JP4335194B2 - Attaching the patch - Google Patents

Attaching the patch Download PDF

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JP4335194B2
JP4335194B2 JP2005287478A JP2005287478A JP4335194B2 JP 4335194 B2 JP4335194 B2 JP 4335194B2 JP 2005287478 A JP2005287478 A JP 2005287478A JP 2005287478 A JP2005287478 A JP 2005287478A JP 4335194 B2 JP4335194 B2 JP 4335194B2
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emblem
patch
back surface
opening
release paper
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JP2007100223A (en
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健行 奥川
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株式会社 オクガワ
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Description

本発明は、合成皮革、人工皮革、布帛などの表素材に、ロゴや模様やキャラクターやエンブレムなどのワッペンを取り付けたワッペンの取付方法に関する。 The present invention relates to a method for attaching a emblem in which a emblem such as a logo, a pattern, a character, or an emblem is attached to a surface material such as synthetic leather, artificial leather, or fabric.

従来のワッペンの取付構造およびその取付方法としては、次のようなものがあった。
印刷等により模様等を作成したポリ塩化ビニル等の表面材をポリウレタン等の熱可塑性合成樹脂の表面に形成してワッペン構成材が構成されている。
下型の表面に、防水膜が形成されたポリエステル系の防水処理布と同じ生地、又は、防水処理布に近い性質を有する裏当布を敷き、その裏当布に重ねて防水処理布を敷く。
Conventional attachment structures and attachment methods of the emblems are as follows.
A patch constituent material is formed by forming a surface material such as polyvinyl chloride on which a pattern or the like is formed by printing or the like on the surface of a thermoplastic synthetic resin such as polyurethane.
Place the same fabric as the polyester waterproof fabric with a waterproof film on the surface of the lower mold, or lay a backing fabric that has properties close to that of the waterproof fabric, and lay the waterproof fabric over the backing fabric. .

次に、ワッペン構成材を防水処理布上に位置決め配置し、上型に設けられたヒータを駆動して上型の温度を所定の温度、例えば、210℃に加熱する。その後、上型を下降させてワッペン構成材を加熱加圧状態で押圧する。
これにより、上型の凹部と凸部の形に応じて、ワッペン構成材を構成する表面材とポリウレタンとが所望形状に成形され、ワッペン類が成型されると同時に防水処理布に溶着され一体となる。
しかる後、上型を上昇させることにより、防水処理布にだけワッペン類が確実に溶着された状態となり、裏当布を外してワッペン類の防水処理布への取り付けを完了する。(例えば、特許文献1参照)。
特開平7−331520号
Next, the emblem component is positioned on the waterproof cloth, and the heater provided in the upper mold is driven to heat the upper mold to a predetermined temperature, for example, 210 ° C. Thereafter, the upper mold is lowered and the emblem component material is pressed in a heated and pressurized state.
Thereby, according to the shape of the concave portion and the convex portion of the upper mold, the surface material constituting the emblem constituting material and the polyurethane are molded into a desired shape, and at the same time as the emblem is molded, it is welded to the waterproof treatment cloth and integrated. Become.
Thereafter, by raising the upper mold, the patch is surely welded only to the waterproofing cloth, and the backing cloth is removed to complete the attachment of the patch to the waterproofing cloth. (For example, refer to Patent Document 1).
JP-A-7-331520

しかしながら、従来例の場合、表素材である防水処理布の表面に接着するものであり、ワッペン構成材の周端面が表面に露出し、見栄えが悪い欠点があった。
また、洗濯などによりワッペン構成材の周端面の一部が防水処理布から剥がれてほつれた状態になりやすく、商品価値が早期に損なわれる欠点があった。特に、スキーウェアやスポーツウェアといった防水膜が形成された防水処理布では、その撥水加工等の防水処理のために接着強度を高くできない欠点があった。
更に、ロゴなどで、そのロゴ部分だけを接着する場合には、接着面積を大きくとることができないために接着強度を高くできず、剥がれやすい欠点があった。
However, in the case of the conventional example, it adheres to the surface of the waterproofing cloth that is the surface material, and the peripheral end face of the emblem component material is exposed on the surface, which has a bad appearance.
In addition, a part of the peripheral end surface of the emblem constituting material is likely to be peeled off from the waterproofing cloth due to washing or the like, and there is a disadvantage that the commercial value is impaired at an early stage. In particular, waterproof fabrics such as ski wear and sportswear that have a waterproof film formed have a drawback that the adhesive strength cannot be increased due to waterproof treatment such as water repellent finish.
Furthermore, when only the logo portion is bonded with a logo or the like, the bonding area cannot be made large, so that the bonding strength cannot be increased, and there is a drawback that it is easy to peel off.

本発明は、上記の点に鑑みてなされたものであって、高い接着強度でワッペンを表素材に取り付けるとともに見栄え良く取り付けて商品価値を向上できるものを良好に提供できるようにすることを目的とする。 The present invention was made in view of the above, aims to the patch with adhesive strength have high to be able to provide good what can improve commercial value attached may look is attached to the superficial materials And

請求項1に係る発明のワッペンの取付方法は、前述のような目的を達成するために、
表素材の裏面に、離型紙を付設したホットメルト樹脂を接着し、その後に、ワッペン素材との重ね合わせ部分を残す状態でワッペン部分の形状に合わせた開口を形成するように前記表素材をレーザ切断機により切抜き、前記離型紙を剥がしてから前記ワッペン素材を前記表素材の裏面に加熱状態で圧着し、しかる後に、下型上に前記ワッペン素材を載置し、その上方から、ワッペン部分の形状に形成した上型を、その凸面表面を前記表素材の表面に接触させるようにセットし、前記上型と前記下型とにより押圧した状態で高周波溶着により前記ワッペン素材を前記表素材の裏面に一体的に接着し、前記ワッペン素材のワッペン部分を前記表素材の開口内に嵌入させた状態で前記ワッペン素材を前記表素材に一体化することを特徴としている。
In order to achieve the above-described object, the attachment method of the emblem of the invention according to claim 1
A hot melt resin with release paper is adhered to the back surface of the surface material, and then the surface material is lasered so as to form an opening that matches the shape of the patch portion while leaving the overlapping portion with the patch material. Cut out with a cutting machine, peel off the release paper, and then crimp the patch material on the back surface of the front material in a heated state, and then place the patch material on the lower mold, and from above the patch part The upper die formed in a shape is set so that the convex surface thereof is in contact with the surface of the surface material, and the emblem material is attached to the back surface of the surface material by high-frequency welding while being pressed by the upper die and the lower die. The emblem material is integrated with the front material in a state where the emblem portion of the emblem material is fitted into the opening of the front material.

請求項1に係る発明のワッペンの取付方法の構成によれば、離型紙を付設したホットメルト樹脂を表素材の裏面に接着した後に、ワッペン部分を嵌入する開口をレーザ切断機により切抜き、加熱状態での圧着により、ワッペン素材を表素材の裏面に一体化しておき、最終的に、上型と下型とにより押圧した状態での高周波溶着により、ワッペン部分を表素材の開口内に嵌入させた状態でワッペン素材を表素材に一体化する。 According to the structure of the attachment method of the emblem of the invention according to claim 1 , after bonding the hot melt resin provided with the release paper to the back surface of the front material, the opening for inserting the emblem portion is cut out by the laser cutting machine, and the heated state The emblem material was integrated with the back surface of the front material by crimping at the end, and finally, the emblem portion was fitted into the opening of the front material by high frequency welding with the upper mold and the lower mold pressed. The patch material is integrated with the front material in the state.

したがって、表素材をレーザ切断機によって局部的に加熱しながら切抜くから、切断面が溶着した状態となり、布製のものはもちろんのこと皮製のものでも切断面からほつれを生じることを回避できる。
しかも、上型と下型とを用いての高周波溶着によって、表素材の裏面へのワッペン素材のワッペン部分以外の表面の接着とワッペン部分の開口内への嵌入とを一挙に行うから、高い接着強度でワッペンを表素材に取り付けるとともに見栄え良く取り付けて商品価値を向上できるものを良好に提供できる。
Therefore, since the surface material is cut out while being locally heated by the laser cutting machine, the cut surface is in a welded state, and it is possible to avoid fraying from the cut surface even in the case of cloth or leather.
In addition, high-frequency welding using the upper and lower molds makes it possible to bond the surface of the patch material other than the patch part to the back surface of the front material and insert the patch part into the opening at once. Attaching the patch to the surface material with strength and attaching it nicely can improve the value of the product.

次に、この発明の実施例について図面を参照しながら説明する。   Next, embodiments of the present invention will be described with reference to the drawings.

図1は、本発明のワッペンの取付方法の実施例を示す工程図であり、この工程図に基づいて各工程ごとに順に説明する。   FIG. 1 is a process diagram showing an embodiment of the emblem mounting method of the present invention, and each process will be described in order based on this process diagram.

(1)ホットメルト樹脂接着工程
図1の(a)の断面図に示すように、表素材1の裏面に、離型紙2を付設したホットメルト樹脂3を接着する。図1の(a)では、表素材1、離型紙2およびホットメルト樹脂3それぞれの厚みは誇張して示している〔図1の(b)でも同様である〕。
(1) Hot-melt resin adhesion step As shown in the cross-sectional view of FIG. 1A, a hot-melt resin 3 provided with a release paper 2 is adhered to the back surface of the front material 1. In FIG. 1A, the thicknesses of the front material 1, the release paper 2 and the hot melt resin 3 are exaggerated (the same applies to FIG. 1B).

(2)レーザー切断工程
図1の(b)の断面図に示すように、離型紙2を付設したホットメルト樹脂3を接着した表素材1を作業台4上に載置し、ワッペン素材との重ね合わせ部分を残す状態でワッペン部分の形状に合わせた開口5が形成されるように、レーザー切断機(図示せず)により切抜く。
(2) Laser cutting step As shown in the cross-sectional view of FIG. 1B, the front material 1 to which the hot melt resin 3 provided with the release paper 2 is bonded is placed on the work table 4, and Cut out by a laser cutting machine (not shown) so that an opening 5 is formed in accordance with the shape of the emblem portion while leaving the overlapped portion.

(3)圧着工程
図1の(c)の断面図に示すように、表素材1の裏面から離型紙2を剥がしてからワッペン素材6上に重ね合わせ、その状態で、例えば、アイロンなどにより、表素材1の裏面にワッペン素材6を加熱状態で圧着し、表素材1とワッペン素材6とを仮止めする。図1の(c)では、表素材1およびホットメルト樹脂3と同様に、ワッペン素材6の厚みは誇張して示している。
(3) Crimping step As shown in the sectional view of FIG. 1 (c), the release paper 2 is peeled off from the back surface of the front material 1 and then superimposed on the emblem material 6, and in that state, for example, with an iron or the like, The patch material 6 is crimped to the back surface of the surface material 1 in a heated state, and the surface material 1 and the patch material 6 are temporarily fixed. In FIG. 1C, the thickness of the emblem material 6 is exaggerated as in the case of the surface material 1 and the hot melt resin 3.

(4)高周波溶着工程
図1の(d)の断面図に示すように、ワッペン部分6a(図2参照)の形状に対応する箇所を凸部7aに形成した下型7上にワッペン素材6を載置し、表素材1の上方から、ワッペン部分6a(図2参照)の形状に対応する箇所を凹部8aに形成した上型8を、その凸面表面を表素材1の表面に接触させるようにセットする。
その後、上型8を下降させ、上型8と下型7とにより押圧した状態で高周波溶着することにより、ホットメルト樹脂3を溶融して、ワッペン素材6を表素材1の裏面に一体的に接着する。これにより、ワッペン素材6のワッペン部分6a(図2参照)を表素材1の開口5内に嵌入させた状態でワッペン素材6を表素材1に一体化し、ワッペンの取り付けを完了する。図1の(d)では、表素材1、ホットメルト樹脂3およびワッペン素材6と同様に、下型7および上型8の厚みは誇張して示している。
(4) High-frequency welding process As shown in the cross-sectional view of FIG. 1 (d), the emblem material 6 is placed on the lower mold 7 in which a portion corresponding to the shape of the emblem portion 6a (see FIG. 2) is formed on the convex portion 7a. Place the upper mold 8 formed on the concave portion 8a corresponding to the shape of the emblem portion 6a (see FIG. 2) from above the front material 1 so that the convex surface thereof contacts the surface of the front material 1 set.
Thereafter, the upper mold 8 is lowered, and the hot melt resin 3 is melted by high frequency welding while being pressed by the upper mold 8 and the lower mold 7, so that the emblem material 6 is integrated with the back surface of the front material 1. Glue. Thus, the emblem material 6 is integrated with the front material 1 in a state where the emblem portion 6a (see FIG. 2) of the emblem material 6 is fitted into the opening 5 of the front material 1, and the attachment of the emblem is completed. In FIG. 1D, the thicknesses of the lower mold 7 and the upper mold 8 are exaggerated as in the case of the front material 1, the hot melt resin 3 and the emblem material 6.

上記表素材1の材料としては、人工皮革、合成皮革、布帛などが使用される。
ワッペン素材の材料としては、表素材1の材料に加えて、ポリエステルフィルムやポリウレタンフィルム、それらのフィルムに金属箔を蒸着して光沢を持たせたものなどが使用される。更には、表素材1と同じ材料で色の違うものも使用される。
下型7の材料としては、ベークライト樹脂や発泡スポンジ材などの絶縁性の材料が使用される。また、上型8の材料としては、真鍮製などの導電性の材料が使用される。
As the material of the surface material 1, artificial leather, synthetic leather, fabric, or the like is used.
As the material of the emblem material, in addition to the material of the surface material 1, a polyester film, a polyurethane film, or a material obtained by vapor-depositing a metal foil on the film is used. Furthermore, the same material as the surface material 1 but having a different color is also used.
As the material of the lower mold 7, an insulating material such as a bakelite resin or a foamed sponge material is used. In addition, as the material of the upper mold 8, a conductive material such as brass is used.

図2は、ワッペンの取付構造の実施例を示す平面図、図3は断面図(図2のA−A線拡大断面図)であり、ワッペン素材6のワッペン部分6aが上方に膨出され、ワッペン部分6aが表素材1の開口5内に嵌入された状態で、ワッペン素材6のワッペン部分6a以外の部分6bの表面全面が表素材1の裏面に接着されて一体化されている。図3においては、表素材1およびワッペン素材6の厚みは、誇張して示している。   FIG. 2 is a plan view showing an embodiment of the emblem mounting structure, FIG. 3 is a sectional view (an enlarged sectional view taken along line AA in FIG. 2), and the emblem portion 6a of the emblem material 6 is bulged upward, In a state where the emblem portion 6 a is inserted into the opening 5 of the front material 1, the entire surface of the portion 6 b other than the emblem portion 6 a of the emblem material 6 is bonded and integrated with the back surface of the front material 1. In FIG. 3, the thicknesses of the front material 1 and the patch material 6 are exaggerated.

このワッペンの取付構造は、上述したワッペンの取付方法によって製作される。図3において、ホットメルト樹脂3は高周波溶着によって溶融されていて図示していない。
上記実施例の方法では、高周波溶着工程における下型7と上型8とによる押圧により、ワッペン素材6のワッペン部分6aを膨出させて表素材1の開口5内に嵌入するようにしているが、例えば、ワッペン素材6において、予め、別の成型処理によりワッペン部分6aを膨出させたものを使用するようにしても良い。
This emblem attachment structure is manufactured by the emblem attachment method described above. In FIG. 3, the hot melt resin 3 is melted by high frequency welding and is not shown.
In the method of the above embodiment, the emblem portion 6a of the emblem 6 is bulged and fitted into the opening 5 of the front material 1 by pressing with the lower mold 7 and the upper mold 8 in the high frequency welding process. For example, in the emblem material 6, a material in which the emblem portion 6 a is bulged in advance by another molding process may be used.

上記実施例において使用するホットメルト樹脂3としては、例えば、厚みが70μmで溶融温度(メルティングポイント)が120℃程度のウレタン系熱可塑性樹脂が用いられるが、例えば、エチレン酢酸ビニル共重合体(EVA)など、表素材1の材質に応じ、それぞれに適した性状のものを用いれば良い。   As the hot melt resin 3 used in the above embodiment, for example, a urethane-based thermoplastic resin having a thickness of 70 μm and a melting temperature (melting point) of about 120 ° C. is used. For example, an ethylene vinyl acetate copolymer ( According to the material of the front material 1, such as EVA), a material suitable for each may be used.

また、上記実施例におけるレーザー切断機で用いるレーザーとしては、炭酸ガス(CO)レーザーやYAGレーザーなど各種のレーザーが適用できる。また、レーザーを照射するヘッド部は、マイクロコンピュータで制御され、設計通りの軌跡を移動して切断できるように構成されている。また、高周波溶着機の発振周波数としては、一例を示せば、40〜42MHz程度である。 As the laser used in the laser cutting machine in the above embodiment, it various lasers such as carbon dioxide (CO 2) laser or a YAG laser is applied. Further, the head unit for irradiating the laser is controlled by a microcomputer, and is configured so that it can be cut by moving the locus as designed. Moreover, as an oscillation frequency of a high frequency welding machine, if an example is shown, it will be about 40-42 MHz.

本発明のワッペンの取付方法の実施例を示す工程図であり、(a)は、ホットメルト樹脂接着工程の説明に供する図、(b)は、レーザー切断工程の説明に供する図、(c)は、圧着工程の説明に供する図、(d)は、高周波溶着工程の説明に供する図である。It is process drawing which shows the Example of the attachment method of the emblem of this invention, (a) is a figure with which it uses for description of a hot-melt-resin adhesion process, (b) is a figure with which it uses for description of a laser cutting process, (c) FIG. 4 is a diagram for explaining the crimping process, and FIG. 4D is a diagram for explaining the high-frequency welding process. ッペンの取付構造の実施例を示す平面図である。Is a plan view showing an embodiment of a mounting structure of word Ppen. 図2のA−A線拡大断面図である。It is an AA line expanded sectional view of FIG.

1…ワッペン素材
2…離型紙
3…ホットメルト樹脂
5…開口
6…ワッペン素材
6a…ワッペン部分
6b…ワッペン部分以外の部分
7…下型
8…上型
DESCRIPTION OF SYMBOLS 1 ... Patch material 2 ... Release paper 3 ... Hot-melt resin 5 ... Opening 6 ... Patch material 6a ... Patch part 6b ... Parts other than a patch part 7 ... Lower mold 8 ... Upper mold

Claims (1)

表素材の裏面に、離型紙を付設したホットメルト樹脂を接着し、その後に、ワッペン素材との重ね合わせ部分を残す状態でワッペン部分の形状に合わせた開口を形成するように前記表素材をレーザ切断機により切抜き、前記離型紙を剥がしてから前記ワッペン素材を前記表素材の裏面に加熱状態で圧着し、しかる後に、下型上に前記ワッペン素材を載置し、その上方から、ワッペン部分の形状に形成した上型を、その凸面表面を前記表素材の表面に接触させるようにセットし、前記上型と前記下型とにより押圧した状態で高周波溶着により前記ワッペン素材を前記表素材の裏面に一体的に接着し、前記ワッペン素材のワッペン部分を前記表素材の開口内に嵌入させた状態で前記ワッペン素材を前記表素材に一体化することを特徴とするワッペンの取付方法 A hot melt resin with release paper is adhered to the back surface of the surface material, and then the surface material is lasered so as to form an opening that matches the shape of the patch portion while leaving the overlapping portion with the patch material. Cut out with a cutting machine, peel off the release paper, and then crimp the patch material on the back surface of the front material in a heated state, and then place the patch material on the lower mold, and from above the patch part The upper die formed in a shape is set so that the convex surface thereof is in contact with the surface of the surface material, and the emblem material is attached to the back surface of the surface material by high-frequency welding while being pressed by the upper die and the lower die. The emblem is integrally bonded to the front material while the emblem portion of the emblem material is fitted into the opening of the front material. Method of mounting.
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