JP4376648B2 - Cleaning resin composition - Google Patents
Cleaning resin composition Download PDFInfo
- Publication number
- JP4376648B2 JP4376648B2 JP2004028862A JP2004028862A JP4376648B2 JP 4376648 B2 JP4376648 B2 JP 4376648B2 JP 2004028862 A JP2004028862 A JP 2004028862A JP 2004028862 A JP2004028862 A JP 2004028862A JP 4376648 B2 JP4376648 B2 JP 4376648B2
- Authority
- JP
- Japan
- Prior art keywords
- mass
- component
- parts
- cleaning
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title claims description 41
- 239000011342 resin composition Substances 0.000 title claims description 16
- 229920005989 resin Polymers 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 44
- 239000000203 mixture Substances 0.000 claims description 26
- -1 alkylene glycol fatty acid ester Chemical class 0.000 claims description 19
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 19
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 11
- 239000000194 fatty acid Substances 0.000 claims description 11
- 229930195729 fatty acid Natural products 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 9
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 9
- 150000003839 salts Chemical class 0.000 claims description 9
- HJJZFSVYWJHHFE-UHFFFAOYSA-N docosanoic acid;propane-1,2-diol Chemical compound CC(O)CO.CCCCCCCCCCCCCCCCCCCCCC(O)=O HJJZFSVYWJHHFE-UHFFFAOYSA-N 0.000 claims description 7
- 150000002903 organophosphorus compounds Chemical class 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims 1
- 150000001342 alkaline earth metals Chemical class 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 23
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 17
- 238000012545 processing Methods 0.000 description 15
- 239000012459 cleaning agent Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 238000001746 injection moulding Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 229910019142 PO4 Inorganic materials 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 6
- 239000010452 phosphate Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000004513 sizing Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000003945 anionic surfactant Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- YRIOTLGRXFJRTJ-UHFFFAOYSA-N (1,1-diphenyl-2-phosphonooxyethyl) prop-2-enoate Chemical compound C=1C=CC=CC=1C(OC(=O)C=C)(COP(O)(=O)O)C1=CC=CC=C1 YRIOTLGRXFJRTJ-UHFFFAOYSA-N 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- ODDSXTDNXBAVPQ-UHFFFAOYSA-N 1,2-dihydroxypropyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OC(O)C(C)O ODDSXTDNXBAVPQ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FKOKUHFZNIUSLW-UHFFFAOYSA-N 2-Hydroxypropyl stearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(C)O FKOKUHFZNIUSLW-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 1
- ZAXRTBFZGJJUGM-UHFFFAOYSA-N 2-docosanoyloxyethyl docosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCCCCCC ZAXRTBFZGJJUGM-UHFFFAOYSA-N 0.000 description 1
- WITKSCOBOCOGSC-UHFFFAOYSA-N 2-dodecanoyloxypropyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCC(C)OC(=O)CCCCCCCCCCC WITKSCOBOCOGSC-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- UWTZRBLIYNMYTC-UHFFFAOYSA-N 2-hexadecanoyloxypropyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OCC(C)OC(=O)CCCCCCCCCCCCCCC UWTZRBLIYNMYTC-UHFFFAOYSA-N 0.000 description 1
- MUHFRORXWCGZGE-KTKRTIGZSA-N 2-hydroxyethyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCO MUHFRORXWCGZGE-KTKRTIGZSA-N 0.000 description 1
- HJIHXGNKBCJVAR-UHFFFAOYSA-N 2-hydroxyethyl docosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OCCO HJIHXGNKBCJVAR-UHFFFAOYSA-N 0.000 description 1
- CTXGTHVAWRBISV-UHFFFAOYSA-N 2-hydroxyethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCO CTXGTHVAWRBISV-UHFFFAOYSA-N 0.000 description 1
- BXCRLBBIZJSWNS-UHFFFAOYSA-N 2-hydroxyethyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OCCO BXCRLBBIZJSWNS-UHFFFAOYSA-N 0.000 description 1
- RFVNOJDQRGSOEL-UHFFFAOYSA-N 2-hydroxyethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCO RFVNOJDQRGSOEL-UHFFFAOYSA-N 0.000 description 1
- ABFWOTZXBYVPIF-UHFFFAOYSA-N 2-hydroxyethyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OCCO ABFWOTZXBYVPIF-UHFFFAOYSA-N 0.000 description 1
- ZVTDEEBSWIQAFJ-KHPPLWFESA-N 2-hydroxypropyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(C)O ZVTDEEBSWIQAFJ-KHPPLWFESA-N 0.000 description 1
- BHIZVZJETFVJMJ-UHFFFAOYSA-N 2-hydroxypropyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCC(C)O BHIZVZJETFVJMJ-UHFFFAOYSA-N 0.000 description 1
- VCNPGCHIKPSUSP-UHFFFAOYSA-N 2-hydroxypropyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OCC(C)O VCNPGCHIKPSUSP-UHFFFAOYSA-N 0.000 description 1
- JEMDXOYRWHZUCG-UHFFFAOYSA-N 2-octadecanoyloxypropyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(C)OC(=O)CCCCCCCCCCCCCCCCC JEMDXOYRWHZUCG-UHFFFAOYSA-N 0.000 description 1
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 description 1
- AMOSICMEJHNLEP-UHFFFAOYSA-N 2-tetradecanoyloxyethyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCC AMOSICMEJHNLEP-UHFFFAOYSA-N 0.000 description 1
- NRRPJRVSNIJDAP-UHFFFAOYSA-N 2-tetradecanoyloxypropyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OCC(C)OC(=O)CCCCCCCCCCCCC NRRPJRVSNIJDAP-UHFFFAOYSA-N 0.000 description 1
- QHTMZVKRYQAWHB-CLFAGFIQSA-N 4-[(z)-octadec-9-enoyl]oxybutyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCCOC(=O)CCCCCCC\C=C/CCCCCCCC QHTMZVKRYQAWHB-CLFAGFIQSA-N 0.000 description 1
- ZHFKPQUAKSMCKS-UHFFFAOYSA-N 4-docosanoyloxybutyl docosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OCCCCOC(=O)CCCCCCCCCCCCCCCCCCCCC ZHFKPQUAKSMCKS-UHFFFAOYSA-N 0.000 description 1
- QILMKHPBHSTXSI-UHFFFAOYSA-N 4-dodecanoyloxybutyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCCCOC(=O)CCCCCCCCCCC QILMKHPBHSTXSI-UHFFFAOYSA-N 0.000 description 1
- UXPYIAWFQKSHNV-UHFFFAOYSA-N 4-hexadecanoyloxybutyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OCCCCOC(=O)CCCCCCCCCCCCCCC UXPYIAWFQKSHNV-UHFFFAOYSA-N 0.000 description 1
- UKKNMCFZDIOGAW-KTKRTIGZSA-N 4-hydroxybutyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCCO UKKNMCFZDIOGAW-KTKRTIGZSA-N 0.000 description 1
- CSBHPXCJKSLXPG-UHFFFAOYSA-N 4-hydroxybutyl docosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OCCCCO CSBHPXCJKSLXPG-UHFFFAOYSA-N 0.000 description 1
- VWMDGDKJQSDMSL-UHFFFAOYSA-N 4-hydroxybutyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCCCO VWMDGDKJQSDMSL-UHFFFAOYSA-N 0.000 description 1
- IKDHIMYPOLRLJB-UHFFFAOYSA-N 4-hydroxybutyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCO IKDHIMYPOLRLJB-UHFFFAOYSA-N 0.000 description 1
- LMRWRQFJQBHUBU-UHFFFAOYSA-N 4-hydroxybutyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OCCCCO LMRWRQFJQBHUBU-UHFFFAOYSA-N 0.000 description 1
- SCSIKTWVGSGLCV-UHFFFAOYSA-N 4-octadecanoyloxybutyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCOC(=O)CCCCCCCCCCCCCCCCC SCSIKTWVGSGLCV-UHFFFAOYSA-N 0.000 description 1
- HAVZZMORNRVMDE-UHFFFAOYSA-N 4-tetradecanoyloxybutyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OCCCCOC(=O)CCCCCCCCCCCCC HAVZZMORNRVMDE-UHFFFAOYSA-N 0.000 description 1
- ZNRNSKNVPBUUNI-CLFAGFIQSA-N 6-[(z)-octadec-9-enoyl]oxyhexyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCCCCOC(=O)CCCCCCC\C=C/CCCCCCCC ZNRNSKNVPBUUNI-CLFAGFIQSA-N 0.000 description 1
- ZCHITUFFQKXSJX-UHFFFAOYSA-N 6-docosanoyloxyhexyl docosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OCCCCCCOC(=O)CCCCCCCCCCCCCCCCCCCCC ZCHITUFFQKXSJX-UHFFFAOYSA-N 0.000 description 1
- YSVWNTWQYQDEFP-UHFFFAOYSA-N 6-dodecanoyloxyhexyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCCCCCOC(=O)CCCCCCCCCCC YSVWNTWQYQDEFP-UHFFFAOYSA-N 0.000 description 1
- IBYKYYZAEVHVLS-UHFFFAOYSA-N 6-hexadecanoyloxyhexyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OCCCCCCOC(=O)CCCCCCCCCCCCCCC IBYKYYZAEVHVLS-UHFFFAOYSA-N 0.000 description 1
- KSARJTPOMPWDIS-KTKRTIGZSA-N 6-hydroxyhexyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCCCCO KSARJTPOMPWDIS-KTKRTIGZSA-N 0.000 description 1
- FWEWBUSIPWBFMR-UHFFFAOYSA-N 6-hydroxyhexyl docosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OCCCCCCO FWEWBUSIPWBFMR-UHFFFAOYSA-N 0.000 description 1
- KJZPSIQWIZPGQG-UHFFFAOYSA-N 6-hydroxyhexyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCCCCCO KJZPSIQWIZPGQG-UHFFFAOYSA-N 0.000 description 1
- FVKCTMUJWIWGPM-UHFFFAOYSA-N 6-hydroxyhexyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCO FVKCTMUJWIWGPM-UHFFFAOYSA-N 0.000 description 1
- TWXPKKOLCJDQBY-UHFFFAOYSA-N 6-octadecanoyloxyhexyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCOC(=O)CCCCCCCCCCCCCCCCC TWXPKKOLCJDQBY-UHFFFAOYSA-N 0.000 description 1
- OZFLRNPZLCUVFP-UHFFFAOYSA-N 8-methylnonyl dihydrogen phosphate Chemical compound CC(C)CCCCCCCOP(O)(O)=O OZFLRNPZLCUVFP-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920000856 Amylose Polymers 0.000 description 1
- NIEVQVGDWLGEIX-UHFFFAOYSA-N C(CCCCCCCCCCCCC)(=O)O.C(CCCCCCCCCCCCC)(=O)O.C(CCCCCCCCCCCCC)(=O)O.C(CCCCCO)O Chemical compound C(CCCCCCCCCCCCC)(=O)O.C(CCCCCCCCCCCCC)(=O)O.C(CCCCCCCCCCCCC)(=O)O.C(CCCCCO)O NIEVQVGDWLGEIX-UHFFFAOYSA-N 0.000 description 1
- IMQOGYFHLCOEBI-UHFFFAOYSA-N C(CCCCCCCCCCCCC)(=O)OCCCCCCO Chemical compound C(CCCCCCCCCCCCC)(=O)OCCCCCCO IMQOGYFHLCOEBI-UHFFFAOYSA-N 0.000 description 1
- QVEFSKDQWUNMDS-UHFFFAOYSA-N CCCCCCCCCCCCCCCC(=O)OCCCCCCO Chemical compound CCCCCCCCCCCCCCCC(=O)OCCCCCCO QVEFSKDQWUNMDS-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- HEBKCHPVOIAQTA-QWWZWVQMSA-N D-arabinitol Chemical compound OC[C@@H](O)C(O)[C@H](O)CO HEBKCHPVOIAQTA-QWWZWVQMSA-N 0.000 description 1
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical compound CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 description 1
- FPVVYTCTZKCSOJ-UHFFFAOYSA-N Ethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCC FPVVYTCTZKCSOJ-UHFFFAOYSA-N 0.000 description 1
- SQUHHTBVTRBESD-UHFFFAOYSA-N Hexa-Ac-myo-Inositol Natural products CC(=O)OC1C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C1OC(C)=O SQUHHTBVTRBESD-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- MBBZMMPHUWSWHV-BDVNFPICSA-N N-methylglucamine Chemical compound CNC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO MBBZMMPHUWSWHV-BDVNFPICSA-N 0.000 description 1
- 229920001890 Novodur Polymers 0.000 description 1
- CGSLYBDCEGBZCG-UHFFFAOYSA-N Octicizer Chemical compound C=1C=CC=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 CGSLYBDCEGBZCG-UHFFFAOYSA-N 0.000 description 1
- XWFLUBQOIDFKOM-UHFFFAOYSA-N Palmitic acid, 4-hydroxybutyl ester Chemical compound CCCCCCCCCCCCCCCC(=O)OCCCCO XWFLUBQOIDFKOM-UHFFFAOYSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- GTVWRXDRKAHEAD-UHFFFAOYSA-N Tris(2-ethylhexyl) phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OCC(CC)CCCC GTVWRXDRKAHEAD-UHFFFAOYSA-N 0.000 description 1
- HPUPGAFDTWIMBR-UHFFFAOYSA-N [methyl(phenoxy)phosphoryl]oxybenzene Chemical compound C=1C=CC=CC=1OP(=O)(C)OC1=CC=CC=C1 HPUPGAFDTWIMBR-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229920001895 acrylonitrile-acrylic-styrene Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001260 acyclic compounds Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- ISGZBAMXNZISAX-UHFFFAOYSA-K aluminum;decanoate Chemical compound [Al+3].CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O ISGZBAMXNZISAX-UHFFFAOYSA-K 0.000 description 1
- BBMXVTPBLPQMAE-UHFFFAOYSA-K aluminum;docosanoate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O BBMXVTPBLPQMAE-UHFFFAOYSA-K 0.000 description 1
- KMJRBSYFFVNPPK-UHFFFAOYSA-K aluminum;dodecanoate Chemical compound [Al+3].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O KMJRBSYFFVNPPK-UHFFFAOYSA-K 0.000 description 1
- JJCSYJVFIRBCRI-UHFFFAOYSA-K aluminum;hexadecanoate Chemical compound [Al].CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O JJCSYJVFIRBCRI-UHFFFAOYSA-K 0.000 description 1
- OFEPSGLLYPYMDB-UHFFFAOYSA-K aluminum;hexanoate Chemical compound [Al+3].CCCCCC([O-])=O.CCCCCC([O-])=O.CCCCCC([O-])=O OFEPSGLLYPYMDB-UHFFFAOYSA-K 0.000 description 1
- HSMXEPWDIJUMSS-UHFFFAOYSA-K aluminum;tetradecanoate Chemical compound [Al+3].CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O HSMXEPWDIJUMSS-UHFFFAOYSA-K 0.000 description 1
- QBEUXDWEKIOSIL-UHFFFAOYSA-N benzyl 5-amino-1h-pyrazole-4-carboxylate Chemical compound N1N=CC(C(=O)OCC=2C=CC=CC=2)=C1N QBEUXDWEKIOSIL-UHFFFAOYSA-N 0.000 description 1
- BEAFHPLLBXXUHK-UHFFFAOYSA-N bis(2-propan-2-ylphenyl) hydrogen phosphate Chemical compound CC(C)C1=CC=CC=C1OP(O)(=O)OC1=CC=CC=C1C(C)C BEAFHPLLBXXUHK-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- BNMJSBUIDQYHIN-UHFFFAOYSA-N butyl dihydrogen phosphate Chemical compound CCCCOP(O)(O)=O BNMJSBUIDQYHIN-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229940061587 calcium behenate Drugs 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- FKYAWWVVKRUUFY-UHFFFAOYSA-L calcium;decanoate Chemical compound [Ca+2].CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O FKYAWWVVKRUUFY-UHFFFAOYSA-L 0.000 description 1
- SMBKCSPGKDEPFO-UHFFFAOYSA-L calcium;docosanoate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O SMBKCSPGKDEPFO-UHFFFAOYSA-L 0.000 description 1
- HIAAVKYLDRCDFQ-UHFFFAOYSA-L calcium;dodecanoate Chemical compound [Ca+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O HIAAVKYLDRCDFQ-UHFFFAOYSA-L 0.000 description 1
- HRBZRZSCMANEHQ-UHFFFAOYSA-L calcium;hexadecanoate Chemical compound [Ca+2].CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O HRBZRZSCMANEHQ-UHFFFAOYSA-L 0.000 description 1
- BSJIICUVGMPYSD-UHFFFAOYSA-L calcium;hexanoate Chemical compound [Ca+2].CCCCCC([O-])=O.CCCCCC([O-])=O BSJIICUVGMPYSD-UHFFFAOYSA-L 0.000 description 1
- ZCZLQYAECBEUBH-UHFFFAOYSA-L calcium;octadec-9-enoate Chemical compound [Ca+2].CCCCCCCCC=CCCCCCCCC([O-])=O.CCCCCCCCC=CCCCCCCCC([O-])=O ZCZLQYAECBEUBH-UHFFFAOYSA-L 0.000 description 1
- NDWWLJQHOLSEHX-UHFFFAOYSA-L calcium;octanoate Chemical compound [Ca+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O NDWWLJQHOLSEHX-UHFFFAOYSA-L 0.000 description 1
- LSFBQOPXRBJSSI-UHFFFAOYSA-L calcium;tetradecanoate Chemical compound [Ca+2].CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O LSFBQOPXRBJSSI-UHFFFAOYSA-L 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- VAROLYSFQDGFMV-UHFFFAOYSA-K di(octanoyloxy)alumanyl octanoate Chemical compound [Al+3].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O VAROLYSFQDGFMV-UHFFFAOYSA-K 0.000 description 1
- UZEFVQBWJSFOFE-UHFFFAOYSA-N dibutyl hydrogen phosphite Chemical compound CCCCOP(O)OCCCC UZEFVQBWJSFOFE-UHFFFAOYSA-N 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- VZEGPPPCKHRYGO-UHFFFAOYSA-N diethoxyphosphorylbenzene Chemical compound CCOP(=O)(OCC)C1=CC=CC=C1 VZEGPPPCKHRYGO-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- QXKGIWNXBUINDE-UHFFFAOYSA-J docosanoate tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O QXKGIWNXBUINDE-UHFFFAOYSA-J 0.000 description 1
- BRWZYZWZBMGMMG-UHFFFAOYSA-J dodecanoate tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O BRWZYZWZBMGMMG-UHFFFAOYSA-J 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- FBPFZTCFMRRESA-GUCUJZIJSA-N galactitol Chemical compound OC[C@H](O)[C@@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-GUCUJZIJSA-N 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- CDAISMWEOUEBRE-GPIVLXJGSA-N inositol Chemical compound O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@H](O)[C@@H]1O CDAISMWEOUEBRE-GPIVLXJGSA-N 0.000 description 1
- 229960000367 inositol Drugs 0.000 description 1
- HGPXWXLYXNVULB-UHFFFAOYSA-M lithium stearate Chemical compound [Li+].CCCCCCCCCCCCCCCCCC([O-])=O HGPXWXLYXNVULB-UHFFFAOYSA-M 0.000 description 1
- AVOVSJYQRZMDQJ-KVVVOXFISA-M lithium;(z)-octadec-9-enoate Chemical compound [Li+].CCCCCCCC\C=C/CCCCCCCC([O-])=O AVOVSJYQRZMDQJ-KVVVOXFISA-M 0.000 description 1
- POYDCAKGHSRECA-UHFFFAOYSA-M lithium;decanoate Chemical compound [Li+].CCCCCCCCCC([O-])=O POYDCAKGHSRECA-UHFFFAOYSA-M 0.000 description 1
- SDIIFPDBZMCCLQ-UHFFFAOYSA-M lithium;docosanoate Chemical compound [Li+].CCCCCCCCCCCCCCCCCCCCCC([O-])=O SDIIFPDBZMCCLQ-UHFFFAOYSA-M 0.000 description 1
- AZEPWULHRMVZQR-UHFFFAOYSA-M lithium;dodecanoate Chemical compound [Li+].CCCCCCCCCCCC([O-])=O AZEPWULHRMVZQR-UHFFFAOYSA-M 0.000 description 1
- BZMIKKVSCNHEFL-UHFFFAOYSA-M lithium;hexadecanoate Chemical compound [Li+].CCCCCCCCCCCCCCCC([O-])=O BZMIKKVSCNHEFL-UHFFFAOYSA-M 0.000 description 1
- PNDUWCHQCLZPAH-UHFFFAOYSA-M lithium;hexanoate Chemical compound [Li+].CCCCCC([O-])=O PNDUWCHQCLZPAH-UHFFFAOYSA-M 0.000 description 1
- BTAUEIDLAAYHSL-UHFFFAOYSA-M lithium;octanoate Chemical compound [Li+].CCCCCCCC([O-])=O BTAUEIDLAAYHSL-UHFFFAOYSA-M 0.000 description 1
- KJSPVJJOPONRTK-UHFFFAOYSA-M lithium;tetradecanoate Chemical compound [Li+].CCCCCCCCCCCCCC([O-])=O KJSPVJJOPONRTK-UHFFFAOYSA-M 0.000 description 1
- 229940105112 magnesium myristate Drugs 0.000 description 1
- 229940063002 magnesium palmitate Drugs 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- WWRYOAYBSQIWNU-UHFFFAOYSA-L magnesium;decanoate Chemical compound [Mg+2].CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O WWRYOAYBSQIWNU-UHFFFAOYSA-L 0.000 description 1
- OBQVOBQZMOXRAL-UHFFFAOYSA-L magnesium;docosanoate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O OBQVOBQZMOXRAL-UHFFFAOYSA-L 0.000 description 1
- BJZBHTNKDCBDNQ-UHFFFAOYSA-L magnesium;dodecanoate Chemical compound [Mg+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O BJZBHTNKDCBDNQ-UHFFFAOYSA-L 0.000 description 1
- ABSWXCXMXIZDSN-UHFFFAOYSA-L magnesium;hexadecanoate Chemical compound [Mg+2].CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O ABSWXCXMXIZDSN-UHFFFAOYSA-L 0.000 description 1
- FKZRUGSMXUERAD-UHFFFAOYSA-L magnesium;hexanoate Chemical compound [Mg+2].CCCCCC([O-])=O.CCCCCC([O-])=O FKZRUGSMXUERAD-UHFFFAOYSA-L 0.000 description 1
- HPBJPFJVNDHMEG-UHFFFAOYSA-L magnesium;octanoate Chemical compound [Mg+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O HPBJPFJVNDHMEG-UHFFFAOYSA-L 0.000 description 1
- DMRBHZWQMKSQGR-UHFFFAOYSA-L magnesium;tetradecanoate Chemical compound [Mg+2].CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O DMRBHZWQMKSQGR-UHFFFAOYSA-L 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- AXLHVTKGDPVANO-UHFFFAOYSA-N methyl 2-amino-3-[(2-methylpropan-2-yl)oxycarbonylamino]propanoate Chemical compound COC(=O)C(N)CNC(=O)OC(C)(C)C AXLHVTKGDPVANO-UHFFFAOYSA-N 0.000 description 1
- MAQCMFOLVVSLLK-UHFFFAOYSA-N methyl 4-(bromomethyl)pyridine-2-carboxylate Chemical compound COC(=O)C1=CC(CBr)=CC=N1 MAQCMFOLVVSLLK-UHFFFAOYSA-N 0.000 description 1
- JFOJYGMDZRCSPA-UHFFFAOYSA-J octadecanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JFOJYGMDZRCSPA-UHFFFAOYSA-J 0.000 description 1
- XZZXKVYTWCYOQX-UHFFFAOYSA-J octanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O XZZXKVYTWCYOQX-UHFFFAOYSA-J 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 229940026235 propylene glycol monolaurate Drugs 0.000 description 1
- 229940093625 propylene glycol monostearate Drugs 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- HEBKCHPVOIAQTA-ZXFHETKHSA-N ribitol Chemical compound OC[C@H](O)[C@H](O)[C@H](O)CO HEBKCHPVOIAQTA-ZXFHETKHSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- CDAISMWEOUEBRE-UHFFFAOYSA-N scyllo-inosotol Natural products OC1C(O)C(O)C(O)C(O)C1O CDAISMWEOUEBRE-UHFFFAOYSA-N 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- XREKCAGAPAEVFE-UHFFFAOYSA-J tri(hexadecanoyloxy)stannyl hexadecanoate Chemical compound [Sn+4].CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O XREKCAGAPAEVFE-UHFFFAOYSA-J 0.000 description 1
- SSWCPXKXMAZRJO-UHFFFAOYSA-J tri(tetradecanoyloxy)stannyl tetradecanoate Chemical compound [Sn+4].CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O SSWCPXKXMAZRJO-UHFFFAOYSA-J 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- QEEHNBQLHFJCOV-UHFFFAOYSA-N tris(2-phenylphenyl) phosphate Chemical compound C=1C=CC=C(C=2C=CC=CC=2)C=1OP(OC=1C(=CC=CC=1)C=1C=CC=CC=1)(=O)OC1=CC=CC=C1C1=CC=CC=C1 QEEHNBQLHFJCOV-UHFFFAOYSA-N 0.000 description 1
- GXZLXDRFEDHOAU-UHFFFAOYSA-N tris(4-phenylphenyl) phosphate Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1OP(OC=1C=CC(=CC=1)C=1C=CC=CC=1)(=O)OC(C=C1)=CC=C1C1=CC=CC=C1 GXZLXDRFEDHOAU-UHFFFAOYSA-N 0.000 description 1
- OECBPUHKHTYFET-UHFFFAOYSA-J tris(decanoyloxy)stannyl decanoate Chemical compound [Sn+4].CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O OECBPUHKHTYFET-UHFFFAOYSA-J 0.000 description 1
- SVETUDAIEHYIKZ-IUPFWZBJSA-N tris[(z)-octadec-9-enyl] phosphate Chemical compound CCCCCCCC\C=C/CCCCCCCCOP(=O)(OCCCCCCCC\C=C/CCCCCCCC)OCCCCCCCC\C=C/CCCCCCCC SVETUDAIEHYIKZ-IUPFWZBJSA-N 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 229940088594 vitamin Drugs 0.000 description 1
- 229930003231 vitamin Natural products 0.000 description 1
- 229920001221 xylan Polymers 0.000 description 1
- 150000004823 xylans Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229940098697 zinc laurate Drugs 0.000 description 1
- 229940105125 zinc myristate Drugs 0.000 description 1
- 229940012185 zinc palmitate Drugs 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- LPEBYPDZMWMCLZ-CVBJKYQLSA-L zinc;(z)-octadec-9-enoate Chemical compound [Zn+2].CCCCCCCC\C=C/CCCCCCCC([O-])=O.CCCCCCCC\C=C/CCCCCCCC([O-])=O LPEBYPDZMWMCLZ-CVBJKYQLSA-L 0.000 description 1
- NVKSAUAQUPYOPO-UHFFFAOYSA-L zinc;decanoate Chemical compound [Zn+2].CCCCCCCCCC([O-])=O.CCCCCCCCCC([O-])=O NVKSAUAQUPYOPO-UHFFFAOYSA-L 0.000 description 1
- IJQXGKBNDNQWAT-UHFFFAOYSA-L zinc;docosanoate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O IJQXGKBNDNQWAT-UHFFFAOYSA-L 0.000 description 1
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 1
- GJAPSKMAVXDBIU-UHFFFAOYSA-L zinc;hexadecanoate Chemical compound [Zn+2].CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O GJAPSKMAVXDBIU-UHFFFAOYSA-L 0.000 description 1
- PKJOUIVGCFHFTK-UHFFFAOYSA-L zinc;hexanoate Chemical compound [Zn+2].CCCCCC([O-])=O.CCCCCC([O-])=O PKJOUIVGCFHFTK-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- GBFLQPIIIRJQLU-UHFFFAOYSA-L zinc;tetradecanoate Chemical compound [Zn+2].CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O GBFLQPIIIRJQLU-UHFFFAOYSA-L 0.000 description 1
Images
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- Moulds For Moulding Plastics Or The Like (AREA)
- Detergent Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、各種樹脂の成形に使用する加工成形機を洗浄するために用いる洗浄用樹脂組成物に関する。 The present invention relates to a cleaning resin composition used for cleaning a processing molding machine used for molding various resins.
熱可塑性樹脂は、射出成形品、押出成形品、フィルム等に幅広く利用されている。これらのプラスチック成形品は多品種少量生産の傾向にあり、品種の切替頻度が多くなっているため、品種切替時の成形機内の洗浄が品質管理上重要となってきている。熱可塑性樹脂の成形加工において、品種切替えの際における成形機の洗浄法としては、下記の方法が知られている。 Thermoplastic resins are widely used for injection molded products, extrusion molded products, films, and the like. Since these plastic molded products tend to be produced in a variety of products in small quantities, and the frequency of switching between products is increasing, cleaning in the molding machine at the time of product switching has become important for quality control. In the molding process of thermoplastic resins, the following methods are known as washing methods for molding machines at the time of product type switching.
まず、後続に使用する樹脂で洗浄する、即ち、スクリューを抜かずに置換用樹脂を用いて先行品種を置換する方法である。しかし、この方法では洗浄に多量の樹脂を流す必要があり、ロス分が多くなるという問題がある。 First, it is a method of washing with a resin to be used subsequently, that is, replacing a preceding product with a replacement resin without removing a screw. However, this method has a problem that a large amount of resin needs to be flowed for cleaning, and the loss is increased.
次に、加工成形機を分解掃除する方法があるが、この方法はあまりに時間がかかり過ぎるという問題がある。例えば押出成形における色替えの場合を例にとると、押出機を停止し、スクリューを抜いた後、スクリュー及びシリンダー内部をブラッシング等の方法で洗浄した後、再びスクリューを組込む等の煩雑な作業が必要となる。 Next, there is a method of disassembling and cleaning the processing molding machine, but this method has a problem that it takes too much time. For example, taking the case of color change in extrusion molding as an example, after the extruder is stopped, the screw is removed, the inside of the screw and cylinder is washed by a method such as brushing, and then complicated work such as re-installing the screw is performed. Necessary.
これらの方法に替えて、置換用樹脂量が少なくて済み、洗浄操作も簡便であることから様々な洗浄剤で洗浄する方法が試みられている。しかし、この洗浄剤による洗浄法の場合も、洗浄後に前剤が残留して焼けや成形不良の原因になったり、また完全に前剤を排出できても洗浄剤が残留し、次の樹脂への置換に多量の樹脂と長い時間を必要とするという問題がある。 Instead of these methods, a method of cleaning with various cleaning agents has been attempted since the amount of the replacement resin is small and the cleaning operation is simple. However, even in this cleaning method using a cleaning agent, the pre-residue remains after cleaning, causing burns and molding defects, and even if the pre-treatment agent can be completely discharged, the cleaning agent remains and moves to the next resin. There is a problem that a large amount of resin and a long time are required for the replacement of the resin.
また洗浄剤には、熱可塑性樹脂に界面活性剤を添加し洗浄性を高めているものがあるが、界面活性剤を添加すると成形機や押出機のスクリューとの摩擦が小さくなるため、前方に洗浄剤を送り出すことが困難になり、洗浄に時間がかかったり場合によっては洗浄できないという問題がある。
樹脂の加工成形機用の洗浄剤には、実用上、次の要件(i)及び(ii)、必要に応じて更に要件(iii)を満たすことが望まれている。 In practical use, it is desired that the cleaning agent for a resin processing and molding machine satisfies the following requirements (i) and (ii) and, if necessary, the requirement (iii).
(i)品種替え時における洗浄性:加工成形機内に残留する樹脂を押し出すためのもの;
(ii)洗浄剤の自己排出性:洗浄剤自体が加工成形機内に残留することを防止するためのもの;
(iii)異物除去性:焦げ(加工成形時に加えられた熱により、シリンダー内壁やスクリューに樹脂が変質してこびり付いたもの)等の異物を加工成形機から押し出すためのもの。
(I) Detergency when changing varieties: for extruding resin remaining in the processing molding machine;
(Ii) Self-discharge property of the cleaning agent: for preventing the cleaning agent itself from remaining in the processing machine;
(Iii) Foreign matter removability: For extruding foreign matters such as scorch (resin that the resin has deteriorated and stuck to the cylinder inner wall or screw due to heat applied during processing and molding) from the processing and molding machine.
要件(i)を満たすようにするためには、樹脂により洗浄剤の粘性を高めればよく、要件(ii)を満たすようにするためには、界面活性剤を配合して流動性を高めればよいが、樹脂と界面活性剤を配合しただけでは、要件(i)及び(ii)の両方を十分に満足させることはできず、改善の余地がある。 In order to satisfy the requirement (i), the viscosity of the cleaning agent may be increased by a resin, and in order to satisfy the requirement (ii), a surfactant may be added to increase the fluidity. However, both the requirements (i) and (ii) cannot be fully satisfied by merely blending the resin and the surfactant, and there is room for improvement.
本発明は、上記した2つ又は3つの要件を満たす、加工成形機に適用したときの洗浄力が高く、後剤への置換も容易である洗浄用樹脂組成物を提供することを課題とする。 An object of the present invention is to provide a cleaning resin composition that satisfies the above two or three requirements, has a high cleaning power when applied to a processing molding machine, and can be easily replaced with a back agent. .
本発明者は、要件(i)及び(ii)の両方を満足させるべく研究の結果、粘性及び流動性に加えて、洗浄剤が加工成形機のシリンダー内壁を押圧する力(その反力として、シリンダー内のスクリューを押圧する力)、即ち弾性に着目し、弾性を示す新たな指標としてスウェル比を使用し、特定成分の組み合わせからなる、所定範囲のスウェル比を満たす洗浄剤が、要件(i)及び(ii)の両方、更には要件(iii)を満足できることを見出して、本発明を完成したものである。 As a result of research to satisfy both requirements (i) and (ii), the present inventor has determined that, in addition to viscosity and fluidity, the force that the cleaning agent presses the cylinder inner wall of the processing machine (as the reaction force) A force that presses the screw in the cylinder), i.e., elasticity, and using a swell ratio as a new indicator of elasticity, a cleaning agent satisfying a swell ratio in a predetermined range consisting of a combination of specific components is required (i The present invention has been completed by finding that both the requirements (ii) and (ii) as well as the requirement (iii) can be satisfied.
本発明は、課題の解決手段として、
(A)ベース樹脂 100質量部、
(B)アルカンスルホン酸又はその塩を50質量%以上含む陰イオン界面活性剤
0.1〜20質量部、及び
(C)アルキレングリコール脂肪酸エステル0.1〜10質量部、
を含有する洗浄剤組成物であり、スウェル比が1.2以上である洗浄用樹脂組成物提供する。
As a means for solving the problems, the present invention
(A) 100 parts by mass of base resin,
(B) 0.1-20 parts by mass of an anionic surfactant containing 50% by mass or more of alkanesulfonic acid or a salt thereof, and (C) 0.1-10 parts by mass of alkylene glycol fatty acid ester,
And a cleaning resin composition having a swell ratio of 1.2 or more.
更に本発明は、課題の他の解決手段として、
(A)ベース樹脂 100質量部、
(B)アルカンスルホン酸又はその塩を50質量%以上含む陰イオン界面活性剤
0.1〜20質量部、
(C)アルキレングリコール脂肪酸エステル0.2〜10質量部、及び
(D)有機燐化合物0.1〜20質量部
を含有する洗浄剤組成物であり、スウェル比が1.2以上である洗浄用樹脂組成物を提供する。
Furthermore, the present invention provides other means for solving the problems,
(A) 100 parts by mass of base resin,
(B) 0.1-20 parts by mass of an anionic surfactant containing 50% by mass or more of alkanesulfonic acid or a salt thereof,
(C) A cleaning composition containing 0.2 to 10 parts by mass of an alkylene glycol fatty acid ester and (D) 0.1 to 20 parts by mass of an organophosphorus compound, and having a swell ratio of 1.2 or more. A resin composition is provided.
本発明における「スウェル比」とは、溶融状態の樹脂をノズル口からストランドを形成するように押し出したときの、ノズル径(d1)とストランド径(d2)の比率(d2/d1)である。本発明の「スウェル比」は、キャピラリーレオメーター(東洋精機(株)、キャピログラフ1B)により、樹脂の加工温度、剪断速度1×102sec−1、キャピラリーの長さ(20mm)、キャピラリーの直径(1mm)の条件で測定した値である。 The “swell ratio” in the present invention is the ratio (d 2 / d 1 ) between the nozzle diameter (d 1 ) and the strand diameter (d 2 ) when the molten resin is extruded from the nozzle opening so as to form a strand. ). The “swell ratio” of the present invention is measured using a capillary rheometer (Toyo Seiki Co., Ltd., Capillograph 1B), resin processing temperature, shear rate 1 × 10 2 sec −1 , capillary length (20 mm), capillary diameter. It is a value measured under the condition of (1 mm).
本発明の洗浄用樹脂組成物は、押出機、射出成形機等に対して優れた洗浄効果を有し、また、後剤への置き換えも非常に容易であり、短時間でかつ少量の材料で樹脂の色替えができる。 The cleaning resin composition of the present invention has an excellent cleaning effect with respect to an extruder, an injection molding machine, etc., and is very easy to replace with a back agent. Resin color can be changed.
(A)成分のベース樹脂は、スチレン系樹脂、ポリプロピレン等のオレフィン系樹脂、ポリメタクリレート、ポリアミド系繊維、ポリエステル系樹脂等を挙げることができるが、これらの中でもスチレン系樹脂が好ましい。 Examples of the base resin of the component (A) include styrene resins, olefin resins such as polypropylene, polymethacrylates, polyamide fibers, polyester resins, and the like. Among these, styrene resins are preferable.
スチレン系樹脂としては、スチレン、α−メチルスチレン、ビニルトルエン等のスチレン系モノマーの単独又は共重合体のほか、これらのスチレン系モノマーと共重合可能なモノマー、例えばアクリロニトリル、メチルメタクリレート等のビニル系モノマーとの共重合体を挙げることができる。 Styrene resins include styrene monomers such as styrene, α-methylstyrene, vinyltoluene, or copolymers, as well as monomers copolymerizable with these styrene monomers, for example, vinyl resins such as acrylonitrile and methyl methacrylate. Mention may be made of copolymers with monomers.
また、スチレン系樹脂は、ブタジエンゴム等のジエン系ゴム、エチレン/プロピレン系ゴム、アクリル系ゴム等に上記のスチレン系モノマー及びビニル系モノマーをグラフト重合させたゴム変性スチレン系樹脂にすることができる。このようなスチレン系樹脂としては、ポリスチレン、ハイインパクトポリスチレン、AS樹脂、ABS樹脂、AAS樹脂、AES樹脂、MS樹脂、MBS樹脂等を挙げることができる。 The styrene resin can be a rubber-modified styrene resin obtained by graft polymerization of the above styrene monomer and vinyl monomer on a diene rubber such as butadiene rubber, ethylene / propylene rubber, acrylic rubber, or the like. . Examples of such a styrenic resin include polystyrene, high impact polystyrene, AS resin, ABS resin, AAS resin, AES resin, MS resin, MBS resin, and the like.
スチレン系樹脂は、重量平均分子量が100,000〜450,000の範囲のものが好ましく、100,000〜300,000の範囲のものがより好ましく、150,000〜250,000の範囲のものがより好ましい。 The styrene resin preferably has a weight average molecular weight in the range of 100,000 to 450,000, more preferably in the range of 100,000 to 300,000, and in the range of 150,000 to 250,000. More preferred.
なお、スウェル比は、上記のとおり、樹脂の加工温度(通常の加工成形機を使用した場合の加工温度)において測定される値であり、上記の(A)成分として列記した樹脂の場合には、240℃で測定する。 As described above, the swell ratio is a value measured at the processing temperature of the resin (processing temperature when a normal processing molding machine is used). In the case of the resins listed as the component (A) above, , Measured at 240 ° C.
(B)成分のアルカンスルホン酸又はその塩は、下記一般式(1)で表されるものが好ましい。一般式(1)中のnは平均値であるから、一般式(1)で表されるものは炭素数の異なるものの混合物となる。(B)成分は、自己排出性の発現に寄与すると共に、(C)成分との間で疑似架橋構造を形成することで、組成物(洗浄使用時における溶融状態の組成物)を増粘させるものである。 Component (B) is preferably an alkanesulfonic acid or a salt thereof represented by the following general formula (1). Since n in the general formula (1) is an average value, what is represented by the general formula (1) is a mixture having different carbon numbers. The component (B) contributes to the expression of self-discharging properties and thickens the composition (a composition in a molten state at the time of cleaning use) by forming a pseudo-crosslinked structure with the component (C). Is.
〔式中、mは平均で5〜30の数、nは0〜30、n≦m、Mは、好ましくはH、Na、K、Mg、Caを示す。〕
アルカンスルホン酸又はその塩以外の陰イオン界面活性剤としては、アルキルベンゼンスルホン酸塩、アルキル又はアルケニルエーテル硫酸塩、アルキル又はアルケニル硫酸塩、炭素数8〜20のα−オレフィンスルホン酸塩、アルキル又はアルケニルエーテルカルボン酸塩、α−スルフォ脂肪酸塩、α−スルフォ脂肪酸エステル、炭素数が12〜20の飽和又は不飽和脂肪酸のアルカリ金属塩等から選ばれる1又は2以上を挙げることができる。
[Wherein, m is an average number of 5 to 30, n is 0 to 30, n ≦ m, and M is preferably H, Na, K, Mg, or Ca. ]
Examples of the anionic surfactant other than alkanesulfonic acid or a salt thereof include alkylbenzene sulfonate, alkyl or alkenyl ether sulfate, alkyl or alkenyl sulfate, α-olefin sulfonate having 8 to 20 carbon atoms, alkyl or alkenyl. Examples thereof include one or more selected from ether carboxylates, α-sulfo fatty acid salts, α-sulfo fatty acid esters, and alkali metal salts of saturated or unsaturated fatty acids having 12 to 20 carbon atoms.
(B)成分中のアルカンスルホン酸又はその塩の含有量は50質量%以上、好ましくは90〜100質量%、より好ましくは99〜100質量%である。 (B) Content of alkanesulfonic acid or its salt in a component is 50 mass% or more, Preferably it is 90-100 mass%, More preferably, it is 99-100 mass%.
(B)成分の含有量は、(A)成分100質量部に対して0.5〜20質量部、好ましくは1〜10質量部、より好ましくは2〜5質量部である。含有量が0.5質量部以上であると十分な洗浄効果を付与でき、特に自己排出性が向上され、20質量部以下であると自己排出性が良好であると共に、押出機内や成形機内に残留して汚染することが抑制される。 (B) Content of a component is 0.5-20 mass parts with respect to 100 mass parts of (A) component, Preferably it is 1-10 mass parts, More preferably, it is 2-5 mass parts. When the content is 0.5 parts by mass or more, a sufficient cleaning effect can be imparted, and in particular, self-discharge is improved, and when it is 20 parts by mass or less, the self-discharge is good, and in the extruder or molding machine. Residual contamination is suppressed.
(C)成分のアルキレングリコール脂肪酸エステルは、エチレングリコール、プロピレングリコール、テトラメチレングリコール、ヘキサメチレングリコール等のアルキレングリコールと炭素数12〜22の脂肪酸のエステル化合物を挙げることができる。(C)成分は、(B)成分との間で疑似架橋構造を形成し、組成物(洗浄使用時における溶融状態の組成物)を増粘させるためのものである。 (C) The alkylene glycol fatty acid ester of a component can mention ester compounds of alkylene glycol, such as ethylene glycol, propylene glycol, tetramethylene glycol, and hexamethylene glycol, and a C12-C22 fatty acid. The component (C) is for forming a pseudo-crosslinked structure with the component (B) and thickening the composition (a composition in a molten state at the time of cleaning use).
(C)成分としては、エチレングリコールモノラウレート、エチレングリコールジラウレート、プロピレングリコールモノラウレート、プロピレングリコールジラウレート、テトラメチレングリコールモノラウレート、テトラメチレングリコールジラウレート、ヘキサメチレングリコールモノラウレート、ヘキサメチレングリコールジラウレート、エチレングリコールモノミリステート、エチレングリコールジミリステート、プロピレングリコールモノミリステート、プロピレングリコールジミリステート、テトラメチレングリコールモノミリステート、テトラメチレングリコールジミリステート、ヘキサメチレングリコールモノミリステート、ヘキサメチレングリコールジミリステート、エチレングリコールモノパルミテート、エチレングリコールジパルミテート、プロピレングリコールモノパルミテート、プロピレングリコールジパルミテート、テトラメチレングリコールモノパルミテート、テトラメチレングリコールジパルミテート、ヘキサメチレングリコールモノパルミテート、ヘキサメチレングリコールジパルミテート、エチレングリコールモノステアレート、エチレングリコールジステアレート、プロピレングリコールモノステアレート、プロピレングリコールジステアレート、テトラメチレングリコールモノステアレート、テトラメチレングリコールジステアレート、ヘキサメチレングリコールモノステアレート、ヘキサメチレングリコールジステアレート、エチレングリコールモノオレート、エチレングリコールジオレート、プロピレングリコールモノオレート、プロピレングリコールジオレート、テトラメチレングリコールモノオレート、テトラメチレングリコールジオレート、ヘキサメチレングリコールモノオレート、ヘキサメチレングリコールジオレート、エチレングリコールモノベヘネート、エチレングリコールジベヘネート、プロピレングリコールモノベヘネート、プロピレングリコールジベヘネート、テトラメチレングリコールモノベヘネート、テトラメチレングリコールジベヘネート、ヘキサメチレングリコールモノベヘネート、ヘキサメチレングリコールジベヘネート等から選ばれる1又は2以上を挙げることができる。 As component (C), ethylene glycol monolaurate, ethylene glycol dilaurate, propylene glycol monolaurate, propylene glycol dilaurate, tetramethylene glycol monolaurate, tetramethylene glycol dilaurate, hexamethylene glycol monolaurate, hexamethylene glycol dilaurate , Ethylene glycol monomyristate, ethylene glycol dimyristate, propylene glycol monomyristate, propylene glycol dimyristate, tetramethylene glycol monomyristate, tetramethylene glycol dimyristate, hexamethylene glycol monomyristate, hexamethylene glycol dimyristate Myristate, ethylene glycol monopalmitate, ethylene glycol Cold dipalmitate, propylene glycol monopalmitate, propylene glycol dipalmitate, tetramethylene glycol monopalmitate, tetramethylene glycol dipalmitate, hexamethylene glycol monopalmitate, hexamethylene glycol dipalmitate, ethylene glycol monostearate , Ethylene glycol distearate, propylene glycol monostearate, propylene glycol distearate, tetramethylene glycol monostearate, tetramethylene glycol distearate, hexamethylene glycol monostearate, hexamethylene glycol distearate, ethylene glycol mono Oleate, ethylene glycol diolate, propylene glycol monooleate, Lopylene glycol dioleate, tetramethylene glycol monooleate, tetramethylene glycol dioleate, hexamethylene glycol monooleate, hexamethylene glycol dioleate, ethylene glycol monobehenate, ethylene glycol dibehenate, propylene glycol monobehenate, propylene glycol dibe Examples thereof include one or more selected from phenate, tetramethylene glycol monobehenate, tetramethylene glycol dibehenate, hexamethylene glycol monobehenate, hexamethylene glycol dibehenate, and the like.
(C)成分としては、プロピレングリコールモノベヘネートが好ましく、更に下記式(2)及び(3)で示されるプロピレングリコールモノベヘネートの混合物がより好ましい。 As the component (C), propylene glycol monobehenate is preferable, and a mixture of propylene glycol monobehenate represented by the following formulas (2) and (3) is more preferable.
式(2)と式(3)のプロピレングリコールモノベヘネートの質量比〔(2)/(3)〕は、好ましくは4:1〜1:1であり、より好ましくは3:1〜1:1である。
The mass ratio [ (2) / (3) ] of the propylene glycol monobehenate of formula (2) and formula (3) is preferably 4: 1 to 1: 1, more preferably 3: 1 to 1: 1.
(C)成分の含有量は、(A)成分100質量部に対して0.1〜10質量部、好まし くは1〜5質量部、より好ましくは1〜3質量部である。含有量が0.1質量部以上であると十分な洗浄効果を付与でき、特に品種替え時の洗浄性が向上され、10質量部以下であると品種替え時の洗浄性が良好であると共に、押出機内や成形機内に残留して汚染することが抑制される。
The content of the component (C) is 0.1 to 10 parts by mass, preferably 1 to 5 parts by mass, more preferably 1 to 3 parts by mass with respect to 100 parts by mass of the component (A). When the content is 0.1 parts by mass or more, a sufficient cleaning effect can be imparted, and in particular, the washability at the time of product change is improved, and when it is 10 parts by mass or less, the washability at the time of product change is good, Residual contamination in the extruder or molding machine is suppressed.
(D)成分の有機燐化合物は、燐原子に結合するエステル性酸素原子を1つ以上有するものが好ましい。(D)成分は、焦げに対して高い溶解力を有しているため、特に異物除去性の発現に寄与する成分である。 The organic phosphorus compound as component (D) preferably has one or more ester oxygen atoms bonded to phosphorus atoms. Since the component (D) has a high dissolving power against scorching, it is a component that contributes to the expression of foreign matter removability.
(D)成分は、トリメチルホスフェート、トリエチルホスフェート、トリブチルホスフェート、トリ(2−エチルヘキシル)ホスフェート、トリブトキシエチルホスフェート、トリオレイルホスフェート、トリフェニルホスフェート、トリクレジルホスフェート、トリキシレニルホスフェート、トリス(イソプロピルフェニル)ホスフェート、トリス(o−フェニルフェニル)ホスフェート、トリス(p−フェニルフェニル)ホスフェート、トリナフチルホスフェート、クレジルジフェニルホスフェート、キシレニルジフェニルホスフェート、ジフェニル(2−エチルヘキシル)ホスフェート、ジ(イソプロピルフェニル)ホスフェート、o−フェニルフェニルジクレジルホスフェート、ジブチルホスフェート、モノブチルホスフェート、ジ(2−エチルヘキシル)ホスフェート、モノイソデシルホスフェート、2−アクリロイルオキシエチルアッシドホスフェート、2−メタクリロイルオキシエチルアッシドホスフェート、ジフェニル−2−アクリロイルオキシエチルホスフェート、ジフェニル−2−メタクリロイルオキシメチルホスフェート等から選ばれる1又は2以上を挙げることができ、これらの中でもトリフェニルホスフェートが好ましい。 Component (D) is trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri (2-ethylhexyl) phosphate, tributoxyethyl phosphate, trioleyl phosphate, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, tris (isopropylphenyl). ) Phosphate, tris (o-phenylphenyl) phosphate, tris (p-phenylphenyl) phosphate, trinaphthyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, diphenyl (2-ethylhexyl) phosphate, di (isopropylphenyl) phosphate , O-phenylphenyl dicresyl phosphate, dibutyl phosphate, monobutyl phosphate, di- 2-ethylhexyl) phosphate, monoisodecyl phosphate, 2-acryloyloxyethyl acid phosphate, 2-methacryloyloxyethyl acid phosphate, diphenyl-2-acryloyloxyethyl phosphate, diphenyl-2-methacryloyloxymethyl phosphate, etc. One or more may be mentioned, and among these, triphenyl phosphate is preferred.
また(D)成分は、トリフェニルホスファイト、トリスノニルフェニルホスファイト、トリストリデシルホスファイト、ジブチルハイドロジエンホスファイト等の亜燐酸エステル及びこれらの縮合物、トリフェニルホスフィンオキシド、トリクレジルホスフィンオキシド、メタンホスホン酸ジフェニル、フェニルホスホン酸ジエチル等から選ばれる1又は2以上を用いることもできる。 The component (D) is composed of phosphites such as triphenyl phosphite, trisnonylphenyl phosphite, tristridecyl phosphite, dibutyl hydrogen phosphite and their condensates, triphenyl phosphine oxide, tricresyl phosphine oxide. 1 or 2 or more selected from diphenyl methanephosphonate, diethyl phenylphosphonate and the like can also be used.
(D)成分の含有量は、(A)成分100質量部に対して0.1〜20質量部、好ましくは1〜10質量部、より好ましくは2〜5質量部である。含有量が0.1質量部以上であると十分な洗浄効果が付与でき、特に異物除去性が向上され、20質量部以下であると異物除去性が良好であると共に、押出機内や成形機内に残留して汚染することが抑制される。 (D) Content of a component is 0.1-20 mass parts with respect to 100 mass parts of (A) component, Preferably it is 1-10 mass parts, More preferably, it is 2-5 mass parts. When the content is 0.1 parts by mass or more, a sufficient cleaning effect can be imparted, and in particular, the foreign matter removal property is improved. When the content is 20 parts by mass or less, the foreign matter removal property is good, and in the extruder or molding machine. Residual contamination is suppressed.
本発明の組成物では、本発明の課題を解決する上で、(B)成分と(C)成分の含有量を関連づけることが好ましい。(B)成分と(C)成分の合計量中の含有割合は、(B)成分は55〜99質量%が好ましく、60〜90質量%がより好ましく、70〜80質量%が更に好ましく、(C)成分は1〜45質量%が好ましく、10〜40質量%がより好ましく、20〜30質量%が更に好ましい。 In the composition of this invention, when solving the subject of this invention, it is preferable to link | relate content of (B) component and (C) component. As for the content ratio in the total amount of (B) component and (C) component, 55-99 mass% is preferable, as for (B) component, 60-90 mass% is more preferable, 70-80 mass% is still more preferable, ( Component C) is preferably 1 to 45% by mass, more preferably 10 to 40% by mass, and still more preferably 20 to 30% by mass.
また、(A)成分100質量部に対する(B)及び(C)成分の合計含有量は、0.5〜20質量部が好ましく、1〜10質量部がより好ましく、2〜7質量部が更に好ましい。 Moreover, 0.5-20 mass parts is preferable, as for total content of (B) and (C) component with respect to 100 mass parts of (A) component, 1-10 mass parts is more preferable, and 2-7 mass parts is further. preferable.
本発明の組成物では、本発明の課題を解決する上で、(B)、(C)、(D)成分の含有量を関連づけることが好ましい。(B)、(C)、(D)成分の合計量中の含有割合は、次のとおりである。 In the composition of the present invention, it is preferable to relate the contents of the components (B), (C), and (D) in order to solve the problems of the present invention. The content ratios in the total amount of the components (B), (C), and (D) are as follows.
(B)成分は20〜90質量%が好ましく、20〜70質量%がより好ましく、30〜60質量%が更に好ましい。 (B) 20-90 mass% is preferable, 20-70 mass% is more preferable, 30-60 mass% is still more preferable.
(C)成分は5〜30質量%が好ましく、5〜20質量%がより好ましく、10〜20質量%が更に好ましい。 Component (C) is preferably 5 to 30% by mass, more preferably 5 to 20% by mass, and still more preferably 10 to 20% by mass.
(D)成分は5〜75質量%が好ましく、25〜70質量%がより好ましく、30〜60質量%が更に好ましい。 The component (D) is preferably 5 to 75% by mass, more preferably 25 to 70% by mass, and still more preferably 30 to 60% by mass.
また、(A)成分100質量部に対する(B)、(C)、(D)成分の合計含有量は、1〜20質量部が好ましく、1〜10質量部がより好ましく、5〜10質量部が更に好ましい。 Moreover, 1-20 mass parts is preferable, as for total content of (B), (C), (D) component with respect to 100 mass parts of (A) component, 1-10 mass parts is more preferable, and 5-10 mass parts. Is more preferable.
本発明の組成物には、本発明の課題を解決できる範囲内で他の成分を含有させることができ、特に(E)、(F)、(G)成分が好ましい。 The composition of the present invention can contain other components within a range that can solve the problems of the present invention, and the components (E), (F), and (G) are particularly preferable.
(E)成分である多価アルコールは、複数個のヒドロキシル基が結合している非環式及び環式化合物である。かかる(E)成分としては、ペンタエリスリトール、ジペンタエリスリトール、トリペンタエリスリトール、ペンチトール類(アドニトール、アラビトール等)、ヘキシトール類(ズルシトール、イノシトール等)、サッカリド類(アミロース、キシラン等)及びこれらの誘導体(N−メチルグルカミン等)等から選ばれる1又は2以上を挙げることができる。
The polyhydric alcohol as the component (E) is an acyclic or cyclic compound in which a plurality of hydroxyl groups are bonded. Examples of the component (E) include pentaerythritol, dipentaerythritol, tripentaerythritol, pentitols (such as adonitol and arabitol), hexitols (such as dulcitol and inositol), saccharides (such as amylose and xylan), and derivatives thereof. 1 or 2 or more selected from (N-methylglucamine etc.) etc. can be mentioned.
(E)成分の含有量は、(A)成分100質量部に対して0.5〜20質量部、好ましくは5〜10質量部である。含有量が0.5質量部以上であると十分な洗浄効果を付与でき、20質量部以下であると押出機内や成形機内に残留して汚染することが抑制される。 (E) Content of a component is 0.5-20 mass parts with respect to 100 mass parts of (A) component, Preferably it is 5-10 mass parts. If the content is 0.5 parts by mass or more, a sufficient cleaning effect can be imparted, and if it is 20 parts by mass or less, it is suppressed from remaining in the extruder or the molding machine and contaminating.
(F)成分である金属石鹸は、炭素数6〜22の脂肪酸と金属(Mg,Li,Zn,Ca,Al,Sn等)の塩である。 The metal soap as the component (F) is a salt of a fatty acid having 6 to 22 carbon atoms and a metal (Mg, Li, Zn, Ca, Al, Sn, etc.).
(F)成分としては、カプロン酸マグネシウム、カプロン酸リチウム、カプロン酸亜鉛、カプロン酸カルシウム、カプロン酸アルミニウム、カプロン酸錫、カプリル酸マグネシウム、カプリル酸リチウム、カプリル酸亜鉛、カプリル酸カルシウム、カプリル酸アルミニウム、カプリル酸錫、カプリン酸マグネシウム、カプリン酸リチウム、カプリン酸亜鉛、カプリン酸カルシウム、カプリン酸アルミニウム、カプリン酸錫、ラウリン酸マグネシウム、ラウリン酸リチウム、ラウリン酸亜鉛、ラウリン酸カルシウム、ラウリン酸アルミニウム、ラウリン酸錫、ミリスチン酸マグネシウム、ミリスチン酸リチウム、ミリスチン酸亜鉛、ミリスチン酸カルシウム、ミリスチン酸アルミニウム、ミリスチン酸錫、パルミチン酸マグネシウム、パルミチン酸リチウム、パルミチン酸亜鉛、パルミチン酸カルシウム、パルミチン酸アルミニウム、パルミチン酸錫、ステアリン酸マグネシウム、ステアリン酸リチウム、ステアリン酸亜鉛、ステアリン酸カルシウム、ステアリン酸アルミニウム、ステアリン酸錫、オレイン酸マグネシウム、オレイン酸リチウム、オレイン酸亜鉛、オレイン酸カルシウム、オレイン酸アルミニウム、オレイン酸錫、ベヘニン酸マグネシウム、ベヘニン酸リチウム、ベヘニン酸亜鉛、ベヘニン酸カルシウム、ベヘニン酸アルミニウム、ベヘニン酸錫等から選ばれる1又は2以上を挙げることができる。 As the component (F), magnesium caproate, lithium caproate, zinc caproate, calcium caproate, aluminum caproate, tin caproate, magnesium caprylate, lithium caprylate, zinc caprylate, calcium caprylate, aluminum caprylate , Tin caprylate, magnesium caprate, lithium caprate, zinc caprate, calcium caprate, aluminum caprate, tin caprate, magnesium laurate, lithium laurate, zinc laurate, calcium laurate, aluminum laurate, tin laurate , Magnesium myristate, lithium myristate, zinc myristate, calcium myristate, aluminum myristate, tin myristate, magnesium palmitate, palmitate Lithium acid, zinc palmitate, calcium palmitate, aluminum palmitate, tin palmitate, magnesium stearate, lithium stearate, zinc stearate, calcium stearate, aluminum stearate, tin stearate, magnesium oleate, lithium oleate, Name one or more selected from zinc oleate, calcium oleate, aluminum oleate, tin oleate, magnesium behenate, lithium behenate, zinc behenate, calcium behenate, aluminum behenate, tin behenate, etc. Can do.
(F)成分の含有量は、(A)成分100質量部に対して0.05〜5質量部、好ましくは0.5〜5質量部である。含有量が0.05質量部以上であると十分な洗浄効果を付与でき、5質量部以下であると200℃以上の高温雰囲気においても低融点の金属塩(リチウム、錫)が融け出し、押出機内や成形機内に残留して汚染することが抑制される。 (F) Content of a component is 0.05-5 mass parts with respect to 100 mass parts of (A) component, Preferably it is 0.5-5 mass parts. When the content is 0.05 parts by mass or more, a sufficient cleaning effect can be imparted, and when it is 5 parts by mass or less, a metal salt (lithium, tin) having a low melting point melts even in a high temperature atmosphere of 200 ° C. or more, and extrusion. Residual contamination in the machine or molding machine is suppressed.
(G)成分であるガラス繊維としては、繊維径が5〜16μm、繊維長が0.5〜12mmのものが好ましい。また、洗浄効果が高く、しかも成形機内部への残留が抑制されるため、表面をシランカップリング剤により処理され、かつアクリル樹脂系の集束剤等により集束処理されたものがさらに好ましい。このときの集束処理の程度は特に限定されないが、付着した有機物量(即ち、集束剤の使用量に等しい。付着した有機物量は、ガラス繊維束と集束剤の合計量中の有機物量を意味する)が0.3〜1.5質量%であることが好ましい。 (G) As a glass fiber which is a component, a thing with a fiber diameter of 5-16 micrometers and a fiber length of 0.5-12 mm is preferable. Further, since the cleaning effect is high and the residual in the molding machine is suppressed, it is more preferable that the surface is treated with a silane coupling agent and the sizing agent is treated with an acrylic resin sizing agent or the like. The degree of the bundling treatment at this time is not particularly limited, but the amount of attached organic matter (that is, equal to the amount of sizing agent used. The amount of attached organic matter means the amount of organic matter in the total amount of the glass fiber bundle and the sizing agent. ) Is preferably 0.3 to 1.5 mass%.
(G)成分の含有量は、(A)成分100質量部に対して5〜30質量部、好ましくは10〜30質量部である。含有量が5質量部以上であると洗浄効果を向上させることができ、30質量部以下であると成形機内に残留したり、成形機が摩耗されることが抑制される。 (G) Content of a component is 5-30 mass parts with respect to 100 mass parts of (A) component, Preferably it is 10-30 mass parts. When the content is 5 parts by mass or more, the cleaning effect can be improved, and when the content is 30 parts by mass or less, it is suppressed that the resin remains in the molding machine or the molding machine is worn.
本発明の組成物は、上記各成分を、ヘンシェルミキサー、タンブラーブレンダー、ニーダー等の混合機で予備混合した後、押出機で混練したり、加熱ロール、バンバリーミキサーで溶融混練することによって製造する。 The composition of the present invention is produced by premixing the above components with a mixer such as a Henschel mixer, a tumbler blender, or a kneader, and then kneading with an extruder, or melt-kneading with a heating roll or a Banbury mixer.
本発明の組成物は、ノズル径(d1)とストランド径(d2)の比率(d2/d1)であるスウェル比が1.2以上のものであり、好ましくは1.3以上、より好ましくは1.4以上のものである。 The composition of the present invention has a swell ratio of 1.2 or more, preferably 1.3 or more, which is a ratio (d 2 / d 1 ) of the nozzle diameter (d 1 ) and the strand diameter (d 2 ). More preferably, it is 1.4 or more.
スウェル比は、図1で示すようなノズル径(d1)とストランド径(d2)との関係から導かれるもので、スウェル比が大きいほど、洗浄時において、組成物が加工成形機のシリンダー内壁を押圧する力(その反力として、シリンダー内のスクリューを押圧する力)、即ち弾性が大きいことを意味する。スウェル比が大きいほど(弾性が大きいほど)、シリンダー内壁やスクリューを強く押圧することになるため、汚れの除去性能が高められる。 The swell ratio is derived from the relationship between the nozzle diameter (d 1 ) and the strand diameter (d 2 ) as shown in FIG. 1, and the larger the swell ratio, the more the composition becomes the cylinder of the processing machine during cleaning. It means that the force that presses the inner wall (the force that presses the screw in the cylinder as the reaction force), that is, the elasticity is large. The greater the swell ratio (the greater the elasticity), the stronger the inner wall of the cylinder and the screw are pressed, so the dirt removal performance is enhanced.
なお、スウェル比は、汚れの除去性能に繋がるものであるため、下限値が重要であり、下限値以上であれば成形加工機の洗浄性能が優れていることを示すものであるため、上限値を決定する必要はない。上限値は、組成物の具体的内容により自ずから決定されるものである。 In addition, since the swell ratio leads to the removal performance of dirt, the lower limit value is important, and if it is equal to or higher than the lower limit value, it indicates that the cleaning performance of the molding machine is excellent, the upper limit value. There is no need to decide. The upper limit value is naturally determined by the specific content of the composition.
本発明の組成物は、以下の作用機構により、要件(i)及び(ii)が満たされるものと考えられる。 The composition of the present invention is considered to satisfy the requirements (i) and (ii) by the following mechanism of action.
(A)成分は、組成物の粘性を高めることで、主として要件(i)の品種替え時における洗浄性を発現させる成分であり、(B)成分は、界面活性剤として作用し、(i)の品種替え時における洗浄性及び(ii)の組成物の自己排出性を発現させる成分である。しかし、(B)成分を加えることで、組成物がシリンダー内壁を押す力(ここではスウェル比で評価)が低下し、洗浄能力が低下するため、(A)及び(B)成分のみでは、要件(i)及び(ii)を満たすことはできない。
(A) component is a component which mainly exhibits the washing | cleaning property at the time of varieties change of requirement (i) by raising the viscosity of a composition, (B) component acts as surfactant, (i) It is a component that expresses detergency at the time of cultivar change and self-discharge of the composition of (ii). However, the addition of component (B) reduces the force with which the composition pushes the inner wall of the cylinder (evaluated by the swell ratio here) and reduces the cleaning ability. Therefore, only the components (A) and (B) are required. (I) and (ii) cannot be satisfied.
そこで本発明のとおり、(A)及び(B)成分の組み合わせに、更に(C)成分を含有させた場合、使用時において(組成物は溶融状態である)、(B)成分のアルカンスルホン酸又はその塩と、(C)成分のアルキレングリコール脂肪酸エステルとの組み合わせにより生じる作用により、組成物がシリンダー内壁を押す力(ここではスウェル比で評価)が向上する。 Therefore, as described in the present invention, when the component (C) is further contained in the combination of the components (A) and (B), when used (the composition is in a molten state), the alkanesulfonic acid of the component (B) Or the force which a composition presses a cylinder inner wall (here evaluated by a swell ratio) improves by the effect | action which arises by the combination with the salt and the alkylene glycol fatty acid ester of (C) component.
このような変化が生じる結果、組成物は洗浄剤の持つべき要素として重要な界面活性力と力学的性質(ここでは組成物がシリンダー内壁を押す力)を両立することができ、即ち、所定範囲のスウェル比を満たす状態になるため、要件(i)及び(ii)が満たされる。 As a result of such a change, the composition can achieve both the surface active force and the mechanical properties (here, the force by which the composition pushes the inner wall of the cylinder) that are important factors for the cleaning agent. Therefore, requirements (i) and (ii) are satisfied.
そして、(A)〜(C)成分に加えて、更に(D)成分を含有させることにより、要件(i)及び(ii)と共に、要件(iii)も満たされる。 Then, in addition to the components (A) to (C), the component (D) is further contained, whereby the requirement (iii) is satisfied together with the requirements (i) and (ii).
以下、実施例、比較例を示し、本発明を更に詳細に説明するが、本発明の範囲がこれらの実施例に限定されるものではない。なお、実施例及び比較例で使用した各成分の詳細は下記の通りである。 EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated further in detail, the scope of the present invention is not limited to these Examples. In addition, the detail of each component used by the Example and the comparative example is as follows.
(A)成分
AS樹脂:ダイセル化学工業(株)製「セビアン−N020」
(B)成分
アルカンスルホン酸ナトリウム:商品名 Hostapur SAS93、クラリアント社製
α−オレフィンスルホン酸ナトリウム 商品名 ルポラン PB-800 ライオン社製
(C)成分
アルキレングリコール脂肪酸エステル:プロピレングリコールモノベヘネート,商品名リケマール PB-100,理研ビタミン(株)製
(D)成分
有機燐化合物:トリフェニルホスフェート(大八化学工業(株))
実施例1〜3、比較例1〜4
表1に示す組成の各成分をタンブラーブレンダーで混合後、押出機にて溶融混練し、ペレット形状の洗浄用樹脂組成物を得た。これらの成分を使用し、下記の方法で洗浄試験を行った。なお、スウェル比は、樹脂加工温度である240℃の測定値である。
(A) Component AS resin: “Cebian-N020” manufactured by Daicel Chemical Industries, Ltd.
(B) Component Sodium alkane sulfonate: Trade name Hostapur SAS93, manufactured by Clariant Co., Ltd. Sodium α-olefin sulfonate Product name Luporan PB-800 Made by Lion Corporation (C) Component Alkylene glycol fatty acid ester: Propylene glycol monobehenate, trade name Riquemar PB-100, manufactured by Riken Vitamin Co., Ltd. (D) Component Organic phosphorus compound: Triphenyl phosphate (Daihachi Chemical Industry Co., Ltd.)
Examples 1-3, Comparative Examples 1-4
After mixing each component of the composition shown in Table 1 with a tumbler blender, it was melt-kneaded with an extruder to obtain a pellet-shaped cleaning resin composition. Using these components, a washing test was conducted by the following method. The swell ratio is a measured value at 240 ° C., which is the resin processing temperature.
[洗浄性評価A]
射出成形機(三菱重工業製「三菱射出成形機265/100MSII」(シリンダー温度250℃)に、先行使用樹脂としてカーボンファイバー入りPA/ABS(ダイセル化学工業(株)製“ノバロイAC5704”)の黒着色品(カーボンブラック濃度1%)を1kg流した。その後、表1の組成の洗浄用樹脂組成物を流して黒色が消えるまでの洗浄用樹脂組成物の使用量による評価を行い、続いて後続使用樹脂としてAS樹脂(ダイセル化学工業(株)製「セピアン−N080」)を流して射出成形し、成形品に洗浄用樹脂組成物の残留物が消えて良品が得られるまでのAS樹脂の使用量による評価を行った。
[Detergency evaluation A]
Black coloring of injection molding machine (Mitsubishi Heavy Industries'"Mitsubishi Injection Molding Machine 265 / 100MSII" (cylinder temperature 250 ° C) with PA / ABS with carbon fiber as a pre-used resin ("Novaloy AC5704" manufactured by Daicel Chemical Industries, Ltd.) The product (carbon black concentration 1%) was flowed 1 kg, and then the cleaning resin composition having the composition shown in Table 1 was flowed to evaluate the amount of the cleaning resin composition used until the black color disappeared. AS resin ("Sepian-N080" manufactured by Daicel Chemical Industries, Ltd.) is used as the resin for injection molding, and the amount of AS resin used until the residue of the cleaning resin composition disappears in the molded product and a good product is obtained. Was evaluated.
[洗浄性評価B]
射出成形機(三菱重工業製「三菱射出成形機265/100MSII」(シリンダー温度250℃)に、先行使用樹脂としてハロゲン系難燃ABS樹脂(ダイセル化学工業(株)製「SER20」)を1kg投入し、500g流したところで、30分間滞留させた。残りの先行使用樹脂500gを排出した後、表1の洗浄用樹脂組成物を流して茶色乃至は黒色の焼け筋が消えるまでの洗浄用樹脂組成物の使用量による評価を行った。
[Detergency evaluation B]
1 kg of halogen-based flame retardant ABS resin ("SER20" manufactured by Daicel Chemical Industries, Ltd.) is used as an advanced resin in an injection molding machine (Mitsubishi Heavy Industries "Mitsubishi Injection Molding Machine 265 / 100MSII" (cylinder temperature 250 ° C)). When the remaining 500 g of the resin used was discharged, the cleaning resin composition until the brown or black burnt lines disappeared after the cleaning resin composition shown in Table 1 was discharged. The amount of use was evaluated.
[滑り性の評価]
射出成形機(三菱重工業製「三菱射出成形機265/100MSII」(シリンダー温度250℃)に表1の洗浄用樹脂組成物をホッパーから投入し、スクリュー位置が0〜100mmまで計量される時間による評価を行った。
[Evaluation of slipperiness]
The resin composition for cleaning shown in Table 1 is put into an injection molding machine (Mitsubishi Heavy Industries “Mitsubishi Injection Molding Machine 265 / 100MSII” (cylinder temperature 250 ° C.) from the hopper, and the evaluation is based on the time when the screw position is measured from 0 to 100 mm. Went.
Claims (3)
(B)下記一般式(1)で表されるアルカンスルホン酸又はその塩0.1〜20質量部、
(C)アルキレングリコール脂肪酸エステル0.2〜10質量部、及び
(D)有機燐化合物0.1〜20質量部
を含有する洗浄剤組成物であり、
(B)成分、(C)成分及び(D)成分の合計量中の含有割合が、(B)成分が20〜90質量%、(C)成分が5〜30質量%、及び(D)成分が5〜75質量%であり、(A)成分100質量部に対する(B)、(C)及び(D)成分の合計含有量が1〜20質量部であり、
スウェル比が1.2以上である洗浄用樹脂組成物。
(B) 0.1-20 parts by mass of an alkanesulfonic acid represented by the following general formula (1) or a salt thereof,
(C) an alkylene glycol fatty acid ester, 0.2 to 10 parts by mass, and (D) a cleaning composition containing 0.1 to 20 parts by mass of an organic phosphorus compound,
(B) component, (C) component, and the content rate in the total amount of (D) component are (B) component 20-90 mass%, (C) component 5-30 mass%, and (D) component. Is 5 to 75% by mass, and the total content of (B), (C) and (D) components with respect to 100 parts by mass of component (A) is 1 to 20 parts by mass,
A cleaning resin composition having a swell ratio of 1.2 or more.
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JP2007077183A (en) * | 2005-09-12 | 2007-03-29 | Daicel Polymer Ltd | Cleaning agent resin composition for molding machine |
TWI408163B (en) | 2007-10-23 | 2013-09-11 | Ind Tech Res Inst | Nano-clay composite and composition for fabricating the same |
JP2009143167A (en) * | 2007-12-17 | 2009-07-02 | Daicel Polymer Ltd | Manufacturing method of resin composition for washing |
JP6112758B2 (en) * | 2010-07-08 | 2017-04-12 | 日本合成化学工業株式会社 | Purging agent and purging method using the same |
JP5552036B2 (en) * | 2010-12-07 | 2014-07-16 | ダイセルポリマー株式会社 | Thermoplastic resin composition for washing molding machine |
JP7187726B1 (en) | 2022-06-06 | 2022-12-12 | 旭化成株式会社 | Detergent for resin processing machine, method for producing the same, and method for cleaning inside of resin processing machine |
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