JP4365808B2 - Integrated circuit socket probe - Google Patents

Description

  According to the present invention, a surface mounting integrated circuit (hereinafter referred to as an IC package) such as an LGA integrated circuit or a BGA integrated circuit is accommodated in a socket mounted on a printed circuit board. It is related with improvement of the probe of the socket for integrated circuits accommodated in the said socket for electrically connecting with the pattern of this.

  As a conventional integrated circuit socket, there is an invention disclosed in Japanese Patent Application Laid-Open No. 2000-340326 filed by the applicant company. This integrated circuit socket has the structure shown in FIGS. That is, it is composed of a pair of base plates 2 in which the probes 1 are accommodated and a frame body 4 that accommodates an IC package 3 that is an LGA integrated circuit or a BGA integrated circuit on the base plate 2. The socket is fixed to the printed circuit board 5 by inserting a screw 6 from the frame 4 into the nut 5a soldered to the nut 5a and screwing it.

  Then, the IC package 3 is accommodated in the frame body 4, and the cover plate 7 is fixed to the upper surface of the frame body 4 using screws 8, so that the IC package 3 is accommodated in the frame body 4. Thus, the bump 3a of the IC package 3 is electrically connected to the pattern formed on the printed circuit board 5 through the probe 1.

  Here, the shape of the probe 1 accommodated in the holes 21a and 22a formed in the lower base plate 21 and the upper base plate 22 will be described. The cylindrical body 11 and the upper and lower ends of the cylindrical body 11 are slidable. The first and second terminals 12 and 13 are accommodated, and the spring 14 is accommodated in the cylindrical body 11 and the first and second terminals 12 and 13 are spring-biased in the protruding direction. ing.

  The front end surface of the first terminal 12 is formed by a cutting tool A in which a cutting edge that cuts the workpiece by rotating is formed on both blades, and the angle of the both blades is, for example, 25 degrees. It is cut into a shape. Thereby, four angle teeth of the same height are formed at the tip of the first terminal 12 (see FIG. 8).

Therefore, when the IC package 3 is accommodated in the frame 4 and closed with the lid plate 7, the bump 3 a of the IC package 3 comes into contact with the chevron formed on the bump receiver 12 b of the first terminal 12. Are all the same height, the first terminal 12 descends vertically in the cylindrical body 11 against the spring force of the spring 14.
JP2000-340326

  By the way, the current flow from the bump 3 a of the IC package 3 to the pattern of the printed circuit board 5 changes from the bump 3 a to the pattern of the printed circuit board 5 through the first terminal 12, the cylindrical body 11, and the second terminal 13. Although it flows, since the 1st, 2nd terminals 12 and 13 slide in the inside of the cylindrical body 11, it is necessary to interpose a clearance gap between both. The current also flows through the spring 14, but since the spring 14 has a long overall length, the resistance value becomes high. In order to reduce the overall resistance value, it is necessary to flow through the cylindrical body 11.

  For this purpose, when the bump 3a abuts against the same height of the bump receiver 12b of the first terminal 12 and lowers the first terminal 12 vertically, the inside of the cylindrical body 11 and the periphery of the first terminal 12 are moved. The contact with the surface becomes unstable, that is, the first terminal 12 and the cylindrical body 11 may or may not come into contact with each other. There is a problem that the resistance value cannot be kept low due to the flow through the spring 14.

  The present invention is intended to solve the above-described problems. The object of the present invention is to make the bumps of the IC package into bump receivers by making the heights of the bump receiving teeth of the first terminals different. Since the first terminal is inclined in the cylindrical body in the contact state, the first terminal and the inner peripheral surface of the cylindrical body come into contact with each other, and the contact resistance value can be suppressed low. Therefore, an object of the present invention is to provide an integrated circuit socket probe capable of obtaining stable characteristics.

The probe portion of the socket for an integrated circuit according to the present invention achieves the above-mentioned object, and the means of claim 1 is slid with the heads protruding from both ends in the cylindrical body accommodated in the socket. A first terminal that abuts against a bump of an IC package that can be accommodated, a second terminal that abuts against a pattern on the printed circuit board, and a spring that biases the first and second terminals in a protruding direction. A probe for an integrated circuit socket, wherein a plurality of angle teeth are formed on a circumference of a tip of the head of the first terminal, heights of the angle teeth are made different, and the bumps are brought into contact with the bumps. When the first terminal has a height of the angle teeth, the first terminal is inclined with respect to the cylindrical body so as to contact the opening and the inner peripheral surface of the cylindrical body. To do.

According to a second aspect of the present invention, in the first aspect of the invention, a plurality of angle teeth are formed on the circumference of the tip of the head of the second terminal, the height of the angle teeth is different, and the print Since the height of the chevron differs when brought into contact with the pattern of the substrate, the second terminal is inclined with respect to the cylindrical body so as to be in contact with the opening and the inner peripheral surface of the cylindrical body. And

According to a third aspect of the present invention, in the first aspect, the tip of the portion of the second terminal protruding from the cylindrical body is formed in a conical shape, and the conical shape of the tip is shifted from the center. Since the second terminal is eccentric when it is eccentric and contacted with the pattern of the printed circuit board, the second terminal is inclined with respect to the cylindrical body, and the opening and inner peripheral surface of the cylindrical body It is characterized by being in contact.

  As described above, in the present invention, when the tip of the first terminal comes into contact with the bump in a state where the IC package is accommodated in the frame, the first terminal is inclined in the cylindrical body. It becomes a contact state. Accordingly, the contact resistance value is lowered and stable characteristics can be obtained.

  Further, when the second terminal comes into contact with the pattern of the printed circuit board, the second terminal also tilts in the cylindrical body, so that the second terminal is in contact with the cylindrical body. Accordingly, the first terminal and the second terminal are brought into contact with the cylindrical body, so that the contact resistance value is further lowered and stable characteristics can be obtained.

  According to the present invention, when a plurality of teeth are formed at the tip of the head of the first terminal, the height of the teeth is different, and the first terminal is brought into contact with the bump of the IC package. It was made to incline with respect to the inner peripheral surface of the cylindrical body.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an integrated circuit socket probe according to the present invention will be described with reference to FIGS. Note that the same reference numerals as those of the above-described conventional example denote the same parts, and description thereof is omitted.
In the present invention, what is different from the prior art is that the tip surface of the first terminal 12 is cut into a cross shape to form four angle teeth and the heights of the angle teeth are made different.

  Next, in order to explain the method of forming the cheek teeth of different heights, the base 12a of the first terminal 12 consisting of the base 12a and the tip 12b (0.34φ in the case of FIG. 1) is cured. Fix with tools. Next, the rotating tool A is fixed while rotating the double-edged cutting tool A on which the blades of inclined surfaces with different angles (25 ° and 30 ° in the embodiment) formed on the disk-shaped circumferential surface by rotating are rotated. The first terminal 12 is cut to a desired depth with respect to the center of the tip surface of the tip 12b. Thereby, one groove | channel from which inclination differs in the front-end | tip part 12b is formed.

  Next, the first terminal 12 is turned 90 ° to perform the same cutting as the cutting amount on the center of the tip surface. In this way, by forming two grooves orthogonal to the tip portion 12b of the first terminal 12, four chevron teeth a to d are formed and between the two chevron teeth a and d facing each other. A difference of approximately 0.05 mm occurs in the other, and the two opposing chevron b, c are the same height, and a difference of approximately 0.029 mm occurs between the chevron a. It will be.

  The tip of the tip portion 13b of the second terminal 13 is formed in a conical shape. However, a tip having the same shape as the first terminal 12 may be used, and as shown in FIG. It is good also as a shape which shifted the tip of shape from the center.

  The first and second terminals 12 and 13 formed as described above are slidably inserted into the cylindrical body 11 with a spring 14 interposed therebetween as shown in FIG. The probe 1 is manufactured so as to be narrowed and not come out (see FIG. 1).

  The probe 1 is accommodated in the base plate 2 of the integrated circuit socket shown in the conventional example, the IC package 3 is accommodated in the frame body 4 in a state of being fixed to the printed circuit board, and the lid plate 7 is attached to the frame. When fixed to the body 4, the tip of the second terminal 13 contacts the pattern of the printed circuit board 5. On the other hand, the angle teeth ad of the first terminal 12 come into contact with the bump 3a. Here, the height of the angle teeth ad varies, and therefore the first terminal 12 is inclined with respect to the cylindrical body 11. In this state, the cylindrical body 11 descends against the spring force of the spring 14, so that the outer peripheral surface of the base 12a of the first terminal 12 and the inner peripheral surface of the cylindrical body 11 are in contact with each other (see FIG. 2). .

  Therefore, since the contact resistance as the probe 1 is reduced and a stable contact state is obtained, the pattern of the printed circuit board 5 and the bump 3a of the IC package 3 are connected with a stable low resistance.

  Although the contact resistance between the first terminal 12 and the cylindrical body 11 is small, the second terminal 13 and the pattern of the printed board 5 shown in FIG. Since the terminal 13 rises in a vertical state, it is difficult to obtain a stable contact state with the cylindrical body 11. Therefore, the second terminal 13 is the same as the first terminal 12, or the eccentric second terminal 13 in which the tip of the cone shown in FIG. Since the second terminal 13 is also inclined with respect to the cylindrical body 11, the contact resistance is reduced, the contact resistance of the entire probe is reduced, and a stable contact state is obtained.

  FIG. 4 shows that the diameter of the tip 12b of the first terminal 12 in the first embodiment is 0.34φ, whereas the tip 12b in this embodiment is as large as 0.38φ. In the manufacturing method, since the angle of the two blades of the cutting tool A is the same as described above, the heights of the teeth a and d are approximately 0.055 mm, and the heights of a, b, and c are approximately 0.032 mm. The other points are the same as the above-described embodiment.

  In FIG. 5, the diameter of the tip 12b of the first terminal 12 in the first embodiment is 0.34φ whereas the tip 12b in this embodiment is as small as 0.25φ. In the manufacturing method, since the angle of the two blades of the cutting tool A is the same as described above, the heights of the teeth a and d are approximately 0.037 mm, and the heights of a, b, and c are approximately 0.022 mm. The other points are the same as the above-described embodiment.

  4 and 5, the second terminal 13 may have a conical tip formed in the same manner as in FIGS. 1 and 2 in the first embodiment. The same shape as the first terminal 12 having a different chevron may be used, or the conical tip may be eccentric.

  In the embodiment described above, the blades of the cutting tool have been described as being 25 ° and 30 °. However, since the height of the plurality of angle teeth only needs to be different, the angle of the both blades is not limited to the above angle. . In addition, the number of the chevron is not limited to four, and it may be any number of three or more because the chevron abuts against the bump and the first terminal 12 is inclined with respect to the cylindrical body 11. Four are preferred because they are very easy to manufacture. Further, the cutting tool may be one that can form a known groove, instead of a rotating disk.

It is sectional drawing which shows the 1st Example of the probe of the socket for integrated circuits which concerns on this invention. It is sectional drawing which shows the state which the 1st terminal in the probe same as the above contact | abutted to the bump and inclined with respect to the cylindrical body. It is sectional drawing of the Example from which the 2nd terminal in FIG. 1 differs. It is sectional drawing in case the outer diameter of the front-end | tip part in a 1st terminal is large. It is sectional drawing in case the outer diameter of the front-end | tip part in a 1st terminal is small. It is sectional drawing of the socket for integrated circuits in the past. It is a disassembled sectional view of the principal part same as the above. It is explanatory drawing which shows the mountain tooth in the conventional 1st terminal.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe 11 Cylindrical body 12 1st terminal 12a Base part 12b Tip part 13 2nd terminal 13a Base part 13b Tip part 14 Spring ad

Claims (3)

A first terminal that abuts against a bump of an IC package that is slidably accommodated in a state in which the head is protruded from both ends of the cylindrical body accommodated in the socket, and a second terminal that abuts against a pattern of the printed circuit board An integrated circuit socket probe comprising a spring for biasing the first and second terminals in a protruding direction, wherein a plurality of teeth are provided on a circumference of a head tip of the first terminal. The first terminal is inclined with respect to the cylindrical body because the height of the chevron is different from the height of the chevron, and the height of the chevron is different when the bump is in contact with the bump. A probe for an integrated circuit socket, wherein the probe is in contact with an opening and an inner peripheral surface of the cylindrical body. When a plurality of chevron is formed on the circumference of the tip of the head of the second terminal, the height of the chevron is different, and the height of the chevron is brought into contact with the pattern of the printed circuit board. 2. The integrated circuit socket probe according to claim 1, wherein the second terminal is inclined with respect to the cylindrical body so as to come into contact with the opening and the inner peripheral surface of the cylindrical body.   The tip of the portion of the second terminal protruding from the cylindrical body has a conical shape, is eccentric so that the conical tip is shifted from the center, and abuts against the pattern of the printed circuit board. The second terminal is tilted with respect to the cylindrical body because the second terminal is eccentric, so that the opening and the inner peripheral surface of the cylindrical body are brought into contact with each other. Integrated circuit socket probe.

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