JPS6027908B2 - Heat absorption/dissipation panel device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat absorption/dissipation panel device for indoor heating and cooling, collecting solar heat energy, or melting snow accumulated on a roof by absorbing or releasing heat energy through radiation. It is.

This type of heat absorbing and dissipating panel device disclosed in Japanese Patent Application Laid-Open No. 1983 (Japanese Patent Application No. Sho 51-2315y) includes a heat absorbing and dissipating plate made of a metal plate with high thermal conductivity, and a heat absorbing and dissipating plate made of a metal plate with high thermal conductivity. at least one conduit for passing a heat-transfer fluid to absorb or radiate heat, the conduit being housed in at least one groove formed in the , are placed inside the plate-like members constituting walls, floors, etc., at a smaller constant interval.

In a heat absorbing/radiating panel device having such a configuration, it is necessary to connect the heat absorbing/radiating plate and the conduit so that thermal energy can be efficiently transferred between them. Moreover, the connection is
It must be possible to maintain a desirable mutual positional relationship between the grooves of the heat absorbing and dissipating plate and the conduit over a long period of time. Generally, it is extremely difficult to bring the grooves of the heat absorbing and dissipating plate into perfect contact with the conduits along their longitudinal direction, and moreover, it requires precision machining, so it is essential to keep the manufacturing cost of the panel device low. possible.

To this end, the gaps between the grooves of the heat absorbing and dissipating plate and the conduits are filled with a filler having high thermal conductivity, thereby eliminating the need for precision machining of the panel device. As a filling material, for example, “
It is known to use a thermal adhesive, which is commercially available under the trade name ``Thermotite'' and solidifies when left in the atmosphere. However, this known thermal adhesive is unable to resist the thermal stresses that are constantly exerted on the heat absorbing and dissipating panel device over a long period of time, resulting in cracks and delamination at the adhesive surface with grooves or conduits. As a result, the thermal resistance between the heat sink and the conduit increases. It goes without saying that this thermal stress is caused by the difference in linear expansion between the heat absorbing and dissipating plate and the conduit. On the other hand, it has also been proposed to use powders such as metal or gypsum as fillers. Since this powder filler is not adhesive, it is not affected by the thermal stress described above. However, due to the difference in linear expansion between the heat absorbing and dissipating plate and the conduit, a relative reciprocating displacement occurs between them in the longitudinal direction of the conduit, and as a result, the filling density of the filler becomes uneven. Even if a powder filler is used, the thermal resistance between the heat absorbing and dissipating plate and the conduit increases, and therefore the heat conduction properties deteriorate over time. In this way, with heat absorbing and dissipating panel devices that use known fillers, it is impossible to maintain the initially good heat conduction characteristics between the heat absorbing and dissipating plates and the conduits over a long period of time, and it has been After a certain amount of use, the overall thermal efficiency decreased and it could not be used any further.

Therefore, the entire panel device had to be replaced with a new one. An object of the present invention is to provide a heat absorbing and dissipating panel device that can almost permanently maintain good heat conduction characteristics at the connecting portion between the heat absorbing and dissipating plate and the conduit.

Another object of the present invention is to provide an improved heat absorbing/dissipating panel device that can appropriately protect each component from damage caused by external mechanical shock or thermal expansion.

Another object of the present invention is to connect a heat absorbing/dissipating plate and a conduit in a heat conductive manner using a filler that does not solidify even when left in the atmosphere for a long period of time, and to prevent cracks or cracks from occurring at the connection portion. It is an object of the present invention to provide a heat absorbing and dissipating panel device.

Another object of the present invention is to provide a heat absorption/dissipation panel device that is unitized so that it can be easily constructed on site.

In order to make other objects, features and advantages of the invention clear, the invention will now be described in detail with reference to the embodiments illustrated in the drawings.

FIG. 1 is a block diagram of a heat absorption and radiation system to which a heat absorption and radiation panel device according to the present invention is applied.

In this heat absorption/dissipation system, water as a liquid medium supplied by the pump 10 via the switching valve 12 to the heat absorption/dissipation panel device 14 is heated by absorbing the radiant heat of sunlight within the heat absorption/dissipation panel device 14. do. The heated hot water is sequentially supplied to the heat storage device 201 via the switching valves 16 and 18, where heat is accumulated. The cooled water from the heat storage device 2 is returned to the pump 10 via the switching valve 22. A heating device 24 such as a boiler is installed between the switching valves 18 and 22.
The hot water heated by this heating device 24 is supplied from the pump river to the heat absorption and radiation panel device 14, so that heat can be radiated to the outside from this heat absorption and radiation panel device 14. Further, between the switching valves 12 and 16, a heat radiating device 26, which can have the same configuration as the heat absorbing and dissipating panel device 14 and serves for indoor heating, is connected. Hot water or heat storage device 2
Pump 10 hot water heated by the accumulated heat
If the heating is supplied by As shown in FIG. 2, the heat absorption/dissipation panel device 14 according to the present invention has a conduit 28 for flowing hot water and a groove 30 in which the conduit 28 is integrated, on the surface thereof, and is connected to the conduit 28 in a heat conductive manner. It is configured as a unit that can be easily constructed on site by combining the heat absorbing and dissipating plate 32 with good thermal conductivity.

The material of conduit 28 may be copper, for example. The heat absorbing and dissipating plate 32 may be made of a metal material such as aluminum, which has an oxide film layer with a thickness of about 50 to 60 mm formed on the front surface and a metallic glossy surface on the back surface. This oxide film layer acts as a selective heat absorbing/radiating layer that efficiently absorbs or emits only heat rays having a wavelength corresponding to a required temperature (for example, 20 to 30 mm). A non-drying adhesive filler 34 is filled in the gap between the conduit 28 and the groove 30 of the heat absorbing/radiating plate 32 (see FIG. 4). Note that in order to reduce heat loss as much as possible, it is desirable to adhere a heat insulating material 36 to the back surface of the heat absorbing and dissipating plate 32. Further, the selective heat absorption and radiation layer provided on the heat absorption and radiation surface of the heat absorption and radiation panel device 14 may be formed by, for example, competitive coating such as carbon black. In this embodiment, the above-mentioned non-drying adhesive filler 36 is made of approximately 40% aluminum powder, approximately 25% organosilicon resin polymer, approximately 25% silicone adhesive synthetic rubber, and approximately 25% organic solvent by volume. A composition containing 10% of each is used.

It has a black hue and a viscosity of approximately 40,000 p.p. (2
5o0), specific gravity 3.0 thermal conductivity approximately 10-14kcal/
and h℃. This filler has excellent water resistance, is non-drying and adhesive, and has good build-up properties. therefore,
Unlike conventionally used thermal adhesives, it does not solidify even if left in the atmosphere, so no cracks or cracks will occur at the joints over a long period of time. Therefore, even if a relative displacement occurs between the heat absorbing and dissipating plate 32 and the conduit 28 due to a difference in the amount of linear expansion, the filler 34 maintains good heat conduction characteristics. Note that the reason why the filler has a high thermal conductivity is that metal powder such as aluminum is uniformly mixed therein. In the present invention, the heat absorbing and dissipating panel device 14 having the above-mentioned configuration is installed inside the heat absorbing and dissipating surface of the building, so when the heat absorbing and dissipating surface is a roof, it is placed below it, and when it is an indoor wall, it is installed inside the heat absorbing and dissipating surface of the building. Place it behind it.

In the embodiment shown in FIG. 3, an oxide film layer with a thickness of approximately 50 to 60 m is formed on the front and back surfaces of the roof, which serves as a heat absorption and radiation surface of the building, similar to the heat absorption and radiation plate 32 described above. It is composed of a metal plate member 38.

The material of this plate member 38 can be copper, for example. The plate member 38 is fixed via a support member 40 to a suitable structural member 42 of the building. The heat absorption/dissipation panel device 14 is
Below the plate-shaped member 38, there is a slight gap almost uniformly below this,
For example, 2.5 to 5. It is fixed to the structural member 42 across the side. The panel device 14 includes a connecting pipe 4 which is bent into an appropriate shape.
4 to connect each other. Note that FIG. 4 is a partially enlarged view of FIG. 3, showing the filler 34 filled between the grooves 30 of the heat absorbing and dissipating plate 32 and the conduit 28. In order to keep the gap between the plate member 38 and the panel device 14, which constitute the heat absorption and radiation surface of the building, constant even under the action of the load due to snow accumulation and to always perform good radiant heat transfer, a gap shown in the figure is provided between the two. This honeycomb structure is made of a material with a low thermal conductivity of 2.5 to 5. It can be formed to the thickness of the cape.

As shown in FIG. 5, according to the present invention, assemblies 14A, 14B, 14C of heat absorbing and dissipating panel devices corresponding to one heat absorbing and dissipating surface of a building are assembled by connecting a plurality of heat absorbing and dissipating panel devices 14,
14D can be formed.

Further, as shown in FIG. 6, such assemblies 14A-1
4D can be appropriately connected and inserted between the switching valves 12 and 16 of the heat absorption and radiation system shown in FIG. The effect when the heat absorbing/dissipating panel device according to the present invention having the above configuration is placed under the roof will be explained separately during heat absorption and heat dissipation.

{1} At the time of heat absorption: When sunlight irradiates the plank member 38 that constitutes the roof, which serves as a heat absorption and radiation surface of the building, only heat rays of a specific length are absorbed by the plate member 38 due to the oxide film layer on the surface. As a result, the plate member 38 is heated.

The heat of the plate member 3838 is radiated from the oxide film layer on the surface thereof toward the heat absorption/dissipation panel device 14, and is absorbed by the oxide film layer on the surface of the heat absorption/dissipation plate 32. Plate member 3838
The heat is simultaneously transmitted to the plate member 38 and the heat absorbing/radiating plate 32. However, the above-mentioned convective heat transfer by air hardly occurs. This is because the air exists in an extremely thin layer between the plate member 36 and the heat absorbing/dissipating plate 32, and this layer of air is hardly disturbed. The heat absorbed by the heat absorbing/radiating plate 32 in this way is transferred to the heat absorbing/radiating plate 32.
The heat absorption/dissipation panel device 14 generates hot water because the water that is conducted from the heat exchanger 2 through the conduit 2M and flows through the conduit 28 is heated.
In the heat absorption/dissipation system shown in FIG. 1, the generated hot water is supplied to the heat storage device 20 by the pump 10, where the heat is stored and used at an appropriate time, or the heat dissipation device 26
and used directly for indoor heating. (2) During heat dissipation: by the heat accumulated in the heat storage device 2, or by the heating device 2
4 generates hot water and supplies this hot water from the pump to the heat absorption/dissipation panel device 14, the heat of the hot water is transferred to the conduit 2.
8 and is conducted to the heat absorbing/radiating plate 32, thereby heating the heat absorbing/radiating plate 32.

The heat of the heat absorbing and dissipating plate 32 is radiated from the oxide film layer on its surface toward the plate-like member 38, is absorbed by the oxide film layer on the back surface of the plate-like member 38, and heats the plate-like member 38. In this case as well, conductive heat transfer through the air takes place at the same time as during the heat absorption described above. Heat from the plate member 38 is radiated to the outside of the building from the oxide layer on its surface. Therefore, for example, if snow is piled up on the plate member 38 as a roof, this snow can be efficiently melted. In addition, in both cases of heat absorption and heat radiation described above, the heat absorption and radiation plate 32 hardly radiates heat to the back side. This is because the back surface of the heat absorbing and dissipating plate 32 is formed as a glossy surface that radiates heat. Further, since a heat insulating material is arranged on the back surface of the heat absorption/dissipation slope 32, heat loss due to conduction or convection can be effectively prevented. The present invention is not limited to the embodiments described above, but can be modified in various ways within its scope.

In particular, in order to prevent the conduit 28 from falling off from the groove 30 of the heat absorption/dissipation plate 32, the connection between the heat absorption/dissipation plate 32 and the conduit 28 is replaced by relying only on the above-mentioned non-drying adhesive filler.
Further mechanical connection means may be provided, thereby increasing the strength of the connection between the two. An embodiment of such a configuration will be described with reference to FIGS. 7 to 12. 7th
In the example shown in the figure, the depth of the groove 30 of the heat absorption/dissipation plate 32 and the diameter of the conduit 28 are made to almost match, and a plate-shaped fixing element 46 is provided on the heat absorption/dissipation plate 32 that straddles the groove 30 above the conduit 28. A plurality of such securing elements 46 are secured at predetermined intervals along the length of the conduit 28, and are secured by suitable means.

In the example shown in FIG. 8, the depth of the groove 30 is
After fitting the conduit 28 into the groove 30, the width at the upper part 48 of the groove 30 is made narrower than the diameter of the conduit 28, and the groove 30, which was initially U-shaped, is turned upside down. Shape into a Q shape.

In the example shown in FIG. 9, the depth of the groove 30 is
8, and after the conduit 2 is accommodated in the groove 30, protrusions are formed at predetermined intervals in the longitudinal direction in the upper part 5 of the groove 30.

In the example shown in FIG. 10, the groove 30 and the conduit 2
8 each have a rectangular cross-sectional shape, and the upper part 5 of the groove 30
2 is drawn in the same manner as in the example shown in FIG. 8 or 9.

In the example shown in FIG. 11, the grooves 30 are preformed in the same shape as shown in FIG. 8, and the conduit 28 has a D-shaped cross section.

When the conduit 28 is placed in the groove 30, the conduit 28 is placed in the first
Article 3 rotated 90 degrees from the state shown in Figure 1
0 through the narrow portion 54 at the top. 1st
In the example shown in FIG. 2, the groove 30 is formed in a semicircular shape, and the upper half of the conduit 28 that protrudes upward from the groove 30 is similarly semicircular. 5
6, and hold this fixing element 56 loosely by the heat absorbing and dissipating plate 3.
2 by an appropriate means.

The advantage in this case is that the plate member 38 of the building can be directly supported on the upper surface of the fixing element 56, and the honeycomb structure as described above is not required. Note that, as in the example shown in FIG. 7, a plurality of fixing elements 56 are arranged at predetermined intervals in the longitudinal direction of the conduit 28. As is clear from the above explanation, according to the present invention, the heat absorbing and dissipating plate and the conduit are mechanically and thermally connected via the non-drying adhesive filler, so that good heat conduction properties can be maintained almost permanently. It becomes possible to maintain

[Brief explanation of the drawing]

Fig. 1 is a block diagram of a heat absorption/dissipation system to which a heat absorption/dissipation panel device according to the present invention is applied, Fig. 2 is an exploded perspective view showing one embodiment of the device of the present invention, and Fig. 3 is a block diagram of a heat absorption/dissipation system to which a heat absorption/dissipation panel device according to the present invention is applied. FIG. 4 is a sectional view showing a part of FIG. 3 enlarged, and FIG. 5 is a partial plan view of an assembly in which the device of the present invention is successively constructed; FIG. 6 is a circuit diagram showing a connection example of the assembly shown in FIG. 5, and FIGS. 7 to 12 are partial sectional views similar to FIG. 4 showing various embodiments of the device of the present invention. 14... Heat absorption/dissipation panel device, 28... Conduit, 32... Heat absorption/dissipation plate, 34... Filling material, 36... Heat insulating material, 38... Heat absorption and radiation surface of a building. Blind 1 Figure 2 Blind 2 Figure 3 Blind 4 Figure 5 Key 6 Figure 7 Blind 7 Figure 8 Figure 9 Figure 10 Blind 11 Figure 12

Claims (1)

[Scope of Claims] 1. A metallic material having at least one groove, which is arranged almost uniformly at a small gap on the inside of a plate-like member forming a heat absorption/dissipation surface of a building. a heat absorbing and dissipating plate; and at least one conduit that fits into the groove and passes through a heat transfer fluid to absorb or radiate heat;
A heat absorption/dissipation panel device characterized in that a non-drying adhesive filler having high thermal conductivity is filled in the fitting gap between the groove and the conduit. 2. The heat absorbing and dissipating panel device according to claim 1, wherein the non-drying adhesive filler contains about 40% metal powder by volume. 3. In the heat absorption/dissipation panel device according to claim 2, the non-drying adhesive filler further comprises about 25% by volume of an organosilicon resin polymer, about 25% of a silicone-based adhesive synthetic rubber, and about 10% by volume of an organosilicon resin polymer. % of an organic solvent. 4. The heat absorption and radiation panel device according to claim 1, wherein the heat absorption and radiation plate has a selective heat absorption and radiation layer on a surface facing the plate member. 5. In the heat absorption/dissipation panel device according to claim 4, a surface of the heat absorption/dissipation plate that does not face the plate member is formed as a glossy surface, and a heat insulating material is adhered to the glossy surface. A heat absorption/dissipation panel device featuring: 6. The heat absorbing and dissipating panel device according to claim 4 or 5, wherein the heat absorbing and dissipating plate is made of aluminum. 7. The heat absorbing and dissipating panel device according to claim 1, wherein the conduit is made of copper. 8. The heat absorbing and dissipating panel device according to claim 1, wherein the plate-like member is made of a metal plate having selective heat absorbing and dissipating layers on both sides. 9. The heat absorbing and dissipating panel device according to claim 4 or 8, wherein the selective heat absorbing and dissipating layer is formed of an oxide film on the surface of a metal plate.