JP4350242B2 - 超音波振動発生装置及び方法、並びにバンプ接合装置 - Google Patents

超音波振動発生装置及び方法、並びにバンプ接合装置 Download PDF

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Publication number
JP4350242B2
JP4350242B2 JP33776699A JP33776699A JP4350242B2 JP 4350242 B2 JP4350242 B2 JP 4350242B2 JP 33776699 A JP33776699 A JP 33776699A JP 33776699 A JP33776699 A JP 33776699A JP 4350242 B2 JP4350242 B2 JP 4350242B2
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JP
Japan
Prior art keywords
voltage
ultrasonic
ultrasonic vibration
frequency
ultrasonic transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP33776699A
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English (en)
Japanese (ja)
Other versions
JP2001149865A (ja
JP2001149865A5 (enExample
Inventor
豊 光本
健二 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP33776699A priority Critical patent/JP4350242B2/ja
Publication of JP2001149865A publication Critical patent/JP2001149865A/ja
Publication of JP2001149865A5 publication Critical patent/JP2001149865A5/ja
Application granted granted Critical
Publication of JP4350242B2 publication Critical patent/JP4350242B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]

Landscapes

  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Wire Bonding (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
JP33776699A 1999-11-29 1999-11-29 超音波振動発生装置及び方法、並びにバンプ接合装置 Expired - Fee Related JP4350242B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33776699A JP4350242B2 (ja) 1999-11-29 1999-11-29 超音波振動発生装置及び方法、並びにバンプ接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33776699A JP4350242B2 (ja) 1999-11-29 1999-11-29 超音波振動発生装置及び方法、並びにバンプ接合装置

Publications (3)

Publication Number Publication Date
JP2001149865A JP2001149865A (ja) 2001-06-05
JP2001149865A5 JP2001149865A5 (enExample) 2006-11-24
JP4350242B2 true JP4350242B2 (ja) 2009-10-21

Family

ID=18311772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33776699A Expired - Fee Related JP4350242B2 (ja) 1999-11-29 1999-11-29 超音波振動発生装置及び方法、並びにバンプ接合装置

Country Status (1)

Country Link
JP (1) JP4350242B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7741756B2 (en) * 2003-12-04 2010-06-22 Koninklijke Philips Electronics N.V. Ultrasound transducer and method for implementing flip-chip two dimensional array technology to curved arrays
JP4193734B2 (ja) * 2004-03-11 2008-12-10 株式会社島津製作所 質量分析装置
JP4585346B2 (ja) * 2005-03-24 2010-11-24 太平洋セメント株式会社 超音波モータの制御方法

Also Published As

Publication number Publication date
JP2001149865A (ja) 2001-06-05

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