JP4338662B2 - 電子部品実装装置 - Google Patents
電子部品実装装置 Download PDFInfo
- Publication number
- JP4338662B2 JP4338662B2 JP2005085847A JP2005085847A JP4338662B2 JP 4338662 B2 JP4338662 B2 JP 4338662B2 JP 2005085847 A JP2005085847 A JP 2005085847A JP 2005085847 A JP2005085847 A JP 2005085847A JP 4338662 B2 JP4338662 B2 JP 4338662B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- electronic component
- chip
- base material
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Description
12 実装アタッチメント群
13 実装ステージ
15 基材シート
16 ICチップ
21 実装アタッチメント
22 突部
23 アンテナ
31 吸引ステージ
33 突部基台
41 突部板
43 突部材
Claims (2)
- 可撓性基材上に形成された複数のパターン上に対応の電子部品を搭載し、複数単位毎に電気的接続させて実装する電子部品実装装置であって、
少なくとも、所定の吸引手段を備えると共に、前記基材に形成された複数のパターン上に搭載されるそれぞれの前記電子部品の位置に対応させた複数の突部を備え、当該電子部品が搭載された基材が搬送されてきたときに、当該突部に形成される所定数の通気孔より当該基材を部分的に吸引して固定する吸引固定手段と、
前記突部上で吸引固定されている前記基材上の複数のパターンおよび電子部品に対して加熱と共に押圧することで当該電子部品を当該パターン上に電気的接続させる実装手段と、
を有することを特徴とする電子部品実装装置。 - 請求項1記載の電子部品実装装置であって、前記吸引固定手段が、前記電子部品が搭載されて搬送される前記基材に対して所定の張力を付加させる位置に配置されることを特徴とする電子部品実装装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005085847A JP4338662B2 (ja) | 2005-03-24 | 2005-03-24 | 電子部品実装装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005085847A JP4338662B2 (ja) | 2005-03-24 | 2005-03-24 | 電子部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006269750A JP2006269750A (ja) | 2006-10-05 |
JP4338662B2 true JP4338662B2 (ja) | 2009-10-07 |
Family
ID=37205396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005085847A Expired - Fee Related JP4338662B2 (ja) | 2005-03-24 | 2005-03-24 | 電子部品実装装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4338662B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10191083B2 (en) | 2015-10-30 | 2019-01-29 | Texas Instruments Incorporated | Magnetic shielded probe card |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114507484B (zh) * | 2022-04-14 | 2022-07-26 | 艺技斯科(天津)技术有限公司 | 一种粘着吸附装置 |
-
2005
- 2005-03-24 JP JP2005085847A patent/JP4338662B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10191083B2 (en) | 2015-10-30 | 2019-01-29 | Texas Instruments Incorporated | Magnetic shielded probe card |
Also Published As
Publication number | Publication date |
---|---|
JP2006269750A (ja) | 2006-10-05 |
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