JP4388424B2 - Wiring board and tilt sensor device - Google Patents

Description

  The present invention relates to a wiring board for forming a tilt sensor device for detecting a tilt direction and a tilt sensor device using the wiring board.

  Conventionally, an inclination sensor device for detecting inclination is generally made of a casing made of an electrical insulator such as an organic resin material and a linear metal material so as to penetrate from the inside to the outside of the casing. And a plurality of electrically conductive pins that are electrically independent from each other and a conductive sphere encapsulated inside the housing. The housing is usually composed of a lower plate and an upper plate, and the conductive pins are sandwiched between the upper plate and the lower plate, or penetrate the upper plate and the lower plate in the thickness direction. Is attached. Further, when the upper plate and the lower plate are joined, a sphere is enclosed between the upper plate and the lower plate by inserting a sphere (see, for example, Patent Documents 1 and 2). .

  Such a tilt sensor device is used by electrically connecting a portion of the conductive pin exposed to the outside of the housing to an electric circuit of an external electric circuit board via solder or the like. The external electric circuit to which the conductive pin is connected is electrically connected to a detector such as an ammeter or a detector including a buzzer.

  Then, the sphere rolls and moves in the housing according to the inclination of the inclination sensor device, and the two adjacent metal pins are electrically connected by the conductive sphere, and this electrical connection is electrically connected to the metal pin. Thus, by detecting with a detector such as an ammeter arranged outside, the direction in which the conductive sphere has moved, that is, the direction of inclination can be detected.

  This tilt sensor device is used as an electronic circuit board that constitutes equipment such as electronic devices such as mobile phones and digital cameras, anti-theft devices for vehicles for work on rough terrain, etc., and anti-theft devices for automobiles. By mounting and mounting, it is possible to detect the tilt directions of various devices on which the tilt sensor device is mounted.

  For example, when mounted as a component on a digital camera or a mobile phone with a camera, the direction in which the image is captured is changed according to the direction of the camera (so-called vertical position or horizontal position), and the upward direction at the time of shooting is always saved. The image can be picked up and stored so as to coincide with the upward direction of the image.

Also, when viewing images with a digital camera, mobile phone, PDA (Personal Digital Assistant), etc., the upper side of the photo is always on the opposite side of the earth's gravity regardless of the orientation of the image display device, such as a digital camera or mobile phone. In other words, it can be displayed so that a user looking at the image display device can easily view an image such as a photograph.
JP-A-11-162306 JP 2004-55316 A

  However, according to the conventional inclination sensor device, the metal pin is disposed so as to penetrate from the inside to the outside of the housing, and the metal pin is electrically connected to the detection device or the like on the external electric circuit board. Since it is necessary to mount, there is a problem that it is difficult to make the surface mountable form, and it is difficult to reduce the thickness and size.

  Also, for example, prepare upper and lower plates, metal pins, and conductive spheres that make up the housing, with the metal pins passing through the upper and lower plates, and encapsulating the conductive spheres. Therefore, there is a problem that the number of parts is large, the manufacturing process is complicated, and the productivity is low.

  In addition, since there is a risk of malfunction if moisture in the outside air enters inside the housing, it is necessary to increase the airtightness in the housing, but there is a risk that the airtightness will deteriorate at the part where the conductive pin penetrates the housing There was a problem that long-term reliability was low.

  Also, when used in an environment where intense vibrations occur, the conductive sphere hits the metal pin and deforms the conductive pin, or the conductive sphere is sandwiched between two adjacent conductive pins. There was also a problem that the tilt could not be detected normally.

  Further, the surface on which the sphere in the housing moves is usually the upper surface of the lower plate and is flat. In this case, since the sphere easily rolls, the sphere moves with a sharp detection even with a slight inclination of the tilt sensor device. Therefore, although it is effective for applications that require detection even at a slight inclination, such as automobile security sensors, for example, in the case of a device that is used by hand, such as a mobile phone with a camera, the device that is to be detected There is also a problem that it is difficult to operate the device normally because it detects a tilt caused by a slight shake other than the direction of the tilt. For example, when it is desired to detect the orientation of the device (cell phone) in the direction of gravity at the time of image capture, that is, whether the image is taken in a vertical position or in a horizontal position, other shakes are detected as the device tilt by mistake. As a result, the orientation of the captured image varies vertically and horizontally.

  For such a problem, a means has been proposed in which a concave portion is provided in the center of the surface on which the sphere in the casing rolls, and the sphere is contained in the sphere to make it difficult to roll. However, in the conventional tilt sensor device, it is necessary to attach each conductive pin so that the distance from the edge of the concave portion is the same, so that the manufacture of the tilt sensor device becomes more complicated and the problem of lowering productivity is induced. There is a risk of being.

  Accordingly, the present invention has been completed in view of the above-mentioned problems, and the object thereof is to provide an easy-to-surface mount on an external electric circuit board and the like, excellent in productivity of the tilt sensor device, and a container in which a sphere is enclosed. An object of the present invention is to provide a wiring board for forming a tilt sensor device having good airtightness and capable of detecting tilt without malfunctioning over a long period of time, and a tilt sensor device using the wiring board.

In the wiring board of the present invention, a curved concave portion is formed in the central portion of the upper surface and the outer shape is a polygonal shape of a quadrangle or more, and the concave portion is surrounded by the outer peripheral portion of the upper surface of the insulating substrate. And an insulating frame having the same outer shape as that of the insulating substrate, and a wiring conductor led out from an inner surface of each side of the insulating frame to at least one of a side surface and a lower surface of the insulating substrate. And the conductive spheres are accommodated inside the insulating frame on the upper surface of the insulating substrate so that they can freely roll, and the wiring conductors are electrically independent from each other , In the insulating frame, a step is formed over the entire circumference between the upper surface and the inner surface, and the wiring conductor passes through the upper surface of the step from the inner surface below the step and the side surface of the insulating substrate and At least one of the lower surfaces And it is characterized in that it is derived.

  The wiring board according to the present invention is preferably characterized in that an electrode pad electrically independent of the wiring conductor is formed on the inner surface of the recess.

  The wiring board according to the present invention is preferably characterized in that the recess is formed so that the sphere contacts the wiring conductor when the insulating substrate is tilted by 10 degrees or more.

  The tilt sensor device according to the present invention includes a wiring board having the above-described configuration, a conductive sphere accommodated in a state of being freely rollable in the recess on the upper surface of the insulating substrate, and an upper surface of the insulating frame. A tilted direction of the wiring board by detecting the wiring conductor in contact with the sphere when the wiring board is tilted. It is.

According to the wiring board of the present invention, a curved concave portion is formed in the central portion of the upper surface and the outer shape is a polygonal shape of a quadrangle or more, and the concave portion is surrounded by the outer peripheral portion of the upper surface of the insulating substrate. And an insulating frame having the same shape as the insulating substrate, and a wiring conductor led out from the inner surface of each side of the insulating frame to at least one of the side surface and the lower surface of the insulating substrate. cage, together are accommodated in a state that can roll freely conductive sphere inside the insulating frame of the upper surface of the insulating substrate, wiring conductors are electrically independent of each other, the insulating frame body, the upper surface A step is formed over the entire circumference between the inner surface and the inner surface, and the wiring conductor is led out from the inner surface below the step to the at least one of the side surface and the lower surface of the insulating substrate through the upper surface of the step . The conductive sphere rolls The adjacent wiring conductors that are in contact with the wiring conductor in the moving direction are electrically connected via conductive spheres, and by detecting this electrical connection, the direction of the sphere rolling, that is, the wiring board The direction of tilt can be detected. The insulating frame has a step formed over the entire circumference between the upper surface and the inner surface, and the wiring conductor passes through the upper surface of the step from the inner surface below the step to at least one of the side surface and the lower surface of the insulating substrate. Therefore, by adjusting the length of the step, the moving distance of the sphere is shortened in a direction that easily tilts, and the sphere is easily contacted with the wiring conductor to increase the detection sensitivity. It is possible to provide a wiring board capable of producing a corresponding inclination sensor device.

  In this case, since the sphere moves along the bottom surface of the curved concave portion, when the inclination of the wiring board is small, the sphere does not move to a position in contact with the wiring conductor, and the sphere moves between adjacent wiring conductors. The sensitivity of inclination detection by electrical connection is merely sharp and can be made reasonably high. As a result, for example, even a device that is used on hand such as a mobile phone does not react to slight tilts such as shaking, and can accurately detect the tilt that is originally intended to be detected, such as the angle at which the device is used. It is possible to provide a wiring board capable of constituting a possible tilt sensor device.

  In addition, since there is no need to dispose conductive pins or the like, it is easy to reduce the thickness and size.

  In addition, the tilt sensor device can be configured by simply storing the sphere in the concave storage portion formed by the insulating substrate and the insulating frame and closing the storage portion with a lid or the like, and the manufacturing process is simple. The tilt sensor device can be manufactured with good productivity.

  In addition, the insulating substrate and the insulating frame can be integrally formed, for example, in the form of an integrally fired ceramic sintered body, and since there are no penetrating parts such as metal pins, a sphere is inserted with a lid. By closing the storage portion, it is possible to enclose the sphere with excellent airtightness and excellent long-term reliability.

  In addition, since the sphere contacts with the planar wiring conductor formed on the inner surface of the insulating frame, severe vibration is applied to the wiring board, and the wiring conductor is deformed even if the sphere repeatedly hits it. In addition, it is possible to effectively prevent the spheres from being sandwiched between adjacent wiring conductors, and it is possible to configure a tilt sensor device that can normally detect tilt over a long period of time.

  In the wiring board of the present invention, preferably, an electrode pad electrically independent from the wiring conductor is formed inside the insulating frame on the upper surface of the insulating substrate. Even when the sphere contacts only one of the wiring conductors by making an electrical connection, the direction of inclination is detected by detecting the electrical connection through the sphere between the wiring conductor and the electrode pad. Therefore, it is possible to further increase the accuracy of detecting the presence / absence of tilt and detecting the direction of tilt.

  In the wiring board of the present invention, preferably, the concave portion is formed so that the sphere contacts the wiring conductor when the insulating substrate is tilted by 10 degrees or more. A wiring board that does not react to tilts of less than 10 degrees, such as frequently occurring camera shake, and thus can prevent misoperation more reliably, and can constitute a tilt sensor device with excellent detection accuracy and ease of use. It can be.

  The tilt sensor device according to the present invention includes a wiring board having the above-described configuration, a conductive sphere that can be freely rolled inside the insulating frame on the upper surface of the insulating substrate, and an upper surface of the insulating frame. And an attached electric body, and when the wiring board is tilted, the wiring board in contact with the sphere is detected to identify the inclination direction of the wiring board. For example, the surface mounting is easy, the productivity is excellent, the airtightness of the container in which the sphere is enclosed is good, and the inclination can be accurately detected without malfunctioning over a long period of time.

  A wiring board and a tilt sensor device of the present invention will be described in detail with reference to the accompanying drawings. Fig.1 (a) is a top view which shows an example of embodiment of the wiring board and inclination sensor apparatus of this invention, FIG.1 (b) is the sectional drawing. In FIG. 1, 1 is an insulating substrate, 2 is an insulating frame, 3 is a wiring conductor, 4 is a conductive sphere, and 9 is a wiring substrate.

  The insulating substrate 1 and the insulating frame 2 have the same outer shape, and the insulating frame 2 is attached to the outer peripheral portion of the upper surface of the insulating substrate 1, so that the upper surface of the insulating substrate 1 and the insulating frame 2 are A storage portion for storing the sphere 4 is formed between the inside and the inside.

  The insulating substrate 1 and the insulating frame 2 are made of an aluminum oxide sintered body (aluminum oxide ceramics), an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, glass Consists of electrically insulating materials such as ceramics.

  The insulating substrate 1 and the insulating frame 2 are made of, for example, the same ceramic material, and the insulating frame 2 is attached to the insulating substrate 1 by being integrally fired. In this case, if the outer shapes of the insulating substrate 1 and the insulating frame 2 are the same, the insulating frame 2 can be easily positioned on the insulating substrate 1 only by aligning the outer surfaces thereof so as not to be displaced vertically. Can be attached together.

  For example, when both the insulating substrate 1 and the insulating frame 2 are made of an aluminum oxide sintered body, an organic binder, a solvent, a plasticizer, and a suitable ceramic raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide are used. A dispersant is added and mixed to form a slurry, and this is formed into a sheet by a conventionally known doctor blade method or the like to obtain a plurality of ceramic green sheets (hereinafter also referred to as green sheets). An appropriate punching process is performed on the green sheet to form a plate-like green sheet to be the insulating substrate 1 and a frame-like green sheet to be the insulating frame 2, and a frame-like green is formed on the plate-like green sheet. It is manufactured by laminating sheets and firing at a temperature of about 1600 ° C.

  The insulating substrate 1 and the insulating frame 2 are bases of containers for housing the spheres 4 in the above-described housing portion, and are quadrilateral or more in order to accurately detect the direction of inclination of the wiring board based on the direction of movement of the spheres 4. It is formed in a polygonal shape.

  In this case, for example, if it is a triangle, it is not possible to detect inclinations in four directions, up, down, left, and right in a plan view. Therefore, it is necessary that the insulating substrate 1 and the insulating frame 2 have a quadrangular or more polygonal shape. The mechanism for detecting the inclination will be described in detail later.

  A wiring conductor 3 is led out from the inner surface of the insulating frame 2 to at least one of the side surface and the lower surface of the insulating substrate 1, and each wiring conductor 3 is electrically independent.

  In addition, the sphere 4 is accommodated inside the insulating frame 2 on the upper surface of the insulating substrate 1 in a state where it can roll freely. The wiring conductors 3 adjacent to each other in the direction in which the sphere 4 rolls and moves are electrically connected via the sphere 4, and by detecting this electrical connection, the direction in which the sphere 4 rolls, that is, the wiring The direction of the inclination of the substrate 9 can be detected.

  A recess 1a is formed at the center of the upper surface of the insulating substrate 1, and the sphere 4 accommodated inside the insulating frame 2 on the upper surface of the insulating substrate 1a has a partial spherical shape, an inverted conical shape, or an inverted polygonal shape. It rolls freely along the bottom surface of the curved concave portion 1a such as a weight according to the gravity accompanying the inclination of the wiring board 9.

  In this case, since the sphere 4 moves along the bottom surface of the recess 1 a, the range of movement stops within the recess 1 a when the inclination of the wiring board 9 is small, and can move to a position in contact with the wiring conductor 3. Effectively prevented. Further, by adjusting the curved surface shape of the concave portion 1a, the sphere 4 can come out of the concave portion 1a when the wiring board is inclined at a desired angle, and can come into contact with the inner surface of the insulating frame 2 on the outer side. . As a result, the sensitivity of inclination detection by electrically connecting the wiring conductors 3 adjacent to each other with the sphere 4 is not sharp but can be appropriately high. As a result, for example, even a device that is used on hand such as a mobile phone does not react to slight tilts such as shaking, and the tilt of the device that is originally desired to be detected, such as the direction of imaging of a camera-equipped mobile phone, can be accurately determined. It can be set as the wiring board 9 which can comprise the inclination sensor apparatus which can be detected.

  Moreover, since it can be mounted only by electrically connecting the lead-out portion of the wiring conductor 3 led to the side surface and the bottom surface of the insulating substrate 1 to the external electric circuit, surface mounting on the external electric circuit substrate can be easily performed.

  Further, since there is no need to dispose a metal pin or the like as in the prior art, it is easy to reduce the thickness and size.

  Further, since the spherical body 4 is accommodated in the concave portion 1a at the center of the upper surface of the insulating substrate 1 and sealed with the lid 5 or the like, the inclination sensor device can be configured, and the manufacturing process is simple. The apparatus can be manufactured with good productivity.

  In addition, since the insulating substrate 1 and the insulating frame 2 can be formed integrally, and there is no penetrating portion such as a metal pin, for example, a recess in which the sphere 4 is accommodated by the lid 5 as will be described later By closing 1a, the sphere 4 can be enclosed in a container with excellent airtightness, and long-term reliability can be improved.

  Further, since the sphere 4 is in contact with the planar wiring conductor 3, even if the sphere 4 repeatedly hits, deformation of the wiring conductor 3 is effectively suppressed, and the inclination is detected normally over a long period of time. A tilt sensor device that can be manufactured can be manufactured.

  The wiring conductor 3 is made of metal powder metallization such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, and gold. For example, an appropriate organic binder, solvent, plasticizer, and dispersant are added to the tungsten powder. Formed by printing and applying a metallized paste obtained by addition and mixing in a predetermined pattern on a green sheet to be an insulating substrate 1 or an insulating frame 2 by a well-known screen printing method, and baking this together with a laminate of green sheets Is done.

  The exposed surface of the wiring conductor 3 has a thickness of 1 to 1 in order to prevent the wiring conductor 3 from being oxidized and corroded and to improve the sensitivity of electrical connection when the wiring conductor 3 and the sphere 4 are in contact with each other. It is preferable that a nickel plating layer having a thickness of about 10 μm and a gold plating layer having a thickness of about 0.1 to 5 μm are sequentially deposited.

  Further, in order to effectively prevent wear of the plating layer when the sphere 4 repeatedly contacts the wiring conductor 3, a metal layer having good corrosion resistance such as platinum or palladium and less likely to wear than gold is used as the outermost plating layer. May be applied as Further, boron or the like may be mixed into the nickel plating layer to increase the hardness of the nickel plating layer. Moreover, you may deposit hard plating layers, such as chromium.

  In the wiring board 9 of the present invention, it is preferable that an electrode pad electrically independent of the wiring conductor 3 is formed inside the insulating frame 2 on the upper surface of the insulating substrate 1. Thereby, even when the sphere 4 is in contact with only one of the wiring conductors 3, the direction of inclination can be detected by electrical connection via the sphere 4 between the wiring conductor 3 and the electrode pad. The detection accuracy in the direction of tilt can be further increased. The electrode pads may be formed on the bottom surface of the recess 1a, or may be formed in the same number as the wiring conductors 3 corresponding to the wiring conductors 3 on the outer surface of the recess 1a on the upper surface of the insulating substrate 1. Good.

  Further, in the wiring board 9 of the present invention, the recess 1a is preferably formed so that the sphere 4 contacts the wiring conductor 3 when the insulating substrate 1 is tilted by 10 degrees or more. As a result, in devices used by hand such as mobile phones, it does not react to tilts of less than 10 degrees, such as hand shakes that occur frequently, malfunctions are prevented more reliably, and it has excellent detection accuracy and ease of use. In addition, the wiring board 9 that can constitute the tilt sensor device can be obtained.

  In order to form the concave portion 1a so that the sphere 4 is in contact with the wiring conductor 3 when the insulating substrate 1 is tilted by 10 degrees or more, for example, in the case of the concave portion 1a having a square shape in plan view, between the opposing sides If the distance is 500 μm, the bottom surface of the recess 1 a may be formed into a shape such as an arcuate spherical shape with a cross section having a radius of curvature of 732 μm. In this case, as shown in FIG. 1B, when the end of the recess 1a is continuous in contact with the inner surface of the insulating frame 2, the sphere 4 does not come out of the recess 1a, and the end of the recess 1a. If it comes to, it will contact | connect the wiring conductor 3. FIG. When the upper surface of the insulating substrate 1 is between the end of the recess 1 a and the inner surface of the insulating frame 2, the sphere 4 may come out of the recess 1 a and contact the wiring conductor 3.

Further, in the wiring board 9 of the present invention, the insulating frame 2 has a step formed over the entire circumference between the upper surface and the inner surface, and the wiring conductor 3 extends from the inner surface below the step to the upper surface of the step. after it that have been derived to at least one side surface and the lower surface of the insulating substrate 1. Thereby, by adjusting the length of the step, the moving distance of the sphere 4 is shortened in a direction in which it is easy to tilt (for example, the vertical direction in a digital camera), and the sphere 4 can easily come into contact with the wiring conductor 3 to detect sensitivity. It is possible to provide the wiring board 9 that can produce a tilt sensor device according to the application, such as increasing the height of the wiring board.

  In the wiring board 9 of the present invention, the insulating substrate 1 and the insulating frame 2 are preferably regular hexagons or regular octagons. This makes it possible to accurately detect the direction in which the tilt occurs (for example, eight directions between the upper, lower, left, and right directions in the plan view, and the six directions of the diagonally upper horizontal direction, the diagonally lower horizontal direction, and the vertical direction). The accuracy can be further improved. In addition, since the polygonal shape exceeding the octagon is close to a circular shape, the sphere 4 tends not to stay on the sides and corners of the insulating frame 2 and tends to move unstably, and the accuracy of detecting the inclination May be low.

  In the wiring board 9 configured as described above, the sphere 4 is accommodated inside the insulating frame 2 on the upper surface of the insulating substrate 1 in a state where the bottom surface of the recess 1a can be freely rolled, and the upper surface of the insulating frame 2 The inclination of the present invention is such that the direction of inclination of the wiring board 9 is specified by detecting the wiring conductor 3 that is in contact with the sphere 4 when the wiring board 9 is tilted by attaching the lid 5 to the board. A sensor device is configured. With the above configuration, the sensitivity of tilt detection does not react to slight tilts such as blurring, and the tilt of the equipment used is moderately high that can be accurately detected, It is possible to provide an inclination sensor device that is easy to mount on the surface, is excellent in productivity, has good airtightness of the container in which the sphere 4 is sealed, and can detect the inclination without malfunctioning over a long period of time.

  The lid 5 is made of an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, a ceramic material such as glass ceramics, iron- It is formed of a metal material such as a nickel-cobalt alloy or an iron-nickel alloy.

  The lid 5 may be anything that can be attached to the upper surface of the insulating frame 2 and seal the storage portion, and is not particularly limited in shape, dimensions, etc. In view of facilitating the work of attaching to the upper surface of 2, it is preferable that the insulating frame 2 and the outer shape be formed in a plate shape having the same shape.

  When the lid 5 is made of an aluminum oxide sintered body, the lid 5 is produced by producing a green sheet in the same manner as the insulating substrate 1 and the insulating frame 2, and cutting and firing the green sheet to a predetermined dimension. Can do. Attachment of the lid 5 to the insulating frame 2 can be performed by a method such as bonding via a bonding material such as glass, brazing material, or resin adhesive.

  Further, the distance between the upper end of the sphere 4 and the lower surface of the lid 5 is preferably 50 μm or more. Accordingly, it is possible to effectively prevent the sphere 4 from frequently contacting the lower surface of the lid 5, and to make the movement of the sphere 4 smoother and ensure the accuracy of tilt detection more reliably. . In addition, it is possible to prevent the distance between the sphere 4 and the lid 5 from becoming too wide, to move the sphere 4 freely, and to effectively collide the sphere 4 with the lid 5 effectively. The distance is more preferably 50 to 300 μm in order to prevent and improve the reliability of hermetic sealing.

  Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

(A) is a top view of the wiring board and inclination sensor apparatus of this invention, (b) is the sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a ... Recessed part 2 ... Insulating frame 3 ... Wiring conductor 4 ... Sphere 5 ... Lid 9 ... Wiring board

Claims (4)

An insulating substrate having a curved concave portion formed in the central portion of the upper surface and having an outer shape of a polygonal shape of a quadrangle or more, and an outer shape attached to the outer peripheral portion of the upper surface of the insulating substrate so as to surround the concave portion An insulating frame having the same shape as the insulating substrate; and a wiring conductor led out from an inner surface of each side of the insulating frame to at least one of a side surface and a lower surface of the insulating substrate. with conductive spheres inside the insulating frame of the upper surface of the substrate is accommodated in a state that can roll freely, wherein the wiring conductors are electrically independent of each other, said insulating frame body, the upper surface A step is formed between the inner surface and the inner surface, and the wiring conductor is led out from the inner surface below the step to the at least one of the side surface and the lower surface of the insulating substrate through the upper surface of the step. Iruko Te Wiring board according to claim.   2. The wiring board according to claim 1, wherein an electrode pad electrically independent of the wiring conductor is formed on an inner surface of the recess.   The wiring substrate according to claim 1, wherein the concave portion is formed so that the sphere contacts the wiring conductor when the insulating substrate is tilted by 10 degrees or more.   A wiring board according to any one of claims 1 to 3, a conductive sphere accommodated in a state of being freely rollable in the recess on the upper surface of the insulating substrate, and an upper surface of the insulating frame And an attached lid, and the direction of inclination of the wiring board is specified by detecting the wiring conductor in contact with the sphere when the wiring board is tilted. Tilt sensor device.

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