JP4409738B2 - Heat dissipation structure of electronic equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat dissipation structure for an electronic device including a control unit and a power unit.
[0002]
[Prior art]
Conventionally, an electronic control device called an ECU is mounted on a vehicle as a unit for each function to be controlled. Each ECU includes a control circuit portion that performs a logical control operation including a microcomputer and a power circuit portion that performs external power control.
[0003]
Hereinafter, a conventional electronic control apparatus will be described with reference to FIG. FIG. 7 is an exploded perspective view showing a schematic configuration of a conventional electronic control device.
[0004]
Reference numeral 1 denotes an electronic control unit, and a main part of the electronic control unit 1 is accommodated in a connector-integrated resin case 2. A control connector 3 and power connectors 4 and 5 are collected on one of the side surfaces of the connector-integrated resin case 2. As a result, connection to the electronic control unit 1 can be performed only from one direction. In the connector-integrated resin case 2, a plurality of power components 6 and 7 are mounted, and connection terminals 8 and 9 are also provided. The connection terminals 8 and 9 are used for electrical connection with the control board 10. The control board 10 is mounted on the upper surface side of the connector-integrated resin case 2 and has through holes 11 and 12 for electrical connection with the connection terminals 8 and 9. A plurality of control components 13, 14 and 15 are mounted on the control board 10. A lid 20 is placed over the control board 10. On the bottom surface side of the connector-integrated resin case 2, a heat sink 21 for releasing heat generated from the power components 6 and 7 is mounted. Waterproof gaskets 22 and 23 are interposed between the lid 20 and the heat sink 21 and the connector-integrated resin case 2.
[0005]
[Problems to be solved by the invention]
However, in the electronic control device as shown in FIG. 7 described above, generally, a large current flows by being connected to the vicinity of the connector pins of the power connectors 4 and 5 in the power circuit portion of the electronic control device 1 and to the connection terminals 8 and 9. The bus bar part generates a lot of heat. The heat generated in the vicinity of the connector pins and in the bus bar portion is radiated by the heat sink 21 attached to the bottom surface of the connector-integrated resin case 2. In order to improve heat dissipation to such an extent that the control circuit portion is not affected, it is conceivable to enlarge the heat sink 21 as one method. However, when the size of the heat sink 21 increases, the size of the entire electronic control device increases, and it becomes difficult to cope with downsizing. Moreover, the problem that a manufacturing cost rises by using a large-sized heat sink remains.
[0006]
SUMMARY OF THE INVENTION The present invention solves the above-described problems, and an object thereof is to provide a heat dissipation structure that is hardly affected by heat generated in a power circuit portion in a control unit of an electronic device.
[0007]
[Means for Solving the Problems]
The present invention achieves the above-described object, and includes a case in which power components are disposed, a heat sink mounted on the case and formed with a recess, and a conductor metal that extends above the recess. And a bus bar disposed in the case so as to be positioned inside the recess, wherein the recess in which the bus bar is disposed is filled and sealed with an electrically insulating resin. is there.
[0008]
The bus bar includes a first bus bar extending so as to pass over the concave portion, and a second bus bar located inside the concave portion and connected to the first bus bar. To do.
[0009]
Further, the bus bar is bent so as to pass through the recess from above the recess.
[0010]
In addition, a part of the bus bar is disposed along the inner side surface of the case side wall.
[0011]
The bus bar is embedded in the resin layer inside the case, and a part of the bus bar is exposed to the outside from the resin layer.
[0012]
In addition, a power part provided with a connection terminal in a case in which power components are arranged, a bus bar formed of a conductor metal and connected to the connection terminal, and a recess formed in the case. The bus bar and the connection terminal are arranged so as to be connected inside the recess, and the recess is filled and sealed with an electrically insulating resin.
[0013]
In addition, one of the connection terminal and the bus bar extends in the bottom direction of the recess.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to FIG.
[0015]
FIG. 1 is an exploded perspective view showing a schematic configuration of an electronic control device according to an embodiment of the present invention.
[0016]
Reference numeral 31 denotes an on-vehicle electronic control device, which is divided into a control unit 32 and a power unit 33, and has a structure in which parts can be easily assembled and can be easily combined with each other. The control unit 32 is formed based on a control connector integrated case 34 as a control case. The control connector integrated case 34 is integrally formed by partially embedding a metal conductive portion in a synthetic resin. The space in the control connector integrated case 34 is partitioned by a wall 34c into a first space 34a and a second space 34b. The shape of the control connector integrated case 34 is substantially a rectangular parallelepiped, and control connectors 35 and 36 are integrally formed on one side surface thereof. A spacer 34d is formed at the corner of the second space 34b on the bottom surface of the control connector integrated case 34. The control connectors 35 and 36 are used for connecting a wire harness to the on-vehicle electronic control device 31. The metal conductor portions integrally embedded in the control connector integrated case 34 form connector connection terminals 37 and 38, relay connection terminals 39, and metal terminal portions in the control connectors 35 and 36, respectively. That is, the metal terminal portions in the control connectors 35 and 36 are connected to the connector connection terminals 37 and 38 exposed in the second space 34b from the electrically insulating resin of the control connector integrated case 34, respectively. . The relay connection terminal 39 is formed on the wall 34c, and both ends (the other end 39a and one end 39b) thereof are exposed in the first and second hollow portions 34a and 34b, respectively.
[0017]
The main part of the control circuit portion of the control unit 32 is formed on the control board 40. The control board 40 is formed by laminating conductive copper stays or the like on one surface or both surfaces of an electrically insulating synthetic resin substrate, as well as a multilayer including an intermediate layer, in the same manner as a normal printed wiring board. The The control board 40 is inserted into the second hollow portion 34b from below the control connector integrated case 34, and the corner mounting holes 40a are fitted to the spacers 34d and attached by screwing or heat caulking. The connection terminals 41 and 42 for electrical connection are arranged at positions corresponding to the connector connection terminals 37 and 38 of the connector integrated case 34 and the one end 39b of the relay connection terminal 39, respectively. The connection terminals 41 and 42 are the connector connection terminals 37 and 38 and one end 39b of the relay connection terminal 39 in a state where the control board 40 is fitted in a predetermined position inside the second hollow portion 34b of the control connector integrated case 34. It is arrange | positioned in the position which can be electrically contacted with. These connection terminals 41 and 42 are attached to the control board 40 by applying a surface mounting technique such as reflow soldering. Control parts 43, 44, 45 are mounted on the front or back surface of the control board 40. The control components 43, 44, and 45 are, for example, semiconductor integrated circuits, individual semiconductor elements, or various electronic components such as resistors and capacitors, and are mounted by applying surface mounting technology or the like. The control board 40 is also formed with a wiring pattern for making electrical connection between the control components 43, 44, 45 and the connection terminals 41, 42 and constituting a control circuit portion. The control board 40 is housed inside the control connector integrated case 34 and the electronic control device 31 is sealed in a waterproof state by covering the upper portion with a lid 50 from a state where electrical connection or the like is performed. The lid 50 is attached using ultrasonic welding or vibration welding. In ultrasonic welding or vibration welding, the lid 50 and the control connector integrated case 34 are directly joined by ultrasonic waves or vibration. By joining the lid 50 using such ultrasonic waves or vibrations, waterproofness can be ensured without using packing or the like, and costs can be reduced.
[0018]
A power unit 33 is combined below the control unit 32 with the intermediate layer 51 interposed therebetween. The intermediate layer 51 is provided with a power-side terminal 52 and a power portion connecting terminal 53, and is integrally embedded in an electrically insulating synthetic resin. The power side terminal 52 is inserted in the intermediate layer 51 from below the control connector integrated case 34 and stored in a predetermined position in the second hollow portion 34b of the control connector integrated case 34. It is attached to the lower part of the integrated case 34. With the intermediate layer 51 attached to the lower part of the control connector integrated case 34, the power side terminal 52 is electrically connected to the other end 39 a of the relay connection terminal 39 in the first hollow portion 34 a of the control connector integrated case 34. It is arrange | positioned in the position which can contact. The power unit connection terminal 53 is used for electrical connection with the power unit 33 when the intermediate layer 51 is combined with the power unit 33. At the corner of the intermediate layer 51, a mounting hole 51a that fits into the spacer 54a is formed for mounting to the power connector integrated case 54. The power-side terminal 52 and the power portion connection terminal 53 rise from insertion holes 52 a and 53 a formed in the intermediate layer 51.
[0019]
The power unit 33 is configured based on a power connector integrated case 54 (corresponding to a case) as a power case (corresponding to the case). The power connector integrated case 54 is formed by embedding conductive metal parts in a synthetic resin having electrical insulation. The power connector integrated case 54 has a substantially rectangular parallelepiped shape and can be stacked with the control connector integrated case 34. In the stacked state, power connectors 55 and 56 are formed on the side surfaces in the same direction as the side surfaces on which the control connectors 35 and 36 are formed in the control connector integrated case 34. The metal terminal portions in the power connectors 55 and 56 are formed by exposing a part of the bus bar embedded in the power connector integrated case 54. In the power connector integrated case 54, power components 57 and 58 are mounted, and a connection terminal 59 for electrical connection with the power portion connection terminal 53 of the intermediate layer 51 is also erected. The connection terminal 59 is also formed by bending a part of the bus bar embedded in the power connector integrated case 54. A spacer 54 a for mounting the intermediate layer 51 is disposed on the power connector integrated case 54 at a position corresponding to the mounting hole 51 a of the intermediate layer 51.
[0020]
A heat sink 60 is attached to the power connector integrated case 54 on the side opposite to the side where the control connector integrated case 34 is combined with the intermediate layer 51 interposed therebetween. The heat sink 60 is made of a metal having good thermal conductivity and has fin processing on the back side, and a power module 61 made of a power control semiconductor is mounted on the front side. The power connector integrated case 54 and the heat sink 60 side so that electrical connection between the power connector integrated case 54 and the power module 61 is possible with the heat sink 60 mounted below the power connector integrated case 54. First, a part of the bus bar is exposed in a planar shape, and an electrical connection portion 100 is provided. The power connector integrated case 54 and the heat sink 60 are bonded by a resin adhesive.
[0021]
The intermediate layer 51 is provided in order to collect terminals erected randomly on the power side. For this reason, the intermediate layer 51 is also considered as one configuration on the power side, and the power side terminal 52 functions as a connection terminal when combined with the power unit 33 with respect to the control unit 32. The relay connection terminals 39 shown in FIG. 1 can also be integrated together when terminals are erected randomly on the control unit 32 side, and function as control-side terminals when combined with the power unit 33. Therefore, when the control unit 32 and the power unit 33 are combined, the other end 39a of the relay connection terminal 39 as the control-side terminal and the power-side terminal 52 come close to each other and are easily welded.
[0022]
When the electronic control device 31 shown in FIG. 1 is assembled, first, the connection terminals 41 and 42 and the control components 43, 44 and 45 are mounted on the control board 40, and the power components 57, 58 and the connection terminal 59 at the end of the bus bar are joined by resistance welding and mounted, and the power module 61 is mounted on the heat sink 60. The control connector integrated case 34 and the control board 40 are combined, and resistance welding is performed between the connector connection terminals 37, 38 and the connection terminal 41 and between the one end 39b of the relay connection terminal 39 and the connection terminal 42. The control unit 32 is formed. Further, the power connector integrated case 54 and the heat sink 60 are joined with a resin adhesive, and the bus bar electrical connection portion 100 and the power module 61 are bonded to each other by wire bonding using a bonding wire such as aluminum, copper, or gold. Then, electrical connection is made, and the resin layer is filled with resin in a liquid state, cured and sealed, and the power portion 33 is formed.
[0023]
The intermediate layer 51 has a shape that fits into the upper part of the power connector integrated case 54. When the intermediate layer 51 is inserted into the mounting hole 51a by inserting the spacer portion 54a at the top of the power connector integrated case 54 and attached by heat caulking or screwing, the power portion connecting terminal 53 and the connecting terminal 59 can contact each other. Since it is close to the degree and can be electrically connected, electrical joining is performed by resistance welding. With the intermediate layer 51 attached to the power unit 33, the control unit 32 is further combined from above. The control connector integrated case 34 and the power connector integrated case 54 are joined by ultrasonic welding or vibration welding. Since waterproofness is good by joining using ultrasonic waves or vibration, it is not necessary to interpose packing or the like, and the manufacturing cost can be reduced.
[0024]
In a state where the control unit 32 and the power unit 33 are combined, the power-side terminal 52 of the intermediate layer 51 can contact the other end 39a of the relay connection terminal 39 of the control connector integrated case 34 in the first hollow portion 34a. Since it protrudes to a position and is in a contactable state, electrical joining is performed by resistance welding.
[0025]
As described above, in the state where the power unit 33 and the control unit 32 are combined, the upper part of the control connector integrated case 34 is opened, and from this upper part, the electric conductivity is high and the heat dissipation is excellent. Using a member such as an insulating resin, for example, an epoxy resin or a silicon resin, resin potting can be performed to increase the reliability of the control unit 32. Further, the lid 50 can be covered and sealed by welding using ultrasonic waves or vibration.
[0026]
Next, heat dissipation structures according to the first to fourth embodiments of the present invention will be described with reference to FIGS.
[0027]
2A and 2B are diagrams showing a part of the power portion according to the first embodiment of the present invention, in which FIG. 2A is a top view in the vicinity of the connector pin portion of the power connector integrated case, and FIG. FIG. In the first embodiment, the same components as shown in FIG.
[0028]
In the first embodiment, the recess 80a is formed in the heat sink 80, the surface area of the heat sink 80 on the side facing the bus bars 66 and 68 is increased, and the heat conduction efficiency from the electrically insulating resin 81 to the heat sink 80 is improved. To do.
[0029]
The bus bars 66 and 68 pass above the recess 80a, are connected to the power connector 56 via the power connector integrated case 54, and are exposed in the connector. The exposed bus bars 66 and 68 form connector pins 66c and 68c connected to the outside. The recess 80a is filled and sealed with the above-described electrically insulating resin 81, and the heat sink 80 and the bus bars 66 and 68 are insulated from each other. Note that the electrically insulating resin 81 may cover the bus bars 66 and 68 above the recess 80a. A branch portion 66a branched from the bus bar 66 in the lateral direction is formed above the recess 80a. The branching portion 66a extends downward toward the bottom surface of the recess 80a formed in the heat sink 80 by being bent downward by the bending portion 66b. An electrically insulating resin is also filled between the branch portion 66a and the bottom surface of the heat sink 80, and the heat sink 80 and the branch portion 66a are insulated from each other. When the bus bars 66 and 68 above the recess 80a are resin-sealed, the branch portion 66a is also resin-sealed.
[0030]
Next, heat dissipation in this embodiment will be described.
[0031]
Heat generated in the vicinity of the connector pins 66c and 68c is conducted to the electrically insulating resin 81 through the branch portions 66a and 68a of the bus bars 66 and 68. Thereafter, the heat is conducted from the electrically insulating resin 81 to the heat sink 80 and released from the surface of the heat sink 80 to the outside.
[0032]
As described above, according to the present embodiment, the branch portions 66a and 68a are formed in the bus bars 66 and 68 above the recesses 80a formed in the heat sink 80, so that the surface area of the bus bars 66 and 68 is increased and the electric insulation property is increased. The efficiency of heat conduction to the resin 81 is improved. Further, by extending the branch portions 66a and 68a toward the bottom surface of the recess 80, the distance between the heat sink 80 and the bus bars 66 and 68 can be kept close, and heat can be quickly conducted from the branch portions 66a and 68a to the heat sink 80. Is possible. In addition, by sealing the recess 80a with resin, the heat dissipation from the heat generating portion to the heat sink 80 is improved, and even when a large current flows, the temperature rise near the connector pins 66c and 68c can be suppressed. It becomes possible. As a result, heat generated in the power unit 33 can be prevented from flowing out to the control circuit unit 32.
[0033]
In the present embodiment, the branch portions 66a and 68a are formed in the lateral direction of the bus bars 66 and 68. However, the shape of the branch portion is not limited to this method, and the bus bars 66 and 68 extend into the recess 80a. All aspects are included. For example, a branch portion may be joined directly below the bus bars 66 and 68 and extended into the recess.
[0034]
Next, a heat dissipation structure according to the second embodiment of the present invention will be described with reference to FIGS.
[0035]
FIGS. 3A and 3B are views showing a part of the power portion according to the second embodiment of the present invention, in which FIG. 3A is a top view in the vicinity of the connector pin portion, and FIG. In the second embodiment, the same components as shown in FIG. 1 and FIG.
[0036]
In the second embodiment, a folded portion 82 is formed instead of the branch portions 66a and 68a of the bus bars 66 and 68. Specifically, the bus bars 66 and 68 are partially bent from above the recess 80a toward the bottom surface of the recess 80a, folded upward near the bottom of the recess 80a, and bent horizontally above the recess. The recess 80a is filled with a resin 81, and the heat sink 80 and the bus bars 66 and 68 are insulated from each other.
[0037]
As described above, also in this embodiment, the bus bars 66 and 68 exist inside the recess 80a formed in the heat sink 80, and it is possible to obtain the same effect as that of the first embodiment shown in FIG. is there.
[0038]
In the first and second embodiments shown in FIGS. 2 and 3, the recess 80a is formed in the heat sink 80 near the connector pin, and the branching portion 66a or the folded portion 82 is formed in the recess 80a. The position where the recess 80a is formed is not limited to the vicinity of the connector pins 66c and 68c. The recess 80a is provided in the vicinity of an arbitrary portion where heat generation is large. It is possible to improve the heat radiation efficiency by sealing.
[0039]
FIG. 4 shows an application example thereof. FIGS. 4A and 4B are diagrams showing a part of a power unit to which the second embodiment is applied. FIG. 4A is a top view of a portion where a recess is formed in the power connector integrated case, and FIG. 4B is a side view of the recess. is there.
[0040]
The position where the recess 80a is formed is different from the position described with reference to FIGS. 2 and 3, but the other structures and effects are the same as those of the embodiment shown in FIGS. Generally, a contact resistance exists at the connection portion between the bus bar and the connection terminal, and heat is generated at the contact portion. Therefore, as shown in FIG. 4, a recess 80 a is provided in the vicinity of the contact portion, and the heat is quickly conducted to the heat sink by extending the bent portion 68 b from the bus bar (branching portion 68 a) inside the recess. It can be released to the outside.
[0041]
Further, a recess 80a as shown in FIGS. 3 and 4 is provided in the vicinity of the power connectors 55 and 56, bus bars 66 and 68 are extended inside, and the recess 80a is filled and sealed with a resin 81 to thereby provide power. It can serve as a stopper for stress generated when the connectors 55 and 56 are attached to and detached from the external connector, and can prevent stress from being transmitted to the portion after the recess 80a.
[0042]
Next, a heat dissipation structure according to a third embodiment of the present invention will be described with reference to FIG.
[0043]
FIGS. 3A and 3B are diagrams showing a part of the power unit according to the third embodiment of the present invention, in which FIG. 3A is a top view in the vicinity of the power connector, and FIG. In the present embodiment, the same components shown in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.
[0044]
In the present embodiment, the bus bars 66 and 68 are branched from the power connector integrated case 54 to the left and right before reaching the power connector 56 portion. The power connector integrated case 54 is provided with a groove 69 on the inner peripheral surface of the side wall in the horizontal direction of the inner peripheral surface, and the branched bus bars 66e and 68e are grooves 69 formed on the inner periphery of the side wall of the power connector integrated case 54. Is disposed in the groove 69 along the line.
[0045]
Next, heat dissipation in this embodiment will be described.
[0046]
Heat generated in the vicinity of the connector pins 66c and 68c is conducted to the branched bus bars 66e and 68e disposed on the inner peripheral surface of the side wall of the power connector integrated case 54 via the branch portions 66d and 68d of the bus bar. The heat conducted to the branched bus bars 66e and 68e is released from the branched bus bars 66e and 68e into the power connector integrated case 54. These branched bus bars 66e and 68e function as heat radiating fins, and heat generated in the vicinity of the connector pins 66c and 68c is quickly conducted to the side wall of the connector integrated case 54 via the bus bar, and the heat is branched. , 68e.
[0047]
As described above, according to the present embodiment, locally generated heat can be quickly conducted to the peripheral portion, so that it is possible to prevent the heat from staying at a certain place and increasing the temperature.
[0048]
Next, a heat dissipation structure according to the fourth embodiment of the present invention will be described with reference to FIG.
[0049]
6A and 6B are views showing a part of a power unit according to a fourth embodiment of the present invention, in which FIG. 6A is a top view of a part of a bus bar arranged in a power connector integrated case, and FIG. FIG. In the present embodiment, the same components shown in FIGS. 1 to 5 are denoted by the same reference numerals and description thereof is omitted.
[0050]
The bus bar 66 is a power transmission path for supplying the power supplied via the connector part to the power components 57, 58 and the like, and is embedded in the synthetic resin 110 in the power connector integrated case 54. Yes. In the present embodiment, as shown in FIG. 6, the bus bar 66 is partially exposed from the synthetic resin 110 to the hollow portion of the power connector integrated case 54 and formed integrally with the exposed portion 66 f.
[0051]
As described above, according to the present embodiment, by forming the exposed portion 66f in the bus bar 66, the exposed portion 66f functions as a heat radiating fin, and quickly releases the heat in the bus bar into the power connector integrated case 54. It becomes possible. Therefore, by exposing the exposed portion 66f of the bus bar from the inside of the synthetic resin 110 in the vicinity of an arbitrary portion where heat generation is large, it is possible to suppress a local temperature rise.
[0052]
In addition, when a very high temperature is expected at a specific location, by combining two or more of the embodiments described with reference to FIGS. 1 to 6, heat can be released more efficiently and the temperature can be increased locally. Can be suppressed. For example, it is possible to dissipate heat more effectively by providing a recess in the heat sink, extending the bus bar into the recess and sealing with resin, and exposing the bus bar from the inside of the synthetic resin to function as a heat radiating fin.
[0053]
【The invention's effect】
As described above, according to the present invention, a part of the bus bar is extended in the recess formed in the heat sink, and the recess is sealed with resin, so that the heat in the bus bar is quickly transmitted to the heat sink and radiated to the outside. It becomes possible. Also, by forming the part corresponding to the heat radiating fin in the bus bar integrally with the bus bar, the heat in the bus bar is quickly released to the outside of the bus bar, and the heat generated in a certain part connected to the bus bar is quickly released. It is possible to suppress a significant temperature rise. As a result, it is possible to reduce the influence of heat on the electronic device including the control unit and the power unit, and it is difficult to be affected by noise and the like, and a stable operation can be performed.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a schematic configuration of an electronic control device according to an embodiment of the present invention.
FIG. 2 is a diagram showing a part of a power unit according to the first embodiment of the present invention.
FIG. 3 is a diagram showing a part of a power unit according to a second embodiment of the present invention.
FIG. 4 is a diagram showing a part of a power unit to which a second embodiment is applied.
FIG. 5 is a diagram showing a part of a power unit according to a third embodiment of the present invention.
FIG. 6 is a diagram showing a part of a power unit according to a fourth embodiment of the present invention.
FIG. 7 is an exploded perspective view showing a schematic configuration of a conventional electronic control device.
[Explanation of symbols]
31 .. Electronic control unit
32..Control part
33 ・ ・ Power Department
34. ・ Control connector integrated case
34a .. 1st space part
34b .. 2nd space part
34c..Wall
34d, 54a, spacer
35, 36 ... Control connector
47, 38 ... Connector connector
39 .. Relay connection terminal
39a ... the other end
39b ... one end
40 ... Control board
41, 42, 59 ... Connection terminals
43, 44, 45 ... Control parts
50 ... Lid
51..Intermediate layer
51a ・ ・ Mounting hole
52 .. Power side terminal
52a, 53a .. Insertion hole
53 .. Terminal for connecting power section
54 ・ ・ Power connector integrated case
55,56 ・ ・ Power connector
57,58 ・ ・ Power parts
60, 80 ... Heat sink
61. Power module
66, 68 ... bus bar
66a, 68a, 66d, 68d ... branching part
66b ... Bending part
66c, 68c ... Connector pin
66e, 68e ... Busted bus bar
66f..Exposed part
69 ...
80a ... recess
100 .. Electrical connection
110 ・ ・ Synthetic resin

Claims (7)

A case where the power components are placed inside;
A heat sink attached to the case and formed with a recess;
A bus bar formed of a conductor metal and extending above the recess and disposed in the case so as to be located inside the recess;
A heat dissipation structure for an electronic device, wherein the recess in which the bus bar is disposed is filled and sealed with an electrically insulating resin. The bus bar
A first bus bar extending so as to pass above the recess;
2. The heat dissipation structure for an electronic device according to claim 1, comprising a second bus bar located inside the recess and connected to the first bus bar. The heat dissipation structure for an electronic device according to claim 1, wherein the bus bar is bent so as to pass through the recess from above the recess. 2. The heat dissipation structure for an electronic device according to claim 1, wherein a part of the bus bar is disposed along the inner side surface of the case side wall. 2. The heat dissipation structure for an electronic device according to claim 1, wherein the bus bar is embedded in the resin layer inside the case, and a part of the bus bar is exposed to the outside from the resin layer. A power section having connection terminals in a case in which power components are arranged; and
A bus bar formed of a conductor metal and connected to the connection terminal;
The heat sink is attached to the case and formed with a recess. The bus bar and the connection terminal are arranged to be connected inside the recess, and the recess is filled and sealed with an electrically insulating resin. A heat dissipation structure for an electronic device. The heat dissipation structure for an electronic device according to claim 6, wherein one of the connection terminal and the bus bar extends toward the bottom of the recess.

Images