JP4375007B2 - Excimer light irradiation equipment - Google Patents

Excimer light irradiation equipment Download PDF

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JP4375007B2
JP4375007B2 JP2003412667A JP2003412667A JP4375007B2 JP 4375007 B2 JP4375007 B2 JP 4375007B2 JP 2003412667 A JP2003412667 A JP 2003412667A JP 2003412667 A JP2003412667 A JP 2003412667A JP 4375007 B2 JP4375007 B2 JP 4375007B2
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heater
arrangement pattern
window portion
excimer
light irradiation
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JP2005169247A (en
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宣是 菱沼
史敏 竹元
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Ushio Denki KK
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Description

本発明は、エキシマ光照射装置に関し、更に詳しくはエキシマ光を透過する窓部が設けられ、該窓部を加熱するヒーター機構を具備したエキシマ光照射装置に関する。   The present invention relates to an excimer light irradiation apparatus, and more particularly to an excimer light irradiation apparatus provided with a heater mechanism that is provided with a window portion that transmits excimer light and heats the window portion.

近年の半導体や液晶の製造工程において、エキシマ光を利用した洗浄や光処理が多く利用されるようになってきた。該エキシマ光の光源としては、例えば電極間に誘電体と放電ガスとを配置し該電極間に高周波高電圧を印加するエキシマランプが広く利用されており、特に大面積をエキシマ光で処理する場合には該エキシマランプを配置したエキシマ光照射装置が有用である。通常、該エキシマ光照射装置では該エキシマランプを配置したランプハウスとエキシマ光を照射して処理する被照射物との間に光透過性の窓を設けている。   In recent semiconductor and liquid crystal manufacturing processes, excimer light-based cleaning and light processing have been frequently used. As a light source for the excimer light, for example, an excimer lamp in which a dielectric and a discharge gas are arranged between electrodes and a high frequency high voltage is applied between the electrodes is widely used. Particularly, a large area is processed with excimer light. An excimer light irradiation device in which the excimer lamp is disposed is useful. Usually, in the excimer light irradiation apparatus, a light transmissive window is provided between a lamp house in which the excimer lamp is disposed and an object to be processed by irradiation with excimer light.

ところが、該エキシマ光照射装置の窓部の温度が低いと例えば液晶等の光洗浄工程において該被照射物側に浮遊する物質が該窓部に付着してエキシマ光の透過特性を低下させるといった問題があり、該窓部にはヒーター等の加熱手段を設ける必要があった。   However, when the temperature of the window portion of the excimer light irradiation device is low, for example, a substance floating on the irradiated object side adheres to the window portion in a light cleaning process such as liquid crystal, and the transmission property of excimer light is deteriorated. It was necessary to provide heating means such as a heater in the window.

該ヒーター等の加熱手段を設けたものとしては、例えば特開平11−295500号公報がある。該公報には、エキシマ光照射装置である紫外線照射装置の光源にエキシマランプである誘電体バリア放電ランプを配置し、窓部に膜厚ヒーターや線状ヒーターを配置した照射装置が開示されている。   For example, Japanese Patent Application Laid-Open No. 11-295500 discloses a device provided with heating means such as the heater. This publication discloses an irradiation apparatus in which a dielectric barrier discharge lamp, which is an excimer lamp, is disposed as a light source of an ultraviolet irradiation apparatus, which is an excimer light irradiation apparatus, and a film thickness heater or a linear heater is disposed in a window portion. .

従来のエキシマ光照射装置の概略図を図5に示す。該エキシマ光照射装置101はランプハウス102内にエキシマランプ103を配置しており、該エキシマランプ103の背面には反射板104が設けられ、該エキシマランプ103の前面には窓部105が設けられている。該窓部105には該窓部105を加熱する加熱手段としてヒーター106が設けられている。該窓部105を介して放射されたエキシマ光は被照射物107に照射される。また、該被照射物107は被照射物固定台108上に置かれ照射処理される。該被照射物107にエキシマ光を照射するときに該被照射物107から飛散する有機物質や処理空間に浮遊する有機金属等が光と反応することにより生成される反応生成物として該窓面105に付着する。このような不具合に対して、該ヒーター106により該窓部105を加熱することで抑制している。
特開平11−295500号
A schematic diagram of a conventional excimer light irradiation apparatus is shown in FIG. The excimer light irradiation apparatus 101 includes an excimer lamp 103 disposed in a lamp house 102, a reflector 104 is provided on the back surface of the excimer lamp 103, and a window portion 105 is provided on the front surface of the excimer lamp 103. ing. The window portion 105 is provided with a heater 106 as a heating means for heating the window portion 105. Excimer light emitted through the window 105 is irradiated to the irradiation object 107. The irradiated object 107 is placed on the irradiated object fixing base 108 and irradiated. When the object 107 is irradiated with excimer light, the window surface 105 is a reaction product generated by the reaction between the organic material scattered from the object 107 or the organic metal floating in the processing space. Adhere to. Such a problem is suppressed by heating the window portion 105 by the heater 106.
JP-A-11-295500

従来のエキシマ光照射装置では、光照射時に、有機物等が付着することにより窓面の透過率が低下するといった問題があった。該問題を解決するために該窓面にヒータを設けることがされているが、真空紫外光を被照射物に照射する場合では該窓面から該被照射物までの距離が非常に短いため、該ヒーターを設けることにより逆に該ヒータが影になって該被照射物の均一な処理が成されないといった問題があった。   The conventional excimer light irradiation apparatus has a problem in that the transmittance of the window surface is reduced due to adhesion of organic substances or the like during light irradiation. In order to solve the problem, a heater is provided on the window surface, but in the case of irradiating the irradiated object with vacuum ultraviolet light, the distance from the window surface to the irradiated object is very short. By providing the heater, there is a problem in that the heater is shaded and uniform treatment of the irradiated object is not performed.

そこで、該エキシマ光照射装置の窓面に有機物等が付着することによる透過率の低下を解消するために該窓部にヒーターを設けた該エキシマ光照射装置において、該窓部の温度を均一化させると共に、該被照射物へ照射される光量のバラツキを低減させたエキシマ光照射装置を提供することを目的とする。   Therefore, in the excimer light irradiation apparatus in which a heater is provided in the window portion in order to eliminate a decrease in transmittance due to adhesion of organic substances or the like to the window surface of the excimer light irradiation device, the temperature of the window portion is made uniform. It is another object of the present invention to provide an excimer light irradiation device in which variation in the amount of light irradiated to the irradiated object is reduced.

本発明のエキシマ光照射装置は、エキシマランプと被照射物との間にエキシマ光を透過する窓部を持ち、該窓部を加熱するヒーターが該窓部上に設けられたエキシマ光照射装置において、該被照射物を搬送しながら光照射処理を行う搬送手段が設けられ、且つ該窓部の光透過部に設けられた該ヒーターの配置パターンが、該被照射物の搬送方向に略直交する方向、または該被照射物の搬送方向に略斜め方向に形成されており、該被照射物搬送方向をA、これに直交する方向をBとした時に、該窓部の光透過部の幅内のB方向での各位置における、該ヒーターの配置パターンのA方向の長さの総和をSとすると、該総和Sの最大値Smaxを、該総和Sの平均値Saveの1.1倍以内としたことを特徴とする。

The excimer light irradiation apparatus of the present invention is an excimer light irradiation apparatus having a window portion that transmits excimer light between an excimer lamp and an object to be irradiated, and a heater for heating the window portion provided on the window portion. A transport means for performing light irradiation processing while transporting the irradiated object is provided, and an arrangement pattern of the heater provided in the light transmitting portion of the window portion is substantially orthogonal to the transport direction of the irradiated object. Direction or the direction of conveyance of the irradiated object, and the width of the light transmission part of the window when the irradiation direction of the irradiated object is A and the direction orthogonal thereto is B. When the sum of the lengths in the A direction of the heater arrangement pattern at each position in the B direction is S, the maximum value Smax of the sum S is within 1.1 times the average value Save of the sum S. It is characterized by that.

本発明のエキシマ光照射装置によれば、該被照射物を搬送しながら光照射処理を行う搬送手段が設けられ、且つヒータの配置パターンが該搬送方向Aに直行する方向であるB方向のどの場所においても該配置パターンが一定のバラツキの範囲内で構成されているので、被照射物への光照射処理が安定して行える。   According to the excimer light irradiation apparatus of the present invention, there is provided a transport means for performing the light irradiation process while transporting the irradiation object, and the heater arrangement pattern in which direction B is the direction perpendicular to the transport direction A. Even in the place, the arrangement pattern is configured within a certain range of variation, so that the light irradiation process to the irradiated object can be stably performed.

該ヒーターにおいて、該配置パターンのA方向の長さの総和Sが変化した場合の影響をガラスに対する水の接触角を測定することで確認した。具体的には、該ヒータの配置パターンをB方向中央部において、該配置パターンのA方向の長さの総和Sが幅20mmになるように該ヒータを作製し、更に、該B方向において該中央部より段階的に配置パターンが細くなる側と段階的に太くなる側を作製した。該ヒータを配置したエキシマ光照射装置を用いて、予め精密洗浄を行ったガラス基板を24時間室内(大気中)で放置したサンプルにオゾン雰囲気中で172nmのエキシマ光を照射した。その後、該サンプルのB方向の各位置で水に対する接触角を測定した。尚、エキシマ光照射装置の窓部からガラスサンプルまでの距離は5.1mmとした。更に、同じ配置パターンで該窓部から該サンプルまでの距離を2.3mmとして照射した場合も同じように接触角の測定を行った。   In the heater, the effect when the total length S in the A direction of the arrangement pattern changed was confirmed by measuring the contact angle of water with respect to the glass. Specifically, the heater is manufactured such that the sum S of the lengths in the A direction of the arrangement pattern is 20 mm in width at the central portion in the B direction, and the center in the B direction. The side where the arrangement pattern becomes thinner than the part and the side where it becomes thicker are produced. Using an excimer light irradiation apparatus provided with the heater, a sample, which had been precision-cleaned in advance, was left in a room (in the atmosphere) for 24 hours, and irradiated with excimer light of 172 nm in an ozone atmosphere. Then, the contact angle with respect to water was measured at each position in the B direction of the sample. In addition, the distance from the window part of an excimer light irradiation apparatus to a glass sample was 5.1 mm. Further, the contact angle was measured in the same manner when irradiation was performed with the same arrangement pattern at a distance from the window portion to the sample of 2.3 mm.

図4には、該配置パターンのA方向の長さの総和Sが幅20mmの部分を基準に細くなる側に5%刻み、太くなる側に5%刻みで変化させた各々の部分の、水の接触角と、該基準の幅における水の接触角に対する偏差(%)を示したものである。また、照射距離については5.1mmの場合と2.3mmの場合の両方について測定した。5.1mm、2.3mmのどちらの照射距離においても、該ヒーターの幅を基準幅より+10%まで増加させた場合の該基準幅の接触角に対する偏差は10%以内であって、ランプ個々の照度バラツキと識別できない程度である。しかし、該ヒーターの幅を基準幅より+15%以上増加させた場合では、該接触角が大きく変化しており、十分な洗浄ができていないことを示している。また、該ヒーターの幅を基準幅より−10%まで減少させた場合の該基準幅の接触角に対する偏差は、該ヒーターの幅を増加させた場合と同様に10%以内である。   In FIG. 4, the total sum S of the lengths in the A direction of the arrangement pattern is increased by 5% on the thinning side with respect to the portion having a width of 20 mm, and the water of each portion changed in 5% increments on the thickening side. And the deviation (%) with respect to the contact angle of water in the reference width. Further, the irradiation distance was measured for both 5.1 mm and 2.3 mm. At both irradiation distances of 5.1 mm and 2.3 mm, the deviation of the reference width with respect to the contact angle when the width of the heater is increased to + 10% from the reference width is within 10%. It cannot be distinguished from illuminance variation. However, when the width of the heater is increased by + 15% or more from the reference width, the contact angle changes greatly, indicating that sufficient cleaning has not been achieved. Further, the deviation of the reference width with respect to the contact angle when the width of the heater is decreased to −10% from the reference width is within 10% as in the case of increasing the width of the heater.

ところで、ガラスの洗浄等のような不純物を除去する処理においては、単純に接触角が小さくなれば良いこととなるが、露光処理等のように一定の光量を照射することにより処理が行われる場合では、照射される光量の基準値からのズレ、つまり偏差が小さいことが求められる。また、洗浄処理においても、LCD基板の処理等では、該洗浄前に既に基板上にTFT素子が形成されている場合があり、光を長く照射しすぎると逆に該TFT素子自身がダメージを受ける等の問題があるため、出来るだけ均一な照射により、光が照射されすぎる部分を少なくしたい。つまり、該基準幅での接触角に対する偏差を小さくすることが望ましく、このような点からも、該ヒーターの幅は基準幅に対して増加する側に10%以内、減少する側に10%以内で構成することにより安定した照射処理が行える、と言える。言い換えると、該被照射物への該ヒーターの該配置パターンのA方向の長さの総和Sが、前記B方向である該被照射物の搬送される幅内において、該総和Sの最大値Smaxが該総和Sの平均値Saveの1.1倍以内であれば安定した処理が可能となる。更に好ましくは、該ヒーターの該配置パターンのA方向の長さの総和Sが±5%以内であれば、被照射物への光照射処理時の該配置パターンのA方向の長さのばらつきによる影響をほぼ無くすことができる。   By the way, in the process of removing impurities such as glass cleaning, it is sufficient that the contact angle is simply reduced. However, when the process is performed by irradiating a certain amount of light as in the exposure process or the like. Then, it is required that the deviation of the amount of light to be irradiated from the reference value, that is, the deviation is small. Also in the cleaning process, the TFT element may already be formed on the substrate before the cleaning, and the TFT element itself is damaged if the light is irradiated for too long. For this reason, it is desirable to reduce the portion that is irradiated with light as uniformly as possible. That is, it is desirable to reduce the deviation with respect to the contact angle at the reference width. From this point of view as well, the heater width is within 10% on the increasing side with respect to the reference width and within 10% on the decreasing side. It can be said that stable irradiation processing can be performed by comprising. In other words, the sum S of the lengths in the A direction of the arrangement pattern of the heaters on the irradiated object is within the width of the irradiated object in the B direction and is the maximum value Smax of the total S. Is within 1.1 times the average value Save of the sum S, stable processing is possible. More preferably, when the total length S in the A direction of the arrangement pattern of the heater is within ± 5%, due to variations in the length of the arrangement pattern in the A direction during the light irradiation process on the irradiated object. The effect can be almost eliminated.

本発明のエキシマ光照射装置は光透過性の窓部が設けられ、該窓部にヒータを配置したものにおいて、被照射物の該ヒータによる影の影響を低減させるために、被照射物を搬送しながら光照射処理を行う搬送手段を設け、且つ該ヒータの配置パターンを精密に作製したものである。また、該配置パターンのA方向の長さの総和Sの最大値Smaxが、該総和Sの平均値Saveの1.1倍以内であれば均一な光照射処理が可能なことを示したものである。以下の実施例に具体的な構成を述べる。   The excimer light irradiation apparatus of the present invention is provided with a light transmissive window portion, and in the case where a heater is disposed in the window portion, the irradiation object is conveyed in order to reduce the influence of the shadow of the irradiation object by the heater. However, a conveying means for performing a light irradiation process is provided, and the arrangement pattern of the heater is precisely manufactured. Also, it is shown that uniform light irradiation processing is possible if the maximum value Smax of the total sum S of the lengths in the A direction of the arrangement pattern is within 1.1 times the average value Save of the total S. is there. A specific configuration will be described in the following examples.

本発明のエキシマ光照射装置の全体構成を示す断面図を図1−a)に示す。本発明のエキシマ光照射装置1は、ランプハウス2内にエキシマランプ3を配置しており、該エキシマランプ3の背面には反射板4が設けられ、該エキシマランプ3の前面には窓部5が設けられている。該窓部5には、該窓部5を加熱する加熱手段としてヒーター6が設けられている。該窓部5を介して放射されたエキシマ光は被照射物7に照射される。また、該被照射物7は搬送手段8上に置かれ、例えばコロ9等によって搬送可能になっている。該被照射物7にエキシマ光を照射するときに該被照射物7から飛散する有機物質や処理空間に浮遊する有機金属が光と反応して生成される反応生成物として該窓面5に付着するのを該ヒーター6により該窓部5を加熱することで抑制している。   A cross-sectional view showing the overall configuration of the excimer light irradiation apparatus of the present invention is shown in FIG. In the excimer light irradiation device 1 of the present invention, an excimer lamp 3 is disposed in a lamp house 2, a reflector 4 is provided on the back surface of the excimer lamp 3, and a window portion 5 is provided on the front surface of the excimer lamp 3. Is provided. The window portion 5 is provided with a heater 6 as a heating means for heating the window portion 5. Excimer light emitted through the window portion 5 is irradiated to the irradiated object 7. Further, the irradiated object 7 is placed on a conveying means 8 and can be conveyed by, for example, a roller 9 or the like. When the object 7 is irradiated with excimer light, an organic substance scattered from the object 7 or an organic metal floating in the processing space adheres to the window surface 5 as a reaction product generated by reaction with light. This is suppressed by heating the window portion 5 with the heater 6.

また、該窓部5に設けられたヒーター6の配置パターン10を図1−b)に示す。該窓部5上に配置パターン10が形成されており、該配置パターン10の両端には給電部11が設けられている。また、該窓部の周辺はランプハウス2で保持されている部分12(斜線部)が有り、該保持されている部分12の内側が光透過部13となっている。また、該被照射物7の搬送方向Aに対して該配置パターン10が略直交する方向Bに配置されている。尚、図中には搬送方向であるA方向を矢印Aとして、また、該搬送方向Aに直交する方向であるB方向を矢印Bとして表している。   Moreover, the arrangement pattern 10 of the heater 6 provided in this window part 5 is shown to FIG. An arrangement pattern 10 is formed on the window portion 5, and power supply portions 11 are provided at both ends of the arrangement pattern 10. Further, there is a portion 12 (shaded portion) held by the lamp house 2 around the window portion, and a light transmitting portion 13 is inside the held portion 12. Further, the arrangement pattern 10 is arranged in a direction B substantially orthogonal to the conveyance direction A of the irradiated object 7. In the figure, the A direction which is the transport direction is indicated by an arrow A, and the B direction which is a direction orthogonal to the transport direction A is indicated by an arrow B.

ここで、該方向Bの各位置として例えば仮想線C、D、Eを用いて説明する。該仮想線Cと該ヒーター6の配置パターン10との交点を図の左側からそれぞれo、p、q、r、s、t、u、v、w、x、y、zとする。該仮想線Cと該ヒータ6の配置パターン10との交わる線分o−p、q−r、s−t、u−v、w−x、y−zの全てを加算する。これを搬送方向Aを横切る該配置パターン10の長さの総和をc1とする。これと同様に他の仮想線D、Eについても搬送方向Aを横切る該配置パターン10の長さの総和d1、e1を計算する。この総和c1、d1、e1の各値の平均値Saveに対して該総和c1、d1、e1の各値の最大値Smaxが該平均値Saveの1.1倍以内となるように該ヒーター6の配置パターン10を形成している。これにより、被照射物へ均一性の高い光照射が可能となり、且つ該窓部5へ被照射物側から飛散する有機物や処理空間に浮遊する有機金属等が光と反応して生成される反応生成物の付着を抑制できる。   Here, for example, virtual lines C, D, and E will be described as the positions in the direction B. The intersections of the imaginary line C and the arrangement pattern 10 of the heater 6 are defined as o, p, q, r, s, t, u, v, w, x, y, and z, respectively, from the left side of the figure. All of the line segments op, qr, st, uv, wx, and yz that intersect the virtual line C and the arrangement pattern 10 of the heater 6 are added. The total sum of the lengths of the arrangement pattern 10 across the conveyance direction A is defined as c1. Similarly, for the other virtual lines D and E, the total lengths d1 and e1 of the arrangement pattern 10 crossing the transport direction A are calculated. The heater 6 is configured such that the maximum value Smax of each value of the sums c1, d1, e1 is within 1.1 times the average value Save with respect to the average value Save of the values of the sums c1, d1, e1. An arrangement pattern 10 is formed. As a result, the irradiated object can be irradiated with highly uniform light, and an organic substance that is scattered from the irradiated object side to the window 5 or an organic metal that floats in the processing space reacts with the light and is generated. Product adhesion can be suppressed.

該配置パターン10を該窓部5の面上に形成する場合、エキシマランプ3を配置している面側であるランプハウス2内に形成するのが好ましい。これにより、被照射物側から飛散する有機物や処理空間に浮遊する有機金属等が光と反応して生成される反応生成物により該配置パターン10が汚染されたり酸化等による該配置パターン10のやせ細り等を抑制できる。   When the arrangement pattern 10 is formed on the surface of the window portion 5, it is preferably formed in the lamp house 2 which is the surface side on which the excimer lamp 3 is arranged. Thereby, the arrangement pattern 10 is contaminated by the reaction product produced by the reaction of the organic matter scattered from the irradiated object side or the organic metal floating in the processing space with the light, or the arrangement pattern 10 is thinned by oxidation or the like. Etc. can be suppressed.

本実施例に示す前記窓部5としては、エキシマランプ3から放射される波長172nmの真空紫外光を透過する合成石英ガラスからなり、例えば被照射物7の搬送方向Aの長さは30cm、該搬送方向に直交する方向Bの幅は100cm、厚みが0.6cmの窓材を使用している。また、該窓部5に設けられたヒーター6は導電性発熱材として金ペーストを用い該窓面にスクリーン印刷され、該スクリーン印刷後例えば600℃、60分間焼成し作製されている。該ヒーター6の配置パターン10としては図1−b)に示したように該被照射物7の搬送方向Aに対して略直交する方向Bに配置されており、該B方向に長い管状のエキシマランプ3のランプ管軸方向とは略並行に配置されている。該ヒーター6によって、該窓部5の温度を100℃以上加熱することにより、反応生成物の該窓部5への付着を抑制している。   The window portion 5 shown in the present embodiment is made of synthetic quartz glass that transmits vacuum ultraviolet light having a wavelength of 172 nm emitted from the excimer lamp 3, and for example, the length in the transport direction A of the irradiated object 7 is 30 cm. A window material having a width of 100 cm and a thickness of 0.6 cm in the direction B perpendicular to the transport direction is used. Further, the heater 6 provided in the window portion 5 is manufactured by performing screen printing on the window surface using gold paste as a conductive heating material, and baking it at 600 ° C. for 60 minutes after the screen printing. As the arrangement pattern 10 of the heater 6, as shown in FIG. 1-b), it is arranged in a direction B substantially perpendicular to the conveying direction A of the irradiated object 7, and is a tubular excimer long in the B direction. The lamp 3 is arranged substantially in parallel with the lamp tube axis direction. By heating the temperature of the window portion 5 by 100 ° C. or more by the heater 6, the adhesion of the reaction product to the window portion 5 is suppressed.

図2には、該窓部5に形成されるヒーター6のその他の配置パターンについて示す。図2−a)には配置パターン21として鋸歯状のパターンが全体としては該被照射物の搬送A方向に略直交するB方向に沿って設けられている。該配置パターン21も前述のようにB方向の各位置において、該配置パターン21の該搬送方向であるA方向の長さの総和Sの最大値Smaxが、該総和Sの平均値Saveの1.1倍以内に形成している。これにより、該被照射物の照射される光の積算量がB方向の各位置で均一化され照射ムラのない安定した光処理が可能となる。図2−b)には配置パターン22として部分的に厚みや形状の異なるパターンを示す。このようなパターンであっても該配置パターン22の該搬送方向であるA方向の長さの総和Sの最大値Smaxが、該総和Sの平均値Saveの1.1倍以内に形成することにより、該被照射物の照射される光の積算量がB方向の処理幅内の各位置で均一化され照射ムラのない安定した光処理が可能となる。尚、該配置パターンを構成する材料としては、金、ニッケル、銀パラジウム合金、等の金属を用いることが好ましく、該金属をペーストにしてスクリーン印刷によりヒーターを形成することができる。   FIG. 2 shows another arrangement pattern of the heater 6 formed in the window portion 5. In FIG. 2A, a sawtooth pattern is provided as the arrangement pattern 21 along the B direction substantially orthogonal to the conveyance A direction of the irradiated object. As described above, the maximum value Smax of the total sum S of the lengths in the A direction, which is the transport direction of the placement pattern 21, is set to 1. of the average value Save of the sum S at each position in the B direction as described above. It is formed within 1 time. As a result, the integrated amount of light irradiated by the irradiated object is made uniform at each position in the B direction, and stable light processing without irradiation unevenness becomes possible. FIG. 2B shows a pattern partially different in thickness and shape as the arrangement pattern 22. Even in such a pattern, the maximum value Smax of the total sum S of the lengths in the A direction which is the transport direction of the arrangement pattern 22 is formed within 1.1 times the average value Save of the total S. The integrated amount of light emitted from the irradiated object is made uniform at each position within the processing width in the B direction, and stable light processing without irradiation unevenness is possible. In addition, it is preferable to use metals, such as gold | metal | money, nickel, and a silver palladium alloy, as a material which comprises this arrangement | positioning pattern, A heater can be formed by screen printing by using this metal as a paste.

図3−a)には第3の実施例として該窓部5に形成されたヒーター6の配置パターン23が略直交するB方向に対して略斜め方向に形成されている場合を示す。該形状であっても該被照射物の該搬送方向であるA方向の該配置パターンの長さの総和Sの最大値Smaxが、該総和Sの平均値Saveの1.1倍以内であれば均一な光照射が可能である。   FIG. 3A shows a case where the arrangement pattern 23 of the heater 6 formed in the window portion 5 is formed in a substantially oblique direction with respect to the B direction substantially orthogonal to the third embodiment. Even if it is the shape, if the maximum value Smax of the total length S of the arrangement pattern in the A direction that is the transport direction of the irradiated object is within 1.1 times the average value Save of the total S Uniform light irradiation is possible.

図3−b)には第4の実施例として該ヒーターの形成された配置パターン24が該窓部上に点対称図形として構成されている場合を示す。該窓部5に形成されたヒーター6の配置パターン24は、ガラスの中心点Pを基準にした点対称図形であって、該配置パターンを繋ぐ部分であるパターン接続部25が周辺よりやや太く形成されている。かかる構成であっても該被照射物の該搬送方向であるA方向の該配置パターンの長さの総和Sの最大値Smaxが、該総和Sの平均値Saveの1.1倍以内であれば均一な光照射が可能である。また、該構成によれば、該配置パターンが該窓部上において点対称図形として配置されていることから大きなガラス窓の場合であってもヒーターの配置パターンを容易に形成することができる。例えばスクリーン印刷によって該配置パターン24を作成する場合、ガラスの中心点Pを基準に該ガラス、または印刷原版側を回転させることにより容易に印刷可能となり、印刷用の原版が小型で対応できる。   FIG. 3B shows a case where the arrangement pattern 24 in which the heater is formed is configured as a point-symmetric figure on the window as a fourth embodiment. The arrangement pattern 24 of the heater 6 formed in the window portion 5 is a point-symmetrical figure with respect to the center point P of the glass, and the pattern connection portion 25 which is a portion connecting the arrangement patterns is formed slightly thicker than the periphery. Has been. Even in this configuration, if the maximum value Smax of the total length S of the arrangement pattern in the A direction that is the transport direction of the irradiated object is within 1.1 times the average value Save of the total S Uniform light irradiation is possible. Further, according to this configuration, since the arrangement pattern is arranged as a point-symmetric figure on the window portion, the arrangement pattern of the heater can be easily formed even in the case of a large glass window. For example, when the arrangement pattern 24 is created by screen printing, printing can be easily performed by rotating the glass or the printing original plate side with respect to the center point P of the glass, and the printing original plate can be made small.

第5の実施例としては、前記ヒーターの形成された配置パターンが前記窓部上において複数のゾーンに分割されており、各ゾーンにおける該ヒーターの配置パターン形状が他のゾーンの配置パターン形状と同一である場合について述べる。本実施例は特に図示しないが、第4の実施例の場合と同様に、窓部に形成されたヒーターの配置パターン26を同一パターンの繰り返しにより、例えばスクリーン印刷等で容易に構成することができる。この場合も、該被照射物の該搬送方向に対する該配置パターンの長さの総和Sの最大値Smaxが、該総和Sの平均値Saveの1.1倍以内であれば均一な光照射が可能である。また、該構成によれば、スクリーン印刷時に使用する原版をガラスに対して小さな原版で構成し、該原版を複数回にわたって転写することにより大きな該窓部全体にヒーターを容易に構成することができる。また、該ゾーン毎にヒーターの入力を独立制御させても良い。これにより被照射物の形状や大きさに合わせて合理的に照射処理が可能となる。   As a fifth embodiment, the arrangement pattern in which the heater is formed is divided into a plurality of zones on the window, and the arrangement pattern shape of the heater in each zone is the same as the arrangement pattern shape of other zones. A case where Although this embodiment is not particularly illustrated, similarly to the case of the fourth embodiment, the heater arrangement pattern 26 formed in the window portion can be easily configured by repeating the same pattern, for example, by screen printing or the like. . Also in this case, uniform light irradiation is possible if the maximum value Smax of the total length S of the arrangement pattern in the transport direction of the irradiated object is within 1.1 times the average value Save of the total sum S. It is. Moreover, according to this structure, the original used at the time of screen printing can be comprised with a small original with respect to glass, and a heater can be easily comprised in the whole large window part by transferring this original several times. . In addition, the heater input may be independently controlled for each zone. Thereby, it is possible to rationally perform irradiation processing according to the shape and size of the irradiated object.

本発明におけるエキシマ光照射装置の概略断面図、及び窓部のヒーター配置パターンを示す図The schematic sectional drawing of the excimer light irradiation apparatus in this invention, and the figure which shows the heater arrangement pattern of a window part 本発明における第2の実施例を示す図The figure which shows the 2nd Example in this invention 本発明における第3、第4の実施例を示す図The figure which shows the 3rd, 4th Example in this invention 本発明におけるヒーターの配置パターンを変化させた場合の影響を示す水の接触角Water contact angle showing the effect of changing the heater arrangement pattern in the present invention 従来におけるエキシマ光照射装置の説明用概略図Schematic diagram for explaining a conventional excimer light irradiation device

符号の説明Explanation of symbols

1 エキシマ光照射装置
2 ランプハウス
3 エキシマランプ
4 反射板
5 窓部
6 ヒーター
7 被照射物
8 搬送手段
9 コロ
10 配置パターン
11 給電部
12 保持されている部分
13 光透過部
A 搬送方向
B 直交する方向
C 仮想線
D 仮想線
E 仮想線
o、p、q、r、s、t、u、v、w、x、y、z 交点
21 配置パターン
22 配置パターン
23 配置パターン
24 配置パターン
25 パターン接続部
P ガラスの中心点
101 エキシマ光照射装置
102 ランプハウス
103 エキシマランプ
104 反射板
105 窓部
106 ヒーター
107 被照射物
108 被照射物固定台
DESCRIPTION OF SYMBOLS 1 Excimer light irradiation apparatus 2 Lamp house 3 Excimer lamp 4 Reflector 5 Window part 6 Heater 7 Irradiated object 8 Conveyance means 9 Roller 10 Arrangement pattern 11 Feeding part 12 Holding part 13 Light transmission part A Conveyance direction B direction
C virtual line
D virtual line
E Virtual line o, p, q, r, s, t, u, v, w, x, y, z Intersection 21 Arrangement pattern 22 Arrangement pattern 23 Arrangement pattern 24 Arrangement pattern 25 Pattern connection part P Glass center point 101 Excimer Light irradiation device 102 Lamp house 103 Excimer lamp 104 Reflector plate 105 Window portion 106 Heater 107 Irradiation object 108 Irradiation object fixing base

Claims (1)

エキシマランプと被照射物との間にエキシマ光を透過する窓部を持ち、該窓部を加熱するヒーターが該窓部上に設けられたエキシマ光照射装置において、
該被照射物を搬送しながら光照射処理を行う搬送手段が設けられ、且つ該窓部の光透過部に設けられた該ヒーターの配置パターンが、該被照射物の搬送方向に略直交する方向、または該被照射物の搬送方向に略斜め方向に形成されており、該被照射物搬送方向をA、これに直交する方向をBとした時に、該窓部の光透過部の幅内のB方向での各位置における、該ヒーターの配置パターンのA方向の長さの総和をSとすると、該総和Sの最大値Smaxを、該総和Sの平均値Saveの1.1倍以内としたことを特徴とするエキシマ光照射装置。
In an excimer light irradiation apparatus having a window portion that transmits excimer light between an excimer lamp and an object to be irradiated, and a heater for heating the window portion provided on the window portion,
A transport means for performing a light irradiation process while transporting the irradiated object, and a direction in which the heater arrangement pattern provided in the light transmitting portion of the window portion is substantially orthogonal to the transport direction of the irradiated object Or formed in a substantially oblique direction with respect to the conveying direction of the irradiated object, and when the irradiated object conveying direction is A and the direction orthogonal to this is B, it is within the width of the light transmitting portion of the window portion. Assuming that the sum of the lengths in the A direction of the heater arrangement pattern at each position in the B direction is S, the maximum value Smax of the sum S is within 1.1 times the average value Save of the sum S. Excimer light irradiation apparatus characterized by the above-mentioned.
JP2003412667A 2003-12-11 2003-12-11 Excimer light irradiation equipment Expired - Fee Related JP4375007B2 (en)

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