JP4328538B2 - Manufacturing method of semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device including a dustproof film that can be peeled instead of a glass plate (lid) in a package in which a semiconductor element having an imaging function or a light receiving function is mounted.
[0002]
[Prior art]
Hereinafter, FIG. 21 which is a perspective view of a semiconductor device 1 in which a semiconductor element 4 (for example, an imaging element or a light receiving element) 4 having a conventional imaging function or a light receiving function is mounted in a recess of a package, and dust and moisture prevention applied thereto are shown. The objective glass plate 11 will be described with reference to FIG.
[0003]
The conventional glass plate 11 is first polished to a predetermined thickness by polishing, and finished to a predetermined thickness while removing scratches and dirt on the glass surface by a chemical or mechanical method. Next, the glass plate 11 finished to a predetermined thickness is separated into pieces that can be mounted on the envelope upper surface 3 of the package body 2 of the semiconductor device 1. The singulation is performed by using a blade fixed to the tip of a 10 μm to 50 μm disk-shaped ultrathin blade together with a resin or metal deposited with a fine diamond of 0.5 μm to 10 μm in diameter.
[0004]
The singulation is performed by rotating a disk-shaped ultrathin blade at high speed while cooling the cut portion with water. Then, the cut pieces are cleaned and dried to become individual glass plates 11 attached to the semiconductor device 1. The glass plate 11 is bonded to the envelope upper surface 3 around the package body 2 on which the semiconductor element 4 is mounted. First, an appropriate amount of adhesive is applied to the envelope upper surface 3. As the adhesive used at this time, an adhesive having either or both of heat sensitivity and photosensitivity is used. The previous glass plate 11 is properly aligned and placed on the adhesive applied to the envelope upper surface 3 in an appropriate amount, and the glass plate 11 is bonded to the envelope upper surface 3 with an adhesive by heating or irradiation with ultraviolet rays. The glass plate 11 is used while being attached even when incorporated in each device.
[0005]
Moreover, the technique regarding the protective sheet of this glass plate 11 is also known (for example, refer patent document 1).
[0006]
[Patent Document 1]
JP-A-7-326650 (2nd page, FIG. 8)
[0007]
[Problems to be solved by the invention]
However, a semiconductor device having a structure in which a glass plate is bonded to the upper surface of the envelope of the package main body for the purpose of dust prevention, light absorption by the glass plate occurs when incorporated in an optical instrument, It may cause a decrease in light receiving efficiency. Further, light is reflected on both the light incident surface and the light exit surface of the glass, and multiple reflections or the like adversely affect the solid-state imaging device as optical signal noise. Furthermore, since the glass plate remains incorporated in the optical device, high optical flatness and thickness accuracy are required, and since the glass plate is a composite of inorganic materials, a trace amount of uranium and thorium, which is an α radiation source, is required. High-purity raw materials are required to avoid radiation damage on the semiconductor element surface due to contamination, and the anti-reflection film is formed to prevent reflection of light on both surfaces of the glass. It had the problem that.
[0008]
[Means for Solving the Problems]
In order to solve this problem, a semiconductor device of the present invention includes a package having a recess, a semiconductor element mounted in the recess, and a transparent dust-proof film bonded to the upper surface of the package via an adhesive film so as to cover the recess. The adhesive film is characterized in that its adhesiveness is reduced by light irradiation.
[0009]
With this configuration, the semiconductor device can be irradiated with light before and after being incorporated into a set product or various modules, and the dust-proof film can be easily peeled off and removed together with the dust adhering to it. There are no issues.
[0010]
Further, the method for manufacturing a semiconductor device of the present invention has a size corresponding to the concave portion of the package on the first base of the dust-proof film sheet in which the dust-proof film and the light-shielding first base are joined via the adhesive film. The step of forming the opening, the step of irradiating the dust-proof film sheet from the first substrate side to reduce the adhesiveness of the part of the adhesive film corresponding to the opening, and the size of the dust-proof film corresponding to the package The method includes a step of cutting, and a step of peeling the dust-proof film from the first base material and bonding the dust-proof film to the package via the adhesive film.
[0011]
With this configuration, the first substrate can be used as a light-shielding mask when the adhesive film is irradiated with light, or as a non-discrete sheet when cutting the dust-proof film, and a semiconductor device can be manufactured with a small number of members. In addition, the adhesive film bonded to the dust-proof film has reduced adhesiveness in any area irradiated with light, and when bonded to a package, it may adhere to the semiconductor element and its wires, causing problems. On the other hand, the non-irradiated region can be used as it is for bonding the first base material and the dust-proof film.
[0012]
In addition, in the method for manufacturing a semiconductor device of the present invention, one surface of the dust-proof film and the first light-shielding base material are bonded to each other through the adhesive material, and the other surface of the dust-proof film and the second substrate are bonded to each other through the adhesive film. A step of forming an opening having a size corresponding to the concave portion in the first base material of the dust-proof film sheet bonded with the material, and a portion corresponding to the opening by irradiating the dust-proof film sheet from the first base material side Reducing the adhesiveness of the adhesive film, cutting the dustproof film into a size corresponding to the package, and peeling the dustproof film from the second substrate and joining the package via the adhesive film. It is characterized by having.
[0013]
With this configuration, the step of forming the opening in the first base material and the step of cutting the dust-proof film can be processed from the same direction, and it is not necessary to turn the dust-proof film sheet between these steps, and the manufacturing is facilitated. .
[0014]
In addition, the pressure-sensitive adhesive film of the method for manufacturing a semiconductor device according to the present invention is characterized in that it is solidified by light irradiation to reduce the adhesiveness.
[0015]
With this configuration, even if the solidified adhesive film deteriorates with time, it does not become a problem because it becomes dust and drops and stacks on the semiconductor element.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0017]
(Embodiment 1)
1 to 9 are perspective views of each layer and each forming process for constituting the dust-proof film 9 in Embodiment 1 of the present invention. FIGS. 10A to 10H are cross-sectional views of the main steps of FIGS.
[0018]
As shown in FIG. 1, the film for producing the dust-proof film 9 of the present invention is composed of a laminated film (dust-proof film sheet) 8 of three layers (5 layers including an adhesive film and a paste material layer), and the first layer ( The second base material 5 is polyolefin, polypropylene, polyester, polyethylene terephthalate, etc., and is preferably flexible, and the second layer 6 is made of a transparent base material (dust-proof film) such as polyethylene terephthalate, polyethylene, acrylic, and ultraviolet light. Reactive type highly transparent acrylic strong adhesive paste (adhesive film) 12 laminated structure, third layer 7 kneaded with dark pigment to make light shielding polyolefin, polypropylene, polyester, polyethylene terephthalate, etc. The base material (first base material) and the weak adhesive paste material 13 are laminated.
[0019]
Each layer is bonded as shown in FIG. 2 so that the transparent second layer 6 is sandwiched between the first layer 5 and the third layer 7.
[0020]
In this state, as shown in FIG. 3, an opening 14 having the same size as the inner periphery of the envelope upper surface 3 of the package body 2 is formed in the third layer 7. The opening 14 is formed by forming a cutting groove 10 to a depth that only the third layer 7 can be removed by a punching die, and then removing the central portion. Further, there is no problem even if the third layer 7 in which the opening 14 is formed in advance is pasted later.
[0021]
Then, an appropriate amount of light (ultraviolet rays) is applied to the laminated film 8 having the third layer 7 in which the opening 14 is formed as shown in FIG. Remove or weaken the 12 stickiness. In this case, when the strong adhesive paste material 12 is solidified by light irradiation, it does not become a dust generation source even if there is a change with time later.
[0022]
Next, as shown in FIG. 5, the third layer 7 bonded to the second layer 6 with the weak adhesive paste 13 is peeled off. However, the glue residue remains on the upper surface of the second layer 6. It is important to select ones that have no properties. Further, the third layer 7 can be peeled off from the second layer 6 immediately before light irradiation for peeling off the second layer 6 from the package.
[0023]
Further, as shown in FIG. 6, the outer side of the ultraviolet irradiation region of the second layer 6 is roughly the same size as the outer periphery of the upper surface 3 of the envelope of the package body 2, and the depth that only the second layer 6 can be removed with a punching die. The cutting groove 10 is formed in As described above, there is no problem even if this groove formation is performed with the third layer 7 left.
[0024]
Finally, as shown in FIG. 7, the excess second layer 6 is removed, and the second layer 6 punched on the upper surface of the first layer 5, that is, the dust-proof film 9 is stuck and remains. In this operation, when the second layer 6 is simultaneously punched while leaving the third layer 7, the excess second layer 6 and third layer 7 are simultaneously removed after the punching process. Thus, the dust-proof film 9 remaining in the state of being arranged at equal intervals on the first layer 5 is attached to the envelope upper surface 3 of each package body 2 of the semiconductor device group as shown in FIG.
[0025]
And it adheres like FIG. 9 and prevents the dust adhering on the semiconductor element 4 at a subsequent process process or inspection process.
[0026]
A series of steps is completed for the semiconductor device 1 having the structure of FIG. Then, only the surface of the semiconductor element 4 is covered from above the dust-proof film 9, and the entire surface is irradiated with ultraviolet rays so that the adhesive force of the adhesion region of the dust-proof film 9 on the envelope upper surface 3 of the package body 2 is weakened and incorporated in the optical device. The dust-proof film 9 is peeled off immediately before application.
[0027]
FIG. 10A to FIG. 10H show cross sections of the semiconductor device 1 in the above main process.
[0028]
By doing so, the optical characteristics of the semiconductor device according to the present embodiment without a glass plate can be greatly improved as compared with the prior art, and the cost can be greatly reduced from the materials and the construction method.
[0029]
(Embodiment 2)
FIG. 11 to FIG. 19 are perspective views of each layer constituting each dust-proof film 9 and each forming process in Embodiment 2 of the present invention.
[0030]
As shown in FIG. 11, the film for creating the dust-proof film 9 of the present invention is composed of a laminated film (dust-proof film sheet) 8 of two layers (three layers when the paste is included), and a second layer (dust-proof film) 6. Is a laminated structure of a transparent base material such as polyethylene terephthalate, polyethylene, acrylic, etc. and a highly UV-sensitive acrylic strong adhesive paste (adhesive film) 12. The third layer 7 is prepared by kneading a dark pigment. It is a base material (first base material) such as polyolefin, polypropylene, polyester, polyethylene terephthalate, etc., which has been made light-shielding.
[0031]
The two kinds of layers are bonded together as shown in FIG. 12, and the transparent second layer 6 is disposed so that the adhesive surface side faces the third layer 7 so as to form one sheet.
[0032]
In this state, as shown in FIG. 13, an opening 14 having the same size as the inner periphery of the envelope upper surface 3 of the package body 2 is formed in the third layer 7. The opening 14 is formed by forming a cutting groove 10 to a depth that only the third layer 7 can be removed by a punching die, and then removing the central portion. Further, there is no problem even if the third layer 7 in which the opening 14 is formed in advance is pasted later.
[0033]
Then, as shown in FIG. 14, an appropriate amount of ultraviolet rays is irradiated on the entire surface of the laminated film 8 through the third layer 7 in which the openings 14 are formed, and the strong adhesive paste 12 in the region of the openings 14 in the second layer 6. Remove or weaken the stickiness.
[0034]
Next, the second layer 6 is turned up as shown in FIG.
[0035]
Further, as shown in FIG. 16, the outer side of the ultraviolet irradiation region of the second layer 6 is roughly the same size as the outer periphery of the upper surface 3 of the envelope of the package body 2 from the second layer 6 side by a punching die. A cutting groove 10 is formed at a depth that only the layer 6 can remove.
[0036]
Finally, as shown in FIG. 17, the second layer 6 is removed, and the second layer 6 punched on the upper surface of the third layer 7, that is, the dust-proof film 9 is stuck and remains.
[0037]
Thus, the dust-proof film 9 remaining in the state of being arranged at equal intervals on the third layer 7 is attached to the envelope upper surface 3 of each package body 2 of the semiconductor device 1 group as shown in FIG.
[0038]
And it adheres like FIG. 19 and prevents the dust adhering on the semiconductor element 4 at a subsequent process process or inspection process.
[0039]
A series of steps is completed for the semiconductor device 1 having the structure of FIG. Then, only the surface of the semiconductor element 4 is covered from above the dust-proof film 9, and the entire surface is irradiated with ultraviolet rays so that the adhesive force of the adhesion region of the dust-proof film 9 on the envelope upper surface 3 of the package body 2 is weakened and incorporated in the optical device. The dust-proof film 9 is peeled off immediately before application.
[0040]
【The invention's effect】
As described above, in the incorporation of a semiconductor device having a conventional imaging function into a camera module, it was necessary to carefully manage dust during the period from product shipment to incorporation into a customer device. According to the semiconductor device of the present invention, it is not necessary to manage it from product shipment to just before installation of the device, the dust-proof film (lid) 9 can be removed in a clean atmosphere just before mounting, and can be incorporated into the device as it is. The dust found inside can be removed, and the yield can be improved.
[0041]
In addition, since the semiconductor device having the structure of the present invention is incorporated in the device without attaching a glass plate, a device having good optical characteristics can be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view of each constituent substrate of a laminated film of a semiconductor device according to a first embodiment of the present invention. FIG. 2 is a perspective view of a laminated film in a form in which the respective constituent substrates are bonded together according to the first embodiment of the present invention. FIG. 3 is a perspective view of a laminated film in which an opening is formed in the third layer in the first embodiment of the present invention. FIG. 4 is a dustproof through the opening in the third layer in the first embodiment of the present invention. FIG. 5 is a perspective view of a form in which ultraviolet rays are radiated on the film paste material. FIG. 5 is a perspective view of a form in which the third layer of the laminated film is peeled off after ultraviolet irradiation in the first embodiment of the present invention. FIG. 7 is a perspective view of the second embodiment of the laminated film according to the first embodiment of the invention (the dust-proof film layer) in which the outer periphery is punched at a certain distance from the ultraviolet irradiation region. The removed outer second layer is peeled off and the dust-proof film is placed on the first layer at equal intervals. FIG. 8 is a perspective view of a form in which the upper surface of the package envelope and a dust-proof film are arranged to face each other in the first embodiment of the present invention. FIG. 9 is a perspective view of the first embodiment of the present invention. 10 is a perspective view of a semiconductor device in which a dustproof lid is bonded to the upper surface of the package. FIG. 10 is a cross-sectional view of the main steps in the first embodiment of the present invention. FIG. 12 is a perspective view of a laminated film in a configuration in which the constituent substrates in the second embodiment of the present invention are bonded together. FIG. 13 is a perspective view of the laminated film in a second embodiment of the present invention. 14 is a perspective view of a laminated film having an opening formed in the third layer. FIG. 14 is a perspective view of a form in which ultraviolet rays are irradiated to the paste material of the dust-proof film through the opening of the third layer in the second embodiment of the present invention. FIG. 15 shows ultraviolet irradiation according to the second embodiment of the present invention. FIG. 16 is a perspective view of the second layer of the laminated film as viewed from the surface side. FIG. 16 is a constant view from the ultraviolet irradiation region of the second layer (dustproof film) of the laminated film in the second embodiment of the present invention FIG. 17 is a perspective view of a form in which outer peripheries separated by a distance are punched. FIG. 17 is a diagram illustrating a case where the punched outer second layer is peeled off and a dustproof film is arranged on the third layer at regular intervals. FIG. 18 is a perspective view of a form in which the upper surface of the package envelope and a dust-proof film are arranged to face each other in the second embodiment of the present invention. FIG. 19 is a second embodiment of the present invention. FIG. 20 is a perspective view of a glass plate applied to a conventional solid-state imaging device. FIG. 21 is a perspective view of a conventional solid-state imaging device. Figure [Explanation of symbols]
1 Semiconductor device (solid-state imaging device)
2 Package body 3 Envelope top surface 4 Semiconductor element 5 First layer 6 Second layer 7 Third layer 8 Laminated film 9 Dustproof film 10 Cutting groove 12 Strong adhesive paste 13 Weak adhesive paste 14 Opening

Claims (3)

A package having a recess, a semiconductor element mounted in the recess, and a transparent dustproof film bonded to the upper surface of the package through an adhesive film whose adhesiveness is reduced by light irradiation so as to cover the recess. A method for manufacturing a semiconductor device , comprising:
Forming an opening having a size corresponding to the concave portion in the first base material of the dustproof film sheet in which the dustproof film and the first light-shielding base material are bonded via the adhesive film;
Irradiating the dustproof sheet with light from the first substrate side, and reducing the adhesiveness of the adhesive film of the portion corresponding to the opening;
Cutting the dust-proof film into a size corresponding to the package;
Separating the dust-proof film from the first base material and bonding the dust-proof film to the upper surface of the package through the adhesive film. A package having a recess, a semiconductor element mounted in the recess, and a transparent dustproof film bonded to the upper surface of the package through an adhesive film whose adhesiveness is reduced by light irradiation so as to cover the recess. A method for manufacturing a semiconductor device , comprising:
A dust-proof film sheet in which one surface of the dust-proof film and the first light-shielding base material are joined via a paste material, and the other side of the dust-proof film and the second base material are joined via the adhesive film Forming an opening having a size corresponding to the concave portion in the first base material,
Irradiating the dustproof sheet with light from the first substrate side, and reducing the adhesiveness of the adhesive film of the portion corresponding to the opening;
Cutting the dust-proof film into a size corresponding to the package;
Separating the dust-proof film from the second base material and bonding the dust-proof film to the package through the adhesive film. Method for producing the adhesive film semiconductor device according to claim 1 or claim 2, wherein the adhesive is solidified by light irradiation is to decrease.

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