JP4369307B2 - パターン加工方法及びパターン加工装置 - Google Patents

パターン加工方法及びパターン加工装置 Download PDF

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Publication number
JP4369307B2
JP4369307B2 JP2004171731A JP2004171731A JP4369307B2 JP 4369307 B2 JP4369307 B2 JP 4369307B2 JP 2004171731 A JP2004171731 A JP 2004171731A JP 2004171731 A JP2004171731 A JP 2004171731A JP 4369307 B2 JP4369307 B2 JP 4369307B2
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Japan
Prior art keywords
pattern
nozzle
substrate
mask
pattern processing
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Expired - Fee Related
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JP2004171731A
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Japanese (ja)
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JP2005349513A5 (https=
JP2005349513A (ja
Inventor
亘 大加瀬
英一郎 高鍋
慎一 河口
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of JP2005349513A5 publication Critical patent/JP2005349513A5/ja
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  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2004171731A 2004-06-09 2004-06-09 パターン加工方法及びパターン加工装置 Expired - Fee Related JP4369307B2 (ja)

Priority Applications (1)

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JP2004171731A JP4369307B2 (ja) 2004-06-09 2004-06-09 パターン加工方法及びパターン加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004171731A JP4369307B2 (ja) 2004-06-09 2004-06-09 パターン加工方法及びパターン加工装置

Publications (3)

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JP2005349513A JP2005349513A (ja) 2005-12-22
JP2005349513A5 JP2005349513A5 (https=) 2007-07-05
JP4369307B2 true JP4369307B2 (ja) 2009-11-18

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JP2004171731A Expired - Fee Related JP4369307B2 (ja) 2004-06-09 2004-06-09 パターン加工方法及びパターン加工装置

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011020212A (ja) * 2009-07-15 2011-02-03 Sharp Corp 基板の加工装置および基板の加工方法、並びに加工基板の製造方法
KR101416942B1 (ko) * 2012-10-25 2014-07-08 주식회사 나무공작소 자동화된 목재용 샌드 블래스터
CN111513411B (zh) * 2020-04-13 2022-07-29 湖南臻和亦康医疗用品有限公司 一种医疗口罩生产用的压平装置
EP4108438A1 (en) * 2021-06-25 2022-12-28 Essilor International Method for manufacturing a lens element

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JP2005349513A (ja) 2005-12-22

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