JP4327526B2 - 光半導体装置 - Google Patents
光半導体装置 Download PDFInfo
- Publication number
- JP4327526B2 JP4327526B2 JP2003273295A JP2003273295A JP4327526B2 JP 4327526 B2 JP4327526 B2 JP 4327526B2 JP 2003273295 A JP2003273295 A JP 2003273295A JP 2003273295 A JP2003273295 A JP 2003273295A JP 4327526 B2 JP4327526 B2 JP 4327526B2
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- JP
- Japan
- Prior art keywords
- light
- optical semiconductor
- semiconductor device
- light reflecting
- central axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Led Device Packages (AREA)
Description
C 中心軸
L,L1a,L1b 光
1 基板
3 LEDチップ(光半導体チップ)
5 リフレクタ
50a 第1の光反射面
50b 第2の光反射面
6 透光部材
Claims (8)
- 放射状に光を発し、かつ厚み方向に延びる中心軸に対して傾斜した方向に進行する光が最も高い光度となる光度分布をもつ光半導体チップと、
上記光半導体チップを上記中心軸廻りに囲む光反射面を有するリフレクタと、
を備えている光半導体装置であって、
上記リフレクタは、上記中心軸に直交し、かつ互いに直交する二方向おいて、上記光半導体チップを挟んで互いに対向する一対ずつの第1および第2の光反射面を備えており、
上記一対の第1の光反射面は、上記光半導体チップから発せられた光のうち、最も高い光度の光を遮る高さとされており、
上記一対の第2の光反射面は、上記第1の光反射面よりも低くかつ上記最も高い光度の光を遮らない高さとされていることを特徴とする、光半導体装置。 - 上記光半導体装置全体が、上記中心軸方向視において長矩形状とされており、
上記長矩形の各辺は、上記第2の光反射面側の辺の方が、上記第1の光反射面側の辺よりも長い、請求項1に記載の光半導体装置。 - 上記一対の第1の光反射面は、上記光半導体チップから向かってきた光を上記中心軸に沿って進行するように反射する、請求項1または2に記載の光半導体装置。
- 上記各第2の反射面の上記中心軸に対する傾斜角が、上記各第1の光反射面の上記中心軸に対する傾斜角よりも小さい、請求項1ないし3のいずれかに記載の光半導体装置。
- 上記リフレクタに収容され、かつ上記光半導体チップを覆う透光部材をさらに有する、請求項1ないし4のいずれかに記載の光半導体装置。
- 上記透光部材のうち上記光半導体チップに対して上記中心軸方向に離間した面は、凸状の曲面とされている、請求項5に記載の光半導体装置。
- 上記光半導体チップおよび上記リフレクタを搭載している基板を備えており、かつこの基板には、上記光半導体チップの複数の電極に電気的に接続された複数の端子が設けられている、請求項1ないし6のいずれかに記載の光半導体装置。
- 放射状に光を発し、かつ厚み方向に延びる中心軸に対して傾斜した方向に進行する光が最も高い光度となる光度分布をもつ光半導体チップと、
上記光半導体チップを上記中心軸廻りに囲む1以上の光反射面を有するリフレクタと、
を備えている光半導体装置であって、
上記リフレクタには、上記光半導体チップから発せられた光のうち、最も高い光度の光を遮る高さとされた光反射面と、上記中心軸方向視において上記光を遮る高さとされた光反射面とは異なる位置に設けられ、かつ上記最も高い光度の光を遮らない高さとされた光反射面と、が混在するように設けられていることを特徴とする、光半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003273295A JP4327526B2 (ja) | 2003-07-11 | 2003-07-11 | 光半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003273295A JP4327526B2 (ja) | 2003-07-11 | 2003-07-11 | 光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005033122A JP2005033122A (ja) | 2005-02-03 |
JP4327526B2 true JP4327526B2 (ja) | 2009-09-09 |
Family
ID=34210576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003273295A Expired - Fee Related JP4327526B2 (ja) | 2003-07-11 | 2003-07-11 | 光半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4327526B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006351708A (ja) * | 2005-06-14 | 2006-12-28 | Toyoda Gosei Co Ltd | 発光ダイオードランプ及び光源装置 |
KR100637476B1 (ko) | 2005-11-09 | 2006-10-23 | 알티전자 주식회사 | 측면발광 다이오드 및 그 제조방법 |
US9041286B2 (en) | 2013-05-29 | 2015-05-26 | Venntis Technologies LLC | Volumetric light emitting device |
-
2003
- 2003-07-11 JP JP2003273295A patent/JP4327526B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2005033122A (ja) | 2005-02-03 |
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