JP4367239B2 - Hybrid integrated circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit device capable of detecting the temperature of a heating element at higher accuracy. <P>SOLUTION: A power element 11a for opening/closing a power supply line to an on-vehicle lamp, a control element 11b for controlling the power of the power element 11a, and a temperature detection element 11c for detecting temperature in the vicinity of the power element 11a, are mounted on an alumina substrate 12. In addition to power control for the power element 11a, the control element 11b enters temperature information detected by the temperature detection element 11c, and performs also correction operation for the temperature information. The control element 11b detects the temperature information of the power element 11a through the correction operation. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

  The present invention relates to a hybrid integrated circuit device configured by mounting various electronic components including a heating element such as a power element as a power supply element on a substrate.

  Conventionally, as this type of device, for example, a hybrid integrated circuit device that drives and controls a control target such as an electromagnetic actuator including various motors mounted on a vehicle and a lamp is known. Such a hybrid integrated circuit device is usually configured such that a power element such as a power transistor is provided on a power supply line to the control target, and drive control of the control target is performed through on / off control of the power element. However, in such a hybrid integrated circuit device, the temperature of the power element itself may increase greatly depending on the driving state of the controlled object.

Therefore, conventionally, as seen in, for example, Patent Document 1, a hybrid integrated circuit device that detects the temperature of a power element has also been proposed.
FIG. 15 shows an outline of the hybrid integrated circuit device described in Patent Document 1. In this hybrid integrated circuit device, various electronic components including the power element 2 are mixedly mounted on the substrate 1. In this hybrid integrated circuit device, the temperature detection element 3 is provided in a form surrounded by the power element 2, and the temperature transmitted from the power element 2 through the substrate 1 or the like is detected by the temperature detection element 3. I am doing so. In this hybrid integrated circuit device, the power element 2 and the temperature detection element 3 are supplied with power through the power supply terminal Tin.
JP-A-11-214691

  According to the conventional hybrid integrated circuit device, when the temperature detected by the temperature detection element 3 reaches the upper limit temperature set in advance by experiment or the like, the drive of the control target is stopped, Overheating accompanying the temperature rise of the power element 2 is also avoided. However, in this conventional hybrid integrated circuit device, since the temperature transmitted from the power element 2 to the temperature detection element 3 via the substrate 1 or the like is detected as the temperature of the power element 2, the detected temperature and the power element The error between 2 and the actual temperature cannot be ignored, and the temperature detection accuracy is naturally lowered. For this reason, even if the upper limit temperature for avoiding overheating associated with the temperature rise of the power element 2 is taken into consideration, such an error must be taken into consideration and set to a temperature that is somewhat lower than the limit temperature of the power element 2. That is, in this case, even if the power element 2 is in a temperature range where the power element 2 can be effectively used, the driving of the power element 2 is limited by the upper limit temperature set in the temperature detection element 3. In other words, the driving of the control target may be unnecessarily limited.

  For the sake of accuracy, it is conceivable that the power element 2 itself has a temperature detection function. However, this makes it impossible to complicate the power element 2 itself, and its versatility is poor.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a hybrid integrated circuit device capable of detecting the temperature of a heating element with higher accuracy.

In order to achieve such an object, in the hybrid integrated circuit device according to claim 1, a substrate on which various electronic components including a heating element and a temperature detection element that detects temperature in the vicinity of the heating element is mounted. In the hybrid integrated circuit device configured to include, as one of the various electronic components, an arithmetic element that takes in temperature information detected by the temperature detection element and corrects the temperature information is provided . The amount of temperature increase for each elapsed time from when the power supply to the heating element at the temperature detected by the temperature detection element is started is obtained from the temperature information by the temperature detection element, and the obtained temperature increase From the heating element to the temperature sensing element determined each time based on the amount, the elapsed time and the heat transfer environment including the distance between the heating element and the temperature sensing element Was to detect the temperature information of the heating element through correction operation for calculating the amount of increase in the temperature of each of the elapsed time of the heating elements by dividing the time transfer temperature ratio is the ratio of the transmission degree of.

  As described above, the temperature detected by the temperature detection element is a temperature transmitted from the heating element through the substrate or the like, and the temperature detected by the temperature detection element and the actual temperature of the heating element are An error naturally occurs between the two. In this respect, according to the above configuration, the temperature information detected by the temperature detection element is taken in and corrected, and the temperature information of the heating element is detected through this correction calculation. The temperature of the element can be detected.

Further, according to the above-described configuration, as the operation element, by the temperature information taken in from the temperature detecting element based on the elapsed time from when the power supply is started it was adopted to correct operation on the heating elements Thus, it is possible to easily realize the temperature detection with high accuracy of the heating element.

  That is, the temperature difference between the temperature detected by the temperature detection element and the temperature of the heating element decreases as time elapses from when the power supply to the heating element is started. In this regard, according to the above configuration, the temperature information of the heating element is detected in order to correct the captured temperature information based on the elapsed time from when the power supply to the heating element is started. Thus, it is possible to suitably suppress an error caused by the variation in the elapsed time between the temperature detected by the temperature detection element and the actual temperature of the heating element.

On the other hand, according to the above configuration, the arithmetic element corrects and calculates temperature information taken from the temperature detection element based on a heat transfer environment including a distance between the heating element and the temperature detection element. by the so employed to further improve these temperature detection accuracy becomes possible to expect.

That is, as the time elapses from when the power supply to the heating element is started, the temperature difference between the temperature detected by the temperature detection element and the temperature of the heating element becomes small, but this temperature difference with respect to the time passage The rate of reduction depends on the heat transfer environment between these elements, that is, the distance between the heating element and the temperature detecting element, the material, shape, size, etc. of each structure constituting the heat transfer path between these elements. To change. In this regard, according to the above configuration, in order to correct the calculated temperature information based on the heat transfer environment including the distance between the heating element and the temperature detection element, in detecting the temperature information of the heating element, This can also be suitably suppressed for errors caused by the difference in the heat transfer environment between the temperature detected by the temperature detection element and the actual temperature of the heating element.

  Note that each structure constituting the heat transfer path between the heating element and the temperature detection element refers to the amount of heat generated when the heat generated in the heating element is transferred to the temperature detection element. It refers to all objects that are heat exchanged.

Then, with the above configuration, the arithmetic element, the amount of increase in the temperature of each of the elapsed time of the temperature detected by the previous SL temperature detecting element with obtaining the temperature information by the same temperature sensing element, is the resulting temperature The heat generation is divided by dividing the amount of increase in temperature by the transfer temperature ratio, which is the ratio of the degree of temperature transfer from the heat generating element to the temperature detecting element, which is determined each time based on the elapsed time and the heat transfer environment. by which is adapted to calculate the amount of increase in the temperature of each of the elapsed time of the device, so that the temperature information of the heating element can be easily detected.

  Here, the amount of temperature increase of the heating element for each elapsed time is determined based on the amount of temperature increase for each elapsed time of the temperature detected by the temperature detection element, the elapsed time, and the heat transfer environment. The value of the transmission temperature ratio when expressed as a division value of the transmission temperature ratio, which is a ratio of the degree of transmission of temperature from the heating element to the temperature detection element, is determined for each elapsed time based on, for example, experiments. Can get to. For this reason, while calculating the transmission temperature ratio corresponding to the elapsed time, the heating element is divided by dividing the amount of increase in temperature detected by the temperature detection element for each elapsed time and the transmission temperature ratio. Temperature information can be detected.

In addition, although the arithmetic element can also take in the information of the said elapsed time from the outside, when the arithmetic element is provided as a control element which performs power control with respect to a heat generating element like the invention of Claim 2 , for example Alternatively, the calculation element itself can calculate the elapsed time by calculating the difference between the time when the temperature information is taken in by the temperature detection element and the time when the power supply to the heating element is started.

According to the third aspect of the present invention, when the heating element to be temperature-detected is a power element that is a power supply element, overheating of the power element is accurately suppressed, and the power More reliable drive control of various actuators and lamps to be supplied can be performed.

  Hereinafter, an embodiment of a hybrid integrated circuit device according to the present invention will be described in detail with reference to FIGS. In the hybrid integrated circuit device according to this embodiment, a device for driving and controlling a lamp mounted on a vehicle is assumed as a control target.

  In this hybrid integrated circuit device, a variety of electronic components 11 are mounted on an alumina substrate 12 as shown in FIG. 1 (a) and a cross-sectional structure of its side in FIG. 1 (b). Configured. The alumina substrate 12 is bonded to the lead frame 13 with an adhesive 14, and in this state, is seamlessly molded with a molding material 15 made of resin or the like. In the hybrid integrated circuit device, an external terminal GT including a power supply terminal and an output terminal is drawn out from the molding material 15, and the various electronic components 11 are electrically connected via the external terminal GT and bonding wires W. Connected.

  On the other hand, on the surface of the alumina substrate 12, as the various electronic components 11, a power element 11a that is a power supply element made of a power transistor, a control element 11b that performs on / off control of the power element 11a, and temperature detection are performed. A temperature detection element 11 c to be performed is mounted by solder 16.

  Among these, the power element 11a is provided on a power supply line (not shown) to the lamp (not shown) formed on the surface of the alumina substrate 12 by firing. The power element 11a is turned on / off based on the drive signal taken from the control element 11b, and the hybrid integrated circuit device performs drive control of the lamp through such on / off control by the control element 11b. The drive signal is generated when, for example, an ON signal from a lamp switch provided in the passenger compartment is taken into the control element 11b.

  Further, the temperature detection element 11c is formed of, for example, a thermistor, and detects temperature in the vicinity of the power element 11a in order to avoid overheating accompanying the temperature rise of the power element 11a. However, the hybrid integrated circuit device according to this embodiment detects the temperature information of the power element 11a through the correction calculation of the temperature information detected by the temperature detection element 11c.

  That is, in this embodiment, in addition to the drive control (power control) of the power element 11a, the control element 11b takes in the temperature information detected by the temperature detection element 11c and corrects it. Then, the control element 11b detects the temperature information of the power element 11a through this correction calculation, and when it is determined that the detected temperature information has reached an upper limit temperature set in advance by experiment or the like, Control to turn off the power element 11a is performed. As a result, the temperature of the power element 11a can be detected with high accuracy, and the overheating associated with the temperature rise of the power element 11a is accurately suppressed, so that the on-vehicle lamp that is the power supply target can be controlled. It becomes possible to perform highly reliable drive control.

Here, an example of a correction calculation method for temperature information detected by the temperature detection element 11c performed by the control element 11b will be described.
The elapsed time from the start of power supply to the power element 11a, that is, the temperature rise amount ΔPT of the power element 11a for each elapsed time since the power element 11a is turned on, and the elapsed time The temperature increase amount ΔST detected by the temperature detection element 11c is:

ΔST = RT × ΔPT (1)
However,
RT: Ratio of the degree of temperature transmission from the power element to the temperature detection element (transmission temperature ratio)

It is expressed by the following relational expression. In this equation (1), the value of the transmission temperature ratio RT can be obtained for each elapsed time based on, for example, experiments, and the hybrid integrated circuit device according to this embodiment is shown in FIG. Assume that the following results are obtained. In this embodiment, the heat transfer path between the power element 11a and the temperature detecting element 11c is formed by the alumina substrate 12, the lead frame 13, the molding material 15, the adhesive 14, the solder 16, and the like. The

That is, as apparent from FIG. 2, the value of the transmission temperature ratio RT is based on the elapsed time T,

RT = B × LnT + A (where RT ≦ 1) (2)
However,
LnT: Common logarithm of elapsed time from when the power element is turned on A: Transmission temperature ratio when “T = 1” (hereinafter referred to as coefficient A)
B: slope when the transmission temperature ratio increases linearly with respect to the common logarithm of the elapsed time from when the power element is turned on (hereinafter referred to as coefficient B)

Can be obtained based on the relational expression. Therefore, the control element 11b first calculates a transmission temperature ratio RT for each elapsed time T based on the equation (2) as a correction calculation of the temperature information detected by the temperature detection element 11c. Then, based on the above equation (1), the power element is divided by dividing the temperature increase amount ΔST detected by the temperature detecting element 11c at each elapsed time T and the calculated transmission temperature ratio RT. A temperature rise amount ΔPT of 11a is calculated. Through such correction calculation by the control element 11b, the temperature information of the power element 11a can be detected.

By the way, in the above equation (2), the values of the coefficients A and B vary depending on the heat transfer environment between the power element 11a and the temperature detection element 11c. Specifically, the value of the coefficient A is mainly based on the distance L between the power element 11a and the temperature detection element 11c, and the value of the coefficient B is mainly related to heat transfer between the power element 11a and the temperature detection element 11c. It varies depending on the route. Therefore, in the hybrid integrated circuit device, for example, when the design of the distance L between the power element 11a and the temperature detecting element 11c is changed, the experiment is performed again, and the relationship of the above formula (2), particularly the coefficient The value of A will be clarified. However, as apparent from FIG. 2, the coefficient A has the characteristics shown in FIG. 3 with respect to the distance L between the power element 11a and the temperature detection element 11c, that is,

A = C × LnL + D (A <1) (3)
However,
LnL: common logarithm of distance between power element and temperature detection element C: slope when coefficient A decreases linearly with respect to common logarithm of distance between power element and temperature detection element (hereinafter referred to as coefficient C)
D: Value of coefficient A when “L = 1” (hereinafter referred to as coefficient D)

It has the following characteristics. Therefore, in such a case, it is possible to determine the reliability of the coefficient A that is obtained again by examining whether the coefficient A that is obtained again by experiment matches the relationship of the expression (3). it can.

  Next, the internal structure and operation of the control element 11b that performs correction calculation using such a method will be described with reference to FIGS. 4 and 5. FIG. FIG. 4 is a block diagram showing the internal structure of the control element 11b including the electrical relationship between the power element 11a and the temperature detection element 11c. FIG. 5 is a flowchart showing a procedure for driving control of the power element 11a by the control element 11b.

  As shown in FIG. 4, the control element 11b is composed of, for example, a logic circuit and the like, and is configured around a control unit 21 that compares and determines various types of information. The control unit 21 is electrically connected through the temperature detection element 11 c and the input unit 22 and electrically through the power element 11 a and the output unit 23. Further, the control unit 21 performs a memory (ROM) 24 in which a program related to driving control of the power element 11a is stored, a register unit 25 for writing and reading information, and operations such as addition and subtraction. The arithmetic unit 26 is also electrically connected. The memory 24 also stores the above equation (1) and the above equation (2) in which the coefficients A and B are obtained in advance through experiments or the like. When an external signal indicating that the lamp is to be turned on is input to the control unit 21 via the input unit 27, the control unit 21 executes the processes in steps S1 to S7 shown in FIG. It becomes.

  That is, first, in the process of step S1, a program relating to the driving control of the lamp is read from the memory 24, and a signal (drive signal) according to the read program is output via the output unit 23 to the power element 11a. Is output. At the same time, the time when the signal is output, that is, the time when the power supply to the power element 11 a is started is stored in the register unit 25. In addition, temperature information detected by the temperature detection element 11 c is taken in via the input unit 22, and this temperature information is also stored in the register unit 25. Then, as a process of step S2, it is confirmed whether or not the power element 11a is turned on. If the on state of the power element 11a is not confirmed, this control is terminated when the power element 11a is turned off as the processing of step S7.

  On the other hand, in the process of step S2, if it is determined that the power element 11a is on and the lamp is lit, temperature information by the temperature detection element 11c is then processed as step S3. Is taken in again via the input unit 22. At the same time, the time when the power supply to the power element 11a stored in the register unit 25 is started and the temperature information by the temperature detection element 11c captured at the same time are read out. In the process of step S3, the difference between the current time and the time read from the register unit 25 is calculated through the calculation unit 26, and the elapsed time T is calculated.

  In the process of the next step S4, the temperature information detected by the temperature detecting element 11c is corrected. That is, in the process of step S4, first, from the temperature information by the temperature detection element 11c input in the process of step S3 and the temperature information by the temperature detection element 11c read out in the process of step S3, A temperature increase amount ΔST detected by the temperature detection element 11c at the elapsed time T is calculated. Then, the equation (2) is read from the memory 24, and the transmission temperature ratio RT is obtained from the calculated elapsed time T based on the equation (2). Then, the above equation (1) is read from the memory 24, and based on this equation (1), the power element 11a is calculated from the obtained transmission temperature ratio RT and the calculated temperature increase ΔST. A temperature rise amount ΔPT is calculated, and thereby temperature information of the power element 11a is detected.

  When the temperature information of the power element 11a is thus detected, it is next determined in step S5 whether or not the detected temperature information has reached the upper limit temperature of the power element 11a. When it is determined that the temperature of the power element 11a is normal, the processes in steps S2 to S5 are repeatedly executed while the lamp is lit. As a result, when it is determined in the process of step S5 that the detected temperature information has reached the upper limit temperature of the power element 11a, the process proceeds to the process of step S7 at that time, and in the process, the power information The element 11a is turned off, and this control is finished.

  In the repetitive process, when the process proceeds from step S5 to step S2, it is confirmed in step S6 whether or not an external signal requesting lighting of the lamp is input to the control unit 21. . Even in the case where the input of the external signal is not confirmed in the process of step S6, the process proceeds to the process of step S7 at that time, the power element 11a is turned off in the process, and this control is finished. .

For reference, an example of a method for manufacturing a hybrid integrated circuit device according to this embodiment will be described with reference to FIG.
That is, first, a conductor pattern and a resistor including a power supply line to the lamp are fired (printed) on the surface of the alumina substrate 12. Then, a solder cream is applied to the surface of the alumina substrate 12, and electronic components 11 such as a power element 11a, a control element 11b, and a temperature detecting element 11c are mounted on the solder cream. In this state, a reflow process for heating the alumina substrate 12 is performed. When the electronic components 11 are mounted on the alumina substrate 12 in this manner, the alumina substrate 12 and the lead frame 13 are then bonded with an adhesive 14. Next, a wire bonding step of electrically connecting the electronic components 11, the conductor pattern, the lead frame 13 and the like via the bonding wires W is performed. Then, the molding material 15 is formed by molding, and a part of the tip of the lead frame 13 taken out from the molding material 15 to the outside is cut to form the external terminal GT.

As described above, according to the hybrid integrated circuit device of this embodiment, excellent effects as described below can be obtained.
(1) Since the temperature information detected by the temperature detection element 11c is taken in and corrected, and the temperature information of the power element 11a is detected through this correction calculation, the temperature of the power element 11a is detected with higher accuracy. Will be able to.

  (2) Since the temperature information detected by the temperature detection element 11c is corrected based on the equations (1) and (2), the temperature information of the power element 11a can be easily detected. become able to.

  (3) Since the control element 11b performs power control on the power element 11a in conjunction with the temperature information correction calculation, the time when the temperature information is taken in by the temperature detection element 11c and the power supply to the power element 11a are By calculating the difference from the start time, the control element 11b itself can calculate the elapsed time T.

  (4) Since the target of temperature detection is the power element 11a, the overheating accompanying the temperature rise of the power element 11a is accurately suppressed, and more reliable drive control of the on-vehicle lamp that is the power supply target is performed. Will be able to do.

In addition, the said embodiment can also be changed and implemented as follows.
As shown in FIG. 6 as a modification of the relationship between the power element 11a and the temperature detection element 11c, the alumina substrate 12 on which the power element 11a and the temperature detection element 11c are mounted is directly bonded to the heat sink 113. You may do it. According to such a relationship, heat from the power element 11a is transmitted to the temperature detection element 11c via the alumina substrate 12, the heat sink 113, and the like. In addition, the cooling effect of the power element 11a by the heat sink 113 can be expected. The manufacturing process of the hybrid integrated circuit device shown in FIG. 6 is basically the same as the process shown in the previous embodiment. However, in the step of adhering the alumina substrate 12 and the heat sink 113, the alumina on which the electronic components 11 are mounted in a state where the positional relationship between the heat sink 113 and a lead frame that will later become the external terminal GT is appropriately fixed. The substrate 12 and the heat sink 113 are bonded.

  Further, as shown in FIG. 7, another variation of the relationship between the power element 11 a and the temperature detection element 11 c may be formed by firing the temperature detection element 11 c on the alumina substrate 12. According to such a relationship, heat from the power element 11a is transferred to the temperature detection element 11c without passing through the solder 16 between the temperature detection element 11c and the alumina substrate 12 illustrated in FIG. It becomes like this. In addition, as illustrated in FIG. 6 above, the temperature detection element 11c is designed to have the same thickness as the power element 11a and the control element 11b in view of handling when assembling an electronic component on the surface of the alumina substrate 12. There is no need. The manufacturing process of the hybrid integrated circuit device shown in FIG. 7 is basically the same as that of the hybrid integrated circuit device shown in FIG. However, in the step of firing (printing) the conductor pattern or resistor on the surface of the alumina substrate 12, the temperature detecting element 11c is also fired (printed) together.

  In addition, when the temperature detection element 11c is formed by baking, as shown in FIG. 8, the temperature detection element 11c is formed on the back surface of the alumina substrate 12 on the path through which heat from the power element 11a is transmitted to the heat sink 113. Can also be provided. According to such a relationship, since the temperature detection element 11c is arranged on the transmission path of heat to the heat sink 113 by the power element 11a, the temperature detection element 11c has a temperature relative to the temperature of the power element 11a. A temperature with a small difference is detected. The manufacturing process of the hybrid integrated circuit device shown in FIG. 8 is basically the same as that of the hybrid integrated circuit device shown in FIG. However, the conductor pattern and the resistor are baked and formed (printed) on the surface of the alumina substrate 12, and the temperature detecting element 11 c is baked and formed (printed) on the back surface of the alumina substrate 12. In this step, a conductor pattern is formed on the alumina substrate 12 so that a detection signal from the temperature detection element 11c can be taken out in the state illustrated in FIG. Thereafter, each electronic component 11 excluding the temperature detecting element 11c is mounted on the surface of the alumina substrate 12, and the alumina substrate 12 and the heat sink 113 are bonded in this state.

  When the temperature detecting element 11c is formed by firing, as shown in FIG. 9, the temperature detecting element 11c is placed on the surface of the alumina substrate 12 on the path through which heat from the power element 11a is transmitted to the heat sink 113. It can also be provided. According to such a relationship, heat from the power element 11a is directly transmitted to the temperature detection element 11c without passing through the alumina substrate 12, and therefore, the temperature detection element 11c causes the power element 11a to A temperature having a smaller temperature difference with respect to the temperature is detected. The manufacturing process of the hybrid integrated circuit device shown in FIG. 9 is basically the same as that of the hybrid integrated circuit device shown in FIG. However, the conductor pattern or resistor is baked (printed) on the surface of the alumina substrate 12, and the temperature detecting element 11c is baked (printed) on the surface of the alumina substrate 12 where the power element 11a will be mounted later. To do. In this step, a conductor pattern is formed on the alumina substrate 12 so that a detection signal from the temperature detecting element 11c can be taken out in the state illustrated in FIG. Thereafter, a solder cream is applied on the temperature detecting element 11c baked and formed on the surface of the alumina substrate 12, and the power element 11a is mounted on the solder cream. In this state, a reflow process for heating the alumina substrate 12 is performed.

  When the hybrid integrated circuit device is a device including a plurality of power elements that are power supply elements, the temperature detection elements may be arranged in a pattern as shown in FIG. According to such an arrangement pattern of the temperature detection elements, the temperature detection elements 111c to 114c are arranged in the vicinity of the power elements 111a to 114a, respectively, so that overheating accompanying a temperature rise of the power elements 111a to 114a is suppressed. Will be able to.

  When the hybrid integrated circuit device includes the power elements 111a to 114a, the temperature detection element 12c that detects the temperature in the vicinity of the power elements 111a and 112a and the temperature that detects the temperature in the vicinity of the power elements 113a and 114a The detection element 34c may be arranged as shown in FIG. 11 (a) or (b). That is, according to such a configuration, the temperature detecting element 12c detects the higher temperature of the power elements 111a and 112a, and the temperature detecting element 34c detects the higher temperature of the power elements 113a and 114a. . Therefore, when the temperature information of the power element obtained through the correction calculation of each temperature information detected by the temperature detection elements 12c and 34c reaches the upper limit temperature, the temperature detection element on the side where such temperature information is detected By performing control to turn off both of the two power elements to be temperature-detected, overheating of these power elements can be suppressed.

  When the hybrid integrated circuit device includes the power elements 111a to 114a, the temperature detection element 1234c can be arranged as shown in FIG. 11 (c) or (d). According to such a configuration, the highest temperature of the power elements 111a to 114a is detected by the temperature detection element 1234c. For this reason, when the temperature information of the power element obtained through the correction calculation of the temperature information detected by the temperature detection element 1234c reaches the upper limit temperature, control is performed to turn off the power elements 111a to 114a. Thus, overheating of all the power elements 111a to 114a can be suppressed.

  As shown in FIG. 12, the hybrid integrated circuit device may include a plurality of power elements 115 a to 118 a as power supply elements that open and close a power supply line to the motor M in an H-bridge connected circuit. Good.

  When the hybrid integrated circuit device includes the power elements 115a to 118a (FIG. 12), the temperature detection element 67c may be arranged as shown in FIG. 13 (a), (b), or (c). That is, in the circuit shown in FIG. 12, since the same current flows through power elements 115a and 117a when motor M is driven, the temperatures of power elements 115a and 117a change in the same way. Similarly, since the same current flows in power elements 116a and 118a, their temperatures also change in the same manner. Therefore, in such a hybrid integrated circuit device, all the power elements 115a to 118a are detected only by detecting temperature information of the power elements 116a and 117a disposed on the power supply side (high side) with respect to the motor M. It is possible to suppress overheating accompanying the temperature rise. In this regard, according to such an arrangement of the temperature detection element 67c, the higher temperature of the power elements 116a and 117a is detected by the temperature detection element 67c. Therefore, when the temperature information of the power element obtained through the correction calculation of the temperature information detected by the temperature detection element 67c reaches the upper limit temperature, the power elements 115a to 118a are controlled to be turned off. Thus, it is possible to suppress overheating associated with the temperature rise of the power elements 115a to 118a. In FIG. 13C, the temperature detection element 67c is disposed between the alumina substrate 12 and the lead frame 13 in the form illustrated in FIG. For this reason, the method of manufacturing the hybrid integrated circuit device is based on the hybrid integrated circuit device illustrated in FIG.

  Further, when the hybrid integrated circuit device includes the power elements 115a to 118a (FIG. 12), the temperature detecting element 58c may be disposed as shown in FIG. 14 (a), (b) or (c). it can. That is, as described above, in the circuit shown in FIG. 12, when the motor M is driven, the same current flows through the power elements 115a and 117a, so the temperatures of the power elements 115a and 117a change in the same way. Similarly, since the same current flows in power elements 116a and 118a, their temperatures also change in the same manner. Therefore, in such a hybrid integrated circuit device, all the power elements 115a to 118a are detected by detecting temperature information of the power elements 115a and 118a disposed on the ground side (low side) with respect to the motor M. It is possible to suppress overheating accompanying the temperature rise. In this regard, according to such an arrangement of the temperature detection elements 58c, the higher temperature of the power elements 115a and 118a is detected by the temperature detection element 58c. Therefore, when the temperature information of the power element obtained through the correction calculation of the temperature information detected by the temperature detection element 58c reaches the upper limit temperature, the power elements 115a to 118a are all controlled to be turned off. Thus, it is possible to suppress overheating associated with the temperature rise of the power elements 115a to 118a. 14C is also arranged between the alumina substrate 12 and the lead frame 13 in the form illustrated in FIG. For this reason, the method for manufacturing the hybrid integrated circuit device also conforms to the hybrid integrated circuit device illustrated in FIG.

  The temperature information detected by the temperature detection element taken into the control element 11b may be either an analog signal or a digital signal. When the temperature information is an analog signal, it is analog / digital converted at the input unit 22 and then taken into the control unit 21. On the other hand, when the temperature information is a serial digital signal, it is serial / parallel converted at the input unit 22 and then taken into the control unit 21.

  The control element 11b does not perform power control of the power element together with the correction calculation of the temperature information detected by the temperature detection element, and may be a normal calculation element. However, in this case, the time when the power control for the power element is started, or the elapsed time T is taken from the outside.

  Instead of the alumina substrate 12, for example, a glass epoxy substrate, a metal base substrate using aluminum or copper, or a ceramic substrate may be employed. However, in such a case, the coefficient A and coefficient B in the above equation (2) and the coefficient C and coefficient D in the above equation (3) change. If the transfer temperature ratio RT decreases due to such influence, the accuracy of the temperature information of the power element detected through the correction calculation may decrease, so use a substrate with a high heat transfer coefficient as the substrate. Is more desirable in practice.

  The drive current of the power element is detected and this amount of current is taken into the control element 11b, and the control element 11b takes this current amount into account and corrects the temperature information detected by the temperature detection element. You may do it. Since the amount of increase in the temperature of the power element has a correlation with the drive current of the power element, the temperature information of the power element can be detected more accurately through such correction calculation. The driving current of the power element 11a can be detected by arranging a shunt resistor on the power supply line to the lamp, for example.

-The temperature detection element should just be provided in the position where the temperature of a power element is transmitted.
The temperature detecting element may be any element that can detect temperature, such as a thermistor or a diode.

  The intended purpose of detecting the temperature of the power element with higher accuracy can be achieved by correcting the temperature information detected by the temperature detecting element by the control element 11b. However, the temperature difference between the temperature detected by the temperature detection element and the temperature of the power element is usually reduced as the elapsed time T from when the power supply to the power element is started increases. For this reason, it is preferable to correct the temperature information detected by the temperature detection element based on the elapsed time T. Further, the temperature information detected by the temperature detection element includes the heat transfer environment between the power element and the temperature detection element, that is, the distance L between the power element and the temperature detection element, and the power element and the temperature detection element. Also affected by the material, shape, size, etc. of each structure constituting the heat transfer path. Therefore, in order to more accurately detect the temperature information of the power element, the temperature information detected by the temperature detection element is corrected and calculated in consideration of the heat transfer environment between the power element and the temperature detection element. More preferably. This most practical example is an example in the previous embodiment in which the temperature information is corrected and calculated using equations (1) and (2).

  The power element may be an element that generates heat (power generation element) due to power supply, such as a power MOSFET, IGBT, diode, or resistor. With these elements, the temperature of the element can be accurately detected through correction calculation of temperature information detected by the temperature detection element.

  In place of the solder 16, for example, a conductive adhesive or a normal adhesive may be used when conductivity is not required.

BRIEF DESCRIPTION OF THE DRAWINGS (a) is a top view which shows the internal planar structure about one Embodiment of the hybrid integrated circuit device concerning this invention. (B) is sectional drawing which shows the cross-section of the internal side surface about the embodiment. The time chart which shows the change of the transmission temperature ratio from the time when the electric power supply with respect to a power element was started. The graph which shows the characteristic of the coefficient A with respect to the distance L of a power element and a temperature detection element. The block diagram which shows the internal structure of a control element also including the electrical relationship with a power element and a temperature detection element. The flowchart which shows the procedure about the drive control of the power element by a control element. Sectional drawing which shows the modification of the relationship between a power element and a temperature detection element. Sectional drawing which shows the modification of the relationship between a power element and a temperature detection element. Sectional drawing which shows the modification of the relationship between a power element and a temperature detection element. Sectional drawing which shows the modification of the relationship between a power element and a temperature detection element. The top view which shows an example of the arrangement pattern of a temperature detection element. (A)-(d) is a top view which shows an example of the arrangement pattern of a temperature detection element. The circuit diagram which shows the power element which opens and closes the power supply line to the motor M connected by H bridge. (A)-(c) is a top view which shows an example of the arrangement pattern of a temperature detection element. (A)-(c) is a top view which shows an example of the arrangement pattern of a temperature detection element. The top view which shows the conventional hybrid integrated circuit device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Electronic component, 11a, 111a-118a ... Power element, 11b ... Control element, 11c, 12c, 34c, 58c, 67c, 111c-114c, 1234c ... Temperature detection element, 12 ... Alumina substrate, 13 ... Lead frame, 14 DESCRIPTION OF SYMBOLS ... Adhesive, 15 ... Mold material, 16 ... Solder, 21 ... Control part, 22 ... Input part, 23 ... Output part, 24 ... Memory, 25 ... Register part, 26 ... Calculation part, 27 ... Input part, 113 ... Heat sink , GT ... external terminal, W ... bonding wire.

Claims (3)

In a hybrid integrated circuit device including a substrate on which various electronic components including a heating element and a temperature detection element that detects temperature in the vicinity of the heating element are mounted.
As one of the various electronic components, an arithmetic element that takes in temperature information detected by the temperature detection element and corrects the temperature information is provided, and the arithmetic element has the temperature detected by the temperature detection element. The amount of increase in temperature for each elapsed time from when the power supply to the heating element is started is obtained from the temperature information by the temperature detection element, and the obtained amount of increase in temperature, the elapsed time, the heating element, and the temperature The heat generation is performed by dividing a transmission temperature ratio, which is a ratio of a degree of temperature transmission from the heat generation element to the temperature detection element, which is determined each time based on a heat transfer environment including a distance between the temperature detection element and the temperature detection element. The hybrid integrated circuit device, wherein temperature information of the heating element is detected through a correction calculation for calculating a temperature increase amount of the element for each elapsed time . The arithmetic element is provided as a control element that performs power control on the heat generating element together, and calculates the difference between the time when the temperature information is taken in by the temperature detecting element and the time when the power supply to the heat generating element is started. The hybrid integrated circuit device according to claim 1, wherein the elapsed time is calculated . The heating element, the hybrid integrated circuit device according to claim 1 or 2 ing the power device is a power supply device.

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