JP4253612B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP4253612B2
JP4253612B2 JP2004128145A JP2004128145A JP4253612B2 JP 4253612 B2 JP4253612 B2 JP 4253612B2 JP 2004128145 A JP2004128145 A JP 2004128145A JP 2004128145 A JP2004128145 A JP 2004128145A JP 4253612 B2 JP4253612 B2 JP 4253612B2
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Japan
Prior art keywords
gas
reaction tube
reaction
cleaning
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004128145A
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English (en)
Japanese (ja)
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JP2004260204A (ja
JP2004260204A5 (enExample
Inventor
和幸 奥田
正憲 境
徹 加賀谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2004128145A priority Critical patent/JP4253612B2/ja
Publication of JP2004260204A publication Critical patent/JP2004260204A/ja
Publication of JP2004260204A5 publication Critical patent/JP2004260204A5/ja
Application granted granted Critical
Publication of JP4253612B2 publication Critical patent/JP4253612B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Drying Of Semiconductors (AREA)
JP2004128145A 2002-03-28 2004-04-23 基板処理装置 Expired - Lifetime JP4253612B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004128145A JP4253612B2 (ja) 2002-03-28 2004-04-23 基板処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002092733 2002-03-28
JP2004128145A JP4253612B2 (ja) 2002-03-28 2004-04-23 基板処理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002366250A Division JP3985899B2 (ja) 2002-03-28 2002-12-18 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008194950A Division JP4948490B2 (ja) 2002-03-28 2008-07-29 クリーニング方法および基板処理装置

Publications (3)

Publication Number Publication Date
JP2004260204A JP2004260204A (ja) 2004-09-16
JP2004260204A5 JP2004260204A5 (enExample) 2006-01-26
JP4253612B2 true JP4253612B2 (ja) 2009-04-15

Family

ID=33133450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004128145A Expired - Lifetime JP4253612B2 (ja) 2002-03-28 2004-04-23 基板処理装置

Country Status (1)

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JP (1) JP4253612B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4948490B2 (ja) * 2002-03-28 2012-06-06 株式会社日立国際電気 クリーニング方法および基板処理装置
JP5157100B2 (ja) * 2006-08-04 2013-03-06 東京エレクトロン株式会社 成膜装置及び成膜方法
US20090004877A1 (en) * 2007-06-28 2009-01-01 Hitachi Kokusai Electric Inc. Substrate processing apparatus and semiconductor device manufacturing method
JP4918452B2 (ja) * 2007-10-11 2012-04-18 東京エレクトロン株式会社 薄膜形成装置の洗浄方法、薄膜形成方法、薄膜形成装置及びプログラム
JP5554252B2 (ja) * 2011-01-20 2014-07-23 株式会社東芝 半導体製造装置およびそのクリーニング方法
JP7113041B2 (ja) 2020-03-04 2022-08-04 株式会社Kokusai Electric クリーニング方法、半導体装置の製造方法、基板処理装置およびプログラム

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Publication number Publication date
JP2004260204A (ja) 2004-09-16

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