JP4388447B2 - Wiring board and tilt sensor device - Google Patents

Description

  The present invention relates to a wiring board for forming a tilt sensor device for detecting a tilt direction and a tilt sensor device using the wiring board.

  Conventionally, an inclination sensor device for detecting inclination is generally made of a casing made of an electrical insulator such as a resin and a linear metal material, and penetrates from the inside to the outside of the casing. The structure includes a plurality of conductive pins arranged and electrically independent from each other, and conductive spheres enclosed in a housing. The housing is usually composed of an upper plate and a lower plate, and the conductive pins are sandwiched between the upper plate and the lower plate, or penetrate the upper plate and the lower plate in the thickness direction. Is attached. In addition, when the upper plate and the lower plate are joined, a sphere is enclosed between the upper plate and the lower plate by inserting a sphere between them (see Patent Documents 1 and 2).

  In such an inclination sensor device, a portion of the conductive pin exposed to the outside of the housing is electrically connected to an electric circuit of the external electric circuit board via solder or the like. An external electric circuit to which the conductive pin is connected is electrically connected to a detector such as an ammeter or a detector including a buzzer.

  Then, the sphere rolls and moves in the housing according to the inclination of the inclination sensor device, and the two adjacent conductive pins are electrically connected by the conductive sphere, and this electrical connection is connected to the conductive pin. The direction in which the conductive sphere has moved, that is, the direction of inclination, can be detected by detecting with a detector such as an ammeter that is connected and arranged outside.

  This tilt sensor device is a component on an external electric circuit board that constitutes equipment such as electronic devices such as mobile phones and digital cameras, anti-theft devices for vehicles working on rough terrain, etc., and anti-theft devices for automobiles. As a result, it is possible to detect the direction of inclination of various devices equipped with this inclination sensor device.

  For example, when used as a component in a digital camera or a mobile phone with a camera, the direction in which the image is captured is changed according to the direction of the camera (so-called vertical position or horizontal position), and the upward direction at the time of shooting is always saved. The image can be captured and stored so as to coincide with the upward direction of the current image.

Also, when viewing images with a digital camera, mobile phone, PDA (Personal Digital Assistant), etc., the upper side of the photo is always on the opposite side of the earth's gravity regardless of the orientation of the image display device, such as a digital camera or mobile phone. In other words, it can be displayed so that a user looking at the image display device can easily view an image such as a photograph.
JP-A-11-162306 JP 2004-55316 A

  However, in the conventional tilt sensor device, the conductive pin is disposed so as to penetrate from the inside to the outside of the housing, and the conductive pin is electrically connected to the detection device or the like on the external electric circuit board. Therefore, there is a problem that it is difficult to achieve a surface mountable form, and it is difficult to reduce the thickness and size.

  In addition, for example, an upper plate and a lower plate, a conductive pin and a conductive sphere constituting the casing are prepared, the conductive pin penetrates the upper plate and the lower plate, and the conductive sphere is enclosed. Therefore, there is a problem that the number of parts is large, the manufacturing process is complicated, and the productivity is low.

  In addition, since there is a risk of malfunction if moisture in the outside air enters inside the housing, it is necessary to increase the airtightness in the housing, but there is a risk that the airtightness will deteriorate at the part where the conductive pin penetrates the housing There was a problem that long-term reliability was low.

  In addition, when used in an environment where intense vibration occurs, the sphere touches the conductive pin and deforms the conductive pin, or the sphere is sandwiched between two adjacent conductive pins, and the tilt is detected normally. There was also a problem that it was impossible to do.

  Therefore, the present invention has been completed in view of the above-mentioned problems, and its purpose is that surface mounting is easy, the productivity of the tilt sensor device is excellent, and the airtightness of the container enclosing the sphere is good. An object of the present invention is to provide a wiring board for forming a tilt sensor device capable of detecting tilt without malfunctioning for a long period of time, and a tilt sensor device using the wiring board.

The wiring board according to the present invention includes an insulating substrate having a polygonal shape having an outer shape of a quadrangle or more, an insulating frame having the same outer shape attached to the outer peripheral portion of the upper surface of the insulating substrate as the insulating substrate, A wiring conductor led out from an inner surface of each side of the insulating frame to at least one of a side surface and a lower surface of the insulating substrate; and electrically connected to the wiring conductor inside the insulating frame on the upper surface of the insulating substrate An electrode pad formed independently, and a conductive sphere can be freely rolled inside the insulating frame on the upper surface of the insulating substrate, and the wiring conductor Are electrically independent from each other, and the electrode pad is provided with a non-forming portion having a width corresponding to the radius of the sphere at the end of the upper surface of the insulating substrate inside the insulating frame. Features.

  In the wiring board of the present invention, preferably, the insulating frame has a step formed on the entire circumference between the upper surface and the inner surface, and the wiring conductor extends from the inner surface below the step. It is led out to at least one of the side surface and the lower surface of the insulating substrate through the upper surface of the step.

  The wiring board of the present invention is preferably characterized in that the outer shape of the insulating substrate and the insulating frame is a regular hexagon or a regular octagon.

  In the wiring board of the present invention, preferably, the insulating board is provided with a groove having an overall shape surrounding the central portion of the upper surface and a depth at which the sphere partially enters. It is characterized by being.

  The wiring board according to the present invention is preferably characterized in that the insulating substrate is provided with a concave portion whose depth is such that the sphere partially enters the central portion of the upper surface thereof.

  In addition, the tilt sensor device of the present invention includes the wiring board of the present invention, a conductive sphere accommodated in a state of being freely rollable inside the insulating frame on the upper surface of the insulating substrate, and the insulating A lid attached to the upper surface of the frame, and the inclination direction of the wiring board is specified by detecting the wiring conductor in contact with the sphere when the wiring board is inclined. It is characterized by that.

  According to the wiring board of the present invention, an insulating substrate whose outer shape is a polygonal shape of a quadrangle or more, an insulating frame having the same outer shape attached to the outer peripheral portion of the upper surface of the insulating substrate as the insulating substrate, and insulation Wiring conductors led out from the inner surface of each side of the frame to at least one of the side surface and the lower surface of the insulating substrate, and the conductive sphere freely rolls inside the insulating frame on the upper surface of the insulating substrate. Since the wiring conductors are electrically independent from each other, the conductive spheres roll and move in the direction in which the conductive conductors are in contact with the wiring conductor in the moving direction. By detecting the electrical connection, the direction in which the conductive sphere rolls, that is, the direction of the inclination of the wiring board can be detected.

  In this case, it is possible to mount on the external electric circuit board simply by electrically connecting the lead-out portion of the wiring conductor led to the side surface and the lower surface of the insulating substrate to the external electric circuit, so that surface mounting can be easily performed.

  In addition, since there is no need to dispose conductive pins or the like, it is easy to reduce the thickness and size.

  In addition, the tilt sensor device can be formed simply by inserting a conductive sphere into the concave storage part formed by the insulating substrate and the insulating frame and closing the storage part with a lid or the like. Therefore, the tilt sensor device can be manufactured with good productivity.

  In addition, the insulating substrate and the insulating frame can be integrally formed, for example, in the form of an integrally fired sintered body (ceramics), and there is no portion through which the conductive pin or the like penetrates. By closing the storage portion containing the sphere, it is possible to enclose the sphere in an excellent airtight state, and to improve the long-term reliability.

  In addition, since the conductive sphere contacts the planar wiring conductor formed on the surface (inner surface) of the insulating frame, even if the circuit board is subjected to severe vibration and the sphere repeatedly hits the wiring, It is possible to effectively prevent the conductor from being deformed or the like and a sphere from being sandwiched between adjacent wiring conductors, and to produce a tilt sensor device that can detect tilt normally over a long period of time. it can.

In the wiring board of the present invention, an electrode pad electrically independent of the wiring conductor is formed inside the insulating frame on the upper surface of the insulating substrate, and the electrode pad is formed on the insulating board inside the insulating frame. Since the non-formed portion having a width corresponding to the radius of the sphere is provided at the end of the upper surface , the sphere can be connected to only one of the wiring conductors by electrically connecting the electrode pad to an external electric circuit. even when in contact, it is possible to detect the direction of tilt by detecting the electrical connection between the wiring conductor and the electrode pads, the detection of the presence or absence of tilt, and the accuracy of the direction detection of the inclination high Kusuru be able to. In addition, since the electrode pad is provided with a non-forming portion having a width corresponding to the radius of the sphere at the end of the upper surface of the insulating substrate inside the insulating frame, the electrode pad includes a contact at the lower end of the sphere. Thus, the electrical connection between the wiring conductor and the electrode pad can be reliably performed, and the area of the electrode pad can be reduced to prevent a short circuit from occurring with other conductors such as the wiring conductor. be able to.

  In the wiring board of the present invention, preferably, the insulating frame has a step formed on the entire circumference between the upper surface and the inner surface, and the wiring conductor passes from the inner surface below the step to the upper surface of the step. Since it is led out to at least one of the side surface and the lower surface of the insulating substrate, by adjusting the length of the step, the length of the step is increased in a direction that is easy to tilt (for example, the vertical direction in a digital camera). It is easy to make contact with the wiring conductor to increase the detection sensitivity, and it is possible to easily form a tilt sensor device that is more appropriate for the application.

  In addition, the wiring board of the present invention preferably has an outer shape of a regular hexagon or a regular octagon, so that the direction in which the inclination occurs can be detected more and more accurately. It is possible to further improve the accuracy of detection of the direction. For example, when the outer shape of the insulating substrate and the insulating frame is a regular hexagon, it is possible to accurately detect the six directions of top and bottom, diagonally upper left and right, and diagonally lower left and right in plan view. , Right and left, diagonally upper left and right, diagonally lower left and right can be detected with high accuracy.

  In the wiring board of the present invention, preferably, the insulating substrate is provided with a groove having an overall shape that surrounds the central portion of the upper surface and a depth at which the sphere is partially inserted. Therefore, once the sphere has entered the groove, it does not come out of the groove when it is slightly tilted, but it comes out of the groove only when it is tilted more than a certain angle. By adjusting the depth, width, cross-sectional shape, etc., it is possible to prevent malfunction caused by slight inclination and vibration, and to set an inclination angle to be detected.

  The wiring board according to the present invention is preferably provided with a recess having a depth at which the sphere partially enters the central portion of the upper surface of the insulating substrate. The sphere contained in the sphere does not come out of the recess when it is slightly tilted, but it comes out of the recess only when it is tilted more than a certain angle. By adjusting, it is possible to prevent malfunction caused by slight inclination and vibration, and to set an inclination angle to be detected.

  In addition, the tilt sensor device of the present invention includes the wiring board of the present invention, a conductive sphere accommodated in a state where it can freely roll inside the insulating frame on the upper surface of the insulating substrate, and an insulating frame. A lid attached to the upper surface, and when the wiring board is tilted, it detects the wiring conductor in contact with the sphere to identify the direction of inclination of the wiring board. An inclination sensor device that is easy to mount, excellent in productivity, has good airtightness in a container in which a sphere is enclosed, and can accurately detect inclination without malfunctioning over a long period of time.

  A wiring board and a tilt sensor device of the present invention will be described in detail with reference to the accompanying drawings.

  Fig.1 (a) is a top view which shows an example of embodiment of the wiring board and inclination sensor apparatus of this invention, FIG.1 (b) is the sectional drawing. In FIG. 1, 1 is an insulating substrate, 2 is an insulating frame, 3 is a wiring conductor, 4 is a conductive sphere, and 9 is a wiring substrate.

  The insulating substrate 1 and the insulating frame 2 have the same outer shape, and the insulating frame 2 is attached to the outer peripheral portion of the upper surface of the insulating substrate 1, so that the upper surface of the insulating substrate 1 and the insulating frame 2. A concave accommodating portion for accommodating the conductive sphere 4 is formed between the inner side and the inner side.

  The insulating substrate 1 and the insulating frame 2 are made of an aluminum oxide sintered body (aluminum oxide ceramic), an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, Made of electrically insulating material such as glass ceramics.

  The insulating substrate 1 and the insulating frame 2 are made of, for example, the same ceramic material, and the insulating frame 2 is attached to the insulating substrate 1 by being integrally fired. In this case, if the outer shape of the insulating substrate 1 and the insulating frame 2 are the same, the insulating frame 2 can be easily attached to the insulating substrate 1 only by aligning the outer surfaces of the insulating substrate 1 and the insulating frame 2 so as not to be displaced in the vertical direction. Can be aligned and attached.

  For example, when both the insulating substrate 1 and the insulating frame 2 are made of an aluminum oxide sintered body, an organic binder, a solvent, a plasticizer, and a suitable ceramic raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide are used. A dispersant is added and mixed to form a slurry, and this is formed into a sheet by a conventionally known doctor blade method or the like to obtain a plurality of ceramic green sheets (hereinafter also referred to as green sheets). Appropriate punching process is performed on the green sheet to form a plate-like green sheet and a frame-like green sheet to be an insulating substrate, and the frame-like green sheet is laminated on the plate-like green sheet, about It is manufactured by firing at a temperature of 1600 ° C.

  The insulating substrate 1 and the insulating frame 2 are the bases of the containers for storing the conductive spheres 4 in the storage portion described above, and the direction of inclination of the wiring substrate 9 is accurately detected by the direction in which the spheres 4 move. In order to do so, it is formed in a polygonal shape that is equal to or greater than a quadrangle. In this case, if the insulating substrate 1 and the insulating frame 2 are triangular, for example, the wiring conductor 3 can be formed only in three directions, and therefore, it is not possible to detect the inclinations in the four directions in the plan view. Therefore, it is necessary that the insulating substrate 1 and the insulating frame 2 have a quadrangular or more polygonal shape.

  The wiring conductor 3 is led out from the inner surface of each side portion of the insulating frame 2 to at least one of the side surface and the lower surface of the insulating substrate 1, and each wiring conductor 3 is electrically independent. Further, the conductive sphere 4 is accommodated inside the insulating frame 2 on the upper surface of the insulating substrate 1 in a state where it can roll freely.

  Further, a portion of the wiring conductor 3 led out to at least one of the side surface and the lower surface of the insulating substrate 1 is electrically connected to an electric circuit of the external electric circuit substrate via solder or the like. The external electric circuit to which the wiring conductor 3 is connected is electrically connected to a detector such as an ammeter or a detector including a buzzer. In this case, mounting can be performed simply by electrically connecting the lead-out portion of the wiring conductor 3 led to the side surface and the bottom surface of the insulating substrate 1 to an external electric circuit, so that surface mounting can be easily performed. Further, since there is no need to dispose conductive pins or the like as in the prior art, it is easy to reduce the thickness and size.

  When the wiring board 9 is tilted, the sphere 4 rolls and moves on the upper surface of the insulating substrate 1 in the tilted direction, and the wiring conductors 3 adjacent to each other in that direction are electrically connected via the conductive sphere 4. By detecting this electrical connection with a detector electrically connected to each wiring conductor 3, the direction in which the sphere 4 rolls, that is, the direction of the inclination of the wiring board 9 is detected. be able to. In this case, since the sphere 4 is in contact with the planar wiring conductor 3, even if the sphere 4 repeatedly hits, deformation of the wiring conductor 3 is effectively suppressed. The inclination can be normally detected over a long period of time without the sphere 4 being sandwiched therebetween.

  The wiring conductor 3 is made of metal powder metallization such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, and gold. For example, an appropriate organic binder, solvent, plasticizer, and dispersing agent are added to the tungsten powder. The metallized paste obtained by adding and mixing is printed and applied in a predetermined pattern on each of the green sheets for the insulating substrate 1 and the insulating frame 2 by a conventionally known screen printing method, and this is baked together with a laminate of green sheets. It is formed.

In the example of FIG. 1A, the wiring conductor 3 is formed at a certain distance from both ends of each side of the insulating frame 2, and the sphere 4 stops at the corner of the inner surface of the insulating frame 2. The adjacent wiring conductors 3 are connected to each other by a sphere 4. In this case, each wiring conductor 3 is formed with a width that includes a contact point when the sphere 4 contacts the inner surface of the insulating frame 2. That is, when the wiring conductor 3 is viewed from the front, the vertical and horizontal widths thereof include the contact points.

  The exposed surface of the wiring conductor 3 has a thickness in order to prevent the wiring conductor 3 from being oxidized and corroded and to improve the sensitivity of electrical connection when the wiring conductor 3 and the conductive sphere 4 are in contact with each other. It is preferable that a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 5 μm are sequentially deposited.

  Further, in order to effectively prevent wear of the plating layer when the conductive sphere 4 repeatedly contacts the wiring conductor 3, a metal layer having good corrosion resistance such as platinum and palladium and harder than gold is plated on the outermost layer. It may be applied as a layer. Further, the nickel plating layer may be mixed with a boron component or the like to increase the hardness of the nickel plating layer.

  Moreover, you may deposit hard plating layers, such as chromium.

  The sphere 4 is formed by processing a metal material such as copper, iron, stainless steel (JIS standard SUS304, etc.) into a spherical shape by polishing or the like, or on the surface of a resin molded into a spherical shape with a conductive material such as nickel or copper. What coated the film can be used. Further, the sphere 4 may be formed by depositing a plating layer such as a glossy nickel plating layer on the surface so as to make the surface smoother and easier to roll, or to effectively prevent oxidative corrosion.

The size of the sphere 4 is preferably about 80% of the distance between opposite sides inside the insulating frame 2 in plan view, for example, about 0.4 mm in diameter.

  The wiring board 9 of the present invention accommodates the spherical body 4 in a housing portion formed by the insulating substrate 1 and the insulating frame body 2 and closes the housing portion with a lid 5 (FIG. 1B) as described later, for example. As a result, the tilt sensor device can be configured and can be easily manufactured, so that the productivity of the tilt sensor device can be improved.

  Further, as described above, the insulating substrate 1 and the insulating frame 2 can be integrally formed by integrally firing the insulating substrate 1 and the insulating frame 2 made of the same ceramic material, and the conductive pins can be integrally formed. Since there is no portion through which etc. penetrate, the spherical body 4 can be sealed in a state excellent in airtightness by closing the storage portion with the lid 5, and long-term reliability can be improved.

Wiring board 9 of the present invention, that have the electrode pads 6 independent electrically is formed to the upper surface of the insulating frame member 2 of the inner wiring conductor 3 of insulating substrate 1. Therefore, to derive the electrode pad 6 on the lower surface or side surface of the insulating substrate 1, the derivation part, by previously electrically connected to the same external electric circuit and wiring conductor 3, the spherical body 4 is the insulating frame Even when it stops at the side of the body 2 and contacts only one of the wiring conductors 3, the direction of the inclination can be detected by the electrical connection between the wiring conductor 3 and the electrode pad 6. the or tilt direction accuracy of the detection of the can height Kusuru.

The electrode pads 6 are preferably formed on substantially the entire upper surface of the insulating substrate 1 inside the insulating frame 2. In this case, the electrical connection between the wiring conductor 3 and the electrode pad 6 can be reliably performed. Further, the electrode pads 6, the inside edge of the upper surface of the insulating substrate 1 of the insulating frame member 2, that non-formation portion of the amount corresponding to the width of the radius of the sphere body 4 provided. Therefore, the electrode pad 6 will include contacts the lower end of the spherical body 4, with the electrical connection can be reliably performed between the wiring conductor 3 and the electrode pad 6, the area of the electrode pads 6 It is possible to prevent a short circuit from occurring with other conductors such as the wiring conductor 3.

  Further, in the wiring board 9 of the present invention, the insulating frame 2 has a step formed over the entire circumference between the upper surface and the inner surface, and the wiring conductor 3 extends from the inner surface below the step to the upper surface of the step. It is preferable that the insulating substrate 1 is led out to at least one of the side surface and the lower surface. In this case, by adjusting the length of the step (projecting length to the inside of the insulating frame 2 below the step), the direction in which the wiring board 9 is inclined easily (for example, the vertical direction in a digital camera) A wiring board 9 capable of forming a tilt sensor device according to the application, such as shortening the moving distance of the sphere 4 and increasing the detection sensitivity by making the sphere 4 easily contact the wiring conductor 3 is provided. can do.

  The step of the insulating frame 2 is formed, for example, by laminating two layers of the green sheet, and the opening size of the lower frame-shaped green sheet is smaller than that of the upper layer, A method such as exposing the inner periphery of the lower green sheet inside the upper green sheet can be used. The green sheet is not limited to two layers, and may be three or more layers.

  Moreover, as for the wiring board 9 of this invention, it is preferable that the external shape of the insulated substrate 1 and the insulated frame 2 is a regular hexagon or a regular octagon. Thereby, the direction of the inclination can be detected with a precision of 60 degrees or 45 degrees in plan view, and the inclination detection accuracy can be further improved.

  In addition, since the polygonal shape exceeding the octagon is close to a circular shape, the conductive sphere 4 tends not to stay on the sides and corners of the insulating frame 2 and tends to move unstably and is inclined. There is a risk that the accuracy of detecting this will be lowered.

  And using the wiring board 9 of the said structure, while accommodating the conductive sphere 4 in the state which can be freely rolled inside the insulating frame 2 of the upper surface of the insulating substrate 1, it is formed in the upper surface of the insulating frame 2. By attaching the lid 5, the present invention is designed to identify the direction of inclination of the wiring board 1 by detecting the wiring conductor 3 that is in contact with the conductive sphere 4 when the wiring board 1 is tilted. The tilt sensor device is configured.

  According to the inclination sensor device of the present invention, with the above configuration, the surface mounting is easy, the productivity is excellent, the airtightness of the container in which the conductive sphere 4 is enclosed is good, and it does not malfunction for a long time. It can be set as the inclination sensor apparatus which can detect inclination.

  The lid 5 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic, or an iron- It consists of metal materials such as nickel-cobalt alloy and iron-nickel alloy.

  The lid 5 is not particularly limited in shape, size, etc. as long as it can be attached to the upper surface of the insulating frame 2 and hermetically seal the storage portion. In view of facilitating the work of attaching to the upper surface of 2, it is preferable that the insulating frame 2 and the outer shape be formed in a plate shape having the same shape.

  When the lid 5 is made of an aluminum oxide sintered body, the lid 5 is produced by producing a green sheet in the same manner as the insulating substrate 1 and the insulating frame 2, and cutting and firing the green sheet to a predetermined dimension. Can do. Moreover, you may produce the cover body 5 by translucent materials, such as glass and transparent resin, so that it can always confirm whether abnormality has generate | occur | produced inside the inclination sensor apparatus.

  Attachment of the lid 5 to the insulating frame 2 can be performed by a method such as bonding via a bonding material such as glass, brazing material, or resin adhesive.

  In the tilt sensor device of the present invention, the distance between the upper end of the sphere 4 and the lower surface of the lid 5 is preferably 50 μm or more. Thereby, it can prevent effectively that the spherical body 4 contacts the lower surface of the cover body 5 frequently, and the movement of the spherical body 4 can be made smoother, and the precision of inclination detection can be ensured more reliably. In addition, it is possible to prevent the distance between the sphere 4 and the lid 5 from becoming too wide, to move the sphere 4 freely, and to effectively collide the sphere 4 with the lid 5 effectively. In order to prevent this and to improve the reliability of hermetic sealing, it is more preferable that the thickness be 50 μm to 300 μm.

  In addition, the inclination sensor device of the present invention has an annular protrusion (not shown) on the inner side of the insulating frame 2 on the upper surface of the insulating substrate 1 at a certain distance from the inner surface of the insulating frame 2. It may be provided at such a height that the ball 4 can get over when the tilt sensor device is tilted more than a certain angle. If such a protrusion is provided, the rolling of the sphere 4 can be stopped by the protrusion, and the sphere 4 can be prevented from rolling and contacting the inner surface of the insulating frame 2 with a slight inclination. Therefore, it is possible to provide a tilt sensor device that can effectively prevent malfunction and can reliably detect tilt when tilted by a certain angle or more.

  In addition, as shown in FIGS. 2A and 2B, the inclination sensor device of the present invention has an insulating substrate 1 whose overall shape surrounds the central portion of the upper surface and whose depth is a sphere 4. It is preferable that a groove 7 having a depth that partially enters is provided. 2A is a plan view showing another example of the embodiment of the present invention, and FIG. 2B is a sectional view thereof. In FIG. 2, the same parts as those in FIG.

  If the groove 7 is provided in this way, the sphere 4 once entering the groove 7 does not come out of the groove 7 when it is slightly inclined, but only when it is inclined more than a certain angle from the groove 7. For example, by adjusting the angle according to the depth, width, cross-sectional shape, etc. of the groove 7, it is possible to prevent malfunction caused by slight inclination or vibration, and to set the inclination angle to be detected. it can.

  For example, as an electronic device such as a mobile phone or a digital camera, the direction in which the image is captured is changed according to the direction of the camera (so-called vertical position or horizontal position), and the upward direction at the time of shooting is always preserved. When mounted for the purpose of capturing and storing images so as to match the direction, the screen does not change with a slight inclination such as camera shake, and the electronic device can be easily used.

  In addition, when used in a vehicle overturn prevention device for work on rough terrain such as a tractor, the overturn prevention device can be set not to operate during normal work.

  Further, when used as a device such as an anti-theft device for automobiles, an anti-theft device can be provided in which an alarm does not sound due to wind or vibration caused when another automobile passes nearby.

  In the configuration of FIG. 2, the overall shape of the groove 7 can be a circle, a polygon similar to the insulating substrate 1 or the insulating frame 2, and a polygon such as a hexagon. When the entire shape of the groove 7 is a polygon, the groove 7 may be formed so that the corner thereof faces the inner surface of the insulating frame 2. In that case, if the tilt sensor device is tilted and the sphere 4 is at the corner facing the inner surface of the insulating frame 2, the sphere 4 is caught at the corner at a certain tilt, but if the tilt is further tilted, the sphere 4 is removed from the groove 7. Then, the sphere 4 comes into contact with the wiring conductor 3 that is in the inclination direction or closest to the inclination direction. Therefore, it becomes easy to guide the sphere 4 to the wiring conductor 3 that is in the inclination direction or closest to the inclination direction.

  The depth of the groove 7 is preferably 0.8% to 3% of the diameter of the sphere 4. If it is less than 0.8%, even if the sphere 4 partially enters the groove 7, it becomes easy to jump out immediately, and it becomes difficult to keep the sphere 4 in the groove 7 within a certain range of inclination angles. If it exceeds 3%, it will be difficult for the sphere 4 once to partially enter the groove 7, and it will be difficult to jump out, and it will be difficult to keep the sphere 4 in the groove 7 within a certain inclination angle range.

  The width of the groove 7 is preferably 18% to 35% of the diameter of the sphere 4. If it is less than 18%, it becomes easy to jump out even if the sphere 4 partially enters the groove 7, and it becomes difficult to keep the sphere 4 in the groove 7 within a certain inclination angle range. If it exceeds 35%, the tilt sensor device tends to be large.

  In addition, as shown in FIGS. 3A and 3B, the tilt sensor device (wiring board 9) of the present invention is such that the insulating substrate 1 has a sphere 4 partially inserted into the center of the upper surface thereof. It is preferable that a recess 8 having a depth is provided. FIG. 3A is a plan view showing another example of the embodiment of the present invention, and FIG. 3B is a cross-sectional view thereof. In FIG. 3, the same parts as those in FIG.

  When the concave portion 8 is provided in this way, the sphere 4 contained in the concave portion 8 in a horizontal state does not come out of the concave portion 8 to a slight degree, and when it is inclined more than a certain angle. Since it comes out of the recess 8 for the first time, it is possible to prevent malfunction due to slight inclination or vibration by adjusting the angle, for example, by the depth or the cross-sectional shape of the recess 8, and the inclination angle to be detected. Can be set.

  In the configuration of FIG. 3, the overall shape of the recess 8 can be a circle, a polygon similar to the insulating substrate 1 or the insulating frame 2, and a polygon such as a hexagon. When the overall shape of the recess 8 is a polygon, the recess 8 may be formed so that the corner thereof faces the inner surface of the insulating frame 2. In that case, if the inclination sensor device is inclined and the sphere 4 is present at the corner facing the inner surface of the insulating frame 2, the sphere 4 is caught at the corner at a certain degree of inclination. Then, the sphere 4 comes into contact with the wiring conductor 3 that is in the inclination direction or closest to the inclination direction. Therefore, it becomes easy to guide the sphere 4 to the wiring conductor 3 that is in the inclination direction or closest to the inclination direction.

  Further, the depth of the recess 8 is preferably 0.8% to 3% of the diameter of the sphere 4. If it is less than 0.8%, the sphere 4 is likely to jump out of the recess 8 immediately, and it is difficult to keep the sphere 4 in the recess 8 within a certain inclination angle range. If it exceeds 3%, it is difficult for the sphere 4 to jump out of the recess 8, and it becomes difficult to keep the sphere 4 in the recess 8 within a range of a certain inclination angle.

  Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

(A) is a top view of the wiring board and inclination sensor apparatus of this invention, (b) is the sectional drawing. (A) is a top view of the wiring board and inclination sensor apparatus of this invention, (b) is the sectional drawing. (A) is a top view of the wiring board and inclination sensor apparatus of this invention, (b) is the sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... Insulating frame 3 ... Wiring conductor 4 ... Sphere 5 ... Lid 6 ... Electrode pad 7 ... Groove 8 ... Recess 9 ... Wiring board

Claims (6)

An insulating substrate having a polygonal shape with an outer shape of a quadrangle or more, an insulating frame having the same outer shape as the insulating substrate attached to the outer peripheral portion of the upper surface of the insulating substrate, and each side portion of the insulating frame A wiring conductor led out from an inner surface of the insulating substrate to at least one of a side surface and a lower surface of the insulating substrate, and an electrode formed independently of the wiring conductor inside the insulating frame on the upper surface of the insulating substrate A conductive sphere that can be freely rolled inside the insulating frame on the upper surface of the insulating substrate, and the wiring conductors are electrically independent from each other. The wiring board is characterized in that the electrode pad is provided with a non-forming portion having a width corresponding to the radius of the sphere at the end of the upper surface of the insulating substrate inside the insulating frame . The insulating frame has a step formed over the entire circumference between the upper surface and the inner surface, and the wiring conductor passes from the inner surface below the step to the upper surface of the step and the side surface of the insulating substrate and wiring board according to claim 1 Symbol mounting, characterized in that the lower surface of which is led to at least one. Said insulating substrate and said insulating frame body, according to claim 1 or claim 2 wiring board, wherein the outer shape shape is a regular hexagon or regular octagon. 2. The insulating substrate according to claim 1, wherein the upper surface is provided with a groove whose entire shape surrounds the central portion of the upper surface and whose depth is such that the sphere partially enters. The wiring board according to claim 3 . The insulating substrate, wiring of any one of claims 1 to 3, characterized in that the recess depth in the center portion is a depth at which the spherical body enters partially the upper surface is provided substrate. The wiring board according to any one of claims 1 to 5 , a conductive sphere accommodated in a state of being freely rollable inside the insulating frame on the upper surface of the insulating substrate, and the insulating frame A lid attached to the upper surface of the body, and when the wiring board is inclined, the inclination direction of the wiring board is specified by detecting the wiring conductor in contact with the sphere. Tilt sensor device characterized by.

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