JP4421728B2 - Sensor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
According to the present invention, an IC module having a detection unit is housed and fixed in the housing so that the detection unit is disposed at the front end of the housing, and one end of a cord is connected to the IC module in the housing. More particularly, the present invention relates to a sensor device that is suitably used as a vehicle wheel speed sensor.
[0002]
[Prior art]
Conventionally, such an apparatus is already known from, for example, Japanese Utility Model Publication No. 6-76865.
[0003]
[Problems to be solved by the invention]
In the above-mentioned conventional one, the housing for positioning and fixing the IC module at a fixed position while ensuring the sealing performance of the connection portion between the IC module and the signal line is a cylindrical case that houses the holder to which the IC module is attached. A connector for closing a rear end opening of the case and electrically connecting the IC module to the IC module; and a connector formed by a synthetic resin by integrally connecting the connector and the rear of the case It is composed of a cover which is mounted on an end portion, one end of the cord connected to the connector terminals Ru Tei is embedded in the cover. For this reason, it is difficult to say that the number of parts constituting the sensor device is small, and accuracy is required for the structure of the seal portion between the case and the cover or between the connector and the case, and the assemblability is also excellent. Is hard to say.
[0004]
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a sensor device that can be configured with a small number of parts and that has improved assemblability while eliminating the need for a seal structure. And
[0005]
[Means for Solving the Problems]
In order to achieve the above object, according to the first aspect of the present invention, an IC module having a detection portion is housed and fixed in the housing so that the detection portion is disposed at the distal end portion of the housing, and one end of the cord is provided. In the sensor device in which the part is connected to the IC module in the housing, a holder having an accommodation recess, an IC module accommodated in the accommodation recess, and a part on the IC module side in a state of being connected to the IC module code but that is accommodated in the accommodating recess, the accommodating recess engage with the IC module housed state is mounted to the holder, the inner挿組stereoscopic the IC module in the clip pin that holds the holder The insertion assembly is covered with the housing made of synthetic resin, and the cord is pulled out from the housing And wherein the door.
[0006]
According to such a configuration, the holder portion of the IC module and the code is contained, the inner挿組solid which engage the IC module comprising a clip pin is mounted for holding the IC module to the holder, Since it is covered with a molded housing, a case that has been necessary in the past is not necessary, and the number of parts can be reduced. In addition, since the cord is pulled out from the housing that covers the entire insertion assembly, it is not necessary to provide a seal portion between the insertion assembly and the housing, and the insertion assembly is inserted into the mold apparatus. Since the housing is formed by molding, the assemblability is also improved.
[0007]
According to a second aspect of the invention, in addition to the configuration of the first aspect of the invention, the holder is formed between the first side wall portion having an insertion hole and the receiving recess portion between the first side wall portion. The clip pin formed in a substantially U shape so as to be able to engage with the IC module housed in the housing recess, and the intermediate portion of the clip pin as a second portion. The clip pin is inserted and installed into the holder through the insertion hole so that both ends of the clip pin are elastically engaged with the inner edge of the insertion hole in a state of contacting and engaging with the side wall. According to this configuration, the clip pin has a simple substantially U shape, and the holder has a first side wall part having an insertion hole and a second side wall part that forms an accommodation recess between the first side wall part. The IC module is a holder with a simple structure. It is possible to configure the inner 挿組 stereoscopic assembled.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on one embodiment of the present invention shown in the accompanying drawings.
[0009]
1 to 4 show an embodiment when the present invention is applied to a vehicle wheel speed sensor. FIG. 1 is a longitudinal sectional view of the sensor device, and FIG. 2 is a sectional view taken along line 2-2 of FIG. 3 is a view taken in the direction of arrow 3 in FIG. 2, and FIG. 4 is an exploded perspective view of the insertion assembly.
[0010]
First, in FIG. 1 to FIG. 3, this sensor device is used, for example, as a vehicle wheel speed sensor, and an IC module 13 is housed in a synthetic resin housing 12 fixed to a fixed support 11. A cord 16 that is fixed and connected to the IC module 13 extends from the housing 12.
[0011]
The IC module 13 includes a detection unit 14 including a magnet and a Hall IC, a capacitor, a substrate, a pair of terminals 15 and 15, and the like, and the detection unit 14 is disposed at the distal end portion of the housing 12 and the pair of terminals 15 and 15. The housing 15 is housed and fixed in the housing 12 so as to be arranged toward the rear side.
[0012]
Referring also to FIG. 4, the cord 16 is formed by covering a bundle of a pair of signal lines 17 and 17 with an insulating coating material 18 made of a synthetic resin, and one end portion of the insulating coating material 18 is When the housing 12 is molded, the housing 12 is integrated with the housing 12 so as to be buried in the housing 12.
[0013]
The extending portions of the signal lines 17 and 17 from one end of the insulating coating material 18 are connected to the terminals 15 and 15 of the IC module 13 by caulking or welding using conductive metal joints 21 and 21. Is done.
[0014]
The IC module 13 and a part of the cord 16 in the state connected to the IC module 13 on the IC module 13 side, that is, one end of the insulating coating material 18 are accommodated in a holder 22 formed of a synthetic resin, the holder 22 in a state accommodating a portion of the IC module 13 and the code 16, then engage the IC module 13 that metal clips pin 23 for holding the IC module 13 to the holder 22 is mounted Thus, the insertion assembly 24 is configured, and the insertion assembly 24 is covered with the housing 12.
[0015]
The holder 22 includes first and second side wall portions 25 and 26 that are parallel to each other, an end wall portion 27 that connects the front ends of the side wall portions 25 and 26, and both the side wall portions 25 and 26 and the end wall portion 27. The holder 22 is integrally formed with a bottom wall portion 28 connecting the lower portions, and the holder 22 is formed with an accommodation recess 29 so as to be sandwiched between the first and second side wall portions 25 and 26.
[0016]
The housing recess 29 includes a module housing portion 29a formed in the front half portion of the holder 22 and a pair of signal line housing portions 29b and 29b formed in the rear half portion of the holder 22 connected to the module housing portion 29a. The IC module 13 is accommodated in the module accommodating portion 29a, and the signal lines 17 and 17 connected to the IC module 13 are accommodated in the signal line accommodating portions 29b and 29b.
[0017]
A partition wall 30 protrudes from the bottom wall portion 28 in the rear half of the holder 22, and the pair of signal line accommodating portions 29 b and 29 b are located between the partition wall 30 and the first and second side wall portions 25 and 26. Formed.
[0018]
The clip pin 23 is formed in a substantially U shape so as to be able to engage with the IC module 13 housed in the module housing portion 29 a of the housing recess 29. On the other hand, the first side wall portion 25 of the holder 22 is provided with an insertion hole 31 into which the clip pin 23 is inserted in a state where the IC module 13 is accommodated in the module accommodation portion 29a. The clip pin 23 inserted in is attached to the holder 22 so as to engage with the IC module 13.
[0019]
The second side wall portion 26 is provided with an engagement hole 32 corresponding to the insertion hole 31 with a width narrower than that of the insertion hole 31. An engagement protrusion 23 a that engages with the engagement hole 32 is provided. Engaging claw portions 23b, 23b that can be engaged with both inner edges of the insertion hole 31 are provided at both ends of the clip pin 23, respectively. Inserted into and inserted into the holder 22 from the insertion hole 31 so that both end portions of the clip pin 23 are elastically engaged with the inner edge of the insertion hole 31 while being in contact with and engaged with the second side wall 26. Is done.
[0020]
In this way, the holder 22, the IC module 13 in which the main part is housed in the module housing part 29 a among the housing recesses 29 included in the holder 22 and the detection part 14 is held at the tip of the holder 22, and the IC module 13 partially cord receiving portion 29b of the IC module 13 side of the signal lines 17 and 17 in the connected state, the cord 16 to be accommodated in 29b, is attached to the holder 22 engages with the IC module 13, IC in挿組solid 24 out the clip pin 23 that holds the module 13 to the holder 22 is to be configured.
[0021]
Such an insertion assembly 24 is inserted into a mold apparatus (not shown), and in order to position the insertion assembly 24 in the mold apparatus, a holder 22 of the insertion assembly 24 is provided. A pair of positioning projections 33, 33... Are projected on the outer surfaces of the first and second side wall portions 25, 26, and a positioning projection 34 is projected on the front surface of the end wall portion 27 of the holder 22. A pair of cylindrical positioning projections 35 and 35 are provided on the outer surface of the bottom wall portion 28 of the holder 22, and positioning projections extending rearwardly on the rear portions of the first and second side wall portions 25 and 26. 35 and 35 are projected.
[0022]
The housing 12 is molded by injecting a hard molten synthetic resin such as polyamide mixed with glass fibers into the mold apparatus in which the insertion assembly 24 is positioned and inserted and clamped. .
[0023]
Incidentally, as shown in FIGS. 2 and 3, the housing 12 is integrally provided with a bracket portion 12a extending outward, and the bracket 12a is fastened to the support body 11 with the bracket portion 12a. A metal collar 37 into which a bolt (not shown) is inserted is embedded in the body.
[0024]
Next, the operation of this embodiment will be described. In this sensor device, a clip pin 23 that engages with the IC module 13 is attached to a holder 22 that accommodates a part of the IC module 13 and the cord 16. The inserted insertion assembly 24 is covered with a molded housing 12. Therefore, the case that has been necessary in the past is not necessary, and the number of parts can be reduced. In addition, since the cord 16 is pulled out from the housing 12 that covers the entire insertion assembly 24, it is not necessary to provide a seal portion between the insertion assembly 24 and the housing 12. Since the housing 12 is formed by molding in the state of being inserted into the apparatus, the assemblability is also improved.
[0025]
Further, the clip pin 23 mounted on the holder 22 so as to hold the IC module 13 on the holder 22 is formed of the first and second side wall portions 25, 26 that sandwich the housing recess 29 for housing the IC module 13. A clip pin which is formed in a substantially U shape so that it can be inserted into the holder 22 from an insertion hole 31 provided in the first side wall 25, and an intermediate portion is brought into contact with and engaged with the second side wall 26. Since both ends of 23 are elastically engaged with both inner edges of the insertion hole 31 provided in the first side wall 25, the clip wall 23 has a simple substantially U shape and the first side wall having the insertion hole 31. The IC module 13 is assembled to the holder 22 and the insertion assembly with a simple structure in which the holder 25 is provided with the portion 25 and the second sidewall portion 26 that forms the housing recess 29 between the first sidewall portion 25 and the second sidewall portion 26. Make up 24 It is possible.
[0026]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various design changes can be made without departing from the present invention described in the claims. It is.
[0027]
【The invention's effect】
As described above, according to the first aspect of the present invention, it is possible to reduce the number of components and improve the assemblability while making it unnecessary to provide a seal structure.
[0028]
According to the second aspect of the present invention, the clip pin has a simple U-shape, a first side wall having an insertion hole, and a second side wall that forms an accommodation recess between the first side wall and the second side wall. The IC module can be assembled to the holder and the insertion assembly can be configured with a simple structure that is simply provided on the holder.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a sensor device.
FIG. 2 is a sectional view taken along line 2-2 of FIG.
FIG. 3 is a view taken in the direction of arrow 3 in FIG. 2;
FIG. 4 is an exploded perspective view of the insertion assembly.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 12 ... Housing 13 ... IC module 14 ... Detection part 16 ... Code 22 ... Holder 23 ... Clip pin 24 ... Insertion assembly 25 ... 1st side wall part 26 ... 2nd side wall part 29 ... accommodation recessed part 31 ... insertion hole

Claims (2)

An IC module (13) having a detection portion (14) is housed and fixed in the housing (12) so that the detection portion (14) is disposed at the tip of the housing (12), and the cord (16) In the sensor device in which one end of the sensor is connected to the IC module (13) in the housing (12),
A holder (22) having a housing recess (29), an IC module (13) housed in the housing recess (29), and the IC module (13) side connected to the IC module (13). Part of the cord (16) accommodated in the accommodating recess (29) and the IC module (13) accommodated in the accommodating recess (29) are engaged with and attached to the holder (22). the IC module (13) is a holder (22) clip pin that holds (23) and out the挿組solid (24) is composed, said挿組solid with the housing (12) made of synthetic resin ( 24) is covered, and the cord (16) is pulled out from the housing (12).  The holder (22) has a first side wall portion (25) having an insertion hole (31) and a second side wall portion (26) formed between the housing recess (29) and the first side wall portion (25). ) And the clip pin (23) formed in a substantially U shape to be able to engage with the IC module (13) accommodated in the accommodation recess (29) 23) The both ends of the clip pin (23) are elastically engaged with the inner edge of the insertion hole (31) in a state where the intermediate portion of 23) is in contact with and engaged with the second side wall portion (26). The sensor device according to claim 1, wherein the sensor device is inserted into the holder (22) through the insertion hole (31).

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