JP4381698B2 - 半導体装置及びその作製方法 - Google Patents

半導体装置及びその作製方法 Download PDF

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Publication number
JP4381698B2
JP4381698B2 JP2003063349A JP2003063349A JP4381698B2 JP 4381698 B2 JP4381698 B2 JP 4381698B2 JP 2003063349 A JP2003063349 A JP 2003063349A JP 2003063349 A JP2003063349 A JP 2003063349A JP 4381698 B2 JP4381698 B2 JP 4381698B2
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JP
Japan
Prior art keywords
fiber
semiconductor
film
insulating film
support
Prior art date
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Expired - Fee Related
Application number
JP2003063349A
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English (en)
Japanese (ja)
Other versions
JP2004273817A (ja
JP2004273817A5 (enExample
Inventor
康行 荒井
麻衣 秋葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2003063349A priority Critical patent/JP4381698B2/ja
Priority to US10/793,787 priority patent/US7113661B2/en
Publication of JP2004273817A publication Critical patent/JP2004273817A/ja
Publication of JP2004273817A5 publication Critical patent/JP2004273817A5/ja
Application granted granted Critical
Publication of JP4381698B2 publication Critical patent/JP4381698B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02—Optical fibres with cladding with or without a coating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/104—Coating to obtain optical fibres
    • C03C25/106—Single coatings
    • C03C25/1061—Inorganic coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/62—Surface treatment of fibres or filaments made from glass, minerals or slags by application of electric or wave energy; by particle radiation or ion implantation
    • C03C25/6206—Electromagnetic waves
    • C03C25/6208—Laser
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02—Optical fibres with cladding with or without a coating
    • G02B6/02395—Glass optical fibre with a protective coating, e.g. two layer polymer coating deposited directly on a silica cladding surface during fibre manufacture

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Thin Film Transistor (AREA)
  • Recrystallisation Techniques (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
JP2003063349A 2003-03-10 2003-03-10 半導体装置及びその作製方法 Expired - Fee Related JP4381698B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003063349A JP4381698B2 (ja) 2003-03-10 2003-03-10 半導体装置及びその作製方法
US10/793,787 US7113661B2 (en) 2003-03-10 2004-03-08 Semiconductor device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003063349A JP4381698B2 (ja) 2003-03-10 2003-03-10 半導体装置及びその作製方法

Publications (3)

Publication Number Publication Date
JP2004273817A JP2004273817A (ja) 2004-09-30
JP2004273817A5 JP2004273817A5 (enExample) 2006-04-06
JP4381698B2 true JP4381698B2 (ja) 2009-12-09

Family

ID=32959084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003063349A Expired - Fee Related JP4381698B2 (ja) 2003-03-10 2003-03-10 半導体装置及びその作製方法

Country Status (2)

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US (1) US7113661B2 (enExample)
JP (1) JP4381698B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4381698B2 (ja) * 2003-03-10 2009-12-09 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP2006128414A (ja) * 2004-10-28 2006-05-18 Furukawa Electric Co Ltd:The ファイバーｓｏｉ基板及びこれを用いた半導体素子並びにその製造方法
US7368307B2 (en) * 2005-06-07 2008-05-06 Eastman Kodak Company Method of manufacturing an OLED device with a curved light emitting surface
CN102027615A (zh) * 2008-03-26 2011-04-20 皇家飞利浦电子股份有限公司 发光二极管器件
US8954156B2 (en) 2010-10-27 2015-02-10 National Tsing Hua University Methods and apparatuses for configuring artificial retina devices
US9114004B2 (en) 2010-10-27 2015-08-25 Iridium Medical Technology Co, Ltd. Flexible artificial retina devices
CN202033560U (zh) * 2011-01-14 2011-11-09 王亚平 一种有源阵列液晶显示面板的基板
US9155881B2 (en) 2011-05-06 2015-10-13 Iridium Medical Technology Co, Ltd. Non-planar chip assembly
US8613135B2 (en) * 2011-05-06 2013-12-24 National Tsing Hua University Method for non-planar chip assembly
KR102009724B1 (ko) * 2012-10-29 2019-08-13 삼성디스플레이 주식회사 플렉서블 표시 장치 및 표시 장치의 휘도 보정 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0522417A1 (en) * 1991-07-09 1993-01-13 Sumitomo Electric Industries, Limited Light-receiving apparatus with optical fiber connection
US5821597A (en) 1992-09-11 1998-10-13 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device
SE513183C2 (sv) * 1994-03-18 2000-07-24 Ericsson Telefon Ab L M Förfarande för framställning av en optokomponent samt kapslad optokomponent
US5627364A (en) 1994-10-11 1997-05-06 Tdk Corporation Linear array image sensor with thin-film light emission element light source
US5631987A (en) * 1995-06-07 1997-05-20 Reliaspeed, Inc. Low cost, mode-field matched, high performance laser transmitter optical subassembly
US5774614A (en) * 1996-07-16 1998-06-30 Gilliland; Patrick B. Optoelectronic coupling and method of making same
US5955776A (en) 1996-12-04 1999-09-21 Ball Semiconductor, Inc. Spherical shaped semiconductor integrated circuit
JP3191729B2 (ja) * 1997-07-03 2001-07-23 日本電気株式会社 光半導体モジュールとその製造方法
JP3147087B2 (ja) 1998-06-17 2001-03-19 日本電気株式会社 積層型半導体装置放熱構造
US6509645B2 (en) 1998-07-09 2003-01-21 Nippon Steel Corporation Spherical semiconductor device and method for fabricating the same
US6312304B1 (en) 1998-12-15 2001-11-06 E Ink Corporation Assembly of microencapsulated electronic displays
TW473783B (en) 1999-08-13 2002-01-21 Semiconductor Energy Lab Laser apparatus, laser annealing method, and manufacturing method of a semiconductor device
JP3897965B2 (ja) 1999-08-13 2007-03-28 株式会社半導体エネルギー研究所 レーザー装置及びレーザーアニール方法
JP3798220B2 (ja) 2000-04-07 2006-07-19 シャープ株式会社 半導体装置およびそれを用いる液晶モジュール
JP4059338B2 (ja) 2002-07-24 2008-03-12 独立行政法人科学技術振興機構 ファイバーを用いた線状センサ及びそのシステム
JP4381698B2 (ja) * 2003-03-10 2009-12-09 株式会社半導体エネルギー研究所 半導体装置及びその作製方法

Also Published As

Publication number Publication date
US7113661B2 (en) 2006-09-26
JP2004273817A (ja) 2004-09-30
US20040179767A1 (en) 2004-09-16

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