CN221657950U - A mold structure convenient for cooling - Google Patents
A mold structure convenient for cooling Download PDFInfo
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- CN221657950U CN221657950U CN202323347534.5U CN202323347534U CN221657950U CN 221657950 U CN221657950 U CN 221657950U CN 202323347534 U CN202323347534 U CN 202323347534U CN 221657950 U CN221657950 U CN 221657950U
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- 238000001816 cooling Methods 0.000 title claims abstract description 85
- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 238000005057 refrigeration Methods 0.000 claims abstract description 24
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims 1
- 239000002826 coolant Substances 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型公开了一种方便冷却的模具结构，包括支撑座与上板，所述支撑座的上端外表面固定安装有下模，所述上板的下端外表面固定安装有上模，所述下模的上端外表面开设有下模腔，所述下模的内部安装有冷却管，所述冷却管的一端固定连接有热水排水接头，所述冷却管的另一端外表面固定连接有冷水进水接头，所述支撑座的一侧设置有散热组件，所述散热组件包括安装板、支撑板、安装块、散热扇、冷却壳、第一微型泵、第二微型泵、第一排出管、第一进水管、第二进水管、第二排出管、导流隔板、半导体制冷片与散热翅片。本实用新型所述的一种方便冷却的模具结构，便于提高散热的效率，便于对冷却液进行散热等优点。
The utility model discloses a mold structure for convenient cooling, including a support seat and an upper plate, a lower mold is fixedly installed on the outer surface of the upper end of the support seat, an upper mold is fixedly installed on the outer surface of the lower end of the upper plate, a lower mold cavity is opened on the outer surface of the upper end of the lower mold, a cooling pipe is installed inside the lower mold, one end of the cooling pipe is fixedly connected to a hot water drainage joint, and the other end of the cooling pipe is fixedly connected to a cold water inlet joint, and a heat dissipation component is arranged on one side of the support seat, and the heat dissipation component includes a mounting plate, a support plate, a mounting block, a heat dissipation fan, a cooling shell, a first micro pump, a second micro pump, a first discharge pipe, a first water inlet pipe, a second water inlet pipe, a second discharge pipe, a guide baffle, a semiconductor refrigeration sheet and a heat dissipation fin. The mold structure for convenient cooling described in the utility model has the advantages of improving the efficiency of heat dissipation and facilitating the heat dissipation of the coolant.
Description
技术领域Technical Field
本实用新型涉及不锈钢制造模具技术领域，具体为一种方便冷却的模具结构。The utility model relates to the technical field of stainless steel manufacturing molds, in particular to a mold structure which is convenient for cooling.
背景技术Background Art
铸造模具是指为了获得零件的结构形状，预先用其他容易成型的材料做成零件的结构形状，然后再在砂型中放入模具，于是砂型中就形成了一个和零件结构尺寸一样的空腔，再在该空腔中浇注流动性液体，该液体冷却凝固之后就能形成和模具形状结构完全一样的零件了；常用于不锈钢铸造生产。A casting mold is a material that is easily formed into a part in advance in order to obtain its structural shape. The mold is then placed in a sand mold, forming a cavity with the same size as the part. A flowing liquid is then poured into the cavity, and after the liquid cools and solidifies, a part with the same shape and structure as the mold can be formed. It is commonly used in stainless steel casting production.
现有技术中为了方便加速工件的冷却效率，现有技术中一般通过液冷的方式进行散热，对液冷散热升高的液体一般仅通过散热翅片进行散热，散热效率低，从而影响了液体对工件散热的效率，为此，我们提出一种方便冷却的模具结构。In order to accelerate the cooling efficiency of the workpiece, the prior art generally dissipates heat through liquid cooling. The liquid with increased heat dissipation by liquid cooling is generally only dissipated through cooling fins, and the heat dissipation efficiency is low, thereby affecting the efficiency of the liquid in dissipating heat to the workpiece. For this reason, we propose a mold structure that is convenient for cooling.
实用新型内容Utility Model Content
(一)解决的技术问题1. Technical issues to be solved
针对现有技术的不足，本实用新型提供了一种方便冷却的模具结构，便于提高散热的效率，便于对冷却液进行散热等优点，可以有效解决背景技术中的问题。In view of the deficiencies in the prior art, the utility model provides a mold structure that is convenient for cooling, which is convenient for improving the efficiency of heat dissipation and facilitating the heat dissipation of the coolant, and can effectively solve the problems in the background technology.
(二)技术方案(II) Technical solution
为实现上述目的，本实用新型采取的技术方案为：一种方便冷却的模具结构，包括支撑座与上板，所述支撑座的上端外表面固定安装有下模，所述上板的下端外表面固定安装有上模，所述上板上端外表面的中部安装有唧嘴，所述下模的上端外表面开设有下模腔，所述下模的内部安装有冷却管，所述冷却管的一端固定连接有热水排水接头，所述冷却管的另一端外表面固定连接有冷水进水接头，所述支撑座的一侧设置有散热组件，所述散热组件包括安装板、支撑板、安装块、散热扇、冷却壳、第一微型泵、第二微型泵、第一排出管、第一进水管、第二进水管、第二排出管、导流隔板、半导体制冷片与散热翅片，所述支撑板的数量为两组，两组所述支撑板固定安装于安装板下端外表面的左右两侧。To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a mold structure that is convenient for cooling, including a support seat and an upper plate, the upper outer surface of the support seat is fixedly installed with a lower mold, the lower outer surface of the upper plate is fixedly installed with an upper mold, the middle part of the upper outer surface of the upper end of the upper plate is installed with a nozzle, the upper outer surface of the lower mold is provided with a lower mold cavity, a cooling pipe is installed inside the lower mold, one end of the cooling pipe is fixedly connected with a hot water drainage joint, and the other end outer surface of the cooling pipe is fixedly connected with a cold water inlet joint, a heat dissipation component is arranged on one side of the support seat, and the heat dissipation component includes a mounting plate, a support plate, a mounting block, a heat dissipation fan, a cooling shell, a first micropump, a second micropump, a first discharge pipe, a first water inlet pipe, a second water inlet pipe, a second discharge pipe, a guide baffle, a semiconductor refrigeration sheet and a heat dissipation fin, and the number of the support plates is two groups, and the two groups of support plates are fixedly installed on the left and right sides of the lower outer surface of the mounting plate.
优选的，所述安装块固定安装于安装板下端外表面的右侧，所述散热扇的数量为三组，三组所述散热扇等间距固定在安装块上。Preferably, the mounting block is fixedly mounted on the right side of the outer surface of the lower end of the mounting plate, the number of the cooling fans is three groups, and the three groups of cooling fans are fixed on the mounting block at equal intervals.
优选的，所述半导体制冷片固定安装于安装板的中部，所述散热翅片位于半导体制冷片的下端外表面，所述散热翅片通过导热胶粘接在半导体制冷片的下端外表面。Preferably, the semiconductor refrigeration plate is fixedly mounted in the middle of the mounting plate, the heat dissipation fins are located on the lower outer surface of the semiconductor refrigeration plate, and the heat dissipation fins are bonded to the lower outer surface of the semiconductor refrigeration plate by means of thermally conductive adhesive.
优选的，所述冷却壳位于半导体制冷片的上端外表面，所述冷却壳通过导热胶粘接在半导体制冷片的上端外表面。Preferably, the cooling shell is located on the upper outer surface of the semiconductor refrigeration plate, and the cooling shell is bonded to the upper outer surface of the semiconductor refrigeration plate by means of heat-conducting adhesive.
优选的，所述导流隔板安装在冷却壳的内部，所述导流隔板的数量为多组，多组所述导流隔板将冷却壳的内腔形成Z型的走水道。Preferably, the guide baffles are installed inside the cooling shell, and there are multiple groups of the guide baffles, which form the inner cavity of the cooling shell into a Z-shaped water channel.
优选的，所述第一微型泵固定在冷却壳上端外表面靠近支撑座一端的左侧，所述第二微型泵固定安装于冷却壳上端外表面靠近支撑座一端的右侧，所述第一排出管连接在第一微型泵的下端外表面，所述第一进水管连接在第一微型泵的一侧外表面与热水排水接头之间，所述第二进水管固定安装于第二微型泵的下端外表面，所述第二排出管固定安装于第二微型泵的一侧外表面与冷水进水接头之间，所述第一排出管、第二进水管的内腔均与冷却壳的内腔连通。Preferably, the first micropump is fixed on the left side of the upper outer surface of the cooling shell near one end of the support seat, the second micropump is fixedly installed on the right side of the upper outer surface of the cooling shell near one end of the support seat, the first discharge pipe is connected to the lower outer surface of the first micropump, the first water inlet pipe is connected between the outer surface of one side of the first micropump and the hot water drain joint, the second water inlet pipe is fixedly installed on the lower outer surface of the second micropump, the second discharge pipe is fixedly installed between the outer surface of one side of the second micropump and the cold water inlet joint, and the inner cavities of the first discharge pipe and the second water inlet pipe are both connected to the inner cavity of the cooling shell.
(三)有益效果(III) Beneficial effects
与现有技术相比，本实用新型提供了一种方便冷却的模具结构，具备以下有益效果：Compared with the prior art, the utility model provides a mold structure that is convenient for cooling and has the following beneficial effects:
1、该一种方便冷却的模具结构，设置的散热组件，通过设置半导体制冷片，便于通过半导体制冷片制冷的效果对制冷液进行散热，提高散热的效率。1. A mold structure that is convenient for cooling has a heat dissipation component, and a semiconductor refrigeration sheet is provided to facilitate heat dissipation of the refrigerant through the refrigeration effect of the semiconductor refrigeration sheet, thereby improving the efficiency of heat dissipation.
2、该一种方便冷却的模具结构，设置的散热扇与散热翅片，便于对半导体制冷片制热的一面进行散热，保证半导体制冷片的正常运转。2. The mold structure is convenient for cooling, and the heat dissipation fan and heat dissipation fins are arranged to dissipate heat from the heating side of the semiconductor refrigeration plate, thereby ensuring the normal operation of the semiconductor refrigeration plate.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本实用新型一种方便冷却的模具结构的整体结构示意图。FIG1 is a schematic diagram of the overall structure of a mold structure that facilitates cooling according to the present invention.
图2为本实用新型一种方便冷却的模具结构的局部侧视截面图。FIG. 2 is a partial side cross-sectional view of a mold structure for convenient cooling according to the present invention.
图3为本实用新型一种方便冷却的模具结构中散热组件的结构示意图。FIG3 is a schematic structural diagram of a heat dissipation component in a mold structure that facilitates cooling according to the present invention.
图4为本实用新型一种方便冷却的模具结构中散热组件的结构分解示意图。FIG. 4 is a schematic diagram of the structural decomposition of a heat dissipation component in a mold structure that facilitates cooling according to the present invention.
图中：1、支撑座；2、下模；3、上模；4、上板；5、唧嘴；6、热水排水接头；7、冷水进水接头；8、散热组件；9、冷却管；10、下模腔；11、安装板；12、支撑板；13、安装块；14、散热扇；15、冷却壳；16、第一微型泵；17、第二微型泵；18、第一排出管；19、第一进水管；20、第二进水管；21、第二排出管；22、导流隔板；23、半导体制冷片；24、散热翅片。In the figure: 1. support base; 2. lower mold; 3. upper mold; 4. upper plate; 5. nozzle; 6. hot water drain connector; 7. cold water inlet connector; 8. heat dissipation assembly; 9. cooling pipe; 10. lower mold cavity; 11. mounting plate; 12. support plate; 13. mounting block; 14. heat dissipation fan; 15. cooling shell; 16. first micro pump; 17. second micro pump; 18. first discharge pipe; 19. first water inlet pipe; 20. second water inlet pipe; 21. second discharge pipe; 22. guide baffle; 23. semiconductor refrigeration sheet; 24. heat dissipation fin.
具体实施方式DETAILED DESCRIPTION
为使本实用新型实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体实施方式，进一步阐述本实用新型。In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.
本实施例是一种方便冷却的模具结构。This embodiment is a mold structure that is convenient for cooling.
如图1-4所示，包括支撑座1与上板4，支撑座1的上端外表面固定安装有下模2，上板4的下端外表面固定安装有上模3，上板4上端外表面的中部安装有唧嘴5，下模2的上端外表面开设有下模腔10，下模2的内部安装有冷却管9，冷却管9的一端固定连接有热水排水接头6，冷却管9的另一端外表面固定连接有冷水进水接头7，支撑座1的一侧设置有散热组件8，散热组件8包括安装板11、支撑板12、安装块13、散热扇14、冷却壳15、第一微型泵16、第二微型泵17、第一排出管18、第一进水管19、第二进水管20、第二排出管21、导流隔板22、半导体制冷片23与散热翅片24，支撑板12的数量为两组，两组支撑板12固定安装于安装板11下端外表面的左右两侧。As shown in Figures 1-4, it includes a support base 1 and an upper plate 4, a lower mold 2 is fixedly installed on the outer surface of the upper end of the support base 1, an upper mold 3 is fixedly installed on the outer surface of the lower end of the upper plate 4, a nozzle 5 is installed in the middle of the outer surface of the upper end of the upper plate 4, a lower mold cavity 10 is opened on the upper outer surface of the lower mold 2, a cooling pipe 9 is installed inside the lower mold 2, one end of the cooling pipe 9 is fixedly connected to a hot water drainage joint 6, and the other end of the outer surface of the cooling pipe 9 is fixedly connected to a cold water inlet joint 7, a heat dissipation component 8 is arranged on one side of the support base 1, the heat dissipation component 8 includes a mounting plate 11, a support plate 12, a mounting block 13, a heat dissipation fan 14, a cooling shell 15, a first micro pump 16, a second micro pump 17, a first discharge pipe 18, a first water inlet pipe 19, a second water inlet pipe 20, a second discharge pipe 21, a guide baffle 22, a semiconductor refrigeration plate 23 and a heat dissipation fin 24, the number of the support plates 12 is two groups, and the two groups of support plates 12 are fixedly installed on the left and right sides of the lower end outer surface of the mounting plate 11.
安装块13固定安装于安装板11下端外表面的右侧，散热扇14的数量为三组，三组散热扇14等间距固定在安装块13上；半导体制冷片23固定安装于安装板11的中部，散热翅片24位于半导体制冷片23的下端外表面，散热翅片24通过导热胶粘接在半导体制冷片23的下端外表面；冷却壳15位于半导体制冷片23的上端外表面，冷却壳15通过导热胶粘接在半导体制冷片23的上端外表面；导流隔板22安装在冷却壳15的内部，导流隔板22的数量为多组，多组导流隔板22将冷却壳15的内腔形成Z型的走水道；第一微型泵16固定在冷却壳15上端外表面靠近支撑座1一端的左侧，第二微型泵17固定安装于冷却壳15上端外表面靠近支撑座1一端的右侧，第一排出管18连接在第一微型泵16的下端外表面，第一进水管19连接在第一微型泵16的一侧外表面与热水排水接头6之间，第二进水管20固定安装于第二微型泵17的下端外表面，第二排出管21固定安装于第二微型泵17的一侧外表面与冷水进水接头7之间，第一排出管18、第二进水管20的内腔均与冷却壳15的内腔连通。The mounting block 13 is fixedly mounted on the right side of the lower outer surface of the mounting plate 11. The number of heat dissipation fans 14 is three groups, and the three groups of heat dissipation fans 14 are fixed on the mounting block 13 at equal intervals; the semiconductor cooling plate 23 is fixedly mounted in the middle of the mounting plate 11, and the heat dissipation fins 24 are located on the lower outer surface of the semiconductor cooling plate 23, and the heat dissipation fins 24 are bonded to the lower outer surface of the semiconductor cooling plate 23 by thermal conductive adhesive; the cooling shell 15 is located on the upper outer surface of the semiconductor cooling plate 23, and the cooling shell 15 is bonded to the upper outer surface of the semiconductor cooling plate 23 by thermal conductive adhesive; the guide baffle 22 is installed inside the cooling shell 15, and the number of the guide baffle 22 is multiple groups, and multiple groups of guide baffles 22 connect the inner and outer surfaces of the cooling shell 15. The cavity forms a Z-shaped water channel; the first micro pump 16 is fixed on the left side of the upper outer surface of the cooling shell 15 near the support seat 1, the second micro pump 17 is fixedly installed on the right side of the upper outer surface of the cooling shell 15 near the support seat 1, the first discharge pipe 18 is connected to the lower outer surface of the first micro pump 16, the first water inlet pipe 19 is connected between the outer surface of one side of the first micro pump 16 and the hot water drain joint 6, the second water inlet pipe 20 is fixedly installed on the lower outer surface of the second micro pump 17, the second discharge pipe 21 is fixedly installed between the outer surface of one side of the second micro pump 17 and the cold water inlet joint 7, and the inner cavities of the first discharge pipe 18 and the second water inlet pipe 20 are both connected to the inner cavity of the cooling shell 15.
需要说明的是，本实用新型为一种方便冷却的模具结构，文中记载的支撑座1、下模2、上模3、上板4、唧嘴5、热水排水接头6、冷水进水接头7、冷却管9与下模腔10均属于现有技术，对于所属技术领域的技术人员来说是可以有效获知的，具体的不再赘述；在冷却壳15的内部充满冷却液，第一进水管19的一端与热水排水接头6进行连接，第二排出管21的一端与冷水进水接头7进行连接，通过第一微型泵16与第二微型泵17的运转带动冷却液循环流动，冷却液在冷却管9的内部流动时可对下模腔10内部的工件进行降温，冷却液升温后通过第一微型泵16进入到冷却壳15的内部，通过设置的导流隔板22，使得冷却液可以在冷却壳15的内部成Z型流动，提高在冷却壳15内部停留的时间，冷却壳15通过导热胶固定在半导体制冷片23的上端外表面，半导体制冷片23的上端外表面为制冷面，便于对冷却壳15内部的液体进行快速的降温，提高降温的效率，从而提高散热的效率，半导体制冷片23的下端外表面为制热面，为了保证半导体制冷片23的正常运转，半导体制冷片23产生的热量传导散热翅片24上，通过散热扇14的运转，提高散热性能。It should be noted that the utility model is a mold structure that is convenient for cooling. The support seat 1, lower mold 2, upper mold 3, upper plate 4, nozzle 5, hot water drainage joint 6, cold water inlet joint 7, cooling pipe 9 and lower mold cavity 10 recorded in the text all belong to the prior art, which can be effectively known to the technicians in the relevant technical field, and the details are not repeated here. The interior of the cooling shell 15 is filled with coolant, one end of the first water inlet pipe 19 is connected to the hot water drainage joint 6, and one end of the second discharge pipe 21 is connected to the cold water inlet joint 7. The operation of the first micro pump 16 and the second micro pump 17 drives the coolant to circulate. When the coolant flows inside the cooling pipe 9, the workpiece inside the lower mold cavity 10 can be cooled, and the cooling After the cooling liquid is heated up, it enters the interior of the cooling shell 15 through the first micro pump 16. The guide baffle 22 is set to allow the cooling liquid to flow in a Z shape inside the cooling shell 15, thereby increasing the time it stays inside the cooling shell 15. The cooling shell 15 is fixed to the upper outer surface of the semiconductor refrigeration plate 23 by a thermally conductive adhesive. The upper outer surface of the semiconductor refrigeration plate 23 is a cooling surface, which is convenient for quickly cooling the liquid inside the cooling shell 15, improving the cooling efficiency, thereby improving the heat dissipation efficiency. The lower outer surface of the semiconductor refrigeration plate 23 is a heating surface. In order to ensure the normal operation of the semiconductor refrigeration plate 23, the heat generated by the semiconductor refrigeration plate 23 is conducted to the heat dissipation fins 24, and the heat dissipation performance is improved through the operation of the heat dissipation fan 14.
需要说明的是，在本文中，诸如第一和第二(一号、二号)等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。It should be noted that, in this article, relational terms such as first and second (number one, number two), etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.
以上显示和描述了本实用新型的基本原理和主要特征和本实用新型的优点。本行业的技术人员应该了解，本实用新型不受上述实施例的限制，上述实施例和说明书中描述的只是说明本实用新型的原理，在不脱离本实用新型精神和范围的前提下，本实用新型还会有各种变化和改进，这些变化和改进都落入要求保护的本实用新型范围内。The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. The technicians in this industry should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.
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