JP4242566B2 - 印刷回路板上の銅の後処理 - Google Patents

印刷回路板上の銅の後処理 Download PDF

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Publication number
JP4242566B2
JP4242566B2 JP2000558701A JP2000558701A JP4242566B2 JP 4242566 B2 JP4242566 B2 JP 4242566B2 JP 2000558701 A JP2000558701 A JP 2000558701A JP 2000558701 A JP2000558701 A JP 2000558701A JP 4242566 B2 JP4242566 B2 JP 4242566B2
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JP
Japan
Prior art keywords
acid
cupric
conversion coating
copper
organometallic conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000558701A
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English (en)
Japanese (ja)
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JP2002520827A5 (US07585860-20090908-C00112.png
JP2002520827A (ja
Inventor
マクグラス，ピーター・ティー
オーウェイ，アバヨミ
サルダー，サエード
ヤコブソン，エリック
Original Assignee
フライズ・メタルズ・インコーポレーテッド・ドゥーイング・ビジネス・アズ・アルファ・メタルズ・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by フライズ・メタルズ・インコーポレーテッド・ドゥーイング・ビジネス・アズ・アルファ・メタルズ・インコーポレーテッド filed Critical フライズ・メタルズ・インコーポレーテッド・ドゥーイング・ビジネス・アズ・アルファ・メタルズ・インコーポレーテッド
Publication of JP2002520827A publication Critical patent/JP2002520827A/ja
Publication of JP2002520827A5 publication Critical patent/JP2002520827A5/ja
Application granted granted Critical
Publication of JP4242566B2 publication Critical patent/JP4242566B2/ja
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Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
JP2000558701A 1998-07-01 1999-07-01 印刷回路板上の銅の後処理 Expired - Lifetime JP4242566B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9133998P 1998-07-01 1998-07-01
US60/091,339 1998-07-01
PCT/US1999/014983 WO2000002426A1 (en) 1998-07-01 1999-07-01 Post-treatment for copper on printed circuit boards

Publications (3)

Publication Number Publication Date
JP2002520827A JP2002520827A (ja) 2002-07-09
JP2002520827A5 JP2002520827A5 (US07585860-20090908-C00112.png) 2006-08-31
JP4242566B2 true JP4242566B2 (ja) 2009-03-25

Family

ID=22227266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000558701A Expired - Lifetime JP4242566B2 (ja) 1998-07-01 1999-07-01 印刷回路板上の銅の後処理

Country Status (7)

Country Link
EP (1) EP1097618B1 (US07585860-20090908-C00112.png)
JP (1) JP4242566B2 (US07585860-20090908-C00112.png)
KR (1) KR100592746B1 (US07585860-20090908-C00112.png)
AT (1) ATE235796T1 (US07585860-20090908-C00112.png)
CA (1) CA2335816A1 (US07585860-20090908-C00112.png)
DE (1) DE69906301T2 (US07585860-20090908-C00112.png)
WO (1) WO2000002426A1 (US07585860-20090908-C00112.png)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE50108246D1 (de) * 2001-09-01 2006-01-05 Trumpf Lasertechnik Gmbh Verfahren zum Herstellen von Löchern in einer Mehrlagenleiterplatte
JP4773399B2 (ja) * 2007-05-18 2011-09-14 矢崎総業株式会社 スズまたはスズ合金めっき層の定量分析方法
KR101663112B1 (ko) * 2014-01-13 2016-10-06 (주)켐프로스 통신용 ｒｆ 필터에 적용된 마그네슘 합금용 구리표면 부식방지제 조성물 및 처리방법
CN111954378A (zh) * 2020-07-20 2020-11-17 上海空间电源研究所 一种铜质焊盘表面铜氧化层还原修复剂及常温原位还原修复方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US5261154A (en) * 1991-07-22 1993-11-16 Macdermid, Incorporated Process for fabricating multilayer printed circuits
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating

Also Published As

Publication number Publication date
WO2000002426A1 (en) 2000-01-13
CA2335816A1 (en) 2000-01-13
ATE235796T1 (de) 2003-04-15
EP1097618B1 (en) 2003-03-26
KR100592746B1 (ko) 2006-06-26
KR20010053363A (ko) 2001-06-25
DE69906301T2 (de) 2004-01-22
JP2002520827A (ja) 2002-07-09
EP1097618A1 (en) 2001-05-09
DE69906301D1 (de) 2003-04-30

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