JP2000097957A - Sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the assemble of an IC module to a support and the connection of a terminal to the IC module in a sensor device in which the support used to support the IC module is housed and fixed inside a housing. SOLUTION: A housing recessed part 24 which houses an IC module 16 is formed in a support 22 which is molded with mold from a synthetic resin. End parts, on the other side, of a terminal block 17 and a terminal block 18 which are provided with a connection part 17a and a connection part 18a at ends on one side so as to face the housing recessed part 24 and which are made of a conductive metal protrude from the support 22. A terminal 20 and a terminal 21 which are buried in the support 22 and which are connected to the IC module 16 and the connection parts 17a, 18b at the terminal blocks 17, 18 can come into elastic and springy contact with each other when the IC module 16 is housed in the housing recessed part 24, and they are bent to be nearly L-shaped.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a sensor device in which a support for supporting an IC module is housed and fixed in a housing.

[0002]

2. Description of the Related Art Conventionally, such a sensor device is already known, for example, from Utility Model Registration Publication No. 2513851.

[0003]

In the above conventional sensor device, a sensor unit including a Hall IC and a control circuit is inserted into a cylindrical housing made of synthetic resin, and the opening at the rear end of the housing is covered. And it is difficult to say that the sensor unit has excellent assemblability such as electrical connection.

[0004] The present invention has been made in view of such circumstances, and has as its object to provide a sensor device that facilitates assembling an IC module to a support and connecting the IC module to the IC module.

[0005]

In order to achieve the above object, the present invention provides a sensor device in which a support for supporting an IC module is housed and fixed in a housing. A housing recess for housing the IC module is formed in the body, and a metal terminal plate having a connection portion facing the housing recess at one end is buried in the support with the other end protruding from the support.
A terminal connected to the module and a connection portion of the terminal plate,
When the IC module is housed in the housing recess, the IC module can be resiliently contacted with each other and bend in a substantially L-shape.

According to such a configuration, by inserting the IC module into the accommodating concave portion of the support, the terminals of the IC module and the connecting portions of the terminal plate resiliently contact each other, The IC module housed in the housing recess is temporarily fixed to the support. In this state, the terminals and the connection portions are electrically connected by welding or soldering, so that the IC module can be fixed to the support of the IC module. Is completed, and the assemblability of the insertion assembly can be improved.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below based on one embodiment of the present invention shown in the accompanying drawings.

1 to 10 show one embodiment of the present invention. FIG. 1 is a side view of a sensor device, and FIG.
3 is a perspective view of the sensor device, FIG. 4 is an enlarged sectional view taken along line 4-4 of FIG. 2, FIG. 5 is a sectional view taken along line 5-5 of FIG. 4, and FIG. 7 is a perspective view of the insertion assembly, FIG. 8 is an exploded perspective view of the insertion assembly, FIG. 9 is a perspective view showing the arrangement of terminal plates in the support, and FIG. 10 is FIG. Of 1
FIG. 10 is a sectional view taken along line 0-10.

First, in FIGS. 1 to 6, this sensor device is used as a wheel speed sensor for detecting the rotation speed of an output shaft in a continuously variable transmission mounted on a vehicle, for example. For example, a pair of IC modules 16, 16 are housed and fixed in a housing 15 fixed to a mission case (not shown), and two sets of conductive modules corresponding to the IC modules 16, 16 respectively. Metal terminal board 17,1
8; 17 and 18 are buried.

The IC module 16 includes a magnet and a Hall IC.
, A capacitor, a board, a pair of terminals 20, 21 and the like.
The housings 0 and 21 are housed and fixed in the housing 15 so as to face rearward.

Incidentally, a pair of IC modules 16, 1
6 is housed and fixed in the housing 15, and two sets of terminal plates 17, 18; 17, 18 corresponding to the respective IC modules 16, 16 are embedded in the housing 15. In order to handle the failure of the IC module 16 with the other IC module 16, the function as a wheel speed sensor is a single IC module 16 and a pair of terminal boards 1 corresponding to the IC module 16.
It is sufficient that the housings 7 and 18 are provided in the housing 15.

Referring to FIGS. 7 and 8, two sets of terminal plates 17, 18; 17, 18 are inserted into a support 22 made of a synthetic resin when the support 22 is formed. The terminal plates 17 and 1
8; a synthetic resin molded by covering the insert assembly 23 with a pair of IC modules 16 and 16 mounted on a support 22 in which the 17 and 18 are embedded. The sensor device is configured by being insert-coupled into a housing 15 made of a metal.

The support member 22 has a substantially rectangular cross-sectional shape and a rod-shaped support main portion 22a, and a coupler corresponding portion 22b having a substantially rectangular cross-sectional shape is integrally connected to the support portion 22b.
The receiving recesses 24, 24 are formed on both outer surfaces of the support main part 22a.

Referring also to FIG. 9, two pairs of terminal plates 17, 18; 17, 18 each having one end facing the housing recess 24, 24 and the other end facing the coupler corresponding portion 22b. The support 2 is bent in a form to protrude.
2 and one end of each of the terminal plates 17, 18 facing the housing recesses 24, 24;
a, 18a; bent in a substantially L-shape as 17a, 18a. On the other hand, the I
The terminals 20, 21; 20, 21 of the C modules 16, 16 are provided in pairs, respectively.
Each of the connecting portions 17a, 18a of the first and second members 7 and 18 is bent in a substantially L-shape so as to resiliently contact the connecting portions 17a and 18a. When the IC modules 16 are accommodated in the accommodating recesses 24, 24, the terminal boards 17,
18; connection parts 17a, 18a of 17, 18; 17a, 1
8a, terminals 20, 21 of the IC modules 16, 16;
20 and 21 respectively resiliently contact each other,
The C modules 16, 16 are temporarily fixed to the support 22, and in the temporarily fixed state, the connecting portions 17a, 18a;
1:20, 21 are electrically connected by soldering, welding, or the like.

Referring to FIG. 10 as well, rectangular insertion holes 25, 25 having inner ends opened on both sides of the accommodation recesses 24, 24 and engagement holes are formed at the tip of the support main portion 22a. 2
6 and 26 are provided, and a fitting groove 27 for opening the outer ends of the insertion holes 25 and 25, and the engagement holes 26 and
An engagement groove 28 for opening an outer end of the support main body 22
It is provided so as to open to the outer periphery of the support main part 22a in a direction perpendicular to the longitudinal direction of the support body a.

The IC modules 16, 16 housed in the housing recesses 24, 24, respectively, are sandwiched between a holder 29 made of synthetic resin, which is resiliently engaged with the support 22, and the support 22.

The holder 29 is provided in the insertion hole 2 of the support 22.
5, 25 and a pair of legs 29a, 29a inserted into the engagement holes 26, 26, and the base ends of both legs 29a, 29a are connected in common and fitted into the fitting groove 27 of the support 22. And the engaging claw portions 29c, 29c provided at the tips of the legs 29a, 29a.
When the legs 29a, 29a are inserted through the insertion holes 25, 25 and the engagement holes 26, 26 so as to be sandwiched between the closed ends, the engagement claws 29 at the tips of the legs 29a, 29a.
c, 29c are resiliently engaged with the outer edges of the engagement holes 26, 26, ie, the engagement grooves 28.

Incidentally, in the mold device for forming the support, each terminal plate 17, 18; 17, 18 is provided with a pressing pin (not shown) slidably provided in the mold device.
And the holding portion provided in the mold apparatus, so that the terminal boards 17, 18; 17, 18 are held in a relative posture. As shown in FIGS. 7 and 8, a plurality of recesses 30, 30... Corresponding to the respective holding pins and a recess 31 corresponding to the holding portion are formed. Further, the upper surface and the lower surface of the support body main portion 22a of the support body 22 and the upper surface of the rear end portion of the support body main portion 22a are inserted and assembled in a mold device when the housing 15 is molded. Positioning cylinders 32 for positioning the three-dimensional body 23 are integrally provided.

The insert assembly 23 is insert-coupled to a housing 15 which is molded over the insert assembly 23. The housing 15 includes a support 22.
Support main part 22a and both IC modules 1
6, 15 and a second covering portion 15b covering the coupler corresponding portion 22b of the support 22.
And each terminal plate 1 protruding from the coupler corresponding portion 22b.
7, 18; a coupler portion 15c which is formed in a cylindrical shape with the other ends of 17, 18 facing each other and is continuous with the second covering portion 15b.
And a bracket portion 1 extending laterally from the first covering portion 15a
5d and the bracket portion 15d.
In this case, a metal collar 33 is embedded by insert coupling or the like at the time of molding the housing 15. Thus color 3
3 through a bolt (not shown) inserted through the housing 1.
5 is fastened to the mission case.

When the housing 15 is molded, the recesses 30, 30,..., 31 formed in the support 22 are filled with a synthetic resin forming the housing 15, but are provided on the support 22. Positioning cylinder 32
Are formed on the outer surface of the first covering portion 15a at portions corresponding to the positioning pins 32 fitted to the positioning tubular portions 32. Further, a mounting groove 35 for mounting an O-ring (not shown) is formed on the outer periphery of the first covering portion 15a.

Next, the operation of this embodiment will be described. A support 22 made of synthetic resin, and terminal plates 17 and 18 made of conductive metal which are protruded at both ends from the support 22 and buried in the support 22; 17, 18 and their terminal plates 1
7, 18; an insert assembly 23 having IC modules 16 and 16 connected to one ends of 17, 18 and attached to a support 22 is made of synthetic resin molded over the insert assembly 23. Is insert-coupled into the housing 15. Therefore, when the housing 15 is molded, the housing 15 and the support 22 are integrally connected, and it is not necessary to provide a seal between the support 22 and the housing 15. Also, terminal plates 17, 18;
Reference numeral 18 denotes a terminal board 1 embedded in the support 22.
7, 18; it is not necessary to provide a seal portion between 17, 18 and the support 22.

Further, since the IC modules 16 and 16 are housed and fixed in the housing 15 when the housing 15 is formed, the assemblability of the sensor device can be improved.

The terminal plate 17, 1 is provided on the housing 15.
8; 17 and 18 are integrally formed with the coupler portion 15c facing the other end thereof, so that the electrical connection between the terminal plates 17, 18; .

The IC modules 16 and 16 are
Terminal plates 17, 18; 17, 18 accommodated in accommodation recesses 24, 24 formed in
17a, 18a; 17a, 18a at one end of
Terminals 20, 21; 2 connected to the C modules 16, 16;
0, 21 are the accommodating recesses 2 of the IC modules 16, 16
They are bent in a substantially L-shape so as to resiliently come into contact with each other when housed in 4, 24. Therefore, the accommodation recesses 24, 2
4 by inserting the IC modules 16
The IC modules 16 and 16 are temporarily fixed to the support 22. In this temporarily fixed state, the terminals 20, 21;
By performing an electrical connection operation by welding or soldering to the 21 and the connection portions 17a, 18a; 17a, 18a, the attachment and the connection of the IC modules 16, 16 to the support 22 are completed, and the interpolation is performed. The assemblability of the assembly 23 can be improved.

Further, since the IC modules 16 and 16 are sandwiched between the holder 29 which is resiliently engaged with the support 22 and the support 22, the housing 15 which covers the insertion assembly 23 is provided. IC modules 16, 1
The IC modules 16 and 16 can be reliably supported by the support 22 so that the IC module 6 does not come off the support 22.

Although the embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and various design changes can be made without departing from the present invention described in the appended claims. It is possible to do.

For example, in the above embodiment, the pair of IC modules 16 and 16 are accommodated and fixed in the support 22. However, the single IC module 16 and the pair of terminal plates 17 and 18 corresponding to the IC module 16 are provided. Is the support 22
The present invention can also be applied to a sensor device provided in.

In the above embodiment, the case where the insertion assembly 23 is insert-coupled to the synthetic resin housing 15 has been described. However, in the present invention, the IC module is mounted in the cylindrical housing. The present invention is also applicable to a sensor device in which a support to be inserted is inserted.

[0029]

As described above, according to the present invention, the IC module is temporarily fixed to the support by inserting the IC module into the accommodation recess, and the terminals and the connection portions are welded in this temporarily fixed state. Alternatively, by performing an electrical connection operation using solder or the like, the attachment and connection of the IC module to the support are completed, so that the assemblability of the insertion assembly can be improved.

[Brief description of the drawings]

FIG. 1 is a side view of a sensor device.

FIG. 2 is a front view as viewed in the direction of arrow 2 in FIG.

FIG. 3 is a perspective view of a sensor device.

FIG. 4 is an enlarged sectional view taken along line 4-4 of FIG. 2;

FIG. 5 is a sectional view taken along line 5-5 in FIG. 4;

FIG. 6 is a sectional view taken along line 6-6 of FIGS. 4 and 5;

FIG. 7 is a perspective view of an insertion assembly.

FIG. 8 is an exploded perspective view of the insertion assembly.

FIG. 9 is a perspective view showing an arrangement of terminal plates in a support.

FIG. 10 is a sectional view taken along line 10-10 of FIG. 7;

[Explanation of symbols]

 15 ... housing 16 ... IC module 17, 18 ... terminal plate 17a, 18a ... connection part 20, 21, ... terminal 22 ... support body 24 ... accommodation recess

Claims (1)

[Claims] 1. A sensor device in which a support (22) for supporting an IC module (16) is housed and fixed in a housing (15), wherein the IC is mounted on the support (22) molded from a synthetic resin. A receiving recess (24) for receiving the module (16) is formed, and the receiving recess (24) is formed.
A metal terminal plate (17, 18) having a connecting portion (17a, 18a) at one end facing the other end of the support (2).
Terminals (20, 21) protruding from 2) and embedded in the support (22) and connected to the IC module (16)
And connection portions (17a, 18) of the terminal plates (17, 18).
a) is bent substantially in an L-shape so as to allow the IC module (16) to resiliently contact each other when housed in the housing recess (24).