JP4251114B2 - Heat dissipation device, electronic device, and dust adhesion prevention method - Google Patents

Description

  The present invention relates to a heat radiating device including a heat radiating fin, an electronic device in which the heat radiating device is mounted on a cooling device that cools an internal heat generating electronic component, and a dust adhesion preventing method for the heat radiating fin.

  The recent trend of speeding up in computers is extremely rapid, and the clock frequency of the CPU has become much larger than before. As a result, the amount of heat generated by the CPU is increased, and it is not sufficient to perform air cooling with a heat sink as in the prior art, and a highly efficient cooling device is indispensable. Therefore, as such a cooling device, a cooling device that circulates and cools the refrigerant has been proposed (see Patent Document 1).

  Hereinafter, a conventional electronic apparatus cooling apparatus that circulates and cools such a refrigerant will be described. In this specification, an electronic device is a device that loads a program to a CPU or the like and performs processing, especially a computer device such as a personal computer, but also has other heat generating electronic components that generate heat when energized. Equipment included. For example, such a conventional electronic apparatus cooling apparatus as shown in FIG. 8 is known. FIG. 8 is a block diagram of a conventional electronic apparatus cooling apparatus.

  In FIG. 8, 100 is a housing, 101 is a heat generating electronic component, 102 is a substrate on which the heat generating electronic component 101 is mounted, 103 is heat exchange between the heat generating electronic component 101 and the refrigerant, A heat receiving unit for cooling, 104 is a heat radiating device that removes heat from the refrigerant, 105 is a pump that circulates the refrigerant, 106 is a pipe that connects them, and 107 is a fan that air-cools the heat radiating device 104.

  The operation of this conventional cooling device will be described. The refrigerant discharged from the pump 105 is sent to the heat receiving unit 103 through the pipe 106. Here, the heat of the heat-generating electronic component 101 is removed, and the temperature rises and is sent to the heat dissipation device 104. This heat radiating device 104 is forcibly air-cooled by the fan 107 and its temperature drops, and then returns to the pump 105 and repeats this. In this way, the refrigerant is circulated to remove heat from the heat generating electronic component 101 and cool it.

The configuration of the heat radiating device 104 mounted on this conventional cooling device will be described. As shown in FIG. 9, 110 is a heat radiating fin, and 111 is a pipe through which a refrigerant liquid flows. The flow path of the refrigerant liquid is constituted by a pipe 111 of a metal pipe having high heat conductivity, and the heat radiation fins 110 are provided so as to increase the surface area of the pipe 111. For this reason, when the refrigerant liquid whose temperature has risen passes through the pipe 111, the retained heat is propagated from the inner surface of the pipe 111 to the outer surface, and is transmitted from the outer surface to the radiating fin. The heat radiation fin 110 is configured to radiate heat into the atmosphere by hitting air from the fan 107.
JP-A-7-142886

As described above, the heat radiating device 104 mounted on the conventional cooling device includes the heat radiating fins 110, and the air sent by the fan 107 directly passes between the heat radiating fins 110. Accordingly, dust and dirt in the atmosphere also pass between the heat radiating fins 110 at the same time, but the dust 112 cannot pass between the heat radiating fins 110 depending on the size of the dust and the dust and other conditions. It may occur that it adheres to the inlet of the fin or the surface of the radiating fin. When the operation of the heat dissipating device 104 is continued, as shown in FIG. 9, dust and dirt accumulate between the heat dissipating fins 110 to block the air passage, and the air flow is suppressed by this flow path resistance, and the dust 112 adheres. It will be easy to do. As a result, air does not flow between the radiating fins, and the radiating performance is lowered.

  As measures against these, a method of providing a filter on the inlet side of the radiating fin 110 or widening the gap between the radiating fins 110 so as to prevent the dust 112 from being trapped is taken. However, even in this case, regular maintenance of the filter is necessary, and if this is neglected, the heat dissipation effect due to the reduction in surface area will be reduced. And if it does not remove the dust collected in the radiation fin 110, it will adhere to the radiation fin 110 with progress of time, and it will become difficult to remove this gradually.

  Accordingly, an object of the present invention is to provide a heat dissipation device and an electronic device in which dust is difficult to adhere to the radiation fin, and a dust adhesion prevention method in which dust is less likely to adhere to the radiation fin.

  The heat dissipating device of the present invention includes a heat dissipating fin fixed to a pipe for flowing a refrigerant by arranging a plurality of heat dissipating plates at predetermined intervals, and a fan for cooling by flowing air through a gap formed between the heat dissipating plates. The main feature is that the gap provided on the air inlet side during the heat radiation operation is formed narrower than the gap on the outlet side.

  According to the present invention, not only is it difficult for dust to adhere to the inside of the radiating fins, but also dust that has adhered can be easily removed.

  The best first mode for carrying out the present invention is that a plurality of heat sinks are arranged at predetermined intervals and a heat sink fin fixed to a pipe for flowing a refrigerant and a gap formed between the heat sinks. It is a heat dissipation device with a fan that cools by flowing air, and the gap provided on the air inlet side is narrower than the gap on the outlet side during the heat dissipation operation, and large dust enters the heat dissipation fins during the heat dissipation operation. Even if small dust enters the radiating fin, it is difficult to accumulate inside.

  The second form of the present invention is a form subordinate to the first form, and is a heat dissipating device provided on the outlet side during the heat dissipating operation, and dust is sucked from the outlet side instead of the inlet side. Can be discharged to the outside.

  A third form of the present invention is a form subordinate to the first or second form, and is a heat dissipating device in which air is flown in the reverse direction after the heat dissipating operation. Air can be ejected from the nozzle-shaped gap to remove dust adhering to the inlet side.

  The fourth form of the present invention is a form subordinate to any one of the first to third forms, wherein the heat radiating plate has a wedge-shaped cross section, and a gap provided on the air inlet side during the heat radiating operation is provided. The heat radiating device is formed narrower than the gap on the outlet side, and the inlet side can be made narrower than the outlet side only by making the cross-sectional shape of the heat radiating plate wedge-shaped.

  A fifth form of the present invention is a form subordinate to any one of the first to third forms, wherein the heat radiating plate has a bent portion protruding into a gap provided on the inlet side during a heat radiating operation, The heat dissipating device forms the gap provided on the inlet side by the bent portion so as to be narrower than the gap on the outlet side, and the inlet side can be made narrower than the outlet side simply by providing the bent portion.

  According to a sixth aspect of the present invention, in a closed circuit for circulating the refrigerant, a heat receiving portion that receives heat from the heat generating electronic component, a pump for circulating the refrigerant, and heat dissipation in any one of the first to fifth aspects. An electronic device provided with a heat receiving part that takes heat from a heat-generating electronic component, transfers the heat using a refrigerant, and dissipates heat from the heat dissipation device. The amount of dust taken in can be reduced.

  In the seventh aspect of the present invention, the gap on one end side of the heat dissipating fin provided with a plurality of heat dissipating plates is formed narrower than the distance on the other end side, and flows from the gap on one end side to the other end side during heat radiation operation, This is a dust prevention method that allows air to flow in the opposite direction during maintenance operations. Large heat particles cannot enter the heat radiating fins during heat radiating operations, and even if small dust enters the radiating fins, it is difficult to accumulate inside. During maintenance operation, dust can be removed by simply flowing air in the opposite direction.

  The eighth form of the present invention is a form subordinate to the seventh form, in which dust is attached to the radiating fin that rotates the fan in the forward direction during the heat radiating operation to forcibly cool the radiating fin and reverses the fan during the maintenance operation. This is a prevention method, and it is possible to carry out forced cooling of the radiating fins and dust removal by simply switching the rotation direction of the fan.

Example 1
Embodiment 1 of the present invention relates to a case where an electronic device is a computer device, and relates to a heat dissipation device mounted on a cooling device of the computer device. FIG. 1 is a configuration diagram of a computer device equipped with a heat dissipation device in Embodiment 1 of the present invention, FIG. 2 is a perspective view of the heat dissipation device in Embodiment 1 of the present invention, and FIG. 3 is a diagram of the heat dissipation device in Embodiment 1 of the present invention. It is sectional drawing of a radiation fin. In addition, since the thing of the code | symbol same as the code | symbol used in description of the conventional heat radiating device is fundamentally the same also in the heat radiating device of a present Example, detailed description is left to description of the conventional heat radiating device, and is abbreviate | omitted.

  In FIG. 1, reference numeral 1 denotes a casing of a computer device, 2 denotes a CPU which is a heat generating electronic component that performs arithmetic processing of the computer device, and 3 denotes a board on which the CPU 2 is mounted. The CPU 2 mounted on the computer device is responsible for the central processing function of the computer device, and generates heat in accordance with its operation. Reference numeral 4 denotes a heat receiving portion that contacts the CPU 2 and exchanges heat with the refrigerant to take heat away from the CPU 2. Reference numeral 5 denotes a heat radiating plate 12 (described later) made of a metal having good thermal conductivity such as aluminum or copper. A heat radiating device that removes heat, 6 is a pump that circulates the refrigerant, 7 is a reserve tank that holds the refrigerant liquid to be replenished when the refrigerant liquid is reduced, and 8 is a flexible that connects these to form a circulation path A pipe 9 is a forced cooling fan provided in the heat radiating device 5. A refrigerant passage is formed inside the heat receiving unit 4, and heat generated by the CPU 2 is transferred from the heat receiving unit 4 in contact with the CPU 2 to a low-temperature refrigerant. The refrigerant is preferably an antifreeze liquid so that the cooling device does not break down due to freezing in a cold region or winter.

  The heat dissipation device 5 releases the heat held by the refrigerant liquid sent out from the pump 6 into the atmosphere. The structure of the heat dissipation device 5 will be described. In FIG. 2, 11 is a heat radiating fin in which a plurality of heat radiating plates are arranged at a predetermined interval, 12 is a plurality of heat radiating plates constituting the heat radiating fin 11 and air flows on both side surfaces, and 13 is penetrated by the fin 11 to receive heat. A pipe through which the refrigerant liquid heated at 4 and heated is passed, and 14 is dust such as dust. The heat dissipating fins 11 are fixed to the pipe 13 by arranging a plurality of heat dissipating plates 12 at a predetermined interval in order to increase the heat transfer area. The heat sink 12 may be a simple flat plate when no spacers are provided when stacked, but when stacked with spacers interposed, both end edges of the heat sink 12 itself as shown in FIG. May be bent into a U shape to constitute a spacer. However, when the heat sink 12 is referred to below, this portion is not included, and the main body portion of the heat sink 12 in which air flows on both side surfaces is referred to as the heat sink 12.

  In the first embodiment, the heat radiating plate 12 is a heat radiating plate 12a having a substantially triangular wedge shape that is not a flat plate, as will be described later. A fan 9 is disposed on the heat radiating fin 11 so that air flows along the heat radiating plates 12, and heat is forcibly cooled from the fin surface. The discharge direction of the fan 9 at the time of cooling is the direction of the arrow A in FIG. That is, during the cooling operation, the air outside the housing 1 enters the housing 1 through the heat radiating device 5, and is discharged to the outside of the housing 1 through an exhaust port provided separately through the fan 9. With this flow from inflow to discharge, the heat of the heat radiating device 5 is taken and the heat remaining in the housing 1 is discharged.

  Next, the heat radiating plate 12 of the radiating fin 11 according to the first embodiment will be described with reference to FIG. In FIG. 3, 12a is a wedge-shaped heat radiation plate which constitutes the heat radiation fin 11 and has a thickest cross section at one end, and gradually becomes thinner and thinnest at the other end (pointed end). Since the discharge direction of the fan 9 at the time of cooling is the direction of the arrow A as described above, in the first embodiment, the heat sinks 12a are arranged with the tips of the heat sinks 12a facing in the direction of the arrow A. If the gap between the heat sinks 12a at this time is T1 on the inlet side and T2 on the outlet side, T1 <T2 as shown in FIG. That is, the gap between the heat radiating plates 12a is small on the inlet side of the heat radiating fin 11 and wide on the outlet side.

  Accordingly, the dust 14 larger than the gap T1 between the inlet side heat radiating plates 12a cannot enter the heat radiating fin 11 from the inlet of the radiating fin 11 and is captured at the inlet of the radiating fin 11. On the other hand, although the small dust 14 can enter the radiating fins 11, the gap between the radiating plates 12 a is gradually widened. To do. Even when the dust 14 approaches the heat radiating plate 12a due to gravity or the like, the normal direction component approaching the heat radiating plate 12a is small, but rather the presence of a component that slips the surface of the heat radiating plate 12a Accelerates rotational movement and reduces the possibility of sticking to the surface. As a result, the dust 14 does not adhere to the opposing surface of each heat radiating plate 12 a, but only adheres to the end of the heat radiating plate 12 a at the entrance of the heat radiating fin 11.

  Furthermore, in Example 1 of this invention, the fan 9 is rotated in the reverse direction and it blows in the arrow B direction. With this pressure, the dust 14 at the entrance of the radiating fin 11 is easily peeled off and discharged to the outside. That is, since the fan 9 of the first embodiment is provided not on the inlet side of the radiating fin 11 but on the outlet side, no object is installed in the inlet portion, and when the dust 14 accumulates on the inlet side, the wind pressure remains unchanged. It can be peeled off and discharged to the outside. At this time, if the air volume in the direction of arrow B is larger than the air volume in the direction of arrow A, the dust 14 can be discharged more effectively. In the case of the turbo type fan 9, each blade has an inlet angle and an outlet angle, respectively, and the normal air volume changes when the rotation direction is reversed. An axial flow type reversible fan that can discharge in both directions with high efficiency should be adopted, and it should have a slight difference in characteristics in the discharge direction. Then, when the same electric power is applied, the blades in which the air volume in the direction of arrow B is larger than the air volume in the direction of arrow A by a predetermined amount are adopted, and dust 14 can be removed at low cost without providing a complicated control circuit. It can be carried out.

  The dust adhesion preventing method according to the first embodiment of the present invention operates as follows based on the flowcharts of FIGS. 4, 5, and 6 in order to remove the dust 14. FIG. 4 is a flowchart for performing the operation for removing dust from the heat dissipation device in the first embodiment of the present invention when the power is turned on, and FIG. 5 is a time interval for the operation for removing dust from the heat dissipation device in the first embodiment of the present invention. FIG. 6 is a flowchart for performing the operation for removing dust of the heat dissipation device in Embodiment 1 of the present invention when the power is turned off.

First, as a first dust removal operation, a case will be described in which an operation for peeling off the dust 14 from the inlet end face of the heat radiation fin 11 is performed when the power is turned on. As shown in FIG. 4, when the power is turned on (step 1), the fan 9 is reversely rotated in the direction opposite to the original direction (step 2) in order to perform a maintenance operation. The reverse rotation is continued as it is until a predetermined time elapses (step 3), and when it elapses, the operation is shifted to the heat radiation operation to be rotated forward (step 4) to perform heat radiation.

  Next, as the second dust removal operation, an operation in which the operation of peeling off the dust 14 from the inlet end face of the radiation fin 11 is repeated at regular time intervals will be described. As shown in FIG. 5, when the power is turned on (step 11), it is checked whether a certain time has passed (step 12). If not, the fan 9 is rotated forward as a heat dissipation operation (step 13). When 1 hour elapses, the fan 9 is rotated in reverse to perform a maintenance operation (step 14). When a certain time, for example, 5 minutes elapses (step 15), the process returns to step 12 and the fan 9 is rotated forward again to use the computer device. During the operation, the maintenance operation is performed at regular intervals to reversely rotate the fan 9.

  Furthermore, the third dust removal operation is performed during the operation of the device after the power is turned off, such as the data storage time after the computer device is shut down or the lamp cooling time after the projector is turned off. This is a case where an operation for peeling off the dust 14 is performed. As shown in FIG. 6, when the power is turned on (step 21), it is checked whether the power is turned off (step 22). If it is not turned off, the forward rotation as the heat radiation operation is continued (step 23). Then, the fan 9 is reversely rotated (step 24). Thereafter, it is confirmed whether the end operation time of the device has elapsed (step 25), and when it has elapsed, the power of the fan 9 is turned off (step 26).

  By performing the dust removal operation with the heat radiating device as described above, the fan 9 is rotated in the reverse direction, and the dust 14 attached to the heat radiating fins 11 is blown out to the outside by the air flow in the reverse direction and discharged to the outside of the housing 1. Can do. If the fan 9 rotates in the reverse direction when the power is turned off, the dust 14 is not left in a state where the dust 14 is adhered for a long time, and the adhered dust 14 is not fixed as it is.

(Example 2)
Embodiment 2 of the present invention relates to a heat dissipation device. FIG. 7 is a cross-sectional view of the heat dissipating fins of the heat dissipating device in Embodiment 2 of the present invention. Also in the second embodiment, reference is made to FIGS. 1, 2, and 4 to 6. In FIG. 7, reference numeral 12b denotes an L-shaped heat radiating plate having a bent portion in which the cross section of the radiating fin 11 is slightly bent at one end.

  The discharge direction of the fan 9 at the time of cooling is the direction of the arrow A as described above. In the second embodiment, the fan 9 is arranged with the front end in the longitudinal direction of the heat radiating plate 12b facing the arrow A direction. Assuming that the gap between the heat radiation plates 12b at this time is T3 on the inlet side and T4 on the outlet side, T3 <T4 as shown in the figure. That is, because of the bent portion of the heat radiating plate 12b, the inlet side to the radiating fin 11 is narrowed and the outlet side is widened. For this reason, the dust 14 larger than the gap T3 between the radiation fins 11 on the inlet side does not enter from the inlet of the radiation fins 11 and is captured by the radiation fins 11. Small dust 14 enters from the entrance of the radiation fin 11, but the gap is wider than the entrance, and thus passes through the radiation fin 11.

  Accordingly, the dust 14 does not adhere to the opposing surface of the heat radiating plate 12 b constituting the heat radiating fin 11, but only attaches to the end surface of the heat radiating plate 12 b at the entrance of the heat radiating fin 11. For this reason, when the rotation direction of the fan 9 is reversed and the wind is sent in the direction of the arrow B, the dust 14 is easily detached and discharged to the outside.

  The dust removal operation of the heat dissipating device of the second embodiment is the same as the dust removal operation of the heat dissipating device of the first embodiment, and a detailed description will be given to the description of the dust removing operation of the first embodiment.

As described above, the heat radiating device according to the second embodiment can narrow the gap on the inlet side by providing the bent portion on the heat radiating plate 12 b, prevents the inflow of dust, and reverses the flow direction of the dust adhering temporarily. It can be easily peeled off.

  The dust adhesion preventing method of the present invention is useful for a heat dissipation device in which heat dissipation fins or heat dissipation plates are laminated.

1 is a configuration diagram of a computer device equipped with a heat dissipation device in Embodiment 1 of the present invention. The perspective view of the heat radiator in Example 1 of this invention. Sectional drawing of the radiation fin of the thermal radiation apparatus in Example 1 of this invention The flowchart which performs the operation for peeling off the heat dissipation device dust in the first embodiment of the present invention when the power is turned on. The flowchart which repeats the operation | movement for peeling off the dust of the thermal radiation apparatus in Example 1 of this invention at a fixed time interval. The flowchart which performs the driving | operation for peeling off the dust of the thermal radiation apparatus in Example 1 of this invention at the time of a power supply OFF Sectional drawing of the radiation fin of the thermal radiation apparatus in Example 2 of this invention Configuration diagram of conventional electronic equipment cooling device Cross-sectional view of conventional radiating fin

Explanation of symbols

1 Housing 2 CPU
Reference Signs List 3 Substrate 4 Heat receiving section 5 Heat dissipating device 6 Pump 7 Reserve tank 8 Piping 9 Fan 11 Heat dissipating fin 12 Heat dissipating plate 12a, 12b Heat dissipating plate 13 Pipe

Claims (12)

A plurality of heat radiating plates are arranged at predetermined intervals and include a heat radiating fin fixed to a pipe through which a refrigerant flows, and a fan that cools the air by flowing air through a gap formed between the heat radiating plates. A heat dissipating device characterized in that the gap provided on the side is formed narrower than the gap on the outlet side. The heat dissipation device according to claim 1, wherein the fan is provided on an outlet side during the heat dissipation operation. 3. The heat dissipation device according to claim 1, wherein after the heat dissipation operation, the fan is reversely rotated and air flows in the reverse direction. 4. The cross section of the heat radiating plate has a wedge shape, and a gap provided on the air inlet side during heat radiating operation is formed narrower than a gap on the outlet side. Heat dissipation device. The heat radiating plate has a bent portion that protrudes into a gap provided on the inlet side during the heat radiating operation, and the bent portion forms a gap provided on the inlet side narrower than a gap on the outlet side. The heat radiating device according to claim 1. An electronic apparatus in which a closed circuit for circulating the refrigerant is provided with a heat receiving part that receives heat from the heat-generating electronic component, a pump for circulating the refrigerant, and the heat dissipation device according to claim 1. The heat receiving portion takes heat from the heat generating electronic component, transfers the heat by a refrigerant, and dissipates heat from the heat dissipation device. A gap on one end side of the heat dissipating fin having a plurality of heat sinks is formed to be narrower than the gap on the other end side, and flows from the gap on the one end side to the other end side during a heat radiation operation, and in the reverse direction during a maintenance operation. A method for preventing dust from adhering to a heat dissipating fin. 8. The method for preventing dust from adhering to a heat radiating fin according to claim 7, wherein the heat radiating fin is forcibly cooled by rotating the fan forward during the heat radiating motion, and the fan is rotated reversely during the maintenance operation. A plurality of heat sinks arranged at predetermined intervals to form air flow paths and heat radiation fins fixed to pipes through which a refrigerant flows; and a fan for cooling by flowing air through the air flow paths formed between the heat radiation plates And a gap between the air flow paths of the radiating fins is wider at one end than at the other end. The heat dissipation device according to claim 9, wherein the fan is rotated forward / reversely. The heat dissipating apparatus according to claim 9, wherein the fan is disposed on a wide side of the air flow path of the heat dissipating fin. A plurality of heat radiating plates are arranged at a predetermined interval and include a heat radiating fin fixed to a pipe through which a refrigerant flows, and a fan that cools the air by flowing air through a gap formed between the heat radiating plates. A heat dissipating device that rotates and allows air to flow in two directions, forward and reverse, with respect to the heat dissipating fins.

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