JP4340276B2 - Suction head for semiconductor chip - Google Patents

Description

  The present invention relates to a suction head for sucking a semiconductor chip obtained by cutting a wafer and transferring the semiconductor chip to be mounted and fixed on a substrate.

  In the semiconductor component manufacturing process, the manufactured wafer is divided into a large number of semiconductor chips (dicing process), and then the divided semiconductor chips are transferred to the circuit board and fixed on the circuit board (die bonding process). Has been done. In these processes, the suction head for sucking and holding (pickup) the semiconductor chip on the stage using vacuum suction force, and then transferring the semiconductor chip onto the substrate and mounting and fixing it on the substrate. Is used.

  This type of suction head is mounted on the holding means and moved in the vertical and horizontal directions, and is connected to the vacuum suction means in order to obtain a suction force using the vacuum pressure. More specifically, the suction head includes a probe having a suction hole for vacuuming outside air. When picking up a semiconductor chip, the suction head is lowered, the probe is brought into contact with the semiconductor chip, and a suction force is applied to suck the semiconductor chip. In order to reliably adsorb the semiconductor chip with the probe, it is required to suck the semiconductor chip with the probe while applying a slight pressure from above. Also, when the semiconductor chip is bonded to the substrate, it is necessary to perform thermocompression bonding in a state where the semiconductor chip is pressed onto the circuit substrate from above with a proper pressure (bonding pressure).

  From the above points, some of the conventional suction heads adopt a configuration in which a downward force is applied to the probe by a spring in order to apply an appropriate pressing force to the semiconductor chip by the probe ( For example, see Patent Documents 1 and 2.)

In such a suction head, a probe is provided in a housing so as to be vertically movable, and a compression coil spring is mounted between the probe and its support member, and the probe head abuts on the semiconductor chip during suction or bonding of the semiconductor chip. At this time, the probe head is applied with a downward force by a spring so that an appropriate pressing force is applied to the semiconductor chip. The spring also has a function of relaxing the impact force when the probe head comes into contact with the semiconductor chip.
Japanese Patent Publication No. 7-101697 JP-A-11-238786

  However, the configuration in which a downward force is applied to the probe using a spring has the following problems.

  That is, the magnitude of the impact force when the probe descends and contacts the semiconductor chip is related to the spring force. When the spring force is large, the impact force applied to the probe also increases, and the degree of wear of the probe increases. In order to prevent this, in order to weaken the force of the spring, it is necessary to reduce the wire diameter of the spring and increase the effective diameter. However, when the effective diameter of the spring is increased, the space for arranging the spring in the suction head is increased, and the entire suction head is increased in size, making it difficult to arrange a plurality of springs in parallel. In particular, since the semiconductor chip is a very small component, the suction head is also required to be downsized.

  Further, since the spring itself is always directly subjected to an impact force, the metal fatigue is advanced and there is a problem in terms of durability.

  From the above points, there is a problem that the life of the suction head is short and the replacement period is short.

  The present invention has been made based on the above circumstances, and an object thereof is to provide a suction head for a semiconductor chip that can be reduced in size and improved in life.

  According to a first aspect of the present invention, there is provided a semiconductor chip suction head for sucking a semiconductor chip, transferring the semiconductor chip, and placing and fixing the semiconductor chip on a substrate, a housing having a suction path on which a suction force from a suction means acts, A probe that is movably provided in the housing and has a suction hole that communicates with the suction path, and that is fixed to the housing, and a probe that sucks the semiconductor chip with a suction force acting from the suction hole. A second magnet disposed on the probe so as to generate a magnetic repulsive force between the first magnet and the first magnet, and applying a force in one direction of movement to the probe by the magnetic repulsive force. And a magnet.

  According to a second aspect of the present invention, there is provided a semiconductor chip suction head for sucking a semiconductor chip, transferring the semiconductor chip, and placing and fixing the semiconductor chip on the substrate, and has a probe insertion hole at a lower end and a suction means at an upper end. There is provided an insertion port through which a suction pipe communicating with the housing is formed, and an internal space is formed therebetween, and a suction path that is fixed to the upper side of the internal space of the housing and communicates the upper and lower spaces. The formed holder and a lower side of the inner space of the housing are provided so as to be movable up and down, and a lower end projects through the probe insertion hole and protrudes to the outside of the housing, and the suction force of the suction path is transmitted to the housing. A probe having a suction hole that acts from the internal space to the outside, a first magnet attached to a side of the holder facing the probe, and the first magnet A second magnet attached to the probe so that the same poles face each other, and the probe attracts the semiconductor chip at the lower end by an attractive force acting from the suction hole, and the first magnet And a magnetic repulsive force generated between the second magnet and the second magnet, and is biased toward the lowered position.

  The housing is divided into, for example, a lower housing and an upper housing, and the lower housing and the upper housing are detachably coupled, and the holder includes, for example, the coupled lower housing and the upper housing. It can be configured to be sandwiched between.

  In addition, a guide portion extending in the vertical direction is formed on the holder, for example, and a guide portion extending in the vertical direction and engaged with the guide portion of the holder so as to be movable up and down is formed on the holder. You may comprise.

  The housing is divided into, for example, a lower housing and an upper housing, and the lower housing and the upper housing are detachably coupled, and the lower housing is, for example, opened at the upper end on the coupling side of the upper housing. The upper housing has, for example, an upper end that is open at the upper end to accommodate the holder, the probe, the first magnet, and the second magnet, and the interior of the lower housing. Having a cylindrical portion inserted from the open portion of the upper end of the coupling side to the lower end portion, and the inner peripheral surface of the cylindrical portion on the inner peripheral surface thereof is a lower end side portion and an upper end side portion having a larger diameter than that. The holder is positioned on the upper side of the upper portion of the upper housing and supported by the upper housing, for example. The probe may for example be configured to be prevented from falling from the upper housing by with retaining means are arranged vertically movable in the lower position than the holder in the interior of the upper housing.

  In this case, the inner peripheral surface of the cylindrical portion of the upper housing and the outer peripheral surface of the holder are configured so that, for example, positioning portions that engage with each other and determine the circumferential position of the holder with respect to the upper housing are formed. May be.

  In addition, a guide hole that penetrates the inner and outer circumferences in the radial direction is formed in the lower portion of the cylindrical portion of the upper housing, and a guide pin that protrudes inside is attached to the guide hole. A guide groove extending in the ascending / descending direction of the probe that engages with the guide pin may be formed, and the guide pin may be configured to constitute a retaining means for preventing the probe from falling by contacting the upper end of the guide groove. .

  Furthermore, the lower housing and the upper housing have, for example, a structure in which a male screw is formed at one coupling portion, a female screw is formed at the other coupling portion, and the male screw and the female screw are coupled to each other. Can do.

  According to the first invention, since the downward force is applied to the probe using the magnetic repulsive force of the combination of the two magnets, the following effects can be obtained. That is, the magnitude of the magnetic force is inversely proportional to the square of the distance between the two magnets. Normally, the two magnets are separated from each other by the magnetic repulsive force, and the probe is displaced toward the lowered position. When the suction head descends and the probe collides with the substrate, initially the repulsive force is small and the impact force is also small. When the suction head is further lowered and the distance between the two magnets is shortened, the magnetic repulsion force increases, and finally a force of a predetermined magnitude is applied to the probe. For this reason, the initial impact force can be reduced without increasing the diameter of the magnet, that is, the arrangement space.

  That is, when the force that the spring is most compressed to push the probe downward and the force that the two magnets are closest to push the probe downward is set to the same magnitude, the configuration using the magnet is The initial impact force can be reduced in a small arrangement space as compared with the configuration using springs.

  Furthermore, the magnet is not bent by itself and does not apply force to the probe, and has high durability without being fatigued or deteriorated due to mechanical operation during adsorption of the semiconductor chip and during bonding. That is, the lifetime of the member that applies a force in the direction of pushing the semiconductor chip against the probe can be increased.

  According to the second invention, by providing a holder inside the housing and disposing the probe movably inside the housing partitioned by the holder, and providing a magnet on each of the faces of the holder and the probe, While adopting a configuration in which the magnetic repulsive force can be maximized between the magnets, the entire suction head can be combined into a small size and light weight with a simple configuration.

  In particular, the probe can be provided with a simpler structure than the one in which the magnet is attached using a separate member by directly attaching the magnet to a position facing the magnet of the holder, and acts between the magnets. The magnetic repulsive force can be directly and maximized. That is, the probe can hold down the semiconductor chip from the upper side by taking full advantage of the advantage of using the magnetic repulsive force as a force for pressing the semiconductor chip from the upper side.

  Also, by forming a suction path that connects the lower space of the housing in which the probe is provided and the suction hole of the suction pipe in the holder, the suction path that connects the suction pipe and the probe is reduced in size and weight with a simple configuration. It can be provided inside.

  Therefore, according to the second aspect of the present invention, it is possible to provide a suction head that effectively uses the magnetic repulsion force as the force of the probe that holds the semiconductor chip in a simple configuration and is small and lightweight.

  It is easy to assemble and disassemble the suction head by dividing the housing into a lower part and an upper part, and holding the holder in a sandwiched state. Replacement can be easily performed with a simple operation by simply removing it.

  Also, by combining the guide part of the probe with the guide part of the holder so that the probe can be moved up and down, the probe is supported directly by the holder and guided to move up and down, thereby effectively receiving the magnetic repulsive force on the holder. It can move stably while maintaining.

  Further, the housing is divided into a lower housing and an upper housing, and a step portion is formed on the inner peripheral surface of the upper housing. A probe that is inserted into the lower portion of the upper housing so as to be movable up and down below the stepped portion and is prevented from falling off from the upper housing by the retaining means, a holder positioned above the stepped portion, One magnet and a second magnet are arranged. Then, the upper housing is inserted into the lower housing to couple them together. For this reason, the upper housing serves as an assembly jig, the probe and the holder are inserted and held inside the upper housing, positioned, and further, the upper housing is inserted into the lower housing and coupled to each other, The probe and the holder can be positioned and incorporated inside the housing, and the housing can be assembled without being restrained by holding the holder. Therefore, the suction head can be more easily assembled and disassembled, and the probe can be easily replaced.

  In addition, a positioning part that determines the circumferential position of the holder relative to the upper housing is formed on the inner peripheral surface of the cylindrical portion of the upper housing and the outer peripheral surface of the holder, so that the holder can be inserted into the upper housing. Since the arrangement position of the holder is easily determined only by housing, the suction head can be easily assembled.

  In addition, a guide pin is attached to a guide hole formed in the lower part of the cylindrical part of the upper housing so as to penetrate the inner and outer circumferences, and is prevented from coming off by engaging with a guide groove formed to extend in the up-and-down direction on the probe. When the probe is inserted and accommodated inside the upper housing, the lowermost position of the probe in the upper housing is automatically determined by the contact between the guide pin and the upper end of the guide groove, and the probe is dropped. Therefore, the probe can be easily attached to the upper housing, and the suction head can be easily assembled.

  Furthermore, the length from the upper end of the housing to the lower end of the probe protruding from the housing can be adjusted by connecting and fixing the lower part and the upper part of the housing with screws and adjusting the screwing position of both screws. . For this reason, when the suction head is mounted on the suction pipe and used, the total length of the suction head can be easily adjusted to an appropriate size according to conditions such as the vertical movement length of the suction pipe.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is an external perspective view showing a suction head 100 according to the present embodiment, FIGS. 2 to 4 are exploded perspective views of main parts, FIGS. 5 and 6 are cross-sectional views taken along line AA ′ of FIG. 7 is a cross-sectional view taken along the line BB ′ of FIG.

  The suction head 100 is mounted on a bonding apparatus (not shown), and is used to suck and hold an electronic component, for example, a semiconductor chip 130 in a component supply unit, and move it to a circuit board mounting position to fix it. The bonding apparatus includes a horizontal / vertical moving unit (not shown), a suction tube 110 driven in the horizontal direction and the vertical direction by the horizontal / vertical moving unit, and a holder 120 attached to the tip of the suction tube 110. The suction head 100 of this embodiment is detachably attached to the holder 120.

  As shown in FIGS. 1 to 7, the suction head 100 includes a cylindrical housing 1, a cylindrical holder 4 and a probe 5 that are coaxially accommodated in an internal space 10 of the housing 1, The probe 5 is configured to include annular permanent magnets 6 and 7 accommodated with the same magnetic pole facing each other.

  The housing 1 includes a cylindrical lower housing 2 and an upper housing 3 which are coupled in the axial direction. The lower housing 2 and the upper housing 3 are preferably formed of a material having excellent corrosion resistance and wear resistance, for example, SUS303. Yes.

  As shown in FIG. 5, the lower housing 2 has a large-diameter portion 21 and a small-diameter portion 22 that are coaxially coupled. The large-diameter portion 21 has an upper end opened, a lower end connected to the upper end of the small-diameter portion 22 via an annular step portion 23, and a knurled surface 21a for preventing slippage at the time of fastening on an outer peripheral surface on the upper end side. A screw portion 21b for fastening the upper housing 3 is formed on the inner peripheral surface, and a screw hole 21c for fastening the set screw 25 is formed on the side wall so as to penetrate therethrough. The set screw 25 is used to fix the lower housing 2 and the upper housing 3 by pressing the tip of the set screw 25 against the screw portion 32 a of the upper housing 3. The step portion 23 is formed with an annular groove portion 23a having a depth corresponding to the thickness of a pair of collar portions 42 of the holder 4 described later. On the other hand, the small-diameter portion 22 has a space having an inner diameter corresponding to the outer diameter of the probe 5, and a probe insertion hole 22 a through which the tip of the probe 5 is inserted is formed at the center of the bottom surface.

  As shown in FIGS. 1 to 7, the upper housing 3 has an annular flange portion 31 and a fastening portion 32 that are coaxially coupled. The flange portion 31 has substantially the same outer diameter as the large-diameter portion 21 of the lower housing 2, and a knurled surface 31 a for preventing slipping is formed on the outer peripheral surface of the flange portion 31. The flange portion 31 is coupled to the holder 120 on the upper surface side. The three cylindrical permanent magnets 33 are arranged evenly in the circumferential direction and embedded, and positioning holes 31b for positioning with the holder 120 are formed. The fastening portion 32 has an inner diameter that can accommodate the holder 4 therein, and a screw portion 32a that is screwed with the screw portion 21b on the lower housing 2 side is formed on the outer peripheral surface, and two circumferential positions of the tip portion are symmetrical. The holes 32b are formed, and a pair of positioning pins 34 are embedded in the holes 32b. This positioning pin 34 determines the position in the rotational direction of a pair of collar portions 42 of the holder 4 to be described later.

  The lower housing 2 and the upper housing 3 are coupled together by screwing the screw portion 21 b of the large-diameter portion 21 of the lower housing 2 and the screw portion 32 a of the fastening portion 32 of the upper housing 3. When combined, the inner space of the lower housing 2 and the inner space of the upper housing 3 form a cylindrical inner space 10 in the housing 1 continuously on the same axis. An upper end opening of the upper housing 3 forms a suction tube insertion port 12 into which the suction tube 110 is inserted through the collar 111. Further, depending on the axial length of the portion where the screw portion 21b of the lower housing 2 and the screw portion 32a of the upper housing 3 are screwed together, the total length of the housing 1 (the lower end surface of the lower housing 2 and the upper end surface of the upper housing 3) The vertical length), that is, the total length of the suction head 100 can be adjusted. By this adjustment, the distance that the probe 5 can move up and down in the axial direction can be adjusted.

  The holder 4 is preferably made of a metal excellent in mechanical conditions such as corrosion resistance and wear resistance, for example, stainless steel SUS303, and the like, as shown in FIG. A pair of collar portions 42 projecting in opposite directions from both side surfaces of the lower end portion and a position rotated by 90 ° from the formation position of the pair of collar portions 42 on the lower end portion of the holder main body 41 are projected downward. A pair of guide protrusions 43 are provided.

  FIG. 8 shows a front view (a), a plan view (b), a bottom view (c) and a side view (d) with the right half of the holder 4 taken as a cross section. Yes. The holder body 41 has an outer diameter adapted to the diameter of the inner space 10 so that the holder body 41 can be smoothly inserted and arranged in the inner space 10 of the housing 1, and the length of the upper portion of the collar portion 42 is longer than the length of the upper housing 3. Is also set short. An annular groove 41a is formed on the outer periphery of the upper end of the holder body 41, and an O-ring 44 is attached to the groove 41a. The holder 4 is airtightly attached to the upper housing 3 via an O-ring 44. At the upper end of the holder main body 41, a suction pipe insertion portion 41b is formed which is a cylindrical space into which the tip of the suction pipe 110 is inserted. A suction port 41c having a cylindrical space with a conical tip is formed at the center of the bottom surface of the suction tube insertion portion 41b. The holder main body 41 is provided with a pair of suction holes 41d that communicate the suction port 41c and the outer peripheral portion in the opposite directions in the radial direction. The suction hole 41d is formed in a direction orthogonal to the direction in which the collar portion 42 extends. The outer peripheral side mouth of the suction hole 41d faces a pair of cut surfaces 41e parallel to the central axis of the holder body 41 that is partially cut in order to secure an air passage. The parallel cut surface 41e is formed so as to avoid the position where the collar portion 42 is formed. The cut surface 41 e forms an air passage 13 between the cut surface 41 e and the inner peripheral surface of the housing 1. The cut surface 41e may be a groove. The lower end side of the cut surface 41e continues to the upper end position of the guide projection 43, and a suction hole 43a penetrating the guide projection 43 in the radial direction is formed at the lower end portion of the cut surface 41e. On the lower end side of the holder main body 41, a magnet holding hole 41f made of a cylindrical space having a depth substantially the same as the thickness of the magnet 6 for accommodating and holding the magnet 6 is formed.

  The upper surfaces of the pair of collar portions 42 have a stopper function that comes into contact with the lower end of the upper housing 3 when the holder 4 is mounted on the upper housing 3. A long hole-shaped notch 42a is formed at the distal end of the collar portion 42 and the distal end side extending in the extending direction of the collar portion 42 is opened. A positioning pin 34 protruding from the lower end surface of the upper housing 3 is fitted or press-fitted into the notch 42 a when the holder 4 is mounted on the upper housing 3. Thereby, the collar part 42 functions also as a rotation stopper with respect to the upper housing 3. The outer diameter of the collar portion 42 matches the inner diameter of the groove portion 23a formed in the step portion 23 of the lower housing 2, and the thickness of the collar portion 42 is substantially equal to the depth of the groove portion 23a. As a result, the collar portion 42 is adapted to be accommodated in the groove portion 23a when the upper housing 3 and the lower housing 2 are coupled most deeply.

  The pair of guide protrusions 43 have a shape that forms part of a cylindrical body whose outer diameter is slightly smaller than the inner diameter of the small-diameter portion 22 of the lower housing 2 and whose inner diameter is set slightly larger than the outer diameter of the permanent magnet 7. It has become. The lower end of the guide projection 43 is greatly chamfered (C cut).

  The probe 5 is preferably excellent in impact resistance and wear resistance, such as SUS303, manganese-nickel-copper-aluminum-molybdenum-carbon-silicon-iron alloy (trade name NAK: Daido Steel Co., Ltd.) 4, and has a cylindrical magnet holder 51 and a suction nozzle 52 formed so as to protrude downward from the center of the bottom surface of the magnet holder 51. . FIG. 9 shows a front view (a), a plan view (b), a bottom view (c), and a side view (d) shown in a partial cross section of the probe 5, respectively. .

  The magnet holder 51 is formed so that its outer diameter is slightly smaller than the inner diameter of the small-diameter portion 22 of the lower housing 2 so as to be slidable in the axial direction inside the small-diameter portion 22 of the lower housing 2. The magnet holder 51 has a magnet holding hole 51a that is a cylindrical space similar to the magnet holding hole 41f of the holder 4 inside, and a pair of guide recesses 51b are formed in the peripheral wall 53 that forms the magnet holding hole 51a. It is a thing. The guide recess 51b is formed at a position facing each other with respect to the axial center like the guide protrusion 43 of the holder 4, and is similar to the outer shape of the guide protrusion 43 so as to be slidably fitted in the guide protrusion 43 in the axial direction. It has the shape of Thus, even when the tip of the guide protrusion 43 and the lower end of the guide recess 51b are in contact with each other, the C-cut inclined surface alleviates the impact received by the both, and also prevents rattling, and the holder 4 prevents the probe 5 from moving. Can be received stably.

  The suction nozzle 52 is formed integrally with the bottom of the magnet holder 51 and the tapered portion 52a, and extends in the axial direction (vertical direction) of the probe 5 from the radial center of the bottom toward the lower side. Suction holes 52b communicating with the upper and lower ends are formed. The opening cross-sectional shape and the size of the suction hole 52b of the suction nozzle 52 are determined in consideration of conditions such as the shape and size of the semiconductor chip to be sucked and the magnitude of the suction force that the suction pump acts on the suction nozzle 52. Set so that the chip can be securely sucked. The cross section of the suction nozzle 52 is, for example, a perfect circle. Further, the tapered portion 52 a is matched with the tapered portion 22 b formed on the bottom surface of the lower housing 2. These tapered portions 22b and 52a alleviate the impact when the probe 5 moves and contacts the lower housing 2 in the protruding direction.

  The suction nozzle 52 is not limited to being formed integrally with the magnet holder 51, and is separately provided according to the conditions such as material and processing, and the separate suction nozzle 52 is welded to the magnet holder 51. For example, it may be fixed integrally by such means.

  The permanent magnets 6 and 7 are made of, for example, a samarium-cobalt magnet, a sintered neodymium magnet, or the like, and are fixed to the magnet holding holes 41f and 51a of the metal holder 4 and the probe 5 by a magnetic attraction force.

  Next, the assembly process of the suction head 100 described above will be described.

  First, the permanent magnet 6 is fitted into the holder 4 and the permanent magnet 7 is fitted into the probe 5. At this time, the lower end surface of the permanent magnet 6 and the upper end surface of the permanent magnet 7 facing each other are fitted into the holder 4 and the probe 5 so as to have the same magnetic pole. Subsequently, the holder 4 fitted with the permanent magnet 6 is press-fitted into the upper housing 3. At this time, the positioning pin 34 is driven into the lower end surface of the upper housing 3, and the positioning pin 34 is passed through the positioning holes 42 a of the pair of collar portions 42 of the holder 4 to position the holder 4.

  Next, the probe 5 is coaxially overlapped with the holder 4 so that the pair of guide recesses 51 b of the probe 5 fitted with the permanent magnet 7 is fitted with the guide protrusions 43 of the holder 4. In this state, when the lower housing 2 is screwed into the upper housing 3 and rotated in the tightening direction, the upper housing 3 moves in the direction of approaching the lower housing 2 along the axial direction. Accordingly, the lower part of the holder 4 and the probe 5 enter the inside of the lower housing 2, and the suction nozzle 52 of the probe 5 is inserted into the insertion hole 22 a of the lower housing 2 and protrudes to the outside.

  The air gap between the permanent magnets 6 and 7 can be adjusted by the tightening state of the upper housing 3 and the lower housing 2. The air gap needs to be set to a size that can secure a distance to move to the holder 4 side when the probe 5 sucks the semiconductor chip 130. Further, since the magnetic repulsive force acts on the permanent magnets 6 and 7 because the same magnetic poles face each other, the lower end surface of the magnet holder 51 of the probe 5 is on the inner bottom surface of the small diameter portion 22 of the lower housing 2. It is in a state of being pressed by a magnetic force, and the pressing force increases as the air gap becomes narrower. Since this force is also related to the impact force when the suction head 100 contacts the semiconductor chip, the air gap is adjusted in consideration of this point. When the appropriate air gap is adjusted, the upper housing 3 is fixed to the lower housing 2 by screwing a set screw 25 into the screw hole 21c of the lower housing 2 and tightening. Thereby, the suction head 100 of this embodiment is completed. For example, the suction head 100 has an outer diameter of about 20 mm, and a length (full length) from the upper end of the housing 1 to the lower end of the probe 5 is about 25 mm.

  As shown in FIGS. 1 and 2, the suction head 100 according to the present embodiment configured as described above is mounted on the bonding apparatus by being held by the holder 120 of the bonding apparatus. Since the suction head 100 needs to be replaced with a new one as the probe 5 wears, the holder 120 is desired to have a configuration in which the suction head 100 can be easily attached and detached. For this reason, as shown in FIG. 2, the holder 120 in the present embodiment employs a detachable method using a magnetic attractive force using a permanent magnet 124. That is, the holder 120 includes an annular fixture 121 that is partially cut off in the circumferential direction, a bolt 122 and a nut 123 for tightening the fixture 121 in the circumferential direction, and a lower surface of the fixture 121 equally in the circumferential direction. Are provided with three columnar permanent magnets 124 embedded at intervals, and positioning pins 125 projecting from the lower surface of the fixture 121. The permanent magnet 124 is embedded in the fixture 121 such that a pole different from the pole appearing at the upper end of the permanent magnet 33 embedded in the upper housing 3 appears at the lower end.

  The holder 120 is fixed to the suction pipe 110 by mounting the fixing tool 121 on the suction pipe 110 and fastening the bolt 122 and the nut 123. At this time, the tip of the suction tube 110 protrudes from the lower surface of the fixture 121 by the sum of the thickness of the collar 111 and the depth of the suction tube insertion portion 41b of the holder 4 as shown in FIG. The holder 120 is attached to the position. Then, the suction head 100 is attached to the holder 120 by fitting the positioning pin 125 into the positioning hole 31 b of the upper housing 3 and attracting the permanent magnet 124 of the holder 120 and the permanent magnet 33 of the upper housing 3. can do.

  On the other hand, when removing the suction head 100 from the holder 120, it is only necessary to pull the suction head 100 away from the holder 120 against the magnetic attraction force of the permanent magnets 33 and 124.

  The material, shape, size, and the like of the permanent magnets 33 and 124 may be selected so as to generate a magnetic force such that the magnetic attraction force is strong enough to prevent the bonding operation. Further, by making the positioning hole 31b a long hole extending in the radial direction of the upper housing 3, the positioning pin 125 can be fitted into the positioning hole 31b without any deterioration in the positioning function of the upper housing 3 in the circumferential direction. It can be done smoothly. Further, by arranging the collar 111 at the insertion port 12 of the housing 1, the connection between the suction tube 110 and the housing 1 can be stabilized.

  Next, a case where the suction head 100 configured as described above is installed in a bonding apparatus and a semiconductor chip is picked up and bonded will be described with reference to FIGS.

  In FIG. 10A, on a stage 140, a plurality of semiconductor chips 130 formed by cutting and dividing a wafer are arranged side by side. The suction head 100 is disposed above the semiconductor chip 130 to be picked up by a program-controlled horizontal / vertical moving unit (not shown).

  When the suction head 100 is lowered by the horizontal / vertical moving unit through the suction pipe 110 in this state, the tip of the suction nozzle 52 of the probe 5 eventually reaches the semiconductor chip 130 on the stage 140 as shown in FIG. Contact. When the suction head 100 is further lowered, the probe 5 moves backward toward the holder 4 in the lower housing 2 against the magnetic repulsive force of the permanent magnets 6 and 7 (see FIG. 6). The tip of the suction nozzle 52 of the probe 5 presses the semiconductor chip 130 by the magnetic repulsive force corresponding to the retraction amount.

  Subsequently, when a suction pump (not shown) is driven to generate a suction force by vacuum pressure through the suction pipe 110, air is sucked from the tip of the suction nozzle 52 of the probe 5 as shown in FIG. Nozzle 52 → center hole of permanent magnet 7 → space between permanent magnets 6 and 7 → suction hole 43a → air passage 13 → suction hole 41d → suction port 41c through which air is sucked into suction pipe 110. It is formed. That is, the air flow path is a suction path that causes the suction force from the suction means to act outside in the internal space of the housing 1. As described above, the reason why the air flow path is bypassed to the side surface of the holder 4 without being formed directly in a straight line is to weaken the suction force and prevent the semiconductor chip 130 from being damaged. . Thereby, the suction head 100 sucks the semiconductor chip 130 with air.

  When the suction head 100 is moved upward as shown in FIG. 10C, the suction head 100 picks up the semiconductor chip 130. At this time, the probe 5 protrudes again to the most advanced position by the magnetic repulsive force of the permanent magnets 6 and 7.

  Next, as shown in FIG. 11A, the suction head 100 is moved to a position above the circuit board 160 placed on the table 150 by the horizontal / vertical moving unit via the suction tube 110, and FIG. As shown in (b), the suction head 100 is lowered. When the semiconductor chip 130 comes into contact with the circuit board 160 and the suction head 100 is further lowered, the distance between the permanent magnets 6 and 7 is reduced, and the force with which the tip of the probe 5 presses the semiconductor chip 130 also increases. As a result, the semiconductor chip 130 is pressed onto the upper surface of the circuit board 160 more reliably and stably.

  In this state, the bonding of the semiconductor chip 130 is performed. That is, driving of a suction pump (not shown) is stopped, suction by the suction pipe 110 is stopped, and suction of the semiconductor chip 130 is stopped. Then, the solder chip interposed between the semiconductor chip 130 and the semiconductor chip 130 and the circuit board 160 is heated to fix the semiconductor chip 130 to the circuit board 160 by pressure.

  Then, as shown in FIG. 11C, by raising the suction head 100, the bonding of the semiconductor chip 130 to the circuit board 160 is completed.

FIG. 12 is a graph showing the relationship between the distance 1 between the permanent magnets 6 and 7 and the magnetic force F between them, in comparison with the relationship between the spring displacement and the spring force. As is clear from this graph, the relationship between the distance l indicated by the dotted line and the spring force is linear, but the magnetic force between the permanent magnets 6 and 7 indicated by the solid line is inversely proportional to the square of the distance l between the two. It is non-linear. Therefore, when the holder 4 and the probe 5 are separated by a distance ₁₀ , the magnetic repulsive force is extremely small compared to the repulsive force of the spring, and conversely, when the distance l approaches zero, the magnetic repulsive force The force greatly exceeds the repulsive force of the spring.

  Therefore, when the suction head 100 comes into contact with the semiconductor chip 130 at the time of picking up and bonding the semiconductor chip 130, or when it comes into contact with the circuit board 160 through the semiconductor chip 130, the impact force at that time is much higher than that of the spring. small. For this reason, the impact at the time of contact can be made sufficiently small. Also, during bonding, a larger pressing force than that of the spring can be obtained.

  Next, with reference to FIG. 13, a suction head 200 according to another embodiment of the present invention will be described.

  FIG. 13 is a partially cutaway front view showing a suction head according to another embodiment.

  In this embodiment, the lower housing 2 ′ and the upper housing 3 ′ in the housing 1 ′ are not fastened by screws as in the previous embodiment, but use a plurality of bolts 91 arranged in the circumferential direction. The two are combined in the axial direction. In the figure, 92 is a through-hole formed in the upper edge open portion of the lower housing 2 ′ in the vertical direction, and 93 is formed in the upper edge of the upper housing 3 ′ along the vertical direction. Screw holes. The bolt 91 is screwed into the screw hole 93 of the upper housing 3 ′ through the through hole 92 of the lower housing 2 ′, thereby connecting the lower housing 2 ′ and the upper housing 3 ′. For example, there are three places where the lower housing 2 'and the upper housing 3' are connected at equal intervals in the circumferential direction of the housing, and bolts 91 are respectively inserted and connected to the three places.

  In the case of this embodiment, in order to adjust the length from the upper end of the upper housing 3 ′ to the lower end of the suction nozzle 52 of the probe 5 protruding from the lower end of the lower housing 2 ′, the upper housing 3 ′ and the lower housing 2 What is necessary is to interpose a spacer (not shown) between the upper end of the lower housing 2 'and the lower end of the upper housing 3', which are locations where they are joined together.

  Next, a suction head 200A according to still another embodiment of the present invention will be described with reference to FIGS.

  14 is an external perspective view showing a suction head 200A according to still another embodiment of the present invention, FIG. 15 is an exploded perspective view of the main part, and FIGS. 16 and 17 are CC ′ cross-sectional views of FIG. 18 is a plan view of the upper housing 203, FIG. 19 is a sectional view taken along the line DD ′ of FIG. 18, and FIG. 20 is an external perspective view showing another configuration of the probe.

  The suction head 200A is mounted on a bonding apparatus (not shown), holds an electronic component, for example, a semiconductor chip 230 (see FIG. 17) in the component supply unit, moves to a circuit board mounting position, and is fixed (mounted). Used to fix). The bonding apparatus is mounted with a horizontal / vertical moving unit (not shown), a suction pipe 110 (see FIGS. 16 and 17) driven in the horizontal and vertical directions by the horizontal / vertical moving unit, and a tip of the suction pipe 110. The holder 120 (see FIGS. 16 and 17) is provided, and the suction head 200A of the present embodiment is detachably attached to the holder 120.

  As shown in FIGS. 14 to 17, the suction head 200 </ b> A includes a cylindrical housing 201 and a cylindrical holder 204 coaxially accommodated in an internal space 210 (see FIGS. 16 and 17) of the housing 201. The probe 205 includes annular permanent magnets 206 and 207 that are accommodated with the same magnetic pole facing the holder 204 and the probe 205, respectively.

  The housing 201 includes a cylindrical lower housing 202 and an upper housing 203 which are detachably coupled in the axial direction. The lower housing 202 and the upper housing 203 are preferably made of a material having excellent corrosion resistance and wear resistance, for example. It is formed of SUS303.

  For example, as shown in FIG. 16, the lower housing 202 has a large-diameter portion 221 and a small-diameter portion 222 that are coaxially coupled. The large-diameter portion 221 has an upper end opened, a lower end connected to the upper end of the small-diameter portion 222 via an annular step 213, and a knurled surface 221a for preventing slipping when fastened to the outer peripheral surface of the upper end. It consists of a formed structure.

  The large-diameter portion 221 has a structure in which a screw portion 221b for fastening the upper housing 203 is formed on the inner peripheral surface, and a set screw hole 221c for fastening the set screw 223 so as to penetrate the side wall is formed. Consists of. The set screw 223 is used to securely fix the lower housing 202 and the upper housing 203 by pressing the distal end portion 223 a against the screw portion 232 a of the upper housing 203 fastened to the lower housing 202.

  On the other hand, the small-diameter portion 222 has a space having an inner diameter corresponding to the outer diameter of the cylindrical portion 232 that is a cylindrical portion of the upper housing 203, and the tip of the probe 205 accommodated in the upper housing 203 is inserted through the center of the bottom portion. A probe insertion hole 222a is formed, and a space-side opening peripheral portion of the probe insertion hole 222a has a tapered surface 222b that gradually widens toward the space side.

  For example, as shown in FIGS. 14 to 19, the upper housing 203 includes an annular flange portion 231 and a cylindrical portion 232 that are coaxially coupled. The flange portion 231 has substantially the same outer diameter as the large-diameter portion 221 of the lower housing 202, and a knurled surface 231 a for preventing slippage at the time of fastening is formed on the outer peripheral surface, and is coupled to the holder 120 on the upper surface side. Three cylindrical permanent magnets 233 are embedded in a uniform manner in the circumferential direction, and positioning holes 231b for positioning with the holder 120 are formed.

  The flange portion 231 is formed with a set screw hole 231c for fastening the set screw 238 so as to penetrate from the knurled surface 231a side toward the inner central axis. The set screw 238 is used to fix the holder 204 to the upper housing 203 by pressing the tip of the set screw 238 against a positioning cut surface 241d on the outer peripheral surface of the holder 204 described later.

  The cylindrical portion 232 has a plurality of inner diameters that can accommodate the holder 204 and the probe 205 therein, and a screw portion 232a that is screwed with the screw portion 221b on the lower housing 202 side is formed on the outer peripheral surface. A guide hole 232b that penetrates the inner and outer circumferences in the radial direction is formed at a predetermined position in the circumferential direction of the lower portion of the cylindrical portion 232, and a guide pin 237 is embedded in the guide hole 232b.

  The guide pin 237 determines a circumferential position and a lowermost position in a cylindrical portion 232 of the probe 205 which will be described later, and when the probe 205 is assembled in the cylindrical portion 232, the probe 205 is located on the distal end side of the cylindrical portion 232. It constitutes a retaining means for preventing it from falling off (falling).

  Further, the upper housing 203 has a large inner diameter portion 234a, a middle inner diameter portion 234b, and a small inner diameter portion 234c formed so that the inner diameter decreases in order from the upper end side to the lower end side inside the flange portion 231 and the cylindrical portion 232. The upper step 235a is formed at the boundary between the large inner diameter portion 234a and the middle inner diameter portion 234b, and the lower step portion 235b is formed at the boundary between the middle inner diameter portion 234b and the small inner diameter portion 234c. The lower step 235b divides the inside of the cylindrical portion 232 into a lower end portion and an upper end portion having a larger diameter.

  A positioning cut surface 231d configured by a surface orthogonal to the set screw hole 231c of the flange portion 231 is formed in a part of the large inner diameter portion 234a. The positioning cut surface 231d has a shape that matches the positioning cut surface 241d of the holder 204. When the holder 204 is inserted into the upper housing 203, the positioning cut surfaces 231d and 241d come into contact with each other so that the circumference of the holder 204 is reduced. The position of the direction is determined. Therefore, these positioning cut surfaces 231 d and 241 d function as positioning portions in the upper housing 203 of the holder 204.

  The probe 205 that is attached to and accommodated in the upper housing 203 so as to be movable up and down is accommodated in the small inner diameter portion 234c on the lower end side of the lower stepped portion 235b in the cylindrical portion 232, and the holder 204 is attached to the cylindrical portion 232. It is accommodated in the middle inner diameter portion 234b and the larger inner diameter portion 234a on the upper end side than the lower stepped portion 235b. Further, the positions facing each other across the central axis of the lower stepped portion 235b are recessed to the lower end side, and when these recessed portions accommodate the probe 205 and the holder 204, the air passage from the probe 205 to the holder 204 is provided. 236.

  The lower housing 202 and the upper housing 203 configured as described above are coupled by screwing the screw portion 221b of the large-diameter portion 221 of the lower housing 202 and the screw portion 232a of the cylindrical portion 232 of the upper housing 203. Is done. At the time of coupling, the cylindrical portion 232 of the upper housing 203 is inserted into the internal space of the lower housing 202 from the upper open end to the lower end end surface. The internal space of the cylindrical portion 232 is arranged coaxially with the internal space of the lower housing 202 to form a columnar internal space 210 in the housing 201.

  Further, in the housing 201 configured as described above, the total length of the housing 201 (that is, the suction head 200A) is determined by the axial length of the portion where the screw portion 221b of the lower housing 202 and the screw portion 232a of the upper housing 203 are screwed together. ) And the amount of protrusion of the probe 205 from the lower housing 202 can be adjusted.

  The holder 204 is preferably made of a metal such as stainless steel SUS303 excellent in mechanical conditions such as corrosion resistance and wear resistance. For example, as shown in FIG. 15, an annular flange portion 241 and a cylindrical shape coupled coaxially. The circular portion 242 is provided. The flange portion 241 has an outer diameter adapted to the large inner diameter portion 234a so that the flange portion 241 can be smoothly inserted and arranged in the upper housing 203, and a positioning cut surface 241d adapted to the above-described positioning cut surface 231d is formed on a part of the outer peripheral surface thereof. Is formed.

  The circular portions 242 have substantially the same outer diameter as the inner inner diameter portion 234b so that they can be smoothly inserted and arranged in the upper housing 203, and the center of the circular portion 242 is located at a position opposite to the central axis of the outer peripheral surface. A pair of opposed cut surfaces 244 parallel to the axis are formed so as to be displaced from the positioning cut surface 241d described above by about 45 °. An annular groove 242a is formed on the outer periphery of the circular portion 242 on the flange portion 241 side, and an O-ring 246 is attached to the groove 242a.

  The holder 204 is airtightly attached to the upper housing 203 via an O-ring 246. A suction tube insertion hole 243a into which the tip of the suction tube 110 is inserted is formed at the upper end of the holder 204. A suction port 243b made of a cylindrical space having a conical tip is formed at the center of the bottom surface of the suction tube insertion hole 243a. The holder 204 is provided with a pair of suction holes 243c that communicate the suction ports 243b and the outer peripheral portion in the opposite directions in the radial direction.

  The opening on the outer peripheral side of the suction hole 243c faces a pair of cut surfaces 244 parallel to the central axis of the holder 204 that is partially cut in order to secure an air passage. The pair of parallel cut surfaces 244 form an air passage 211 between the inner peripheral surface of the inner diameter portion 234b of the upper housing 203. In addition, this pair of cut surfaces 244 may be comprised by the groove | channel.

  On the lower end side of the holder 204, a magnet holding hole 245 made of a cylindrical space having a depth substantially the same as that of the permanent magnet 206 for accommodating and holding the permanent magnet 206 is formed. The lower end surface of the circular portion 242 of the holder 204 in which the magnet holding hole 245 is formed has a stopper function that comes into contact with the end surface of the lower stepped portion 235b of the upper housing 203 when the holder 204 is attached to the upper housing 203.

  Further, the positioning cut surface 241 d of the flange portion 241 of the holder 204 is aligned with the positioning cut surface 231 d formed on the large inner diameter portion 234 a of the upper housing 203 when the holder 204 is mounted on the upper housing 203, so It has a positioning function to determine the directional position. Since the holder 204 is inserted into the upper housing 203 with such a structure, the holder 204 is accommodated in the upper housing 203 at a position above the lower stepped portion 235b.

  On the other hand, the probe 205 is preferably excellent in impact resistance and wear resistance, for example, SUS303-nickel-copper-aluminum-molybdenum-carbon-silicon-iron alloy (trade name NAK: Daido Steel Co., Ltd.). 15, for example, as shown in FIG. 15, a cylindrical magnet holding portion 251 that houses the permanent magnet 207, and a suction nozzle that is formed so as to protrude downward from the bottom center portion of the magnet holding portion 251 252.

  The magnet holding portion 251 has an outer diameter slightly smaller than the inner diameter of the small inner diameter portion 234c so as to be accommodated in the small inner diameter portion 234c of the cylindrical portion 232 of the upper housing 203 so as to be slidable in the axial direction. In addition, the end portion on the suction nozzle 252 side has a tapered portion 253 configured in an inclined shape so as to be fitted to the tapered surface 222 b of the lower housing 202.

  When the tapered portion 253 matches the tapered surface 222 b formed on the bottom surface of the lower housing 202, the probe 205 moves in the protruding direction of the suction nozzle 252 with respect to the lower housing 202 and comes into contact with the lower housing 202. To alleviate the impact.

  Further, the magnet holding portion 251 has a structure in which a guide groove 254 extending in the ascending / descending direction (vertical direction) is formed in a part on the outer peripheral end side including the tapered portion 253. A guide pin 237 embedded in a guide hole 232b formed in the cylindrical portion 232 of the upper housing 203 is inserted into the guide groove 254 so as to be engaged therewith. Further, a stop surface 254 a that contacts the circumferential end of the guide pin 237 is formed on the upper end side of the guide groove 254.

  As described above, the guide groove 254 and the guide pin 237 are engaged to determine the circumferential position of the probe 205 in the cylindrical portion 232 of the upper housing 203. Further, when the probe 205 is accommodated in the upper housing 203, the stop surface 254a and the guide pin 237 come into contact with each other, so that the probe 205 can be prevented from coming off from the upper housing 203 and the probe 205 can be prevented from being removed. The lower end position is determined. Since the stop surface 254a of the guide groove 254 and the guide pin 237 come into contact with each other, the lowermost position of the probe 205 is determined. Therefore, if the contact position is adjusted, the tapered portion 253 and the tapered surface 222b described above are adjusted. It is possible to avoid contact and to further alleviate the impact at the time of contact.

  Furthermore, the magnet holding part 251 has a magnet holding hole 251a formed of a cylindrical space similar to the magnet holding hole 245 of the holder 204, and holds the permanent magnet 207 in the magnet holding hole 251a.

  The suction nozzle 252 is formed integrally with the lower end side of the tapered surface 253 of the magnet holding part 251 and extends in the axial direction (vertical direction) of the probe 205 from the radial center of the magnet holding part 251 downward. A suction hole 252a communicating with the upper and lower ends is formed in the interior. For example, as shown in FIG. 20, the opening cross-sectional shape and the size of the suction hole 252a of the suction nozzle 252 may not be a perfect circle, but may be a flat straight line (or an ellipse) with a smaller opening area. . In addition, the shape and size of the opening cross section of the suction port 252a are determined in consideration of the shape and size of the semiconductor chip to be adsorbed or the magnitude of the suction force that the suction pump acts on the suction nozzle 252. It suffices if it is set so that it can be adsorbed on the surface.

  The suction nozzle 252 is not limited to being formed integrally with the magnet holding part 251, but is provided separately according to conditions such as material and processing. The separate suction nozzle 252 is attached to the magnet holding part 251. You may make it adhere integrally by means, such as welding.

  The permanent magnets 206 and 207 are made of, for example, a samarium-cobalt magnet, a sintered neodymium magnet, or the like, and are fixed to the magnet holding holes 245 and 251a of the metal holder 204 and the probe 205 by a magnetic attraction force.

  Next, the assembly process of the suction head 200A described above will be described.

  First, the permanent magnet 206 is fitted into the magnet holding hole 245 of the holder 204, and the permanent magnet 207 is fitted into the magnet holding hole 251 a of the probe 205. At this time, the lower end surface of the permanent magnet 206 and the upper end surface of the permanent magnet 207 facing each other are fitted into the holder 204 and the probe 205 so as to have the same magnetic pole.

  Subsequently, a guide pin 237 is inserted into the guide hole 232b of the cylindrical portion 232 of the upper housing 203 with the tip protruding from the inner peripheral surface of the small inner diameter portion 234c, and the probe 205 is inserted from the upper end opening side of the upper housing 203. The guide groove 254 of the probe 205 is engaged with the guide pin 237 by being inserted so as to be accommodated in the small inner diameter portion 234c through the inner diameter portion 234a and the middle inner diameter portion 234b. As a result, the probe 205 is held at a position below the lower step 235 b inside the upper housing 203 so as to be movable up and down (moving up and down) without coming out of the upper housing 203.

  Next, the holder 204 is positioned so that the positioning cut surface 231d of the upper housing 203 and the positioning cut surface 241d of the holder 204 are matched, and the lower end surface of the cylindrical portion 232 is placed on the lower stepped portion 235b. The upper housing 203 is inserted and accommodated in the large inner diameter portion 234a and the middle inner diameter portion 234b from the upper end opening side. At this time, the pair of cut surfaces 244 of the holder 204 are positioned on the pair of air passages 236 formed in the lower stepped portion 235b of the upper housing 203, and are paired with the inner peripheral surface of the inner diameter portion 234b. An air passage 211 communicating with the air passage 236 is formed.

  When the holder 204 is accommodated in the upper housing 203, a set screw 238 is screwed into a set screw hole 231 c formed in the flange portion 231 of the upper housing 203, and the holder 204 is fixed to the upper housing 203. When the probe 205 and the holder 204 are accommodated in the upper housing in this way, the upper housing 203 is inserted into the lower housing 202 while being screwed in the tightening direction so that the screw portions 221b and 232a are screwed together. Accordingly, the suction nozzle 252 of the probe 205 is inserted into the probe insertion hole 222a of the lower housing 202 and protrudes to the outside.

  Then, a set screw 223 is screwed into a set screw hole 221 c formed in the large diameter portion 221 of the lower housing 202, and the upper housing 203 is fixed to the lower housing 202. Thereby, the suction head 200A of the present embodiment is completed. The suction head 200A has an outer diameter of about 20 mm, for example, and a length (full length) from the upper end of the housing 201 to the lower end of the probe 205 is about 25 mm.

  The suction head 200 </ b> A according to the present embodiment configured as described above is mounted on the bonding apparatus by being held by the holder 120 of the bonding apparatus. Since the suction head 200A needs to be replaced with a new one as the probe 205 is worn, the holder 120 is preferably configured so that the suction head 200A can be easily attached and detached.

  Therefore, as shown in FIGS. 16 and 17, for example, the holder 120 in the present embodiment employs a detachable method using a magnetic attractive force using a permanent magnet 124. That is, the holder 120 includes an annular fixing member (not shown) in which a part of an annular member having an outer diameter similar to the outer diameter of the flange portion 231 of the upper housing 203 is cut off, and a fastening tool for tightening the fixing member in the circumferential direction. And three cylindrical permanent magnets 124 embedded in the lower surface of the fixture at equal intervals in the circumferential direction, and positioning pins 125 projecting from the lower surface of the fixture. Has been. The permanent magnet 124 is embedded in the fixture such that a magnetic pole different from the magnetic pole appearing at the upper end of the permanent magnet 233 embedded in the upper housing 203 appears at the lower end.

  The holder 120 is fixed to the suction pipe 110 by covering the fixing tool on the lower end side of the suction pipe 110 and fastening bolts and nuts. At this time, the holder 120 protrudes from the lower surface of the fixture with respect to the suction tube 110 by the amount that the tip of the suction tube 110 (that is, the lower end) is added to the depth of the suction tube insertion hole 243a of the holder 204. Attach to position. Then, the positioning pin 125 is fitted into the positioning hole 231b of the upper housing 203, and the permanent magnet 124 of the holder 120 and the permanent magnet 233 of the upper housing 203 are attracted to attach the suction head 200A to the holder 120. can do.

  When removing the suction head 200A from the holder 120, it is only necessary to pull the suction head 200A away from the holder 120 against the magnetic attractive force of the permanent magnets 233 and 124. The material, shape, size, etc. of the permanent magnets 233 and 124 may be selected so as to generate a magnetic force such that the magnetic attractive force is strong enough to prevent the bonding operation. Further, by making the positioning hole 231b a long hole extending in the radial direction of the upper housing 203, the positioning function of the positioning pin 125 in the circumferential direction of the upper housing 203 is not lowered at all, and the fitting of the positioning pin 125 to the positioning hole 231b is also possible. It can be done smoothly.

The perspective view which looked at the adsorption head in one embodiment of the present invention from the upper part. The perspective view which decomposed | disassembled the suction head and was seen from the upper and lower sides. The perspective view which decomposed | disassembled the suction head and was seen from the lower side. The perspective view which decomposed | disassembled the holder of the attraction | suction head, the probe, and a pair of permanent magnet, and was seen from the lower side. FIG. 3 is a cross-sectional view taken along line A-A ′ of FIG. 2. FIG. 3 is a cross-sectional view taken along line A-A ′ of FIG. 2 when the probe is retracted. B-B 'sectional drawing of FIG. 4 is a partial cutaway view of the holder. 4 is a partially cutaway view of the probe. The front view which shows pick-up operation | movement in order of a process. The front view which shows bonding operation | movement in order of a process. The graph which shows the characteristic of magnetic force. The partially notched front view which shows the suction head in other embodiment. The perspective view which looked at the adsorption head in other embodiments from the upper part. The perspective view which decomposed | disassembled a part of adsorption head and was seen from the lower side. FIG. 15 is a cross-sectional view taken along the line C-C ′ of FIG. 14. FIG. 15 is a cross-sectional view taken along the line C-C ′ of FIG. 14 when the probe is retracted. The top view of an upper housing. D-D 'sectional drawing of FIG. The perspective view which shows the other structure of a probe.

Explanation of symbols

1, 1 ', 201 ... housing 2, 2', 202 ... lower housing 3, 3 ', 203 ... upper housing 4, 204 ... holder 5, 205 ... probe 6, 206 ... permanent magnet 7, 207 ... permanent magnet 10, 210 ... Internal space 12 ... Suction pipe insertion ports 13, 211,236 ... Air passages 21,221 ... Large diameter portions 22,222 ... Small diameter portions 23 ... Step portions 25,223 ... Set screws 31,231 ... Flange portions 32 ... fastening Part 33, 233 ... Permanent magnet 34 ... Positioning pin 41 ... Holder body 42 ... Collar part 43 ... Guide projection 44, 246 ... O-ring 51 ... Magnet holder 52, 252 ... Suction nozzle 53 ... Peripheral wall 91 ... Bolts 100, 200, 200A ... Suction head 110 ... Suction tube 120 ... Holder 130 ... Semiconductor chip 140 ... Stage 150 ... Table 160 ... Circuit board.
231d ... Positioning cut surface 232 ... Cylindrical portion 232b ... Guide hole 234a ... Large inner diameter portion 234b ... Medium inner diameter portion 234c ... Small inner diameter portion 235a ... Upper step portion 235b ... Lower step portion 237 ... Guide pin 244 ... A pair of cut surfaces 254 ... Guide groove

Claims (7)

In a semiconductor chip adsorption head that adsorbs a semiconductor chip, transfers the semiconductor chip, and places and fixes it on a substrate,
A housing having a probe insertion hole at the lower end and an insertion port for inserting a suction tube communicating with the suction means at the upper end, and forming an internal space therebetween,
A holder that is fixed to the upper side of the internal space of the housing and has a suction path that communicates the upper and lower spaces;
The lower end of the inner space of the housing is provided so as to be movable up and down, and the lower end is inserted through the probe insertion hole and protrudes to the outside of the housing, and the suction force of the suction path is transferred from the inner space of the housing to the outside A probe having a suction hole to act;
A first magnet attached to the side of the holder facing the probe;
A second magnet attached to the probe so that the same pole faces the first magnet,
The probe attracts the semiconductor chip at the lower end by an attracting force acting from the attracting hole, and receives a magnetic repulsive force generated between the first magnet and the second magnet toward a lowered position. A semiconductor chip suction head characterized by being biased. The housing is divided into a lower housing and an upper housing, and these lower housing and upper housing are detachably coupled,
2. The suction head for a semiconductor chip according to claim 1 , wherein the holder is sandwiched between the lower housing and the upper housing joined together. The holder has a guide portion extending in a vertical direction at a lower portion, and a guide portion extending in a vertical direction and engaged with the guide portion of the holder so as to move up and down is formed at an upper portion of the probe. The semiconductor chip suction head according to claim 1 , wherein: The housing is divided into a lower housing and an upper housing, and these lower housing and upper housing are detachably coupled,
The lower housing has a cylindrical shape in which an upper end on the coupling side with the upper housing is opened and the upper housing is accommodated therein,
The upper housing is opened at the upper end to house the holder, the probe, the first magnet, and the second magnet inside, and the lower housing has a lower end portion from the open portion at the upper end of the coupling side. And a step portion is formed on the inner peripheral surface of the cylindrical portion to partition the inner peripheral surface into a lower end side portion and an upper end side portion having a larger diameter than the inner peripheral surface.
The holder is positioned on the upper side of the stepped portion inside the upper housing and supported by the upper housing,
The probes in claim 1, characterized in that it is prevented from falling from the upper housing by with retaining means are arranged vertically movable in the lower position than the holder in the interior of the upper housing The suction head for semiconductor chips as described. The inner peripheral surface of the cylindrical portion of the upper housing and the outer peripheral surface of the holder are formed with positioning portions that engage with each other to determine the circumferential position of the holder with respect to the upper housing. The suction head for a semiconductor chip according to claim 4 . A guide hole is formed in the lower part of the cylindrical portion of the upper housing so as to penetrate the inner and outer peripheries in the radial direction. A guide pin protruding inward is attached to the guide hole, and the probe is associated with the guide pin. A guide groove extending in the lifting direction of the mating probe is formed,
The guide pin and the guide groove of the upper end and the stopper semiconductor chip suction head according to claim 4 or 5, characterized in that it constitutes a means for preventing the dropping of the probe by abutment. The lower housing and the upper housing are characterized in that a male screw is formed at one coupling part and a female screw is formed at the other coupling part, and the male screw and the female screw are coupled to each other. Item 7. A semiconductor chip suction head according to Item 2, 4, 5 or 6 .

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