JP2004273817A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004273817A5 JP2004273817A5 JP2003063349A JP2003063349A JP2004273817A5 JP 2004273817 A5 JP2004273817 A5 JP 2004273817A5 JP 2003063349 A JP2003063349 A JP 2003063349A JP 2003063349 A JP2003063349 A JP 2003063349A JP 2004273817 A5 JP2004273817 A5 JP 2004273817A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003063349A JP4381698B2 (ja) | 2003-03-10 | 2003-03-10 | 半導体装置及びその作製方法 |
| US10/793,787 US7113661B2 (en) | 2003-03-10 | 2004-03-08 | Semiconductor device and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003063349A JP4381698B2 (ja) | 2003-03-10 | 2003-03-10 | 半導体装置及びその作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004273817A JP2004273817A (ja) | 2004-09-30 |
| JP2004273817A5 true JP2004273817A5 (enExample) | 2006-04-06 |
| JP4381698B2 JP4381698B2 (ja) | 2009-12-09 |
Family
ID=32959084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003063349A Expired - Fee Related JP4381698B2 (ja) | 2003-03-10 | 2003-03-10 | 半導体装置及びその作製方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7113661B2 (enExample) |
| JP (1) | JP4381698B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4381698B2 (ja) * | 2003-03-10 | 2009-12-09 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
| JP2006128414A (ja) * | 2004-10-28 | 2006-05-18 | Furukawa Electric Co Ltd:The | ファイバーｓｏｉ基板及びこれを用いた半導体素子並びにその製造方法 |
| US7368307B2 (en) * | 2005-06-07 | 2008-05-06 | Eastman Kodak Company | Method of manufacturing an OLED device with a curved light emitting surface |
| WO2009118678A1 (en) * | 2008-03-26 | 2009-10-01 | Philips Intellectual Property & Standards Gmbh | Light emitting diode device |
| US8954156B2 (en) | 2010-10-27 | 2015-02-10 | National Tsing Hua University | Methods and apparatuses for configuring artificial retina devices |
| US9114004B2 (en) | 2010-10-27 | 2015-08-25 | Iridium Medical Technology Co, Ltd. | Flexible artificial retina devices |
| CN102073184A (zh) * | 2011-01-14 | 2011-05-25 | 王亚平 | 有源阵列液晶显示面板的基板 |
| US9155881B2 (en) | 2011-05-06 | 2015-10-13 | Iridium Medical Technology Co, Ltd. | Non-planar chip assembly |
| US8613135B2 (en) | 2011-05-06 | 2013-12-24 | National Tsing Hua University | Method for non-planar chip assembly |
| KR102009724B1 (ko) * | 2012-10-29 | 2019-08-13 | 삼성디스플레이 주식회사 | 플렉서블 표시 장치 및 표시 장치의 휘도 보정 방법 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0522417A1 (en) * | 1991-07-09 | 1993-01-13 | Sumitomo Electric Industries, Limited | Light-receiving apparatus with optical fiber connection |
| US5821597A (en) | 1992-09-11 | 1998-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device |
| SE513183C2 (sv) * | 1994-03-18 | 2000-07-24 | Ericsson Telefon Ab L M | Förfarande för framställning av en optokomponent samt kapslad optokomponent |
| US5627364A (en) | 1994-10-11 | 1997-05-06 | Tdk Corporation | Linear array image sensor with thin-film light emission element light source |
| US5631987A (en) * | 1995-06-07 | 1997-05-20 | Reliaspeed, Inc. | Low cost, mode-field matched, high performance laser transmitter optical subassembly |
| US5774614A (en) * | 1996-07-16 | 1998-06-30 | Gilliland; Patrick B. | Optoelectronic coupling and method of making same |
| US5955776A (en) | 1996-12-04 | 1999-09-21 | Ball Semiconductor, Inc. | Spherical shaped semiconductor integrated circuit |
| JP3191729B2 (ja) * | 1997-07-03 | 2001-07-23 | 日本電気株式会社 | 光半導体モジュールとその製造方法 |
| JP3147087B2 (ja) | 1998-06-17 | 2001-03-19 | 日本電気株式会社 | 積層型半導体装置放熱構造 |
| US6509645B2 (en) | 1998-07-09 | 2003-01-21 | Nippon Steel Corporation | Spherical semiconductor device and method for fabricating the same |
| US6312304B1 (en) | 1998-12-15 | 2001-11-06 | E Ink Corporation | Assembly of microencapsulated electronic displays |
| TW487959B (en) | 1999-08-13 | 2002-05-21 | Semiconductor Energy Lab | Laser apparatus, laser annealing method, and manufacturing method of a semiconductor device |
| JP3897965B2 (ja) | 1999-08-13 | 2007-03-28 | 株式会社半導体エネルギー研究所 | レーザー装置及びレーザーアニール方法 |
| JP3798220B2 (ja) | 2000-04-07 | 2006-07-19 | シャープ株式会社 | 半導体装置およびそれを用いる液晶モジュール |
| JP4059338B2 (ja) | 2002-07-24 | 2008-03-12 | 独立行政法人科学技術振興機構 | ファイバーを用いた線状センサ及びそのシステム |
| JP4381698B2 (ja) * | 2003-03-10 | 2009-12-09 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
-
2003
- 2003-03-10 JP JP2003063349A patent/JP4381698B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-08 US US10/793,787 patent/US7113661B2/en not_active Expired - Fee Related