JP4423558B2 - Method for manufacturing terminals for surface mount electronic components - Google Patents

Description

  The present invention relates to a method for manufacturing a surface-mounted electronic component, and more particularly to a method for manufacturing the terminal.

  Conventionally, as a technique related to a method for manufacturing a terminal of a surface mount electronic component, for example, there is one disclosed in Patent Document 1. In this technology, a substrate in which electronic elements are formed one by one in the vertical and horizontal directions is manufactured, and slits that penetrate are formed along both end portions of the electronic element in one unit on the substrate. A terminal is formed on the inner surface, and then the substrate is cut in a direction perpendicular to the slit.

JP-A-7-245228

  According to this technique, the terminals formed at both ends of the surface mount electronic component have conductive surfaces on the upper and lower surfaces and the end surface. However, in recent surface mount electronic components, In addition, a terminal having a total of five conductive surfaces having conductive surfaces on both side surfaces cannot be manufactured.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a terminal of a surface mount electronic component that can easily mass-produce a surface mount electronic component having terminals having a total of five conductive surfaces at both ends of a base.

In the method for manufacturing a terminal of a surface-mount electronic component according to an aspect of the present invention, the first and second main surfaces of the base body having the first and second main surfaces arranged in parallel with a space between each other, Correspondingly, bottomed grooves are formed at predetermined intervals. A conductive material is embedded in the first and second main surfaces and the grooves. The base material is cut along the grooves. Each of the grooves is formed to intersect the first and second main surfaces vertically and horizontally.

According to this aspect, since each groove is cut after applying the conductive material to each bottomed groove and the first and second surfaces, both ends of the base material cut into a rectangular parallelepiped shape. Thus, a terminal having five conductive surfaces is obtained. In addition, a terminal can also be comprised using such a conductive surface as a foundation | substrate. Since the grooves on the first and second main surfaces intersect and are formed vertically and horizontally, they can be mass-produced. Before cutting the base material, an electronic component component, for example, a fusible body is formed in the region surrounded by the grooves in the base material.

  As described above, according to the present invention, a large number of surface mount electronic components having terminals having five surfaces as conductive surfaces can be manufactured simultaneously.

  One embodiment of the present invention is to manufacture a surface mount electronic component such as the surface mount fuse 2 as shown in FIG. This fuse 2 has a fusible body 6 formed in the center in the longitudinal direction inside a substantially rectangular parallelepiped base 4, and terminals 8, 8 are formed at both ends of the base 4, respectively, and are connected to the fusible body 6. It is what. These terminals 8 and 8 are all formed on the end surface, the upper and lower surfaces, and both side surfaces of the base 4 and have a total of five conductor surfaces. Actually, the bases of the terminals 8 and 8 are formed on both ends of the fusible body 6 by the conductive paste 12 made of a material such as copper or silver, and the material made of a material such as nickel or tin is formed thereon. A plating layer 14 is formed, and the conductive paste 12 and the plating layer 14 form terminals 8 and 8. Both openings of the fusible body are sealed by the sealing portion 10.

  Such a surface mount type fuse is manufactured as follows. First, the base material 20 is formed as shown in FIGS. The base material 20 is insulative having first and second main surfaces 22 and 24 located in parallel with a distance therebetween.

  Next, as shown in FIGS. 1B and 2B, grooves 26 and 28 are formed on both the main surfaces 22 and 24 at a predetermined interval. The grooves 26 and 28 are bottomed concave shapes, and the grooves 26 and 28 are formed substantially orthogonal to each other. The grooves 26 formed on the first and second main surfaces 22 and 24 are at the same position, and the grooves 28 formed on the first and second main surfaces 22 and 24 are also at the same position. These grooves 26 and 28 are formed by, for example, dicing or laser scribing.

  As shown in FIG. 1C, the grooves 26 and 28 and the first and second main surfaces 22 and 24 are coated and filled with a conductive paste 30, for example, copper or silver paste. This application and filling is performed by screen printing, for example.

  Next, the soluble body 6 is formed in a rectangular region surrounded by the grooves 26 and 28 in the first and second main surfaces 22 and 24 as shown in FIG. That is, a through hole is formed in the center of each rectangular region surrounded by the grooves 26 and 28 so as to penetrate between the first and second main surfaces 22 and 24. The fusible body 6 is formed on the inner peripheral surfaces of these through holes by, for example, through-hole plating. These fusible bodies 6 can be formed by, for example, a copper or tin plating layer.

  The sealing portion 10 is formed by filling the sealing material so as to seal both openings on the first and second main surface sides of the fusible body 6, and exposing and developing.

  Next, as shown in FIG. 1 (d), the substrate 20 is cut vertically and horizontally along the grooves 26 and 28 to form a large number of substrates 4. The cutting is performed by, for example, dicing, laser scribing or the like. A conductive paste 12 having conductive surfaces on end surfaces, both side surfaces, and upper and lower surfaces is formed on both ends of the substrate 4 formed by cutting.

  Thereafter, as shown in FIG. 1E, a plating layer 14 is formed on the conductive paste 12 of each substrate 4 by barrel plating or the like. Thereby, the formation of the terminal 8 and the formation of the fusible body 6 on each substrate 4 is completed.

  In this way, surface mount electronic components having terminals having conductive surfaces on the five surfaces at both ends of the substrate 4 can be mass-produced.

  In the above embodiment, the fusible body 6 is formed after applying the conductive paste to the grooves 26 and 28. However, the fusible body 6 is first formed at a predetermined interval on the substrate 20, and then the grooves 26, 28, the conductive paste 12 may be applied to the grooves 26, 28 and the first and second type surfaces 22, 24, and then the substrate 20 may be cut along the grooves 26, 28.

It is a figure which shows each process of one Embodiment of the manufacturing method of the surface mount-type electronic component by this invention. It is a perspective view which shows a part of the same embodiment. It is a front view of the surface mount type fuse manufactured by the same embodiment.

Explanation of symbols

20 Base material 22 24 Main surface 26 28 Groove 30 Conductive paste (conductive material)

Claims (1)

Forming bottomed grooves corresponding to each other on each of the first and second main surfaces of the base body having first and second main surfaces arranged in parallel at an interval; ,
Embedding a conductive material in the first and second main surfaces and the grooves;
Cutting the substrate along the grooves,
Equipped,
The method of manufacturing a surface-mount electronic component, wherein the grooves are formed to intersect the first and second main surfaces in the vertical and horizontal directions .

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