JP4276456B2 - Plate heat transfer device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is a plate heat conduction device that conducts heat to a plate, and is a technique that is particularly suitable for producing a hardened body using a fast-curing cement composition.
[0002]
[Prior art]
Conventionally, a method as shown in FIGS. 10 and 11 has been used as a method of heating the surface of the plate. For example, as shown in FIG. 10, a pipe 102 is provided on the back surface of the plate 101 to be heated, and the surface of the plate 101 is heated by flowing steam or hot water through the pipe, or as shown in FIG. A method has been used in which a rubber heater 103, a heating wire or the like is bonded to the back surface of the plate 101 to be heated to heat the surface of the plate. As other examples, there were a method of spraying hot air and steam directly on the back surface of the plate to be heated, and a method of heating with a far infrared heater.
[0003]
However, in the conventional heating method, the temperature rises locally only in the portion of the entire plate surface that is in contact with the heating device, and it is difficult to uniformly heat the entire plate surface. Therefore, temperature irregularities (unevenness) occur in the plate, and extreme thermal distortion occurs in the plate, which deteriorates the dimensional accuracy of the plate. Further, even if a temperature sensor is provided on the plate to adjust the temperature, the conventional heating method has a large temperature variation on the plate, and it is difficult to accurately measure the temperature, and the temperature cannot be adjusted.
[0004]
The present invention has been made in view of such problems, and is a plate heat conduction device that can conduct heat uniformly to the surface of the plate and uniformly heat or cool the surface of the plate without unevenness. Providing is a technical issue.
[0005]
[Means for Solving the Problems]
That is, the present invention has a heat medium space into which the heat medium fluid flows into substantially the entire back surface of the plate to conduct heat, and conducts heat to the surface of the plate by convection of the fluid. An inflow means for flowing the fluid into the heat medium space; and a discharge means for discharging the fluid in the space to the outside of the space, and the back surface of the plate is discharged out of the heat medium space. A collecting groove is formed, and the discharge means communicates with the collecting groove.
[0006]
With this configuration, the heat medium space can be filled with a fluid, and the surface of the plate can be uniformly heated or cooled by heat conduction of the filled fluid. Further, since the heat medium space is formed on substantially the entire back surface of the plate, the entire surface of the plate can be heated or cooled. Further, for example, when a gas unnecessary for heat conduction is mixed in the heat medium space, such as when steam is generated from the fluid or mixed when the fluid flows in, the heat medium space is discharged by the discharge means. Since unnecessary gas can be discharged from the heat medium, the heat medium space can be filled with a fluid serving as a heat medium.
[0007]
In addition, a collecting groove for storing fluid to be discharged is formed on the back surface of the plate. Since the collecting groove communicates with the discharging means, the fluid to be discharged is collected in the collecting groove. The fluid can be discharged from the groove by the discharge means. Since the plate heat conduction device of the present invention uses gravity, if the back surface of the plate has a slight inclination, it is not possible to completely discharge the mixed gas or the like. For this reason, it is desirable that the opening of the discharging means is disposed at a position slightly higher than the back surface of the plate.
[0008]
According to the plate heat conduction device of the present invention, it is possible to uniformly heat and cool the entire plate, so that temperature spots on the plate do not occur. Therefore, it is difficult for thermal distortion of the plate to occur, and it is possible to maintain the accuracy dimension of the plate with high accuracy. Furthermore, according to the present invention, it is possible to easily adjust the temperature of the plate, which has been difficult in the past, by adjusting the temperature of the fluid flowing into the plate.
[0009]
The heat medium fluid may be any liquid or gas as long as it can flow into the heat medium space and conduct heat to the plate. Further, by adjusting the temperature, both heating and cooling can be performed, and it is also possible to adjust the temperature depending on the properties of the flowing fluid. For example, when the plate should not be heated to 100 ° C. or higher, it can be heated without exceeding 100 ° C. by using water as the fluid. On the other hand, when heating the plate to 100 ° C. or higher, oil or the like may be used without using water.
[0010]
As the plate to be heated and cooled according to the present invention, a plate having high corrosion resistance can be suitably used, and a plate made of stainless steel or aluminum can be exemplified. However, stainless steel and aluminum plates have a high coefficient of thermal expansion, and are difficult to apply to plates that require high accuracy. Therefore, it can be suitably used in the present invention by using a material with less thermal distortion and applying a rust prevention treatment to the surface in contact with the liquid or introducing a rust inhibitor into the liquid. Further, it is desirable that the plate has a uniform thickness as much as possible in order to minimize thermal distortion, and that the heat medium space formed on the back surface of the plate is as symmetric as possible in the left and right direction.
[0011]
In the plate heat conduction device of the present invention, an exhaust groove for allowing the gas to be discharged to flow into the back surface of the plate is formed, and the exhaust groove is preferably communicated with the collective groove.
[0012]
When fluid flows into the heat medium space, it usually flows in using a supply pump or the like. For this reason, air other than the fluid serving as the heat medium may be mixed in the heat medium space. Further, when a liquid is used as the heat medium, the liquid may evaporate due to heat conduction with the plate, and a large amount of gas may accumulate in the heat medium space. In such a case, it is possible to exhaust from the discharge means.
[0013]
However, the heat medium space is widely formed over the entire back surface of the plate, and when the gas is located at a position away from the collecting groove, it is difficult to discharge, and a large amount of gas accumulates in the heat medium space. Sometimes. When a large amount of gas accumulates in the heat medium space, heat conduction between the plate and the fluid is hindered, and the surface of the plate cannot be uniformly heated and cooled. Therefore, by forming an exhaust groove for allowing the gas to be discharged to flow into the back surface of the plate, it becomes possible to easily collect and exhaust the gas accumulated in a place away from the collective groove in the collective groove, It is possible to reliably fill the heat medium space with the heat medium fluid. The exhaust groove may be formed so that gas flows into the back surface of the plate. For example, the effect can be further improved by forming a plurality of gas in the collecting groove by using the upper surface of the exhaust groove as an inclined surface. Is demonstrated.
[0014]
Moreover, it is desirable that the back surface of the plate according to the present invention be inclined upward toward the collecting groove. With the above configuration, the gas to be discharged can be guided to the collecting groove along the inclination of the back surface of the plate, so that the gas located at a position away from the opening of the discharging means can also be easily collected and exhausted in the collecting groove. Therefore, it is possible to reliably fill the heat medium space with the heat medium fluid.
[0015]
Further, the heat medium space is a space surrounded by the plate, a side plate provided on the back surface of the plate, and a bottom plate spaced from the back surface of the plate, and the opening of the inflow means. The portion passes through the bottom plate and is located in the heat medium space, and the opening is provided with a rectifying plate having substantially the same shape as the opening through a certain distance. It is preferable that the fluid flows in along the bottom plate through a gap with the portion.
[0016]
In the plate heat conduction device according to the present invention, since the fluid as the heat medium flows in from the opening of the inflow means, the fluid in the heat medium space convects in the space. However, if the fluid is introduced from the opening only in one direction, the fluid in the heat medium space does not convect over the whole, and temperature spots may occur in the space. This temperature spot causes a temperature spot on the surface of the plate. Therefore, it is desirable to provide a baffle plate so that the fluid in the heat medium space may be convected over the entire area as necessary.
[0017]
The opening of the inflow means passes through the bottom plate and is located in the heat medium space, and since the rectifying plate is disposed at a certain distance in the opening, the gap between the rectifying plate and the opening is Fluid flows in along the bottom plate from the gap. Accordingly, convection occurs in multiple directions, and convection is performed over the entire heat medium space. In addition, the convection mechanism may not only use the rectifying plate but also convect the fluid using, for example, a fan screw. The direction in which the fluid flows in from the opening is preferably directed in multiple directions, but it is desirable not to directly flow toward the surface of the plate in order to eliminate temperature spots on the plate.
[0018]
In addition, the plate heat conduction device according to the present invention can be used for various applications. For example, in a slurry molding device that continuously molds a curable slurry, the slurry is cured by heating the curable slurry. It can be suitably used as a plate heater to be promoted. If the plate heater used in the slurry molding apparatus does not uniformly heat the plate surface, cracks or the like may occur in the molded product, and it is important to uniformly heat the plate surface. Therefore, the present invention can be preferably used.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of a plate heat conduction device according to the present invention will be described in detail with reference to the drawings.
[0020]
In the present embodiment, a plate heat conduction device is used as a slurry heating device in a slurry molding apparatus that continuously develops a curable slurry to a predetermined width and thickness to obtain a molded product. The slurry molding apparatus is arranged in a belt that continuously receives and conveys uncured slurry on a moving surface, a roll that defines the flow width and thickness of the uncured slurry on the moving surface, and a lower portion of the belt. And a plate heat conduction device for heating the belt. As a molded product molded by such a slurry molding apparatus, for example, a cement-based building material panel as a building material can be exemplified.
[0021]
The curable slurry used in the present embodiment is a mixture mainly composed of an inorganic curable material, and is a fast-curing cement composition that further increases fast-curing by heating.
[0022]
That is, the plate heat conduction device according to the present embodiment heats the slurry from the lower part of the belt when the uncured slurry conveyed on the belt is cured with the roll by standardizing the width, thickness and the like. And used to accelerate the curing of the slurry.
[0023]
Next, the plate heat conduction device according to the present embodiment will be described in detail. FIG. 1 is a perspective view of a plate heat conduction device according to the present embodiment as viewed from below, and FIG. 2 is a cross-sectional view taken along the A line shown in FIG. FIG. 3 is a B cross-sectional view of FIG. As shown in the figure, the plate heat conduction device includes a plate 1 disposed under the belt, a heat medium space 2 for filling a back surface 1b of the plate 1 with a heating fluid, and the heat medium space 2. A supply pipe 3 serving as an inflow means for introducing the heat medium fluid into the heat medium, a collecting groove 4 for storing the fluid to be discharged in the heat medium space 2, and the collecting groove 4 communicated with the back surface 1b of the plate 1. A plurality of exhaust grooves 5 and a drain pipe 6 disposed below the collective grooves 4 and serving as a discharge means for discharging the fluid to be discharged from the heat medium space 2 to the outside are provided. Moreover, in this Embodiment, in order to heat the said hardening slurry and to accelerate | stimulate hardening of a slurry, warm water was used as a fluid for heat media.
[0024]
In the plate 1, a belt for transporting the cured slurry is moved on the surface 1a, and the back surface 1b is filled with warm water and the plate surface 1a is heated by heat conduction. At this time, if there are temperature spots on the surface 1a of the plate 1, the curing time of the slurry varies, and in some cases, cracks or the like may occur in the molded product. Further, if the dimensional accuracy of the plate 1 disposed at the lower part of the belt is poor, the molded product is deformed according to the distortion of the plate 1 when the molded product is cured, or an excessive force is applied to the molded product to cause cracks, etc. May also occur. Therefore, it is necessary to heat the entire surface 1a of the plate 1 to a uniform temperature.
[0025]
The heat medium space 2 is a space surrounded by the plate 1, a side plate 21 provided on the periphery of the back surface 1 b of the plate 1, and a bottom plate 22 arranged at a distance from the plate 1. 1 is formed over substantially the entire back surface.
[0026]
The supply pipe 3 has a cylindrical shape, and one opening 3a penetrates the bottom plate 22 and is located in the heat medium space 2, and the other opening 3b has a water supply pump for supplying hot water ( (Not shown). One opening 3 a is adjusted to be substantially flush with the bottom surface 22 a of the heat medium space 2. The opening 3a is provided with a flap 7 for flowing hot water flowing into the heat medium space 2 in the horizontal direction along the bottom surface 22a.
[0027]
FIG. 4 is a perspective view of the opening 3a of the supply pipe 3 provided with the flap 7 as viewed from below. The flap 7 includes a rectifying plate 71 having substantially the same shape as the opening 3 a of the supply pipe 3, and a plurality of rectifying fins 72 erected on the outer periphery of the opening 3 a. Via the opening 3a of the supply pipe 3 and a gap 7a. Accordingly, the hot water flowing into the heat medium space 2 flows in four directions along the bottom surface 22a from the gap 7a between the flow straightening fins 72. The rectifying plate 71 of the flap 7 is preferably substantially the same shape as the opening 3a of the supply pipe 3 in order to prevent supply shortage due to pressure loss.
[0028]
A plurality of the exhaust grooves 5 are formed on the back surface 1b of the plate 1, and a gas to be exhausted in the heat medium space 2 flows in. The hot water supplied from the water supply pump is often mixed with air mixed with the hot water. Therefore, even if it is going to fill the heat medium space 2 with warm water, air will accumulate in the upper part. The exhaust groove 5 is formed in order to collect such air and the like in the collecting groove 4 easily.
[0029]
The drain pipe 6 has a cylindrical shape, and one opening 6a thereof is disposed below the collecting groove 4, and discharges the fluid to be discharged accumulated in the collecting groove 4 from the heat medium space to the outside. For this reason, the other opening 6 b is disposed outside the heat medium space 2.
[0030]
Next, the flow of fluid in the plate heat conduction device configured as described above will be described in detail.
[0031]
First, hot water flows into the heat medium space 2 from the opening 3a of the supply pipe 3 disposed on the bottom surface 22a. At this time, since the flap 7 is provided in the opening 3a of the supply pipe 3, hot water flows in four directions along the bottom surface 22a. When the inflow of hot water proceeds, the air in the heat medium space 2 accumulates in the upper collecting groove 4 and is discharged from the drain pipe 6 to the outside. In addition, when hot water is supplied, gas such as air mixed in the hot water and flowing into the heat medium space 2 also accumulates in the collecting groove 4. At this time, the gas located away from the collecting groove 4 is collected in the collecting groove 4 along the exhaust groove 5 formed on the back surface 1 b of the plate 1. In this way, the gas collected in the collecting groove 4 is discharged from the drain pipe 6, and the hot water is almost completely filled in the heat medium space 2. Furthermore, since hot water is continuously flowing from the supply pipe 3, hot water exceeding the capacity of the heat medium space 2 is discharged from the drain pipe 6 together with the gas. Therefore, the fluid in the heat medium space 2 circulates and does not cause temperature spots, so that the surface 1a of the plate 1 can be heated evenly.
[0032]
The plate heat conduction apparatus according to the present invention includes not only the first embodiment described above but also other embodiments. Here, another embodiment is illustrated. In the second embodiment, the exhaust groove 5 of the first embodiment is different. FIG. 6 is a partial perspective view of the plate heat conduction device according to the second embodiment, and FIG. 7 is a cross-sectional view of FIG. In the first embodiment, the upper surface of the exhaust groove 5 is formed substantially parallel to the surface 1 a of the plate 1, but in the second embodiment, the upper surface of the exhaust groove 5 is inclined upward toward the collecting groove 4. Yes. Therefore, compared with the first embodiment, the gas in the heat medium space 2 can be easily collected in the collecting groove 4.
[0033]
In the third and fourth embodiments, the exhaust groove 5 shown in the first and second embodiments is not provided, and the back surface 1b of the plate 1 is inclined. FIG. 8 is a partial cross-sectional view of the plate heat conduction device according to the third embodiment, and corresponds to FIG. 7 of the second embodiment. In the first and second embodiments, the exhaust groove 5 is provided on the back surface 1b of the plate 1 and the gas in the heat medium space 2 is collected in the collecting groove 4 by the exhaust groove 5, but in the third embodiment, the plate 1 The entire back surface 1 b is inclined upward toward the collecting groove 4. Therefore, as compared with the first and second embodiments, the plate heat conduction device of the third embodiment can collect the gas on the entire back surface 1b of the plate 1 in the collecting groove 4 without leakage.
[0034]
FIG. 9 is a partial cross-sectional view of the plate heat conduction device according to the fourth embodiment, and corresponds to FIG. 8 of the third embodiment. In the plate heat conduction device according to the fourth embodiment, the positions of the drain pipe 6 and the collecting groove 4 of the plate heat conduction device shown in the third embodiment are made different. In the fourth embodiment, unlike the other embodiments, the drain pipe 6 and the collecting groove 4 are located at the center of the plate 1. Compared to other embodiments, the passage route of the gas flowing through the exhaust groove 5 can be shortened, so that the gas can be efficiently collected in the collecting groove 4. However, since the fluid is discharged from the lower part of the drain pipe 6, it is desirable to select appropriately according to the installation situation.
[0035]
【The invention's effect】
As described above, according to the present invention, heat can be uniformly conducted to the surface of the plate, and the surface of the plate can be uniformly heated or cooled without spots. Also, if necessary, by providing an exhaust groove that facilitates gas discharge or by inclining the back surface of the plate, it becomes possible to fill the heat medium space under the plate almost completely with the heat medium fluid, The surface of the plate can be heated or cooled uniformly.
[Brief description of the drawings]
FIG. 1 is a perspective view of a plate heat conduction device according to a first embodiment.
FIG. 2 is a view taken in the direction of arrow A in FIG.
3 is a cross-sectional view taken along B in FIG.
FIG. 4 is an enlarged view of a supply pipe portion according to the present embodiment.
FIG. 5 is an enlarged view of a collecting groove portion according to the present embodiment.
FIG. 6 is a perspective view of a plate heat conduction device according to a second embodiment.
7 is a cross-sectional view taken along the line C in FIG.
FIG. 8 is a cross-sectional view of a plate heat conduction device according to a third embodiment.
FIG. 9 is a cross-sectional view of a plate heat conduction device according to a fourth embodiment.
FIG. 10 is a perspective view of a conventional plate heater.
FIG. 11 is a perspective view of a conventional plate heater.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Plate 2 Heat medium space 3 Supply pipe 4 as inflow means 4 Collecting groove 5 Exhaust groove 6 Drain pipe 71 as discharge means Rectification plate 101 Plate 102 Pipe 103 Rubber heater

Claims (5)

A plate heat conduction device having a heat medium space into which a heat medium fluid flows into substantially the entire back surface of a plate to conduct heat, and conducting heat to the surface of the plate by convection of the fluid,
Inflow means for flowing the fluid into the heat medium space; and discharge means for discharging the fluid in the heat medium space to the outside of the heat medium space,
On the back surface of the plate, there is formed a collecting groove for storing the fluid discharged out of the heat medium space,
The plate heat conduction device, wherein the discharge means communicates with the collecting groove. 2. The plate heat conduction according to claim 1, wherein an exhaust groove for allowing a gas to be discharged to flow is formed on a rear surface of the plate, and the exhaust groove communicates with the collecting groove. apparatus. The plate heat conduction device according to claim 1, wherein a rear surface of the plate is inclined upward toward the collecting groove. The heat medium space is a space surrounded by the plate, a side plate provided on the back surface of the plate, and a bottom plate arranged at an interval from the back surface of the plate,
The opening of the inflow means is located in the heat medium space through the bottom plate, and the opening is provided with a rectifying plate that allows fluid to flow along the bottom plate. The plate heat conduction apparatus according to any one of claims 1 to 3. The plate heat conduction device according to any one of claims 1 to 4, wherein the fluid is a heating fluid, and the plate is used in a slurry molding apparatus to heat a curable slurry to be molded. .

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