JP4356419B2 - Induction heating cooker - Google Patents

Description

  The present invention relates to an induction heating cooker using an infrared sensor.

  In the conventional induction heating cooker, a temperature sensor such as a thermistor is brought into contact with a top plate on which the pan is placed to detect the temperature of the pan.

  Moreover, in order to improve the responsiveness of temperature detection of a pan, the temperature of the pan was detected by detecting the infrared intensity output from the pan with an infrared sensor (see, for example, Patent Document 1).

  Hereinafter, an induction heating cooker having a conventional configuration will be described with reference to FIG. In the figure, 41 is a load pan, 42 is a top plate on which the load pan 41 is placed, 43 is a heating coil for heating the load pan 41, 44 is an infrared sensor for detecting infrared intensity from the load pan 41, and 45 is an infrared sensor 44. , An amplifying means for amplifying the output from the infrared sensor 44, and a control means for controlling the current supply to the heating coil 43 according to the output from the infrared sensor 44.

In the induction heating cooker configured as described above, since the temperature of the load pan 41 is directly detected by infrared rays radiated from the bottom of the pan, it is possible to perform temperature detection with excellent thermal responsiveness.
Japanese Examined Patent Publication No. 4-39197

  However, in the conventional configuration, since the infrared sensor 44 detects infrared radiation from the load pan 41 through the gap between the heating coils 43, there is a problem that it is easily affected by the temperature of peripheral members such as the heating coil 43.

  Further, when the infrared sensor 44 is mounted in an inclined state, the temperature of the temperature detection portion at the bottom of the pan is shifted and the temperature of a portion having a different temperature distribution is measured, or the influence of infrared radiation from other than the pan bottom is further affected. For example, there is a problem that accurate temperature detection cannot be performed.

  Further, since the distance from the top plate 42 to the infrared sensor 44 varies, there is a problem in that the infrared intensity incident on the infrared sensor 44 from the load pan 41 varies and accurate temperature detection cannot be performed.

  Further, if the infrared sensor 44 is brought close to the heating coil 43 in order to increase the intensity of the infrared light incident on the infrared sensor 44 from the load pan 41, the temperature cannot be detected accurately due to the influence of radiation noise from the heating coil 43. There was a problem.

  The present invention solves the above-mentioned problems, and stably detects infrared radiation from the pan, and improves the temperature detection accuracy by the infrared sensor by reducing the influence of infrared detection due to unnecessary radiation from the heating coil. An object is to provide an induction heating cooker.

In order to solve the conventional problems, an induction heating cooker according to the present invention heats a top plate and a pan placed on the top plate when a high-frequency current is supplied below the top plate. a heating coil, a heating coil support base for supporting the heating coil, an infrared sensor for detecting infrared rays emitted transmitted through the top plate from the pan bottom of the pot, a waveguide for guiding the infrared to the infrared sensor Amplifying means for amplifying the output of the infrared sensor; temperature calculating means for calculating the temperature of the pan bottom by inputting the output of the amplifying means; and from the heating coil in accordance with the output from the temperature calculating means A control means for controlling the heating output, a printed wiring board for fixing the infrared sensor and the amplifying means, and a printed wiring board made of a metal material from the heating coil. Provided that suppresses magnetic shield means unwanted radiation of the plate, the said magnetic shielding means Utotomoni covering the printed circuit board periphery of the top surface is bent on the printed wiring board side, said printed wiring board and said magnetic shielding means It is attached to the lower part of the heating coil support, and the upper surface of the magnetic shield means is lower than the upper surface of the waveguide so that the upper surface of the waveguide approaches the bottom of the pan.

As a result, the upper surface of the magnetic shielding means is made lower than the upper surface of the waveguide so that the upper surface of the waveguide is brought close to the bottom of the pan, and the waveguide guides infrared radiation from the pan to the infrared sensor. The temperature at the bottom of the pan can be detected without being affected by infrared radiation, and it is equipped with a magnetic-shielding means that is made of metal and suppresses unwanted radiation from the heating coil to the printed wiring board. By being bent to the side of the board , unnecessary radiation from the heating coil to the infrared sensor can be suppressed, and by further fixing the infrared sensor and the amplifying means on the same printed wiring board, the amplifying means from the infrared sensor. Since it is possible to reduce noise superimposition on the wiring up to, it is possible to improve the temperature detection accuracy by the infrared sensor.

  In addition, by attaching the printed wiring board to the lower part of the heating coil support base, it is possible to suppress variations in the angle between the heating surface and the light receiving surface of the infrared sensor and the variation in the distance from the top plate to the infrared sensor. Detection accuracy can be improved.

In the induction heating cooker of the present invention, an infrared sensor and an amplifying means are arranged on a printed wiring board covered with a magnetic shielding means whose outer periphery is bent toward the printed wiring board and whose upper surface is lower than the upper surface of the waveguide. while reducing the influence of unwanted radiation from the heating coil by fixing leads to infrared rays radiated from the pot bottom in waveguides closer to the upper surface to the pan bottom in the infrared sensor, and an infrared sensor is fixed printed since improving the mounting accuracy of the infrared sensor by attaching a wiring board to the heating coil support base bottom can detect infrared radiation from the pot stably, it is possible to improve the temperature detection accuracy of the infrared sensor.

The first invention includes a top plate, a heating coil that is provided below the top plate and that heats a pan placed on the top plate when a high-frequency current is supplied thereto, and a heating coil support that supports the heating coil An infrared sensor that detects infrared rays emitted from the bottom of the pan and transmitted through the top plate, a waveguide that guides the infrared rays to the infrared sensor, amplification means that amplifies the output of the infrared sensor, Temperature calculating means for calculating the temperature of the pan bottom by inputting the output of the amplifying means, control means for controlling the heating output from the heating coil in accordance with the output from the temperature calculating means, the infrared sensor, and the amplification A printed wiring board for fixing the means, and a magnetic shielding means that is made of a metal material and suppresses unnecessary radiation from the heating coil to the printed wiring board. The magnetic shielding means Utotomoni covering the printed circuit board periphery of the top surface is bent on the printed wiring board side, the printed wiring board and said magnetic shielding means, by being attached to the heating coil support base bottom, from the bottom of the pan The emitted infrared light is guided to the infrared sensor from the vicinity of the pan bottom by the waveguide, and the temperature of the pan bottom can be detected without the infrared sensor being affected by the infrared radiation from the peripheral member such as a heating coil. Furthermore, by fixing the infrared sensor and the amplifying means on the same printed wiring board, it is possible to reduce the superimposition of noise on the wiring from the infrared sensor to the amplifying means, and to improve the temperature detection accuracy by the infrared sensor.

  In addition, by attaching a printed wiring board to the lower part of the heating coil support base, variations in the angle between the heating surface and the light receiving surface of the infrared sensor and variations in the distance from the top plate to the infrared sensor are suppressed, and temperature detection accuracy by the infrared sensor is improved. Can be improved.

Further, with the suppressing magnetic shielding means unwanted radiation from the heating coil formed of a metal material to the printed wiring board, said magnetic shielding means that will covering the printed circuit board periphery of the top surface is bent on the printed wiring board side Thus, noise superimposed on components and patterns on the printed wiring board from the heating coil can be reduced. Even if the magnetic shield means is lower than the upper surface of the waveguide and the printed wiring board and the magnetic shield means are attached to the lower part of the heating coil support base, the magnetic shield means is larger than the gap of the heating coil for detecting infrared rays. The infrared radiation can be guided from the vicinity of the pan bottom to the infrared sensor with the top surface of the waveguide approaching the load pan, and the temperature detection accuracy of the infrared sensor can be improved.

In the second invention, in particular, the first invention is configured to have a holding means for holding at least one of the infrared sensor and the waveguide on the printed wiring board, whereby the temperature detection portion of the pan bottom varies. And the temperature detection accuracy of the infrared sensor can be improved.

In the third invention, in particular, in the first or second invention, the lower end of the magnetic shield means is located below the lower surface of the printed wiring board, so that the parts and patterns on the surface opposite to the infrared sensor of the printed wiring board can be obtained. it is possible to further reduce the noise superimposed, and since the construction of that fitted inside the printed wiring board of a magnetic-shield means, it is possible to reduce the arrangement variations of the printed circuit board and a magnetic-shield means, the infrared sensor The temperature detection accuracy can be improved.

A fourth invention is, in particular, waveguides the invention of the first or 3, by Rukoto consists of a cylindrical inner surface formed in the magnetic shielding means, noise superimposed from the heating coil to the components and the pattern on the printed circuit board The temperature detection accuracy of the infrared sensor can be improved with a simple configuration.

In the fifth aspect of the invention, in particular, the fourth aspect of the invention is configured such that the magnetic shield means, the heating coil support base, and the printed wiring board can be fastened together. The light receiving surface angle of the infrared sensor, the inclination angle variation of the waveguide, and the distance variation from the top plate to the infrared sensor can be suppressed, and the temperature detection accuracy by the infrared sensor can be improved.

According to a sixth aspect of the invention, in particular, the fifth aspect of the invention is provided with an adjusting unit that is disposed on the same printed wiring board as the infrared sensor and the amplifying unit, and adjusts the amplification degree of the amplifying unit. By providing a notch that can be adjusted by the adjusting means by inserting a screwdriver or the like in the vicinity, the waveguide can be adjusted with the magnetic-shielding means attached, so that the reflectance variation of the waveguide can be adjusted. The temperature detection accuracy by the infrared sensor can be improved. In addition, the seventh invention includes, in particular, the temperature detection means for detecting the temperature in the vicinity of the infrared sensor and the correction means for correcting the output from the infrared sensor according to the temperature detected by the temperature detection means. With this configuration, the temperature characteristics of the infrared sensor can be reduced, and the adjustment can be performed in a state where the influence of the ambient temperature during adjustment is also corrected by the adjusting means.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, this invention is not limited by this embodiment.

(Embodiment 1)
FIG. 1 is a sectional view showing a reference embodiment of the present invention.

  In FIG. 1, 11 is a load pan, 12 is a top plate on which the load pan 11 is placed, 13 is a heating coil for heating the load pan 11, 14 is a heating coil support for supporting the heating coil 13, and 15 is a load pan 11. Quantum type sensors are used as infrared sensors for detecting infrared radiation from the infrared rays. Reference numeral 16 denotes a waveguide that guides infrared rays from the load pan 11 to the infrared sensor 15 and is formed of a metal cylinder having high reflectivity. Reference numeral 17 denotes a printed wiring board for fixing the infrared sensor 15, which is fastened to the heating coil support 14 with screws 18. Reference numeral 19 denotes a holding means for holding the infrared sensor 15 and the waveguide 16, and the holding means 19 is fixed to the printed wiring board 17. Reference numeral 20 denotes a magnetic shielding means for preventing noise from the heating coil 13 to the printed wiring board 17 and is made of a metal material.

  FIG. 2 is a block diagram according to the first embodiment of the present invention.

  In FIG. 2, 21 is an amplifying means for amplifying the output from the infrared sensor 15 and is composed of an operational amplifier and a resistor, and further includes an adjusting means 22 consisting of a variable resistor. 23 is a temperature calculating means for calculating the temperature of the pan bottom based on the output from the infrared sensor 15, 24 is a control means for controlling the high-frequency current of the heating coil 13 based on a signal from the temperature calculating means 23, and 25 is a temperature near the infrared sensor 15. The temperature detecting means for detecting is composed of a thermistor and is fixed to the printed wiring board 17. Reference numeral 26 denotes correction means for correcting the output from the infrared sensor 15 in accordance with the output from the temperature detection means 25. The temperature calculation means 23, the control means 24, and the correction means 27 are constituted by a microcomputer.

  The operation | movement is demonstrated about the induction heating cooking appliance comprised as mentioned above.

  When the high frequency current is supplied to the heating coil 13, the load pan 11 placed above the heating coil 13 is heated. Infrared rays corresponding to the temperature of the pan are emitted from the bottom of the load pan 11, and the infrared rays emitted from the load pan 11 pass through the top plate 12 and are input to the infrared sensor 15. Since the waveguide 16 is interposed between the load pan 11 and the infrared sensor 15, the infrared sensor 15 is not affected by the infrared radiation from the heating coil 13 or the heating coil support 14, and the load pan 11 is not affected by the infrared radiation. Infrared radiation can be detected.

  The infrared sensor 15 is fixed to the printed wiring board 17 through the holding means 19, and the printed wiring board 17 is fixed to the lower column portion of the heating coil support base 14, and the heating coil support base 14 has the top plate 12 on the upper surface. The mounting error of the distance from the top plate 12 to the heating coil 13 and the infrared sensor 15 and the angle between the top plate 12 and the infrared sensor 15 is very small. Infrared radiation from the load pan 11 centering on is detected at a position spaced apart by a fixed interval.

  Since the output signal from the infrared sensor 15 is a minute signal, the signal is amplified by the amplification means 21. The infrared sensor 15, the amplifying means 21, and the adjusting means 22 are fixed on the same printed wiring board 17 in order to suppress noise superposition on the wiring. The adjusting means 22 absorbs the sensitivity variation of the infrared sensor 15 and the amplification degree variation in the amplifying means 21 and adjusts the load pan 11 to obtain a predetermined output at a predetermined temperature. The infrared detection unit is composed of the components placed on the.

  Since the printed wiring board 17 is attached to the heating coil support 14 and is close to the heating coil 13 and is easily affected by unnecessary radiation from the heating coil 13, a magnetic-shielding means 20 is disposed on the printed wiring board 17. The unnecessary radiation component from the heating coil 13 is absorbed by the waveguide 16 and the magnetic shielding means 20 that cover the periphery of the infrared sensor 15.

  Here, when the shape of the waveguide 16 is formed in a double cylindrical shape as shown in FIG. 3, unnecessary radiation from the heating coil 13 is caused by the outer tube portion 16 a and the inner tube portion 16 b of the waveguide 16. It absorbs and the magnetic-shielding effect to the infrared sensor 15 becomes higher. Further, most of the unnecessary radiation from the heating coil 13 is absorbed by the outer tube portion 16a, and only the outer tube portion 16a rises in temperature due to self-heating, and the inner tube portion 16b has little self-heating and also transfers heat from the outer tube portion 16a. Therefore, the temperature rise due to unnecessary radiation of the heating coil 13 of the infrared sensor 15 is reduced.

  Further, if the outer periphery is bent toward the printed wiring board 17 as shown in FIG. 4, the shape of the magnetic shielding means 20 can absorb unnecessary radiation components that enter the side of the printed wiring board 17 from the outer periphery of the heating coil 13. As shown in FIG. 5, if the lower end of the magnetic shielding means 20 is configured to be below the lower surface of the printed wiring board 17, it is possible to absorb unnecessary radiation components that enter the lower side of the printed wiring board 17. Further, in the configuration shown in FIG. 5, the printed wiring board 17 is configured to fit within the magnetic shield means 20, and the mounting error between the printed wiring board 17 and the magnetic shield means 20 is extremely small.

  The output signal of the infrared sensor 15 amplified by the amplification means 21 is input to the temperature calculation means 23. At this time, the temperature in the vicinity of the infrared sensor 15 is detected by the temperature detection means 25, and a correction value considering the temperature characteristics of the infrared sensor 15 is output from the correction means 26. The temperature calculation means 23 calculates the temperature of the load pan 11 from the detection output of the infrared sensor 15 and the output of the correction means 26, and the control means 24 controls the current flowing through the heating coil 13 so as to be in the set heating state. .

  Even when adjustment is performed by the adjusting means 22, the temperature detection means 25 detects the temperature in the vicinity of the infrared sensor 15, and adjustment is performed in a state where the temperature is corrected by the correction means 26.

  As described above, in the present embodiment, the infrared sensor for detecting the infrared radiation guided by the waveguide and the amplification means are fixed by the printed wiring board, and the printed wiring board is attached to the lower part of the heating coil support base. With the configuration, the infrared radiation from the pan is guided to the infrared sensor from the vicinity of the pan bottom by the waveguide, so that the temperature of the pan bottom can be detected without being affected by the infrared radiation from the peripheral members such as the heating coil. The waveguide can suppress unwanted radiation from the heating coil to the infrared sensor, and by fixing the infrared sensor and the amplification means on the same printed wiring board, noise to the wiring from the infrared sensor to the amplification means The temperature detection accuracy by the infrared sensor can be improved.

  In addition, by attaching the printed wiring board to the lower part of the heating coil support base, it is possible to suppress variations in the angle between the heating surface and the light receiving surface of the infrared sensor and the variation in the distance from the top plate to the infrared sensor. Detection accuracy can be improved.

  In addition, the amplification degree can be adjusted by the adjustment means, and the adjustment means, the infrared sensor, and the amplification means are fixed on the same printed wiring board, so that the sensitivity variation of the infrared sensor and the amplification degree variation of the amplification means are increased. When replacing the infrared sensor, it is possible to incorporate it into the equipment with the variation always reduced by adjusting means by replacing the entire printed wiring board, and detecting it at the site of repair and service The temperature detection accuracy by the infrared sensor can be maintained without re-adjusting the accuracy.

  In addition, the temperature detection means detects the temperature near the infrared sensor, and the correction means corrects the output from the infrared sensor, so that the temperature characteristics of the infrared sensor can be reduced, and the adjustment means Adjustment can be made with the influence of ambient temperature during adjustment corrected.

  In addition, by configuring the waveguide in a double cylindrical shape, unnecessary radiation from the heating coil to the infrared sensor can be further reduced, and heat generation in the inner cylindrical part close to the infrared sensor can be suppressed. Since the heat generated in the outer cylindrical portion is difficult to transfer heat to the inside, the influence of the ambient temperature of the infrared sensor can be reduced and the temperature detection accuracy of the infrared sensor can be improved.

  In addition, by adopting a configuration in which at least one of the infrared sensor and the waveguide is held on the printed wiring board by the holding means, it is possible to reduce variations in the temperature detection portion of the pan bottom and improve the temperature detection accuracy of the infrared sensor. it can.

  Further, by providing a magnetic shielding means and configuring the upper surface of the magnetic shielding means to be lower than the upper surface of the waveguide, it is possible to reduce noise superimposed on components and patterns on the printed wiring board from the heating coil, and the magnetic shielding means Even when the gap is larger than the gap of the heating coil for infrared detection, infrared radiation can be guided from the bottom of the pan to the infrared sensor with the upper end of the waveguide close to the load pan, improving the temperature detection accuracy of the infrared sensor. can do.

  In addition, by adopting a configuration in which the outer periphery of the magnetic shielding means is bent toward the printed wiring board side, noise superimposed on components and patterns on the printed wiring board from outside the printed wiring board of the heating coil can be reduced. The temperature detection accuracy can be improved.

Further, by arranging the lower end of the magnetic shield means below the lower surface of the printed wiring board, it is possible to further reduce noise superimposed on components and patterns on the surface opposite to the infrared sensor of the printed wiring board, since the configuration of the inner printed circuit board fitted to the engagement of the magnetic shielding means, it is possible to reduce the arrangement variations of the printed circuit board and a magnetic-shield means, it is possible to improve the temperature sensing accuracy of the infrared sensor.

  Further, even if the heating coil support of the present embodiment is not applied to the top plate, the heating surface and the light receiving surface of the infrared sensor can be arranged as long as the distance and angle between the top plate and the heating coil are constant. The variation in angle and the variation in the distance from the top plate to the infrared sensor can be suppressed, and the temperature detection accuracy by the infrared sensor can be improved.

  The same effect can be obtained even when the infrared sensor of the present embodiment is not a quantum type but a pyroelectric element such as a thermopile.

(Embodiment 2)
FIG. 6 shows a cross-sectional view of the second embodiment of the present invention.

  In FIG. 6, the difference from the first embodiment is that the waveguide 16 and the magnetic shielding means 20 are integrally formed, and the waveguide 16 is formed on the inner surface of the cylindrical portion of the magnetic shielding means 20, and the printed wiring. The plate 17 and the magnetic shielding means 20 are configured to be fastened to the heating coil support with screws 18.

  The operation | movement is demonstrated about the induction heating cooking appliance comprised as mentioned above.

  The magnetic-shielding means 20 is configured integrally with the waveguide 16 and is configured to be completely magnetic-shielded except for the light receiving surface of the infrared sensor 15. Further, the printed wiring board 17 has a shape that can be accommodated in the magnetic shielding means 20, and the printed wiring board 17 is set on the magnetic shielding means 20 and attached to the heating coil support base 14 with screws 18, so that the number of parts during assembly is small. Easy assembly. Further, since the magnetic shield means 20 can be fastened together with the printed wiring board 17, the magnetic shield means 20 can be fixed stably, the mounting error in the angle and distance between the top plate 12 and the infrared sensor 15, and the inclination of the waveguide 16. Errors are also reduced.

  When the magnetic shield means 20 covers the printed wiring board 17, adjustment by the adjusting means 22 is difficult when the magnetic shield means 20 is attached. However, as shown in FIG. When the cutout portion 28 is provided, a driver or the like can be inserted from the cutout portion 28, and so as to absorb variations in sensitivity of the infrared sensor 15, amplification of the amplification means 21, and reflectivity of the waveguide 16. It can be adjusted by the adjusting means 22.

  As described above, in the present embodiment, by integrally configuring the waveguide and the magnetic shielding means, it is possible to further reduce noise superposition from the heating coil to the components and patterns on the printed wiring board. With this configuration, the temperature detection accuracy of the infrared sensor can be improved.

  In addition, by adopting a configuration in which the magnetic shield means, the heating coil support base, and the printed wiring board can be fastened together, even in the configuration in which the magnetic shield means is provided above the printed wiring board, the angle of the light receiving surface of the heating surface and the infrared sensor and the waveguide Variations in tilt angle and variations in distance from the top plate to the infrared sensor can be suppressed, and temperature detection accuracy by the infrared sensor can be improved.

  In addition, the magnetic-shielding means can be adjusted with the waveguide and the magnetic-shielding means attached by providing a notch in the vicinity of the adjusting means, thereby reducing the reflectance variation of the waveguide. Thus, the temperature detection accuracy by the infrared sensor can be improved.

  As described above, the induction heating cooker according to the present invention reduces the influence on the infrared detection due to unnecessary radiation from the heating coil, guides the infrared radiation from the pan to the infrared sensor with the waveguide, and the infrared sensor. By detecting the infrared radiation from the pan in a stable manner by improving the mounting accuracy of the pot, the temperature detection accuracy by the infrared sensor can be improved, and the cooking device with improved cooking performance in automatic cooking such as kettle, cooked rice, and pottery Can be provided.

It shows the induction heating cooker of a section definitive to form state of reference of the present invention The block diagram which shows the induction heating cooking appliance in Embodiment 1 of this invention The figure which shows the waveguide of the induction heating cooking appliance in Embodiment 1 of this invention The figure which shows the cross section of the induction heating cooking appliance in Embodiment 1 of this invention. The figure which shows the cross section of the induction heating cooking appliance in Embodiment 1 of this invention. The figure which shows the cross section of the induction heating cooking appliance in Embodiment 2 of this invention. The figure which shows the magnetic-shielding means of the induction heating cooking appliance in Embodiment 2 of this invention The figure which shows the cross section of the conventional induction heating cooking appliance

Explanation of symbols

DESCRIPTION OF SYMBOLS 13 Heating coil 14 Heating coil support stand 15 Infrared sensor 16 Waveguide 17 Printed wiring board 19 Holding means 20 Magnetic-shielding means 21 Amplifying means 22 Adjustment means 23 Temperature calculation means 24 Control means 25 Temperature detection means 26 Correction means

Claims (7)

A top plate; a heating coil that is provided below the top plate and that heats a pan placed on the top plate when a high frequency current is supplied; a heating coil support that supports the heating coil; An infrared sensor that detects infrared rays emitted from the bottom of the pan and transmitted through the top plate, a waveguide that guides the infrared rays to the infrared sensor, an amplification unit that amplifies the output of the infrared sensor, and an output of the amplification unit Temperature calculating means for calculating the temperature of the pan bottom, control means for controlling the heating output from the heating coil in accordance with the output from the temperature calculating means, printed wiring for fixing the infrared sensor and the amplifying means a plate formed of a metallic material and a magnetic shielding means for suppressing the unnecessary radiation to the printed circuit board from the heating coil, the magnetic shielding means Utotomoni periphery of the upper surface is bent on the printed wiring board side covering the printed wiring board, the printed wiring board and said magnetic shielding means is attached to the support under the heating coil, the upper surface of said magnetic shielding means the waveguide An induction heating cooker that is lower than the upper surface of the tube and the upper surface of the waveguide approaches the bottom of the pan. The induction heating cooker according to claim 1, further comprising holding means for holding at least one of the infrared sensor and the waveguide on the printed wiring board. The induction heating cooker according to claim 1 or 2, wherein the lower end of the magnetic shielding means is located below the lower surface of the printed wiring board. The induction heating cooker according to claim 1 or 3, wherein the waveguide is configured by an inner surface of a cylindrical portion formed in the magnetic shielding means. The induction heating cooker according to claim 4, wherein the magnetic shielding means, the heating coil support base, and the printed wiring board are fastened together with screws. An infrared sensor and an amplifying means are disposed on the same printed wiring board, and include an adjusting means for adjusting the amplification degree of the amplifying means, and the magnetic shield means inserts a driver or the like in the vicinity of the adjusting means to adjust the adjustment. The induction heating cooking appliance of any one of Claims 1-5 which provided the notch which can be adjusted with a means. The induction heating cooker according to claim 6, comprising temperature detection means for detecting a temperature in the vicinity of the infrared sensor and correction means for correcting an output from the infrared sensor in accordance with a temperature detected by the temperature detection means.

Images