JP4337471B2 - Portable electronic devices - Google Patents

Description

  The present invention relates to a portable electronic device such as a portable telephone or a portable information terminal.

  Conventionally, a plurality of plate-like circuit boards connected by a film-like wiring have been used as a circuit board incorporated in an electronic device such as a portable telephone, and such a circuit board group has a wiring portion thereof. Is efficiently stored inside the electronic device. For example, Patent Document 1 discloses a technique in which a plurality of plate-like circuit boards are mounted on a flexible board, the flexible board is bent at a connecting portion, and the circuit boards are three-dimensionally stacked and housed in a housing of an electronic device. Proposed.

In recent years, a plurality of film-like circuit boards connected by film-like wirings may be used in portable telephones that are particularly demanded to be thin and multifunctional. In addition, the film-like circuit board is also used for the purpose of downsizing the configuration of electronic components and the like provided in the mobile phone. For example, Patent Document 2 proposes a technique for configuring an image sensor module by folding a flexible printed circuit board on which a lens, an image sensor, and the like are mounted.
JP 2001-358422 A JP 2002-330319 A

  By the way, the circuit board group incorporated in the mobile phone is connected to many other configurations (for example, a display, a digital camera, a key, a speaker, a memory, etc.) provided in the mobile phone. For this reason, in a mobile phone, a large number of film-like wirings are bonded to a plurality of circuit boards by a method such as pressure bonding, and circuit boards or circuit boards and other configurations are complicatedly connected. As a result, the process of connecting circuit boards or circuit boards and other components by wiring becomes complicated, and the manufacturing cost of the mobile phone increases.

  The present invention has been made in view of the above problems, and an object thereof is to simplify the manufacturing process of a portable electronic device such as a portable telephone.

The invention according to claim 1 is a portable electronic device, and includes an exterior component, a circuit board provided in the exterior component, and a first flat panel display device provided on one main surface of the exterior component. And a second flat panel display device provided on the other main surface opposite to the one main surface of the exterior component, wherein the circuit board is mounted with at least one mounting part on which the electronic component is mounted A first connection part that connects the at least one mounting part and the first flat panel display device in a bent state, and the at least one mounting part and the second flat panel display device are bent. and a second connecting portion connecting at state, the first flat panel display device and the second flat panel display device is connected to the same side of the circuit board Is, the first connection portion is bent in one place, in which the second connection portion is bent at two locations.

A second aspect of the present invention is the portable electronic device according to the first aspect , wherein the at least one mounting portion, the first connection portion, and the second connection portion are formed in one base layer. A portable electronic device characterized by being formed.

  According to a third aspect of the present invention, in the portable electronic device according to the second aspect, the wiring is formed only on one side of the base layer.

Invention of Claim 4 is a portable electronic device of any one of Claim 1 thru | or 3, Comprising: The said 1st connection part and the said 2nd connection part are said at least 1 mounting. It is extended from the part.

The invention of claim 5 is a portable electronic device according to any one of claims 2 to 4, before Symbol least one mounting portion, prior Symbol first connecting portion and the second The base layer on which the connecting portion is formed is cut out from one film-like member.

In the present invention, the manufacturing process of the portable electronic device can be simplified, and the first flat panel display device and the second device connected to the same side surface of the circuit board by bending each connecting portion. These flat panel display devices can be compactly accommodated in a predetermined direction on the front and back sides and in a predetermined position of the outer case .

According to the second aspect of the present invention, each mounting portion and peripheral components are three-dimensionally overlapped by bending at a plurality of connecting portions including the first connecting portion and the second connecting portion, so that the outer case is compact. In a circuit board that tends to have a complicated shape so as to be housed, it is manufactured individually by forming at least one mounting portion and the first and second connection portions on one base layer. In addition, the process of connecting a plurality of circuit boards is not required, the manufacturing process can be simplified, and the manufacturing cost can be reduced. In the invention of claim 3, it is possible to easily mount the electronic component on the circuit board and connect the flat panel display device. According to a fourth aspect of the present invention, the at least one mounting portion can be connected to the first flat panel display device and the second flat panel display device in a state where the first and second connection portions are bent, respectively. Therefore, compact storage in the outer case by three-dimensionally superimposing the first flat panel display device and the second flat panel display device is easily performed in a predetermined direction on the front and back sides with less difficulty. be able to. Furthermore, the invention of claim 5 eliminates the need for connecting a plurality of individually manufactured circuit boards by complicated joining work, simplifying the manufacturing process of the portable electronic device and reducing the manufacturing cost. can do.

  FIG. 1 is a plan view showing a structure of a mobile phone (hereinafter referred to as “mobile phone”) 1 which is a mobile electronic device according to the first embodiment of the present invention. The mobile phone 1 has a film-like circuit board 2 on which various electronic parts are mounted and peripheral parts such as a display, a digital camera, and a memory are connected, and an exterior part (hereinafter referred to as “exterior case”) that houses the circuit board 2. 3) and other peripheral components such as a microphone, a speaker, an antenna, etc. (not shown).

  FIG. 2 is a plan view showing the circuit board 2 provided in the outer case 3 and the main display module 5, the sub display module 7 and the memory card module 10 which are peripheral components connected to the circuit board 2. The circuit board 2 includes a main mounting portion 4, a key mounting portion 6, and a camera module mounting portion 8 as a plurality of mounting portions on which a plurality of electronic component groups are respectively mounted. In addition, the circuit board 2 includes connection portions 91 to 94 for connecting the main mounting portion 4 to the main display module 5, the sub display module 7, the camera module mounting portion 8 and the key mounting portion 6, respectively. A connection unit 95 for connecting the unit 6 and the memory card module 10;

  The main mounting portion 4, the key mounting portion 6, the camera module mounting portion 8, and the base layer 21 of the connection portions 91 to 95 are formed by cutting out from one film-like member, and only on one side thereof. A wiring 90 is formed. Hereinafter, the surface of the circuit board 2 on which the wiring 90 is formed (the front surface in FIG. 2) is referred to as the front surface of the circuit board 2, and the opposite side is referred to as the back surface. The three mounting parts, that is, the main mounting part 4, the key mounting part 6, and the camera module mounting part 8 are connected to the other two mounting parts in order to be arranged at predetermined positions in the outer case 3, respectively. It is located at a position off the straight line.

  The main mounting unit 4 is a mounting unit on which a group of electronic components for control, a group of electronic components for communication, and the like are mounted. The electronic component group includes various IC packages and IC bare chips. IC components 41 such as, chip components 42 such as resistors and capacitors, and the like are included. The key mounting unit 6 is a mounting unit for an electronic component group for the operation unit of the mobile phone 1, and the contact 61 (see FIG. 1) of each key switch that constitutes the operation unit of the mobile phone 1 is provided on the back surface thereof. A plurality of IC components 62 for controlling output of various signals and the like are mounted on the front surface thereof as shown in FIG. On the camera module mounting portion 8, a digital camera 82, which is a CCD or CMOS type imaging device, various IC components 81 for controlling the same, and the like are mounted on the front surface.

  The main display module 5 and the sub display module 7 are flat panel display devices using liquid crystal, and the main display module 5 and the connection unit 91, and the sub display module 7 and the connection unit 92 are respectively ACF (Anisotropic Conductive Film). ), ACP (Anisotropic Conductive Paste) or the like. At this time, the main display module 5 and the sub display module 7 are connected to the same surface (front surface) of the circuit board 2 such that the display surfaces 51 and 71 face the same direction as the front surface of the circuit board 2. The memory card module 10 is a memory card built in a cellular phone, and the end portion of the memory card module 10 and the connection portion 95 are bonded together by a bonding material.

  Each of the connecting portions 91 to 95 is a foldable film, and the circuit board 2 is bent like paper at each connecting portion as shown in FIG. 1 to mount the display surface 51 of the main display module 5 and the key. It is stored in the exterior case 3 after being folded so that the back surface of the portion 6 faces the same side.

  3 to 6 are views showing a state in which the circuit board 2 to which each peripheral component is connected is folded in the final assembly process, and FIG. 7 is a diagram in which the folded circuit board 2 and the peripheral component are stored in the outer case 3. It is a figure which shows a mode. Hereinafter, the final assembly process of the mobile phone 1 will be described with reference to FIGS. 3 to 7.

  When the circuit board 2 is folded, first, the main mounting portion 92 connecting the main mounting portion 4 and the sub display module 7 shown in FIG. 3 is mounted so that the front surface thereof faces the front surface of the main mounting portion 4. In the vicinity of the end portion on the side of the portion 4, it is valley-folded along the broken line 12, and the sub-display module 7 side so that the surface opposite to the display surface 71 of the sub-display module 7 faces the front surface of the main mounting portion 4. It is bent again in the reverse direction along the broken line 13 in the vicinity of the end of the. As described above, since the connecting portion 92 is bent at two places, the display surface 71 of the sub display module 7 faces the same direction as the front surface of the main mounting portion 4 as shown in FIG. It arrange | positions so that it may overlap with the front side. As a result, the connecting portion 92 connects the main mounting portion 4 and the sub display module 7 in a state where the main mounting portion 4 is bent twice.

  Subsequently, with respect to the connection portion 93 that connects the main mounting portion 4 and the camera module mounting portion 8 shown in FIG. 3, a part of the front surface of the connection portion 93 is the front surface of the main mounting portion 4, similarly to the connection portion 92. And then the rear surface of the camera module mounting portion 8 (that is, the surface opposite to the surface on which the digital camera 82 or the like is mounted) is the front surface of the main mounting portion 4. Is again bent in the opposite direction along the broken line 13 so as to face the line. When the connecting portion 93 is bent at two locations, the camera module mounting portion 8 faces the same direction as the front surface of the main mounting portion 4 and faces the front side of the main mounting portion 4 as shown in FIG. Arranged to overlap. As a result, the connecting portion 93 connects the main mounting portion 4 and the camera module mounting portion 8 in a state of being bent twice.

  Next, the connecting portion 91 connecting the main mounting portion 4 and the main display module 5 shown in FIG. 4 is along the broken line 11 so that a part of the back surface of the connecting portion 91 faces the back surface of the main mounting portion 4. Mountain folded. When the connecting portion 91 is bent at one place, the display surface 51 of the main display module 5 faces the same direction as the back surface of the main mounting portion 4 and is on the back side of the main mounting portion 4 as shown in FIG. Arranged to overlap. FIG. 6 is a cross-sectional view of the vicinity of the main mounting portion 4 taken along arrow AA in FIG. As shown in FIG. 6, the connecting portion 91 connects the main mounting portion 4 and the main display module 5 in a state of being bent once, and the connecting portion 92 is bent twice in the main mounting portion 4 and the sub display module 7. Connect in state.

  Further, the connecting portion 95 for connecting the key mounting portion 6 and the memory card module 10 shown in FIG. 4 extends along the broken line 11 so that a part of the front surface of the connecting portion 95 faces the front surface of the key mounting portion 6. As shown in FIG. 5, the memory card module 10 is disposed so as to overlap the front surface side of the key mounting portion 6. As a result, the connection unit 95 connects the key mounting unit 6 and the memory card module 10 in a state of being bent once.

  Then, as shown in FIG. 7, the folded circuit board 2, the main display module 5, and the like are accommodated in the outer case 3. In FIG. 7, only a part of the front portion of the outer case 3 is shown. When the circuit board 2 and peripheral components are housed in the outer case 3, first, the front surface (the back surface of the paper in FIG. 7) of the main mounting portion 4 and the key mounting portion 6 of the circuit board 2 and the outer case. 3 is arranged so as to face the inner surface of the back surface portion 31 of the third. At this time, the sub display module 7 and the digital camera 82 are fitted into the opening provided in the back surface portion 31.

  Thereafter, the front surface portion 30 of the outer case 3 is attached to the back surface portion 31 with the inner surface facing the back surfaces of the main mounting portion 4 and the key mounting portion 6 of the circuit board 2. At this time, the main display module 5 is fitted into the opening of the front surface portion 30. Through the above assembling work, in the mobile phone 1, the main display module 5 is provided on the main surface 35 on the front side of the outer case 3, and the sub display module 7 is formed on the main surface 36 (that is, the back surface) opposite to the main surface 35. And a digital camera 82 is provided.

  These series of assembly operations may be performed by a small robot arm 15 as shown in FIG. 3 or may be performed manually by an operator.

  As described above, in the mobile phone 1 according to the first embodiment, the circuit board 2 formed by cutting the base layer 21 from one film-like member as an integrated object is folded and used. For this reason, the process of connecting a plurality of circuit boards manufactured individually as in the prior art by a complicated joining operation using ACF or the like is not required, and the manufacturing process of the mobile phone 1 can be simplified and the manufacturing cost can be simplified. Can be reduced. In addition, since the circuit board 2 has a circuit (wiring 90) formed on only one surface of the base layer 21 (may be cut out after the circuit is formed), the electronic component is mounted on the circuit board 2 and the periphery. Components can be connected without reversing the front and back of the circuit board 2. As a result, these steps can be easily performed.

  Further, the circuit board 2 is formed into a compact shape as shown in FIG. 7 by bending the circuit board 2 in a complicated manner at two or more connecting portions and superimposing each mounting portion and peripheral components three-dimensionally. Easily (ie, handled as an integral part). Thereby, the storage area in the exterior case 3 of the circuit board 2 can be reduced.

  Further, as shown in FIG. 3, the main display module 5 and the sub display module 7 are connected on the same surface of the circuit board 2 so that the display surfaces 51 and 71 face the same direction. The connecting portion 91 for connecting the module 5 is bent at one place, and the connecting portion 92 for connecting the circuit board 2 and the sub display module 7 is bent at two places, so that the main display module 5 and the sub display module 5 are connected as shown in FIG. The display module 7 is placed on the back side and the front side of the main mounting unit 4 so that the display surfaces 51 and 71 face each other (that is, the surfaces opposite to the display surface face each other). Can be arranged.

  In the circuit board 2, the main mounting part 4, the key mounting part 6, and the camera module mounting part 8 are freely located at positions off the straight line connecting the other two mounting parts. Various incorporation into the mobile phone 1 is possible. Note that the number of mounting parts may be four or more. By positioning any one of the mounting parts at a position away from the straight line connecting any two other mounting parts, irregular and diverse mounting is realized. A plurality of peripheral components can be arranged at desired positions.

  Conversely, the main display module 5 and the sub display module 7 may be connected, or the digital camera 82 may be mounted on one mounting part. In particular, the digital camera 82 may be directly mounted on the main mounting part 4. Good.

  FIG. 8 is a plan view showing the structure of the mobile phone 1a according to the second embodiment of the present invention, and shows a state before the circuit board and peripheral components incorporated in the mobile phone 1a are folded. The main configuration of the mobile phone 1a is the same as that of the first embodiment, and the same reference numerals are given in the following description. The circuit board 2 also has a circuit formed only on the front side on the base layer 21.

  In the mobile phone 1a, the circuit board 2 further includes a connection portion 96 for connecting the circuit board 2 and the back surface portion 31 of the outer case 3, and the connection portion 96 is a side on which the connection portion 94 of the key mounting portion 6 is formed. The wiring 90 is formed only on the front surface thereof. Further, unlike the first embodiment, the back surface portion 31 that is a part of the outer case 3 has a connector 34 for connection to the circuit board 2, a power supply module 32 that serves as a power source for the circuit board 2, and a power supply module Wiring 33 is provided to connect 32 and connector 34.

  The connecting portion 96 is detachably attached to the back surface portion 31 by a connector 34 provided on the back surface portion 31. Each mounting part and each peripheral component of the circuit board 2 and the power supply module 32 of the back surface part 31 are electrically connected via the connector 34 and the wiring 33 and the wiring 90 of each connection part of the circuit board 2. Further, the base layer of the connection part 96 is a part of the base layer 21 of the circuit board 2 formed by being cut out from one film-like member, and can be bent like the other connection parts. .

  In the mobile phone 1a, the circuit board 2 is folded by the same procedure as that of the first embodiment, and the connection portion 96 is attached to the back surface portion 31 by the connector 34. Thereafter, the connecting portion 96 is bent, and the circuit board 2 is easily accommodated in the back surface portion 31 together with the peripheral components such as the main display module 5, and the front surface portion (not shown) is attached to the back surface portion 31 and the mobile phone 1a. Is assembled. Alternatively, the connection portion 96 may be attached to the back surface portion 31 first, and the circuit board 2 and each peripheral component may be housed in the back surface portion 31 while being folded so as to fold origami.

  As described above, in the mobile phone 1a according to the second embodiment, the circuit board 2 is a circuit board in which a circuit is formed only on one surface of one film-like base layer 21. The connection process is omitted, and further, electronic components can be mounted on the circuit board 2 and peripheral components can be easily connected, the manufacturing process of the mobile phone 1a can be simplified, and the manufacturing cost can be reduced. Can do.

  Further, by making the connecting portion 96 with the back surface portion 31 detachable with respect to the connector 34, the circuit board 2 can be easily detached from the outer case 3 even when the circuit board 2 incorporated in the mobile phone 1a breaks down. Can be exchanged. This facilitates repair of the mobile phone 1a.

  Further, since the back surface portion 31 has circuits such as the power supply module 32, the wiring 33, and the connector 34, and this circuit is connected to the circuit board 2, a part of a circuit group that operates the back surface portion 31 together with the circuit board 2. Thus, the mobile phone 1a can be further reduced in thickness.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, in the mobile phone according to the above-described embodiment, the circuit board 2 has the camera module mounting portion 8 and the main display module 5 and the sub display module 7 are connected as peripheral components, all of which are provided. There is no need. Further, peripheral components such as a microphone, a speaker, and an antenna may be further connected or mounted on the circuit board 2 as necessary. The main display module 5 and the sub display module 7 may be other flat panel display devices using organic EL or the like.

  Each mounting part such as the main mounting part 4 may have a multilayer structure from the viewpoint of miniaturization of each mounting part, and further, the entire circuit board 2 including the connection part may have a multilayer structure. Since the connection part to be folded is not retrofitted, the circuit board 2 can easily realize a multilayer structure of the connection part. When there are a large number of mounting parts, circuits may be formed on both sides of the circuit board 2, and peripheral parts may be connected and electronic parts may be mounted on both sides.

  Each mounting portion such as the main mounting portion 4 may be configured by mounting a plate-shaped rigid substrate formed of glass epoxy or the like on the film-like circuit board 2 (that is, on the base layer 21). Good. Further, the mounting portion may be configured by mounting another film-like circuit board on the film-like circuit board 2.

  In the second embodiment, an example in which the circuit of the exterior case 3 connected to the connection portion of the circuit board 2 is the power supply module 32 or the like has been described. However, the circuit disposed in the exterior case 3 is a power supply module. The circuit is not limited to a microphone module. Note that the connection portion 96 may be a connection portion with the exterior case 3 dedicated for positioning when the circuit board 2 is stored. In this case, the connection portion 96 does not need to be formed with wiring.

  In the above embodiment, a mobile phone has been described. However, the present invention describes a portable information terminal or a computer (for example, a PDA (Personal Digital) including a plurality of flat panel display devices or flat panel display devices and an imaging device. Assistants)), digital still cameras, digital video cameras, portable receivers, and other various portable electronic devices.

The top view which shows the structure of the portable telephone which concerns on 1st Embodiment Plan view showing circuit board and peripheral components Diagram showing how the circuit board is folded Diagram showing how the circuit board is folded Diagram showing how the circuit board is folded Sectional view showing how the circuit board is folded The figure which shows a mode that a circuit board and peripheral components are accommodated in an exterior case The top view which shows the structure of the portable telephone which concerns on 2nd Embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1a Cellular phone 2 Circuit board 3 Exterior case 4 Main mounting part 5 Main display module 7 Sub display module 8 Camera module mounting part 21 Base layer 82 Digital camera 90 Wiring 91-93 Connection part

Claims (5)

A portable electronic device,
Exterior parts,
A circuit board provided in the exterior component;
A first flat panel display device provided on one main surface of the exterior component;
A second flat panel display device provided on the other main surface opposite to the one main surface of the exterior component,
The circuit board is
At least one mounting part on which the electronic component is mounted;
A first connection part for connecting the at least one mounting part and the first flat panel display device in a bent state;
A second connecting portion for connecting the at least one mounting portion and the second flat panel display device in a bent state;
The first flat panel display device and the second flat panel display device are connected to the same side surface of the circuit board;
The portable electronic device, wherein the first connection portion is bent at one place, and the second connection portion is bent at two places . The portable electronic device according to claim 1,
The portable electronic device, wherein the at least one mounting portion, the first connection portion, and the second connection portion are formed in one base layer. The portable electronic device according to claim 2,
A portable electronic device, wherein a wiring is formed only on one side of the base layer. The portable electronic device according to any one of claims 1 to 3,
The portable electronic device, wherein the first connection portion and the second connection portion are extended from the at least one mounting portion. The portable electronic device according to any one of claims 2 to 4 ,
The portable electronic device, wherein the base layer on which the at least one mounting portion, the first connection portion, and the second connection portion are formed is cut out from one film-like member. machine.

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