JP4350242B2 - 超音波振動発生装置及び方法、並びにバンプ接合装置 - Google Patents

超音波振動発生装置及び方法、並びにバンプ接合装置 Download PDF

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Publication number
JP4350242B2
JP4350242B2 JP33776699A JP33776699A JP4350242B2 JP 4350242 B2 JP4350242 B2 JP 4350242B2 JP 33776699 A JP33776699 A JP 33776699A JP 33776699 A JP33776699 A JP 33776699A JP 4350242 B2 JP4350242 B2 JP 4350242B2
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Japan
Prior art keywords
voltage
ultrasonic
ultrasonic vibration
frequency
ultrasonic transducer
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Expired - Fee Related
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JP33776699A
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English (en)
Japanese (ja)
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JP2001149865A (ja
JP2001149865A5 (https=
Inventor
豊 光本
健二 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP33776699A priority Critical patent/JP4350242B2/ja
Publication of JP2001149865A publication Critical patent/JP2001149865A/ja
Publication of JP2001149865A5 publication Critical patent/JP2001149865A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

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  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Wire Bonding (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
JP33776699A 1999-11-29 1999-11-29 超音波振動発生装置及び方法、並びにバンプ接合装置 Expired - Fee Related JP4350242B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33776699A JP4350242B2 (ja) 1999-11-29 1999-11-29 超音波振動発生装置及び方法、並びにバンプ接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33776699A JP4350242B2 (ja) 1999-11-29 1999-11-29 超音波振動発生装置及び方法、並びにバンプ接合装置

Publications (3)

Publication Number Publication Date
JP2001149865A JP2001149865A (ja) 2001-06-05
JP2001149865A5 JP2001149865A5 (https=) 2006-11-24
JP4350242B2 true JP4350242B2 (ja) 2009-10-21

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ID=18311772

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Application Number Title Priority Date Filing Date
JP33776699A Expired - Fee Related JP4350242B2 (ja) 1999-11-29 1999-11-29 超音波振動発生装置及び方法、並びにバンプ接合装置

Country Status (1)

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JP (1) JP4350242B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1890031B (zh) * 2003-12-04 2010-09-29 皇家飞利浦电子股份有限公司 超声变换器和将倒装二维阵列技术应用于弯曲阵列的方法
JP4193734B2 (ja) * 2004-03-11 2008-12-10 株式会社島津製作所 質量分析装置
JP4585346B2 (ja) * 2005-03-24 2010-11-24 太平洋セメント株式会社 超音波モータの制御方法

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Publication number Publication date
JP2001149865A (ja) 2001-06-05

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