JP4380457B2 - 圧電発振器および圧電発振器の製造方法 - Google Patents

圧電発振器および圧電発振器の製造方法 Download PDF

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Publication number
JP4380457B2
JP4380457B2 JP2004227855A JP2004227855A JP4380457B2 JP 4380457 B2 JP4380457 B2 JP 4380457B2 JP 2004227855 A JP2004227855 A JP 2004227855A JP 2004227855 A JP2004227855 A JP 2004227855A JP 4380457 B2 JP4380457 B2 JP 4380457B2
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Japan
Prior art keywords
resin
semiconductor element
package
piezoelectric oscillator
piezoelectric
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Expired - Fee Related
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JP2004227855A
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Japanese (ja)
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JP2006049547A (ja
JP2006049547A5 (https=
Inventor
和彦 下平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2004227855A priority Critical patent/JP4380457B2/ja
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Publication of JP2006049547A5 publication Critical patent/JP2006049547A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2004227855A 2004-08-04 2004-08-04 圧電発振器および圧電発振器の製造方法 Expired - Fee Related JP4380457B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004227855A JP4380457B2 (ja) 2004-08-04 2004-08-04 圧電発振器および圧電発振器の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004227855A JP4380457B2 (ja) 2004-08-04 2004-08-04 圧電発振器および圧電発振器の製造方法

Publications (3)

Publication Number Publication Date
JP2006049547A JP2006049547A (ja) 2006-02-16
JP2006049547A5 JP2006049547A5 (https=) 2007-09-20
JP4380457B2 true JP4380457B2 (ja) 2009-12-09

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ID=36027767

Family Applications (1)

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JP2004227855A Expired - Fee Related JP4380457B2 (ja) 2004-08-04 2004-08-04 圧電発振器および圧電発振器の製造方法

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JP (1) JP4380457B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009278399A (ja) * 2008-05-15 2009-11-26 Epson Toyocom Corp 圧電デバイス

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JP2006049547A (ja) 2006-02-16

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