JPS6129882Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a floor structure, and particularly to a floor structure suitable for indoor heating and cooling.

One of the indoor heating and cooling systems is the floor cooling/heating return system, in which the floor itself cools, heats, or
Since it is heated, it is possible to effectively cool and heat the room by adjusting the indoor temperature alone or in combination with other indoor heating and cooling equipment.

Conventionally, floor panels that warm the floorboards by flowing a heat medium below the floor surface (Utility Model No. 51-81531
No.) has been proposed.

This floor panel consists of a heat insulating board placed on a floor slab and a heat conductive board placed on the board, with a flow path for warm air or hot air provided in either the heat insulating board or the heat conductive board. A concave groove is provided.

A heated floor is formed by laying multiple floor panels on a floor slab so that their grooves communicate with each other, and warm air and hot air in the flow path flows in contact with the heat conductive substrate, warming the heat conductive substrate. .

By the way, when grooves are provided on a heat-insulating substrate, heat is transferred to the heat-conductive substrate through the portion of the heat-conductive substrate where warm air or hot air passing through the groove comes into contact with the heat-conductive substrate, that is, on the open end of the groove. Since the heating occurs in one part of the heat conductive board, the other part of the heat conductive board that is not in contact with warm air or hot air, that is, the part of the heat conductive board on both sides of the open end of the groove, is heated by the heat transfer heated by heat transfer. The heat must be conducted from a portion of the board.

Furthermore, even when grooves are provided on a heat conductive substrate, the areas that require heating by heat conduction as described above still remain, although they occupy a smaller area than in the case described above. The presence cannot be completely removed.

From this, heating over the entire area of the heat conductive substrate,
Heating takes time and has poor thermal efficiency.

Furthermore, heating by the heat conduction of the heat conductive substrate,
If a plurality of grooves are formed or both substrates are formed to have a small thickness in order to reduce the proportion occupied by the portion that requires heating, the strength required for the floor cannot be maintained.

Furthermore, since the groove is surrounded by both an insulating substrate that does not allow heat to pass through and a heat conductive substrate that allows heat to pass through easily, when the supply of warm air or hot air is stopped, the heat remaining in the groove will transfer to the heat conductive substrate. consumed in a short time. Therefore, there is a problem in heat retention.

Therefore, the present invention can uniformly cool or heat the entire floor surface in a short time,
Moreover, the objective is to create a floor structure with high cold and heat retention effects.

The present invention comprises a floor slab, a covering material consisting of a base layer disposed on the floor slab, and a surface layer on the base layer, and the base layer is made of an elastic material bonded with a continuous gap. A plurality of passages for a fluid cooling medium or heating medium formed by a large number of granules are communicated with voids in the base layer that are open to the lower surface of the surface layer, and the passages are formed in the base layer or the floor slab. It is characterized by having been established.

According to the present invention, the cooling medium or heating medium flowing through the passage can flow radially through countless continuous voids in the base layer and reach the lower surface of the surface layer, and while moving through the voids, it can flow radially. Since the object is cooled or heated, all parts of the surface layer can be cooled or heated by the cooling or heating medium and the cooled or heated granules.

In addition, since the base layer itself has a heat insulating function and each of the granules constituting the base layer is cooled or heated, even after the supply of the cooling medium or heating medium is stopped, the granules The object subsequently exerts a cooling or warming effect on the surface layer.

Therefore, it is possible to realize a high cold or heat retention effect and increase thermal efficiency.

The features of the invention will become clearer from the following description of the illustrated embodiment.

The floor 10 according to the present invention consists of a floor slab 12 and a facing material 14 bonded onto the floor slab.

As shown in FIG.
It consists of a base layer 16 that is bonded thereon and a surface layer 18 that is formed on the base layer. Base layer 16
It consists of multiple granules of elastic material such as rubber chips or cork chips and a room-temperature curable resin for bonding these granules, and the multiple granules are also bonded to a fluid to enable individual elastic deformation. The particles are adhesively bonded with continuous gaps 20 between them to allow flow. Further, the upper surface of the base layer 16 is uneven with a large number of granules, and the convex portions are in surface or point contact with the lower surface of the surface layer 18, and the gaps 20 between the granules are formed on the lower surface of the surface layer 18. The recessed portion communicates with the recessed portion in the horizontal direction.

As shown in FIG. 1, in the facing material 14, a plurality of passages 22 for a fluid cooling medium or heating medium are formed substantially parallel to the floor slab 12, and these passages 22 are connected to the surface layer 18. It communicates with a cavity 20 that is open to the lower surface of. Gases such as cold air and hot air, and liquids such as cold water and hot water can be made to flow through this passage 22. As shown in FIG. 2, the passage 22 can be formed by a pipe member 24, so that the flow of the cooling and heating medium is not hindered by elastic deformation of the covering material 14 when loaded. Increase the hardness of No. 14, and
As shown in the figure, when the passage 22 is provided at the lower part of the covering material 14, the passage 22 does not easily undergo cross-sectional deformation, so the pipe member as described above is not required.

Further, as shown in FIG. 3, a base layer 16 is formed between a first layer 16a and an intermediate layer 16b below the first layer.
A second layer 16c is formed through the first layer 16.
A passage 22 can also be provided in a. middle layer 1
In step 6b, a sealing material such as granular or powdered rubber or sand having a smaller diameter than the granular material forming the second layer is sprinkled on the second layer 16c to be adhered to the floor slab 12. It consists of a sealing layer 26 to be formed. Alternatively, a liquid resin that is curable at room temperature may be further applied on the sealed second layer 16c to form a sacrificial coating layer 28. The second layer 16c and the intermediate layer 16b are the floor slab 1
2 and the passage 24. Second
The layer 16c is airtightly formed using granules having a smaller diameter than the granules of the first layer 16a. Thereby, the heat insulating effect of the second layer 16c can be increased. Furthermore, since the first layer 16a itself has heat insulating properties, it prevents the temperature of the cooling medium or heating medium flowing through the passage 22 from increasing or decreasing. By providing the layer 16b, the above-mentioned prevention effect can be further increased.

A plurality of holes are provided in the tubular member 24 forming the passageway 22 to allow a cooling or heating medium to be discharged around the passageway 22, preferably towards the surface layer 18, and to flow through the underlayer 16 through the voids. This allows the surface layer 18 to be directly cooled or heated. Furthermore, since each particulate matter is cooled or heated when the cooling medium or heating medium flows in the void 20, the portion of the surface layer 18 that is in contact with the particulate matter is cooled by the cooled or heated particulate matter. or heated.

In the examples described above, the passages are provided in the base layer above the floor slab, but instead of these examples, passages 22' may be provided in the floor slab 12, as shown in FIG. 4. The passage 22' is defined by a plurality of grooves 30 open on the upper surface of the floor slab 12 and a plate member 32 provided on the lower surface of the base layer 16 and arranged in the longitudinal direction of the grooves 30. Alternatively, the passageway 22' may be defined by a tubular member 34 disposed within the groove 30 as shown in FIG. The plate member 32 and the tube member 34 are each provided with a plurality of holes at intervals in the longitudinal direction, so that the cooling or heating medium flowing in the passage 22' is directed to the surface layer 18 as in the previous example. It can be released towards the target.

In the example shown in FIGS. 1, 2, and 3, the base layer 1
6 is formed thickly, also in FIGS. 4 and 5.
In the example shown in the figure, on the contrary, when the thickness of the underlying layer is small,
It is preferable to apply each.

According to the heating and cooling floor structure according to the present invention, since the cooling medium or heating medium flowing through the passage reaches the lower surface of the surface layer through the voids in the base layer, the medium can be diffused radially, so to speak. In addition, the cooling or heating medium can flow between the recesses under the lower surface of the surface layer, and the individual granules are cooled or heated, so that the cooling or heating medium directly flows into the cooled or heated granules. This makes it possible to indirectly cool or heat the entire surface layer almost uniformly and in a short time.

Furthermore, according to the present invention, even after the supply of the cooling medium or heating medium is stopped, the granular materials constituting the base layer are cooled or heated, so that the cooling or heating effect on the surface layer is maintained for a short time. Together with the heat insulating properties of the base layer, the above effect can be maintained for a certain period of time without disappearing. In other words, it has excellent cold or heat retention properties, which is also effective in increasing indoor heating and cooling efficiency.

Furthermore, according to the present invention, uniform cooling or heating over a wide area of the surface layer and therefore the floor surface does not result in a reduction in the strength that the floor itself should have.

[Brief explanation of drawings]

1, 2, and 3 are partial vertical sectional views showing an example in which a passage for a heat medium is provided in the base layer in the floor structure according to the present invention, and FIGS. FIG. 2 is a partial vertical cross-sectional view showing an example in which a passageway is provided in a floor slab. 10: Floor, 12: Floor slab, 14: Surface material, 16:
Base layer, 16a: first layer, 16b: intermediate layer, 1
6c: second layer, 18: surface layer, 20: void, 2
2: passage, 24, 34: pipe member, 26: sealing layer, 28: sacrificial coating layer, 30: groove, 32: plate member.

Claims (1)

[Scope of utility model registration request] The method includes a floor slab and a facing material adhered to the floor slab, the facing material being formed on a base layer made of a large number of particles of elastic material bonded with continuous gaps, and on the base layer. and at least one of the floor slab and the base layer is provided with a plurality of passages for a fluid cooling medium or a heating body, and the passages are open to the lower surface of the surface layer. A heating and cooling floor structure that communicates with the voids in the strata.