JP4241203B2 - 可撓性フィルムのラミネート方法およびラミネート装置並びに回路基板の製造方法 - Google Patents

可撓性フィルムのラミネート方法およびラミネート装置並びに回路基板の製造方法 Download PDF

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Publication number
JP4241203B2
JP4241203B2 JP2003169240A JP2003169240A JP4241203B2 JP 4241203 B2 JP4241203 B2 JP 4241203B2 JP 2003169240 A JP2003169240 A JP 2003169240A JP 2003169240 A JP2003169240 A JP 2003169240A JP 4241203 B2 JP4241203 B2 JP 4241203B2
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Japan
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film
flexible
planar body
flexible film
substrate
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Japanese (ja)
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JP2004066812A (ja
JP2004066812A5 (https=
Inventor
信幸 黒木
孝義 赤松
陽一 榛葉
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Toray Industries Inc
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Toray Industries Inc
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  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2003169240A 2002-06-13 2003-06-13 可撓性フィルムのラミネート方法およびラミネート装置並びに回路基板の製造方法 Expired - Fee Related JP4241203B2 (ja)

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Application Number Priority Date Filing Date Title
JP2003169240A JP4241203B2 (ja) 2002-06-13 2003-06-13 可撓性フィルムのラミネート方法およびラミネート装置並びに回路基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002172431 2002-06-13
JP2003169240A JP4241203B2 (ja) 2002-06-13 2003-06-13 可撓性フィルムのラミネート方法およびラミネート装置並びに回路基板の製造方法

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JP2004066812A JP2004066812A (ja) 2004-03-04
JP2004066812A5 JP2004066812A5 (https=) 2006-07-13
JP4241203B2 true JP4241203B2 (ja) 2009-03-18

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JP2003169240A Expired - Fee Related JP4241203B2 (ja) 2002-06-13 2003-06-13 可撓性フィルムのラミネート方法およびラミネート装置並びに回路基板の製造方法

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005297402A (ja) * 2004-04-13 2005-10-27 Tsuchiya Co Ltd フィルムの貼着装置及びフィルム貼着体の製造方法
FR3006235B1 (fr) * 2013-05-30 2015-11-20 Hexcel Reinforcements Element multicouche comprenant un materiau de renfort associe a une couche support par liaison electrostatique
JP5954549B2 (ja) * 2014-08-01 2016-07-20 日東電工株式会社 可撓性薄膜構造の表示セルを取り扱う方法
CN108568381B (zh) * 2017-03-14 2023-07-18 蓝思科技股份有限公司 一种胶水的无气泡压合方法及其采用的设备
KR20230029821A (ko) * 2020-06-21 2023-03-03 게리 샤프 이노베이션즈 인코포레이티드 용제 적층된 리타더 스택의 정밀 제조를 위한 장비 및 공정
CN117429077B (zh) * 2023-12-19 2024-03-22 湖南安泰康成生物科技有限公司 一种电极贴片的成型方法

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JP2004066812A (ja) 2004-03-04

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