motor mover)
117 Magnets 119, 119a, 119b Receiving terminals 120, 120a, 120b Feeding terminal 500 Exposure apparatus 501 Illumination system unit 502 Original stage 503 Projection lens 504 Substrate stage

Claims (10)

A coil having a longitudinal direction and a lateral direction and having an air-core part;
A power receiving unit fixed to the coil;
A support for supporting the coil;
A power feeding part fixed to the support,
The power receiving unit has a power receiving terminal electrically connected to the coil,
The power supply unit has a power supply terminal,
The power receiving terminal contacts the power feeding terminal in a slidable state so as to allow thermal expansion in the longitudinal direction,
The support includes a surface plate, and a support member that is disposed on the air core and is fixed to the surface plate in a state extending from the surface plate in a direction orthogonal to the longitudinal direction and the short direction, The support member is configured such that the coil and the support member are in contact with each other in the lateral direction to support the coil, and a gap is provided between the coil and the support member in the longitudinal direction. Coil unit to do. A spacer is fixed to the air core of the coil,
  The support member supports the coil by the spacer and the support member coming into contact with each other in the lateral direction, and a gap is provided between the spacer and the support member in the longitudinal direction. The coil unit according to claim 1. 3. The coil unit according to claim 1, wherein the shape having the longitudinal direction and the lateral direction is a substantially oval shape or a substantially rectangular shape. The coil unit according to any one of claims 1 to 3, further comprising an elastic member for press-contacting the power receiving terminal and the power feeding terminal. A plurality of the coils;
Wherein the plurality of coils, coil unit according to any one of claims 1 to 4 which each longitudinal is characterized in that it comprises a first coil group which are arranged along the first direction . 6. The coil unit according to claim 5 , wherein the plurality of coils include a second coil group arranged such that each longitudinal direction thereof is along a second direction orthogonal to the first direction. A first element comprising the coil unit according to claim 5 or 6 ,
A second element that moves relative to the first element by electromagnetic interaction with a magnetic field generated when a current is passed through the coil unit of the first element;
The electromagnetic actuator according to claim 1, wherein when a current is passed through the first coil group, the second element moves relative to the first element in the short direction. A substrate stage;
The original stage and
A projection system that projects the pattern of the original held on the original stage onto the substrate held on the substrate stage;
An exposure apparatus, wherein at least one of the substrate stage and the original stage is driven by the electromagnetic actuator according to claim 7 . A substrate stage and a projection system;
An exposure apparatus that irradiates a substrate held on the substrate stage with exposure energy via the projection system to form a latent image pattern,
An exposure apparatus, wherein the substrate stage is driven by the electromagnetic actuator according to claim 7 . A device manufacturing method comprising:
Applying a photosensitive agent to the substrate;
Forming a latent image pattern on the photosensitive agent on the substrate by the exposure apparatus according to claim 8 or 9 ,
Developing the latent image pattern;
A device manufacturing method comprising:

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