JP4350008B2 - Semiconductor device and camera module - Google Patents

Description

  The present invention relates to a semiconductor device and a camera module.

  In recent years, mobile phones and handy personal computers (portable personal computers) incorporating small cameras have been developed. For example, a mobile phone equipped with a small camera captures an image with a small camera and captures it as image data, and a caller transmits the image data to the other party. Such a small camera is generally composed of an image sensor and a lens formed as a CMOS sensor.

  Mobile phones and handy personal computers are being further miniaturized, and miniaturization is also required for the small cameras used in them. In order to satisfy such a demand for miniaturization of a camera, a camera module in which a CMOS sensor and a lens are integrally arranged has been developed.

  Such a camera module includes a BCC (bump chip carrier) package type semiconductor device, which is composed of a semiconductor element and a mold resin for sealing the semiconductor element. As a feature of the BCC package type, a protrusion is formed on the mold resin, and an external connection terminal is formed on the surface thereof. Moreover, the pattern wiring connected to the electrode of the semiconductor element is exposed on the surface of the mold resin. The pattern wiring and the external connection terminal on the protrusion are formed of a common metal film (see, for example, Patent Document 1).

  Such a semiconductor device is mounted on a wiring board by connecting an external connection terminal and a terminal of the wiring board. However, since the pattern wiring is exposed to the outside of the mold resin, when the external connection terminal and the terminal of the wiring board are joined by solder, the solder may come into contact with the pattern wiring, causing a short circuit between the terminals. Sometimes. In order to prevent such a short circuit, high-precision mounting is required.

  In addition, when a circuit pattern is exposed on the surface of the semiconductor device, it is known that the surface of the semiconductor device is entirely covered with an insulating film such as a photoresist (for example, see Patent Document 1).

JP 2004-103860 A (page 6-7, FIG. 5)

  An object of the present invention is to provide a semiconductor device and a camera module capable of preventing a short circuit between terminals when mounted on a wiring board even when a pattern wiring is exposed to the outside.

  A semiconductor device according to the present invention includes a semiconductor element, a mold resin for sealing the semiconductor element, a protrusion formed on the surface of the mold resin, and an electrode electrically connected to the electrode of the semiconductor element. Pattern wiring formed on the surface of the resin, external connection terminals formed on the projection and connected to the pattern wiring, and external connection on the projection so as to partially cover the pattern wiring And a ring-shaped insulating film disposed around the terminal.

  The camera module according to the present invention is electrically connected to a semiconductor element, a mold resin for sealing the semiconductor element, a protrusion formed on the surface of the mold resin, and an electrode of the semiconductor element. A pattern wiring formed on the surface of the mold resin, an external connection terminal formed on the projection and connected to the pattern wiring, and the projection on the projection so as to partially cover the pattern wiring. The semiconductor device includes a ring-shaped insulating film disposed around the external connection terminal. Further, the camera module is attached to the mold resin and carries a lens for imaging, and an imaging element is attached to the mold resin and has an imaging surface facing the imaging lens through an opening of the mold resin. And a wiring board having a terminal connected to an external connection terminal of the semiconductor device.

  According to this configuration, since the external connection terminals on the individual protrusions are surrounded by the ring-shaped insulating film, the solder material used for mounting is patterned when the semiconductor device is mounted on a wiring board or the like. Contact with the wiring and short circuit can be prevented. Furthermore, the terminal portion mounting strength can be improved.

  In addition, since only the portion around the protrusion, which is a part of the surface of the mold resin, is covered with the ring-shaped insulating film, the cost is lower than when the entire surface of the mold resin is covered. In addition, it is possible to perform an electrical test using a portion of the pattern wiring that is not covered or to mount an additional component.

  As described above, according to the present invention, it is possible to prevent a short circuit between terminals at the time of mounting on a wiring board even when the pattern wiring is exposed to the outside with a small structure.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a semiconductor device according to the present invention, and FIG. 2 is a plan view showing a surface (lower surface) of the semiconductor device of FIG.

  1 and 2, a semiconductor device 10 includes a semiconductor element 12 and a mold resin 14 that seals the semiconductor element 12 and forms a package. The semiconductor element 12 is sealed with a die attaching material 13 and a mold resin 14. Protrusions 16 project from the surface of the mold resin 14 (the lower surface in FIG. 1). The protrusion 16 is a portion made of the same material as the mold resin 14.

  An external connection terminal 18 that covers the surface of the protrusion 16 is provided on the protrusion 16. Further, the pattern wiring 20 is formed on the surface of the mold resin 14, and the pattern wiring 20 is electrically connected to the electrodes of the semiconductor element 12 by wires 22. The pattern wiring 20 and the external connection terminal 18 on the protrusion 16 are formed of a common metal film, and one external connection terminal 18 is electrically connected to one pattern wiring 20.

  The external connection terminals 18 are arranged in a grid array, and FIG. 2 shows the external connection terminals 18 in 4 columns and 4 rows as an example. As for the external connection terminals 18 in the upper left two columns and two rows in FIG. 2, the pattern wiring 20 extending from the external connection terminal 18 in the leftmost column extends right side from the external connection terminal 18. The pattern wirings 20 extending from the external connection terminals 18 in the second row are adjacent to each other and pass between the two external connection terminals 18 in the leftmost row. Accordingly, the pattern wiring 20 extending from the external connection terminal 18 in the second column from the left is close to the external connection terminal 18 in the leftmost column.

  Further, a ring-shaped insulating film 24 is provided around the external connection terminal 18 so as to partially cover the pattern wiring 20. The ring-shaped insulating film 24 prevents the external connection terminal 18 and the pattern wiring 20 extending from the other external connection terminal 18 in the vicinity thereof from coming into electrical contact via solder. That is, when the external connection terminal 18 of the semiconductor device 10 is joined to the terminal of the wiring board by solder, even if the solder flows so as to protrude from the external connection terminal 18 (18a), the other solder external to which the solder is close The pattern wiring 20 (20b) extending from the connection terminal 18 (18b) is not contacted, thereby preventing a short circuit.

  For example, the pitch between the two external connection terminals 18 is 0.5 mm to 1.0 mm, the diameter of the external connection terminals 18 is 0.3 mm to 0.5 mm, and the height is 0.05 mm to 0.10 mm. The ring-shaped insulating film 24 has a diameter of 0.5 mm to 1.0 mm and a height of 0.03 mm to 0.05 mm.

  FIG. 3 is a view showing a method of manufacturing the semiconductor device of FIGS. The semiconductor device 10 in FIGS. 1 and 2 is a semiconductor device called a BCC (bump chip carrier). In FIG. 3A, a resist 31 is applied to the copper frame 30 and patterned, and in FIG. 3B, the copper frame 30 is etched to form a recess 32. In FIG. 3C, the resist 31 is removed, the resist 33 is applied and patterned, and the copper frame 30 is nickel-plated (or nickel-plated and palladium-plated) to form the metal film 34. In FIG. 3D, the resist 33 is peeled off, and a lead frame composed of the copper frame 30 and the metal film 34 is completed. The metal film 34 is continuous with the surface portion 34 a of the recess 32 and the surface portion 34 a of the recess 32, and forms a high surface portion 34 b around the recess 32.

  In FIG. 3E, the semiconductor element 36 is diced using a dicing material 35. In FIG. 3F, the electrode of the semiconductor element 36 and the high surface portion 34 b around the recess 32 are wire-bonded by a wire 37. In FIG. 3G, the wire-bonded semiconductor element 36 is resin-sealed with a mold resin 38. In FIG. 3H, the copper frame 30 is removed by etching, and the semiconductor device 10 is completed.

  The semiconductor element 36 corresponds to the semiconductor element 12 of FIG. 1, and the mold resin 38 corresponds to the mold resin 14 of FIG. The portion of the mold resin 38 filled in the recess 32 becomes the protrusion 16 in FIG. 1, and the portion of the die attaching material 35 corresponds to the die attaching material 13 in FIG. A portion 34 a of the metal film 34 on the surface of the recess 32 becomes the external connection terminal 18 on the protrusion 16. After removing the copper frame 30, the high surface portion 34 b around the recess 32 of the metal film 34 is exposed on the surface of the mold resin 38 and becomes the pattern wiring 20 of FIG. 1.

  FIG. 4 is a diagram illustrating a process of forming a ring-shaped insulating film 24 disposed around the external connection terminal 18 on the protrusion 16. In the embodiment, an insulating material such as a photoresist is ejected around the protrusion 16 using the ink jet head 40 and printed. The inkjet head 40 is suitable for printing a small amount of insulating material in a defined pattern. The insulating film 24 can also be formed by means such as spin coating or screen printing. However, in order to form the insulating film 24 on the surface where the protrusions 16 are provided, the inkjet printing method is an inexpensive and reliable method. The ring-shaped insulating film 24 is preferably made of a thermoplastic resin, and is preferably melted and fixed by heating after the semiconductor device 10 is mounted on the wiring board.

  FIG. 5 is a diagram showing another example of the ring-shaped insulating film 24. In the embodiment shown in FIG. 2, the ring-shaped insulating film 24 is provided in close contact with the outer peripheral portion of the external connection terminal 18 on the protruding portion 16, but in the embodiment shown in FIG. The insulating film 24 is provided with a gap from the outer periphery of the external connection terminal 18 on the protrusion 16. Even in this configuration, the ring-shaped insulating film 24 can perform the same short-circuit preventing effect as described above.

  FIG. 6 is a view showing a camera module 50 including the semiconductor device 10 according to the present invention. As described above, the semiconductor device 10 includes a semiconductor element 12, a mold resin 14 that seals the semiconductor element 12, a protrusion 16 that is formed to protrude from the surface of the mold resin 14, The pattern wiring 20 electrically connected to the electrode and formed on the surface of the mold resin 14, the external connection terminal 18 formed on the protrusion 16 and connected to the pattern wiring 20, and the pattern wiring 18 are partially connected. A ring-shaped insulating film 24 disposed around the external connection terminal 18 on the protrusion 16 is provided so as to cover.

  The camera module 50 is attached to the mold resin 14 of the semiconductor device 10, is attached to the lens holder 54 that carries the imaging lens 52, and the mold resin 14, and faces the imaging lens 52 through the opening 56 of the mold resin 14. And an imaging device 58 having an imaging surface. Reference numeral 55 denotes a filter.

  Further, the camera module 50 includes a wiring board 62 having a terminal 60 connected to the external connection terminal 18 of the semiconductor device 10. The wiring board 62 is made of a flexible printed board. The image sensor 58 is disposed in the opening of the wiring board 62 and is connected to the pattern wiring 18 of the semiconductor device 10 by the bumps 64. The external connection terminal 18 of the semiconductor device 10 is connected to the terminal 60 of the wiring board 62 by solder. For this reason, the melted solder may protrude from the external connection terminals 18 on the protrusions 16 and contact other pattern wirings 18 as described above to cause a short circuit. Since there is the ring-shaped insulating film 24 arranged, such a short circuit can be prevented.

FIG. 1 is a sectional view showing a semiconductor device according to the present invention. FIG. 2 is a plan view showing the surface (lower surface) of the semiconductor device of FIG. FIG. 3 is a view showing a method of manufacturing the semiconductor device of FIGS. FIG. 4 is a diagram illustrating a process of forming a ring-shaped insulating film disposed around the protrusion. FIG. 5 is a diagram showing another example of a ring-shaped insulating film. FIG. 6 is a view showing a camera module including a semiconductor device according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Semiconductor device 12 Semiconductor element 14 Mold resin 16 Protrusion part 18 External connection terminal 20 Pattern wiring 22 Wire 24 Insulating film 40 Inkjet head 50 Camera module 52 Imaging lens 54 Lens holder 56 Opening 58 Imaging element 60 Terminal 62 Wiring board

Claims (5)

A semiconductor element;
A mold resin for sealing the semiconductor element;
A protrusion formed on the surface of the mold resin,
A pattern wiring electrically connected to the electrodes of the semiconductor element and formed on the surface of the mold resin;
An external connection terminal formed on the protrusion and connected to the pattern wiring;
And a ring-shaped insulating film disposed around the external connection terminal on the protrusion so as to partially cover the pattern wiring.   2. The semiconductor device according to claim 1, wherein the ring-shaped insulating film around the protrusion is formed by ink jetting.   The semiconductor device according to claim 1, wherein the ring-shaped insulating film is provided with a gap from an outer peripheral portion of the external connection terminal on the protrusion.   2. The semiconductor device according to claim 1, wherein the ring-shaped insulating film is made of a thermoplastic resin, and is melted and fixed by heating after the semiconductor device is mounted on a wiring board. A semiconductor element, a mold resin for sealing the semiconductor element, a protrusion formed on the surface of the mold resin, and an electrode electrically connected to the electrode of the semiconductor element, formed on the surface of the mold resin A pattern wiring, an external connection terminal formed on the projection and connected to the pattern wiring, and a ring disposed around the external connection terminal on the projection so as to partially cover the pattern wiring A semiconductor device provided with an insulating film, and
A lens holder attached to the mold resin and carrying an imaging lens;
An imaging element attached to the mold resin and having an imaging surface facing the imaging lens through an opening of the mold resin;
A camera module comprising: a wiring board having a terminal connected to an external connection terminal of the semiconductor device.

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