JP4233401B2 - Circuit board mounting structure in electronic equipment and mounting method thereof - Google Patents

Circuit board mounting structure in electronic equipment and mounting method thereof Download PDF

Info

Publication number
JP4233401B2
JP4233401B2 JP2003192730A JP2003192730A JP4233401B2 JP 4233401 B2 JP4233401 B2 JP 4233401B2 JP 2003192730 A JP2003192730 A JP 2003192730A JP 2003192730 A JP2003192730 A JP 2003192730A JP 4233401 B2 JP4233401 B2 JP 4233401B2
Authority
JP
Japan
Prior art keywords
circuit board
frame
projecting piece
frame body
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003192730A
Other languages
Japanese (ja)
Other versions
JP2005032748A (en
Inventor
芳裕 三野
善雄 杉森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP2003192730A priority Critical patent/JP4233401B2/en
Priority to CNB2004100621662A priority patent/CN1317927C/en
Publication of JP2005032748A publication Critical patent/JP2005032748A/en
Application granted granted Critical
Publication of JP4233401B2 publication Critical patent/JP4233401B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明はテレビチューナ等に使用して好適な電子機器における回路基板の取付構造、及びその取付方法に関する。
【０００２】
【従来の技術】
従来の電子機器における回路基板の取付構造の図面を説明すると、図１０は従来の電子機器における回路基板の取付構造を示す斜視図、図１１は従来の電子機器における回路基板の取付構造を示す正面図である。
【０００３】
次に、従来の電子機器における回路基板の取付構造を図１０，図１１に基づいて説明すると、金属板からなり、ロ字状をなした箱形の枠体５１は、上下方向の両側に開放部５１ａ、５１ｂを有した状態で、ロ字状に配置された側壁５１ｃと、側壁５１ｃに設けられた複数個の舌片５１ｄと、側壁５１ｃに設けられた複数個の切り欠き部によって形成された肩部５１ｅと、側壁５１ｃから突出する取付脚５１ｆを有する。
【０００４】
金属板からなるシールド板５２は、平板部５２ａと、この平板部５２ａの一端側に位置する肩部５２ｂと、この肩部５２ｂから突出する突片５２ｃを有し、このシールド板５２は、枠体５１内を複数個の区画室に区画した状態で、側壁５１ｃに適宜手段によって取り付けられている。
【０００５】
そして、シールド板５２が枠体５１に取り付けられた際、肩部５２ｂと突片５２ｃが枠体５１内に位置した状態で、肩部５２ｂは、開放部５１ａに向かって配置されると共に、突片５２ｃは、開放部５１ａに向かって延びている。
【０００６】
セラミック基板からなる矩形状の回路基板５３は、複数個の孔５３ａと、一端側に設けられた複数個の突部５３ｂを有し、この回路基板５３には、ここでは図示しないが、配線パターンが設けられると共に、種々の電子部品が搭載されて、所望の電気回路が形成されている。
【０００７】
この回路基板５３は、上方の開放部５１ａ側から枠体５１内に収容され、突片５２ｃが孔５３ａに挿通されると共に、回路基板５３の下面がシールド板５２の肩部５２ｂと側壁５１ｃの肩部５１ｅに載置（当接）した状態で、舌片５１ｄを枠体５１内側に折曲して、回路基板５３が取り付けられる。
【０００８】
そして、回路基板５３が取り付けられた際、回路基板５３は、シールド板５２の肩部５２ｂ、及び側壁５１ｃの肩部５１ｅと折り曲げられた舌片１ｄとによって挟持された状態で取り付けられると共に、回路基板５３の外周縁部５３ｃが側壁５１ｃの内面に当接した状態となっている。
【０００９】
この状態で、回路基板５３と、回路基板５３の孔５３ａから突出した突片５２ｃが半田付けされて、回路基板５３上の接地用の配線パターン（図示せず）が接地される。（例えば、特許文献１参照）
【００１０】
従来の回路基板の取付構造を使用した電子機器は、セットに組み込まれて使用されるが、この時、外部環境やセット内の電子部品によって温度が上昇すると、枠体５１、セラミック基板からなる回路基板５３、及びシールド板５２が膨張する。
【００１１】
すると、肩部５１ｅ，５２ｂと舌片５１ｄとで挟持されたセラミック基板からなる回路基板５３に応力がかかり、回路基板５３にヒビや割れを生じたりする。また、回路基板５３の外周縁部５３ｃが側壁５１ｃに当接しているため、この膨張によって、回路基板５３の外周縁部５３ｃが欠ける等の事態が生じる。
【００１２】
次に、従来の電子機器における回路基板の取付方法を図１０，図１１に基づいて説明すると、先ず、枠体５１にシールド板５２が取り付けられ、肩部５２ｂと突片５２ｃが開放部５１ａ側に向けられたものを用意する。
【００１３】
次に、回路基板５３が上方の開放部５１ａ側から枠体５１内に収容され、突片５２ｃが孔５３ａに挿通されると共に、回路基板５３の下面がシールド板５２の肩部５２ｂと側壁５１ｃの肩部５１ｅに載置（当接）する。
【００１４】
しかる後、舌片５１ｄを枠体５１内側に折曲して、回路基板５３を取り付けた後、回路基板５３と、回路基板５３の孔５３ａから突出した突片５２ｃが半田付けすると、回路基板５３の取付が完了する。
【００１５】
しかし、このような従来の電子機器における回路基板の取付方法においては、舌片５１ｄを折り曲げる際、その折曲力がセラミック基板からなる回路基板５３にかかり、回路基板５３が欠ける事態が生じる。
【００１６】
また、このような回路基板の取付方法を用いて製造された電子機器がセットに組み込まれて使用される際、外部環境やセット内の電子部品によって温度が上昇すると、枠体５１、セラミック基板からなる回路基板５３、及びシールド板５２が膨張する。
【００１７】
すると、肩部５１ｅ，５２ｂと舌片５１ｄとで挟持されたセラミック基板からなる回路基板５３に応力がかかり、回路基板５３にヒビや割れを生じ、また、回路基板５３の外周縁部５３ｃが側壁５１ｃに当接しているため、回路基板５３の外周縁部５３ｃが欠ける等の事態が生じる。
【００１８】
【特許文献１】
特開平７−３１２４８５号公報
【００１９】
【発明が解決しようとする課題】
従来の電子機器における回路基板の取付構造は、回路基板５３がシールド板５２の肩部５２ｂと舌片５１ｄとで挟持されているため、外部環境等によって温度が上昇すると、枠体５１、セラミック基板からなる回路基板５３、及びシールド板５２が膨張し、すると、挟持されたセラミック基板からなる回路基板５３に応力がかかり、回路基板５３にヒビや割れを生じたりするという問題がある。
また、回路基板５３の外周縁部５３ｃのほぼ全周が側壁５１ｃに当接しているため、この膨張によって、回路基板５３の外周縁部５３ｃが欠けるという問題がある。
【００２０】
従来の電子機器における回路基板の取付方法においては、舌片５１ｄを折り曲げる際、その折曲力がセラミック基板からなる回路基板５３にかかり、回路基板５３が欠けるという問題がある。
【００２１】
また、このような回路基板の取付方法を用いて製造された電子機器がセットに組み込まれて使用される際、外部環境やセット内の電子部品によって温度が上昇すると、枠体５１、セラミック基板からなる回路基板５３、及びシールド板５２が膨張する。
【００２２】
すると、肩部５１ｅ，５２ｂと舌片５１ｄとで挟持されたセラミック基板からなる回路基板５３に応力がかかり、回路基板５３にヒビや割れを生じ、また、回路基板５３の外周縁部５３ｃのほぼ全周が側壁５１ｃに当接しているため、回路基板５３の外周縁部５３ｃが欠けるという問題がある。
【００２３】
そこで、本発明はセラミック基板からなる回路基板のヒビや割れ等が無い電子機器における回路基板の取付構造、及びその取付方法を提供することを目的とする。
【００２４】
【課題を解決するための手段】
上記課題を解決するための第１の解決手段として、開放部を有する箱形の枠体と、この枠体内に取り付けられたシールド板と、前記枠体内に取り付けられたセラミック基板からなる回路基板とを備え、前記シールド板は、前記枠体内に位置し、前記開口部側に向かって配置された肩部と、この肩部から前記開放部に向かって突出し、前記肩部に連なる基部分の幅が前記回路基板に形成された孔の幅よりも狭い突片を有し、前記突片が前記孔に挿通され、前記回路基板が前記肩部から離れた状態で、前記突片に半田付けされて取り付けられた構成とした。
【００２５】
また、第２の解決手段として、前記枠体、又は前記突片には、前記回路基板が前記突片から抜け出るのを防止するための抜け止め部を設けた構成とした。
また、第３の解決手段として、前記抜け止め部は、前記枠体に設けられた折曲片によって形成された構成とした。
【００２６】
また、第４の解決手段として、前記回路基板の外周縁部は、前記枠体の切り曲げ部が前記回路基板に設けられたサイド電極に接触する箇所を除いて、前記枠体から離れた状態で配置された構成とした。
また、第５の解決手段として、前記回路基板は、前記突片によって位置決めされた構成とした。
【００２７】
また、第６の解決手段として、開放部を有する箱形の枠体と、この枠体に取り付けられ、前記枠体に位置する肩部、及びこの肩部から前記開放部に向かって突出し、前記肩部に連なる基部分の幅が前記回路基板に形成された孔の幅よりも狭い突片を有するシールド板と、前記孔に挿通された前記突片に半田付けされて、前記枠体内に取り付けられるセラミック基板からなる回路基板とを備え、前記回路基板を前記枠体内に収容して、前記突片を前記回路基板に挿通する挿通工程と、この挿通工程の後、前記肩部から前記回路基板を離した状態で、前記回路基板が前記突片から抜け出るのを防止する抜け防止工程と、この抜け防止工程の後、前記回路基板が前記肩部から離れた状態で、前記回路基板を前記突片に半田付けする半田付工程とを有した取付方法とした。
【００２８】
また、第７の解決手段として、前記挿通工程の後、前記枠体、又は前記突片には、前記抜け防止工程を行うための抜け止め部が形成され、前記抜け止め部によって、前記回路基板の前記抜け防止工程を行うようにした取付方法とした。
【００２９】
また、第８の解決手段として、前記挿通工程は、前記枠体の前記開放部を上方に位置させた状態で、前記回路基板を前記枠体内に収容することによって行い、前記挿通工程の後、前記枠体の前記開放部が下方に位置するように前記枠体を裏返して、前記肩部から前記回路基板を離すと共に、前記抜け止め部を前記回路基板に当接させることによって前記抜け防止工程を行うようにした取付方法とした。
【００３０】
また、第９の解決手段として、前記回路基板は、挿通された前記突片によって位置決めされ、前記回路基板の全外周縁部が前記枠体から離れた状態で、前記半田付工程が行われるようにした取付方法とした。
【００３１】
また、第１０の解決手段として、前記回路基板と前記突片の半田付けがクリーム半田を用いた前記半田付工程によって行うようにした取付方法とした。
また、第１１の解決手段として、前記回路基板に前記クリーム半田を設けた後、前記挿通工程を行うようにした取付方法とした。
【００３２】
【発明の実施の形態】
本発明の電子機器における回路基板の取付構造、及びその取付方法の図面を説明すると、図１は本発明の電子機器における回路基板の取付構造に係る正面図、図２は本発明の電子機器における回路基板の取付構造に係る側面図、図３は本発明の電子機器における回路基板の取付構造に係り、カバーを取り去った状態を示す平面図、図４は本発明の電子機器における回路基板の取付構造に係り、カバーを取り去った状態を示す下面図である。
【００３３】
また、図５は図３の５−５線における断面図、図６は図３の６−６線における断面図、図７は本発明の電子機器における回路基板の取付方法に係り、挿通工程を示す説明図、図８は本発明の電子機器における回路基板の取付方法に係り、抜け防止工程における抜け止め部を示す説明図、図９は本発明の電子機器における回路基板の取付方法に係り、抜け防止工程と半田付工程を示す説明図である。
【００３４】
次に、本発明の電子機器における回路基板の取付構造を図１〜図６に基づいて説明すると、金属板からなり、ロ字状をなした箱形の枠体１は、上下方向の両側に開放部１ａ、１ｂを有した状態で、ロ字状に配置された側壁１ｃと、４角の近傍において、側壁１ｃが切り曲げ（折曲）された折曲片からなる複数個の抜け止め部１ｄと、側壁１ｃから下方に突出する取付脚１ｅと、側壁１ｃに設けられた複数個の切り曲げ部１ｆを有する。
【００３５】
なお、この枠体１は、開放部１ａ側が上壁によって塞がれ、下方の開放部１ｂのみが開放されたものでも良い。
【００３６】
金属板からなるシールド板２は、平板部２ａと、この平板部２ａの一端側に位置する肩部２ｂと、この肩部２ｂから突出する突片２ｃを有し、このシールド板２は、枠体１内を複数個の区画室に区画した状態で、側壁１ｃに適宜手段によって取り付けられている。
【００３７】
そして、シールド板２が枠体１に取り付けられた際、肩部２ｂと突片２ｃが枠体１内に位置した状態で、肩部２ｂは、下方の開放部１ｂに向かって配置されると共に、突片２ｃは、下方の開放部１ｂに向かって延びて配置されている。
【００３８】
セラミック基板からなる矩形状の回路基板３は、複数個の孔３ａを有し、この回路基板３には、ここでは図示しないが、配線パターンが設けられると共に、種々の電子部品Ｄが搭載されて、所望の電気回路が形成されている。
【００３９】
この回路基板３は、下方の開放部１ｂ側から枠体１内に収容され、突片２ｃが孔３ａに挿通されると共に、回路基板３の下面が抜け止め部１ｄに当接して、この抜け止め部１ｄによって、回路基板３が突片２ｃから抜け出るのを防止されている。
【００４０】
また、回路基板３の下面が抜け止め部１ｄに当接した際、回路基板３の上面は、シールド板２の肩部２ｂから離れた状態となっており、この状態で、回路基板３がシールド板２の突片２ｃに半田４付けされて取り付けられ、この半田４付けによって、回路基板３上の接地用の配線パターン（図示せず）が接地される。
【００４１】
また、この時、回路基板３は、突片２ｃによって位置決めされると共に、切り曲げ部１ｆが枠体１内に曲げられて、ここでは図示しないが、切り曲げ部１ｆが回路基板３の外周縁部３ｂに設けられたサイド電極に接触した状態となり、そして、回路基板３の外周縁部３ｂは、枠体１の切り曲げ部１ｆが回路基板３に設けられたサイド電極に接触する箇所を除いて、側壁１ｃ（枠体１）の内面から離れた（隙間を持たせた）状態で、配置されている。
【００４２】
なお、この実施例では、回路基板３の抜け止めを行うための抜け止め部１ｂが枠体１の折曲片によって形成されたもので説明したが、シールド板２の突片２ｃの先端部がカシメ等によって拡げられて形成された止め部によって、回路基板３の抜け止め部を構成したものでも良い。
【００４３】
金属板からなる第１，第２のカバー５，６は、それぞれ平板状部５ａ、６ａと、この平板状部５ａ、６ａから折り曲げられた爪部５ｂ、６ｂを有し、第１のカバー５は、平板状部５ａで上方の開放部１ａを覆った状態で、爪部５ｂが側壁１ｃに弾接されて取り付けられ、また、第２のカバー６は、平板状部６ａで下方の開放部１ｂを覆った状態で、爪部ｂｂが側壁１ｃに弾接されて取り付けられている。
【００４４】
本発明の回路基板の取付構造を使用した電子機器は、セットに組み込まれて使用されるが、この時、外部環境やセット内の電子部品によって温度が上昇すると、枠体１、セラミック基板からなる回路基板３、及びシールド板２が膨張する。
【００４５】
しかしながら、回路基板３は、シールド板２の肩部２ｂから離れた（隙間を持った）状態で、突片２ｃに半田４付けされているため、回路基板３、及びシールド板２の平板部２ａが膨張しても、回路基板３には応力がかからず、回路基板３にヒビや割れが発生しない。
【００４６】
また、回路基板３は、突片２ｃによって位置決めされ、回路基板３の外周縁部３ｂは、枠体１の切り曲げ部１ｆが回路基板３に設けられたサイド電極に接触する箇所を除いて、側壁１ｃ（枠体１）の内面から離れた（隙間を持たせた）状態で、配置されているため、回路基板３や枠体１（側壁１ｃ）が膨張しても、回路基板３の外周縁部３ｂへの応力が少なく、回路基板３に欠けが発生しない。
【００４７】
次に、本発明の電子機器における回路基板の取付方法を図７〜図９に基づいて説明すると、先ず、図７に示すように、枠体１にシールド板２が取り付けられ、肩部２ｂと突片２ｃが開放部１ｂ側に向けられたものを用意すると共に、点線で示すように、回路基板３上にクリーム半田７を塗布したものを用意する。
【００４８】
次に、図７に示すように、枠体１の下方の開放部１ｂを上方に位置させた状態で、回路基板３が開放部１ｂ側から枠体１内に収容され、突片２ｃが孔３ａに挿通される挿通工程を行う。
この時、回路基板３は、シールド板２の肩部２ｂに載置（当接）した状態となる。
【００４９】
しかる後、この状態で、図８に示すように、枠体１を切り曲げして、抜け止め工程を行うための抜け止め部１ｄを形成する。
次に、図９に示すように、枠体１を裏返して、枠体１の開放部１ｂが下方に位置した状態する。
すると、回路基板３が突片２ｃにガイドされて自重で下方に移動し、回路基板３は、抜け止め部１ｄに係止されて抜け防止工程が行われる。
【００５０】
即ち、この抜け防止工程では、回路基板３が突片２ｃから抜け出るのを防止すると共に、回路基板３の上面がシールド板２の肩部２ｂから離れた状態となり、且つ、回路基板３の全外周縁部３ｂが枠体１の内面から離れた位置で配置された状態となる。
【００５１】
次に、このような状態で、枠体１がリフロー炉に搬送されて、クリーム半田７が溶融すると、回路基板３と、回路基板３の孔３ａから突出した突片２ｃが半田４付けされて、回路基板３の取付が完了する。
【００５２】
なお、クリーム半田７の塗布は、挿通工程後からリフロー炉に搬送する間で、任意に選択できるものである。
【００５３】
そして、このような本発明の電子機器における回路基板の取付方法においては、抜け止め部１ｄを切り曲げする際、その折曲力がセラミック基板からなる回路基板３にかからず、回路基板３が欠けることが無い。
【００５４】
また、このような回路基板の取付方法を用いて製造された電子機器がセットに組み込まれて使用される際、外部環境やセット内の電子部品によって温度が上昇すると、枠体１、セラミック基板からなる回路基板３、及びシールド板２が膨張する。
【００５５】
しかしながら、回路基板３は、シールド板２の肩部２ｂから離れた（隙間を持った）状態で、突片２ｃに半田４付けされているため、回路基板３、及びシールド板２の平板部２ａが膨張しても、回路基板３には応力がかからず、回路基板３にヒビや割れが発生しない。
【００５６】
また、回路基板３は、突片２ｃによって位置決めされ、回路基板３の外周縁部３ｂは、枠体１の切り曲げ部１ｆが回路基板３に設けられたサイド電極に接触する箇所を除いて、側壁１ｃ（枠体１）の内面から離れた（隙間を持たせた）状態で、配置されているため、回路基板３や枠体１（側壁１ｃ）が膨張しても、回路基板３の外周縁部３ｂへの応力が少なく、回路基板３に欠けが発生しない。
【００５７】
【発明の効果】
本発明の電子機器における回路基板の取付構造は、開放部を有する箱形の枠体と、この枠体内に取り付けられたシールド板と、枠体内に取り付けられたセラミック基板からなる回路基板とを備え、シールド板は、枠体内に位置し、開口部側に向かって配置された肩部と、この肩部から開放部に向かって突出し、この肩部に連なる基部分の幅が回路基板に形成された孔の幅よりも狭い突片を有し、突片が孔に挿通され、回路基板が肩部から離れた状態で、突片に半田付けされて取り付けられた構成とした。
このような構成によって、外部環境やセット内の電子部品によって温度が上昇して、枠体、セラミック基板からなる回路基板、及びシールド板が膨張しても、回路基板は、シールド板の肩部から離れた（隙間を持った）状態で、突片に半田付けされているため、回路基板、及びシールド板の平板部が膨張しても、回路基板には応力がかからず、回路基板のヒビや割れの無いものが得られる。
【００５８】
また、枠体、又は突片には、回路基板が突片から抜け出るのを防止するための抜け止め部を設けたため、その構成が簡単で、生産性の良好なものが得られる。
【００５９】
また、抜け止め部は、枠体に設けられた折曲片によって形成されたため、抜け止め部は、枠体の外部から切り曲げによって形成できて、その構成が簡単で、生産性の良好なものが得られる。
【００６０】
また、回路基板の外周縁部は、枠体の切り曲げ部が回路基板に設けられたサイド電極に接触する箇所を除いて、枠体から離れた状態で配置されたため、回路基板や枠体（側壁）が膨張しても、回路基板の外周縁部への応力が少なく、回路基板に欠けが発生しない。
【００６１】
また、回路基板は、突片によって位置決めされたため、回路基板の位置決めが簡単であると共に、回路基板が枠体、及びシールド板の肩部に接触しない構成を確実に得ることが出来る。
【００６２】
また、開放部を有する箱形の枠体と、この枠体に取り付けられ、枠体に位置する肩部、及びこの肩部から開放部に向かって突出し、この肩部に連なる基部分の幅が回路基板に形成された孔の幅よりも狭い突片を有するシールド板と、孔に挿通された前記突片に半田付けされて、枠体内に取り付けられるセラミック基板からなる回路基板とを備え、回路基板を枠体内に収容して、突片を回路基板に挿通する挿通工程と、この挿通工程の後、肩部から回路基板を離した状態で、回路基板が突片から抜け出るのを防止する抜け防止工程と、この抜け防止工程の後、回路基板が肩部から離れた状態で、回路基板を突片に半田付けする半田付工程とを有した取付方法としたため、従来のような、舌片で回路基板を挟持する構成が無く、従って、回路基板には応力がかからず、回路基板にヒビや割れが発生しないものが得られる。
【００６３】
また、挿通工程の後、枠体、又は突片には、抜け防止工程を行うための抜け止め部が形成され、抜け止め部によって、回路基板の抜け止め工程を行うようにした取付方法としたため、抜け防止用の治具を用いること無く、枠体、或いはシールド板で兼用できて、その構成が簡単で、生産性の良好なものが得られる。
【００６４】
また、挿通工程は、枠体の開放部を上方に位置させた状態で、回路基板を枠体内に収容することによって行い、挿通工程の後、枠体の開放部が下方に位置するように枠体を裏返して、肩部から回路基板を離すと共に、抜け止め部を回路基板に当接させることによって抜け防止工程を行うようにした取付方法としたため、回路基板のシールド板への挿入が容易であると共に、枠体を裏返すことによって、回路基板と肩部の間に隙間を自動的に形成できて、作業性の良好な取付方法を提供できる。
【００６５】
また、回路基板は、挿通された突片によって位置決めされ、回路基板の外周縁部は、枠体の切り曲げ部が回路基板に設けられたサイド電極に接触する箇所を除いて、枠体から離れた状態で、半田付工程が行われるようにした取付方法としたため、回路基板の位置決めが確実で、回路基板や枠体（側壁）が膨張しても、回路基板の外周縁部への応力が少なく、回路基板に欠けが発生しないものが得られる。
【００６６】
また、回路基板と突片の半田付けがクリーム半田を用いた半田付工程によって行うようにした取付方法としたため、半田付作業が容易となり、生産性の良好なものが得られる。
【００６７】
また、回路基板にクリーム半田を設けた後、挿通工程を行うようにした取付方法としたため、クリーム半田の回路基板への塗布が容易となり、生産性の良好なものが得られる。
【図面の簡単な説明】
【図１】本発明の電子機器における回路基板の取付構造に係る正面図。
【図２】本発明の電子機器における回路基板の取付構造に係る側面図。
【図３】本発明の電子機器における回路基板の取付構造に係り、カバーを取り去った状態を示す平面図。
【図４】本発明の電子機器における回路基板の取付構造に係り、カバーを取り去った状態を示す下面図。
【図５】図３の５−５線における断面図。
【図６】図３の６−６線における断面図。
【図７】本発明の電子機器における回路基板の取付方法に係り、挿通工程を示す説明図。
【図８】本発明の電子機器における回路基板の取付方法に係り、抜け防止工程における抜け止め部を示す説明図。
【図９】本発明の電子機器における回路基板の取付方法に係り、抜け防止工程と半田付工程を示す説明図。
【図１０】従来の電子機器における回路基板の取付構造を示す斜視図。
【図１１】従来の電子機器における回路基板の取付構造を示す正面図。
【符号の説明】
１ 枠体
１ａ 開放部
１ｂ 開放部
１ｃ 側壁
１ｄ 抜け止め部
１ｅ 取付脚
１ｆ 切り曲げ部
２ シールド板
２ａ 平板部
２ｂ 肩部
２ｃ 突片
３ 回路基板
３ａ 孔
３ｂ 外周縁部
４ 半田
５ 第１のカバー
５ａ 平板状部
５ｂ 爪部
６ 第２のカバー
６ａ 平板状部
６ｂ 爪部
７ クリーム半田
Ｄ 電子部品[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit board mounting structure in an electronic apparatus suitable for use in a television tuner or the like, and a mounting method thereof.
[0002]
[Prior art]
FIG. 10 is a perspective view showing a circuit board mounting structure in a conventional electronic device, and FIG. 11 is a front view showing a circuit board mounting structure in the conventional electronic device. FIG.
[0003]
Next, a circuit board mounting structure in a conventional electronic device will be described with reference to FIGS. 10 and 11. A box-shaped frame 51 made of a metal plate and having a square shape is open on both sides in the vertical direction. In the state having the portions 51a and 51b, the side wall 51c is arranged in a square shape, the plurality of tongue pieces 51d are provided on the side wall 51c, and the plurality of notches are provided on the side wall 51c. And a mounting leg 51f protruding from the side wall 51c.
[0004]
The shield plate 52 made of a metal plate has a flat plate portion 52a, a shoulder portion 52b positioned on one end side of the flat plate portion 52a, and a protruding piece 52c protruding from the shoulder portion 52b. The body 51 is attached to the side wall 51c by appropriate means in a state where the body 51 is partitioned into a plurality of compartments.
[0005]
When the shield plate 52 is attached to the frame 51, the shoulder 52b is disposed toward the open portion 51a while the shoulder 52b and the protruding piece 52c are positioned in the frame 51, and The piece 52c extends toward the opening 51a.
[0006]
A rectangular circuit board 53 made of a ceramic substrate has a plurality of holes 53a and a plurality of protrusions 53b provided on one end side. Although not shown here, the circuit board 53 has a wiring pattern. And various electronic components are mounted to form a desired electric circuit.
[0007]
The circuit board 53 is accommodated in the frame 51 from the upper open part 51a side, the projecting piece 52c is inserted into the hole 53a, and the lower surface of the circuit board 53 is formed between the shoulder 52b of the shield plate 52 and the side wall 51c. In a state where it is placed (contacted) on the shoulder 51e, the tongue 51d is bent inside the frame 51, and the circuit board 53 is attached.
[0008]
When the circuit board 53 is attached, the circuit board 53 is attached while being sandwiched between the shoulder 52b of the shield plate 52 and the shoulder 51e of the side wall 51c and the bent tongue 1d. The outer peripheral edge 53c of the substrate 53 is in contact with the inner surface of the side wall 51c.
[0009]
In this state, the circuit board 53 and the protruding piece 52c protruding from the hole 53a of the circuit board 53 are soldered, and a grounding wiring pattern (not shown) on the circuit board 53 is grounded. (For example, see Patent Document 1)
[0010]
An electronic device using a conventional circuit board mounting structure is used by being incorporated in a set. At this time, if the temperature rises due to an external environment or an electronic component in the set, a circuit composed of a frame 51 and a ceramic substrate. The substrate 53 and the shield plate 52 expand.
[0011]
Then, stress is applied to the circuit board 53 made of a ceramic substrate sandwiched between the shoulder portions 51e, 52b and the tongue piece 51d, and the circuit board 53 is cracked or cracked. Further, since the outer peripheral edge 53c of the circuit board 53 is in contact with the side wall 51c, the expansion causes a situation such as the outer peripheral edge 53c of the circuit board 53 being chipped.
[0012]
Next, a method for attaching a circuit board in a conventional electronic device will be described with reference to FIGS. 10 and 11. First, a shield plate 52 is attached to the frame 51, and the shoulder portion 52b and the projecting piece 52c are on the open portion 51a side. Prepare something that is aimed at.
[0013]
Next, the circuit board 53 is accommodated in the frame 51 from the upper opening 51a side, the projecting piece 52c is inserted into the hole 53a, and the lower surface of the circuit board 53 is connected to the shoulder 52b of the shield plate 52 and the side wall 51c. Is placed (contacted) on the shoulder 51e.
[0014]
Thereafter, the tongue 51d is bent inside the frame 51 and the circuit board 53 is attached. Then, the circuit board 53 and the projecting piece 52c protruding from the hole 53a of the circuit board 53 are soldered. Installation of is completed.
[0015]
However, in the conventional method of attaching a circuit board in an electronic apparatus, when the tongue piece 51d is bent, the bending force is applied to the circuit board 53 made of a ceramic substrate, and the circuit board 53 is lost.
[0016]
In addition, when an electronic device manufactured using such a circuit board mounting method is incorporated into a set and used, if the temperature rises due to the external environment or electronic components in the set, the frame 51 and the ceramic substrate The resulting circuit board 53 and shield plate 52 expand.
[0017]
Then, stress is applied to the circuit board 53 formed of the ceramic substrate sandwiched between the shoulder portions 51e, 52b and the tongue piece 51d, and the circuit board 53 is cracked or cracked. Further, the outer peripheral edge 53c of the circuit board 53 is formed on the side wall. Since it is in contact with 51c, the outer peripheral edge 53c of the circuit board 53 is missing.
[0018]
[Patent Document 1]
Japanese Patent Laid-Open No. 7-312485
[Problems to be solved by the invention]
The circuit board mounting structure in the conventional electronic apparatus is such that the circuit board 53 is sandwiched between the shoulder portion 52b of the shield plate 52 and the tongue piece 51d. When the circuit board 53 and the shield plate 52 are expanded, a stress is applied to the circuit board 53 made of the sandwiched ceramic substrate, and there is a problem that the circuit board 53 is cracked or cracked.
Further, since the substantially entire circumference of the outer peripheral edge 53c of the circuit board 53 is in contact with the side wall 51c, there is a problem that the outer peripheral edge 53c of the circuit board 53 is lost due to this expansion.
[0020]
In the conventional circuit board mounting method in an electronic apparatus, when the tongue piece 51d is bent, the bending force is applied to the circuit board 53 made of a ceramic substrate, and the circuit board 53 is missing.
[0021]
In addition, when an electronic device manufactured using such a circuit board mounting method is incorporated into a set and used, if the temperature rises due to the external environment or electronic components in the set, the frame 51 and the ceramic substrate The resulting circuit board 53 and shield plate 52 expand.
[0022]
Then, stress is applied to the circuit board 53 formed of the ceramic substrate sandwiched between the shoulder portions 51e, 52b and the tongue piece 51d, and the circuit board 53 is cracked or cracked. Since the entire circumference is in contact with the side wall 51c, there is a problem that the outer peripheral edge portion 53c of the circuit board 53 is missing.
[0023]
SUMMARY OF THE INVENTION An object of the present invention is to provide a circuit board mounting structure in an electronic device free from cracks or cracks in a circuit board made of a ceramic substrate, and a mounting method therefor.
[0024]
[Means for Solving the Problems]
As a first means for solving the above problems, a box-shaped frame having an open portion, a shield plate attached to the inside of the frame, and a circuit board made of a ceramic substrate attached to the inside of the frame, wherein the shield plate is located in the frame body, and arranged shoulders toward the opening side from the shoulder portion and projecting toward the opening portion, the base portion continuing to said shoulder portion A protrusion having a width narrower than a width of a hole formed in the circuit board; the protrusion is inserted into the hole; and the circuit board is separated from the shoulder portion and soldered to the protrusion. It was set as the structure attached.
[0025]
As a second solution, the frame or the projecting piece is provided with a retaining portion for preventing the circuit board from coming out of the projecting piece.
As a third solution, the retaining portion is formed by a bent piece provided on the frame.
[0026]
Further, as a fourth solution, the outer peripheral edge of the circuit board is separated from the frame except where the cut and bent portions of the frame are in contact with side electrodes provided on the circuit board. It was set as the arrangement | positioning by.
As a fifth solution, the circuit board is positioned by the protruding piece.
[0027]
Further, as a sixth solving means, a box-shaped frame member having an opening, attached to the frame, a shoulder portion positioned on the frame, and protrudes toward the opening from the shoulder, A shield plate having a projecting piece narrower than a width of the hole formed in the circuit board and a base plate connected to the shoulder is soldered to the projecting piece inserted into the hole , A circuit board made of a ceramic substrate to be mounted; an insertion process for housing the circuit board in the frame body and inserting the projecting piece into the circuit board; and after the insertion process, the circuit from the shoulder A disconnection preventing step for preventing the circuit board from coming out of the protruding piece in a state where the substrate is separated, and after the disconnection preventing step, the circuit board is separated from the shoulder portion in the state where the circuit board is separated from the shoulder portion. Soldering process to solder to the projecting piece It was was mounting method.
[0028]
Further, as a seventh solving means, after the insertion step, the frame body or the projecting piece is formed with a retaining portion for performing the retaining step, and the circuit board is configured by the retaining portion. The attachment method was adapted to perform the above-mentioned removal prevention step.
[0029]
Further, as an eighth solving means, the insertion step is performed by accommodating the circuit board in the frame body with the open portion of the frame body positioned upward, and after the insertion step, Flip prevention step by turning the frame body over so that the open portion of the frame body is located below, separating the circuit board from the shoulder portion, and bringing the retaining portion into contact with the circuit board. It was set as the attachment method which was made to perform.
[0030]
As a ninth solving means, the circuit board is positioned by the inserted projecting piece, and the soldering step is performed in a state where the entire outer peripheral edge of the circuit board is separated from the frame body. The mounting method is as follows.
[0031]
As a tenth solution, the mounting method is such that the circuit board and the protruding piece are soldered by the soldering process using cream solder.
Further, as an eleventh solution, an attachment method is provided in which the cream solder is provided on the circuit board and then the insertion step is performed.
[0032]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a front view of a circuit board mounting structure in an electronic device according to the present invention, and FIG. 2 is a diagram in the electronic device according to the present invention. FIG. 3 is a side view of the circuit board mounting structure, FIG. 3 is a plan view showing the circuit board mounting structure in the electronic device of the present invention, with the cover removed, and FIG. 4 is the circuit board mounting in the electronic device of the present invention. It is a bottom view which shows the state which concerns on the structure and removed the cover.
[0033]
5 is a cross-sectional view taken along line 5-5 in FIG. 3, FIG. 6 is a cross-sectional view taken along line 6-6 in FIG. 3, and FIG. 7 relates to the circuit board mounting method in the electronic device of the present invention. FIG. 8 is an explanatory view showing a circuit board mounting method in the electronic device of the present invention, and is an explanatory diagram showing a retaining portion in the disconnection preventing step, and FIG. 9 is related to a circuit board mounting method in the electronic device of the present invention. It is explanatory drawing which shows a removal prevention process and a soldering process.
[0034]
Next, the mounting structure of the circuit board in the electronic apparatus of the present invention will be described with reference to FIGS. 1 to 6. A plurality of retaining portions comprising a side wall 1c arranged in a square shape with the open portions 1a and 1b and a bent piece in which the side wall 1c is cut (bent) in the vicinity of the four corners. 1d, a mounting leg 1e protruding downward from the side wall 1c, and a plurality of cut and bent portions 1f provided on the side wall 1c.
[0035]
The frame 1 may be one in which the open portion 1a side is closed by the upper wall and only the lower open portion 1b is opened.
[0036]
The shield plate 2 made of a metal plate has a flat plate portion 2a, a shoulder portion 2b positioned on one end side of the flat plate portion 2a, and a projecting piece 2c protruding from the shoulder portion 2b. In a state where the body 1 is partitioned into a plurality of compartments, the body 1 is attached to the side wall 1c by appropriate means.
[0037]
When the shield plate 2 is attached to the frame body 1, the shoulder portion 2 b is disposed toward the lower opening portion 1 b in a state where the shoulder portion 2 b and the projecting piece 2 c are located in the frame body 1. The projecting piece 2c is arranged extending toward the lower opening 1b.
[0038]
The rectangular circuit board 3 made of a ceramic substrate has a plurality of holes 3a. The circuit board 3 is provided with a wiring pattern and various electronic components D, which are not shown here. A desired electric circuit is formed.
[0039]
The circuit board 3 is accommodated in the frame 1 from the lower open part 1b side, the projecting piece 2c is inserted into the hole 3a, and the lower surface of the circuit board 3 is in contact with the retaining part 1d. The stop portion 1d prevents the circuit board 3 from coming out of the protruding piece 2c.
[0040]
Further, when the lower surface of the circuit board 3 contacts the retaining portion 1d, the upper surface of the circuit board 3 is separated from the shoulder 2b of the shield plate 2, and in this state, the circuit board 3 is shielded. Solder 4 is attached to and attached to the projecting piece 2c of the board 2, and a grounding wiring pattern (not shown) on the circuit board 3 is grounded by the solder 4 attachment.
[0041]
At this time, the circuit board 3 is positioned by the projecting piece 2 c and the cut and bent portion 1 f is bent into the frame body 1. Although not shown here, the cut and bent portion 1 f is the outer peripheral edge of the circuit board 3. The outer peripheral edge 3b of the circuit board 3 is in contact with the side electrode provided on the part 3b, except for the part where the bent part 1f of the frame 1 is in contact with the side electrode provided on the circuit board 3. Thus, they are arranged apart from the inner surface of the side wall 1c (frame body 1) (with a gap).
[0042]
In this embodiment, the description has been given of the case where the retaining portion 1b for retaining the circuit board 3 is formed by the bent piece of the frame body 1. However, the tip portion of the projecting piece 2c of the shield plate 2 is The retaining portion of the circuit board 3 may be configured by a retaining portion that is expanded by caulking or the like.
[0043]
The first and second covers 5 and 6 made of a metal plate have flat plate portions 5a and 6a and claw portions 5b and 6b bent from the flat plate portions 5a and 6a, respectively. The claw 5b is elastically attached to the side wall 1c in a state where the upper open portion 1a is covered with the flat plate-like portion 5a, and the second cover 6 is the flat open portion 6a. The claw part bb is elastically attached to the side wall 1c in a state of covering 1b.
[0044]
The electronic device using the circuit board mounting structure of the present invention is used by being incorporated into a set. At this time, when the temperature rises due to an external environment or an electronic component in the set, the frame 1 and the ceramic substrate are included. The circuit board 3 and the shield plate 2 expand.
[0045]
However, since the circuit board 3 is soldered 4 to the projecting piece 2c in a state separated from the shoulder 2b of the shield plate 2 (with a gap), the circuit board 3 and the flat plate portion 2a of the shield plate 2 are used. Even if swells, the circuit board 3 is not stressed, and the circuit board 3 is not cracked or cracked.
[0046]
Further, the circuit board 3 is positioned by the projecting piece 2c, and the outer peripheral edge portion 3b of the circuit board 3 is except for the portion where the cut and bent portion 1f of the frame body 1 is in contact with the side electrode provided on the circuit board 3, Since the circuit board 3 and the frame body 1 (side wall 1c) are expanded, they are arranged away from the inner surface of the side wall 1c (frame body 1) (with a gap). The stress on the peripheral edge 3b is small and the circuit board 3 is not chipped.
[0047]
Next, a method of attaching the circuit board in the electronic apparatus according to the present invention will be described with reference to FIGS. 7 to 9. First, as shown in FIG. 7, the shield plate 2 is attached to the frame 1, and the shoulder portion 2 b and In addition to preparing the protrusion 2c facing the open portion 1b, prepare the solder paste 7 coated on the circuit board 3 as indicated by the dotted line.
[0048]
Next, as shown in FIG. 7, the circuit board 3 is accommodated in the frame body 1 from the open portion 1 b side with the open portion 1 b below the frame body 1 positioned upward, and the projecting piece 2 c is a hole. The insertion process inserted in 3a is performed.
At this time, the circuit board 3 is placed (contacted) on the shoulder 2b of the shield plate 2.
[0049]
Thereafter, in this state, as shown in FIG. 8, the frame body 1 is cut and bent to form a retaining portion 1d for performing a retaining step.
Next, as shown in FIG. 9, the frame body 1 is turned over so that the open portion 1 b of the frame body 1 is positioned below.
Then, the circuit board 3 is guided by the projecting piece 2c and moves downward by its own weight, and the circuit board 3 is locked by the retaining portion 1d to perform a removal prevention process.
[0050]
That is, in this removal prevention process, the circuit board 3 is prevented from coming out of the projecting piece 2 c, the upper surface of the circuit board 3 is separated from the shoulder 2 b of the shield plate 2, and The peripheral edge 3b is placed at a position away from the inner surface of the frame 1.
[0051]
Next, in this state, when the frame body 1 is conveyed to the reflow furnace and the cream solder 7 is melted, the circuit board 3 and the projecting piece 2c protruding from the hole 3a of the circuit board 3 are attached to the solder 4. The mounting of the circuit board 3 is completed.
[0052]
The application of the cream solder 7 can be arbitrarily selected between the insertion process and the transfer to the reflow furnace.
[0053]
And in such a mounting method of the circuit board in the electronic device of the present invention, when the retaining portion 1d is cut and bent, the bending force is not applied to the circuit board 3 made of the ceramic substrate, and the circuit board 3 There is no lack.
[0054]
Further, when an electronic device manufactured using such a circuit board mounting method is incorporated into a set and used, if the temperature rises due to an external environment or an electronic component in the set, the frame 1 and the ceramic substrate The resulting circuit board 3 and the shield plate 2 expand.
[0055]
However, since the circuit board 3 is soldered 4 to the projecting piece 2c in a state separated from the shoulder 2b of the shield plate 2 (with a gap), the circuit board 3 and the flat plate portion 2a of the shield plate 2 are used. Even if swells, the circuit board 3 is not stressed, and the circuit board 3 is not cracked or cracked.
[0056]
Further, the circuit board 3 is positioned by the projecting piece 2c, and the outer peripheral edge portion 3b of the circuit board 3 is except for the portion where the cut and bent portion 1f of the frame body 1 is in contact with the side electrode provided on the circuit board 3, Since the circuit board 3 and the frame body 1 (side wall 1c) are expanded, they are arranged away from the inner surface of the side wall 1c (frame body 1) (with a gap). The stress on the peripheral edge 3b is small and the circuit board 3 is not chipped.
[0057]
【The invention's effect】
A circuit board mounting structure in an electronic device of the present invention includes a box-shaped frame having an open portion, a shield plate mounted in the frame, and a circuit board made of a ceramic substrate mounted in the frame. , the shield plate is located inside the frame, and arranged shoulders toward the opening side, protruding toward the opening from the shoulder portion, forming the width of the base portion connected to the shoulder portion to the circuit board The projecting piece is narrower than the width of the formed hole , the projecting piece is inserted into the hole , and the circuit board is separated from the shoulder portion and soldered to the projecting piece.
With such a configuration, even if the temperature rises due to the external environment or electronic components in the set and the frame, the circuit board made of the ceramic board, and the shield board expand, the circuit board can be removed from the shoulder of the shield board. Since it is soldered to the projecting piece in a separated state (with a gap), even if the flat part of the circuit board and the shield plate expands, no stress is applied to the circuit board, and the circuit board is cracked. And without cracks.
[0058]
Further, since the frame body or the projecting piece is provided with a retaining portion for preventing the circuit board from coming out of the projecting piece, the structure is simple and a product with good productivity can be obtained.
[0059]
In addition, since the retaining portion is formed by a bent piece provided on the frame, the retaining portion can be formed by cutting and bending from the outside of the frame, and its configuration is simple and the productivity is good. Is obtained.
[0060]
In addition, the outer peripheral edge of the circuit board is arranged away from the frame except for the portion where the cut and bent portions of the frame are in contact with the side electrodes provided on the circuit board. Even if the side wall expands, the stress on the outer peripheral edge of the circuit board is small, and the circuit board is not chipped.
[0061]
Further, since the circuit board is positioned by the projecting piece, it is easy to position the circuit board and it is possible to reliably obtain a configuration in which the circuit board does not contact the frame body and the shoulder portion of the shield plate.
[0062]
Further, a frame body of a box shape having an opening, attached to the frame, a shoulder portion positioned on the frame, and projecting toward the opening from the shoulder portion, the width of the base portion continuous with the shoulder A shield plate having a projecting piece narrower than the width of the hole formed in the circuit board, and a circuit board made of a ceramic substrate that is soldered to the projecting piece inserted into the hole and attached to the frame body, Inserting the circuit board into the frame and inserting the projecting piece into the circuit board, and preventing the circuit board from coming out of the projecting piece after the insertion process with the circuit board separated from the shoulder. Since the attachment method has a removal prevention step and a soldering step of soldering the circuit board to the protruding piece after the removal prevention step and the circuit board is separated from the shoulder portion, There is no configuration to hold the circuit board in one piece, so the circuit board Is not applied stress, it is obtained that the circuit board cracks or cracks do not occur.
[0063]
Further, after the insertion process, the frame body or the projecting piece is formed with a retaining portion for performing the removal prevention process, and the attachment method is configured to perform the retaining process of the circuit board by the retaining portion. Without using a jig for preventing detachment, it can be used as a frame or a shield plate, and a simple structure and good productivity can be obtained.
[0064]
Further, the insertion step is performed by housing the circuit board in the frame body with the open portion of the frame body positioned upward, and after the insertion step, the frame is so positioned that the open portion of the frame body is positioned below. The circuit board is turned over, the circuit board is separated from the shoulder, and the retaining part is brought into contact with the circuit board to perform the removal prevention process, so that the circuit board can be easily inserted into the shield plate. In addition, by turning the frame upside down, a gap can be automatically formed between the circuit board and the shoulder, and a mounting method with good workability can be provided.
[0065]
Further, the circuit board is positioned by the inserted projecting piece, and the outer peripheral edge of the circuit board is separated from the frame body except for the portion where the cut and bent part of the frame body contacts the side electrode provided on the circuit board. Since the mounting method is such that the soldering process is performed in a state where the circuit board is placed, the positioning of the circuit board is reliable, and even if the circuit board or the frame (side wall) expands, the stress on the outer peripheral edge of the circuit board does not occur. There are few things which a chip | tip does not generate | occur | produce in a circuit board.
[0066]
In addition, since the mounting method is such that the circuit board and the projecting piece are soldered by a soldering process using cream solder, the soldering operation is facilitated and a product with good productivity can be obtained.
[0067]
In addition, since the mounting method is such that after the cream solder is provided on the circuit board, the insertion process is performed, the cream solder can be easily applied to the circuit board, and a product with good productivity can be obtained.
[Brief description of the drawings]
FIG. 1 is a front view of a circuit board mounting structure in an electronic apparatus according to the invention.
FIG. 2 is a side view relating to a circuit board mounting structure in an electronic apparatus according to the invention.
FIG. 3 is a plan view showing a state where a cover is removed according to the circuit board mounting structure in the electronic apparatus of the present invention.
FIG. 4 is a bottom view showing a state where a cover is removed according to the circuit board mounting structure in the electronic apparatus of the present invention.
5 is a cross-sectional view taken along line 5-5 of FIG.
6 is a cross-sectional view taken along line 6-6 of FIG.
FIG. 7 is an explanatory diagram showing an insertion process according to a circuit board mounting method in the electronic apparatus of the invention.
FIG. 8 is an explanatory view showing a retaining portion in a slip prevention process according to a method for mounting a circuit board in the electronic apparatus of the present invention.
FIG. 9 is an explanatory diagram showing a disconnection prevention process and a soldering process according to the circuit board mounting method in the electronic apparatus of the present invention.
FIG. 10 is a perspective view showing a circuit board mounting structure in a conventional electronic device.
FIG. 11 is a front view showing a circuit board mounting structure in a conventional electronic device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Frame 1a Opening part 1b Opening part 1c Side wall 1d Retaining part 1e Mounting leg 1f Cutting and bending part 2 Shield plate 2a Flat plate part 2b Shoulder part 2c Projection piece 3 Circuit board 3a Hole 3b Outer peripheral edge part 4 Solder 5 First cover 5a Flat plate portion 5b Claw portion 6 Second cover 6a Flat plate portion 6b Claw portion 7 Cream solder D Electronic component

Claims (11)

開放部を有する箱形の枠体と、この枠体内に取り付けられたシールド板と、前記枠体内に取り付けられたセラミック基板からなる回路基板とを備え、前記シールド板は、前記枠体内に位置し、前記開口部側に向かって配置された肩部と、この肩部から前記開放部に向かって突出し、前記肩部に連なる基部分の幅が前記回路基板に形成された孔の幅よりも狭い突片を有し、前記突片が前記孔に挿通され、前記回路基板が前記肩部から離れた状態で、前記突片に半田付けされて取り付けられたことを特徴とする電子機器における回路基板の取付構造。A box-shaped frame having an open portion, a shield plate attached in the frame, and a circuit board made of a ceramic substrate attached in the frame, wherein the shield plate is located in the frame. , a shoulder portion disposed toward the opening side, this from the shoulder portion toward the open portion protrudes, than the width of the hole width of the base portion continuing to the shoulder portion is formed on the circuit board A circuit in an electronic device having a narrow projecting piece, wherein the projecting piece is inserted into the hole , and the circuit board is soldered to the projecting piece in a state of being separated from the shoulder portion. Board mounting structure. 前記枠体、又は前記突片には、前記回路基板が前記突片から抜け出るのを防止するための抜け止め部を設けたことを特徴とする請求項１記載の電子機器における回路基板の取付構造。The mounting structure for a circuit board in an electronic device according to claim 1, wherein the frame body or the projecting piece is provided with a retaining portion for preventing the circuit board from coming out of the projecting piece. . 前記抜け止め部は、前記枠体に設けられた折曲片によって形成されたことを特徴とする請求項２記載の電子機器における回路基板の取付構造。3. The circuit board mounting structure in an electronic device according to claim 2, wherein the retaining portion is formed by a bent piece provided on the frame. 前記回路基板の外周縁部は、前記枠体の切り曲げ部が前記回路基板に設けられたサイド電極に接触する箇所を除いて、前記枠体から離れた状態で配置されたことを特徴とする請求項１から３の何れかに記載の電子機器における回路基板の取付構造。The outer peripheral edge portion of the circuit board is disposed in a state of being separated from the frame body except for a portion where a cut and bent portion of the frame body is in contact with a side electrode provided on the circuit board. A circuit board mounting structure in an electronic device according to any one of claims 1 to 3. 前記回路基板は、前記突片によって位置決めされたことを特徴とする請求項４記載の電子機器における回路基板の取付構造。The circuit board mounting structure in an electronic apparatus according to claim 4, wherein the circuit board is positioned by the protruding piece. 開放部を有する箱形の枠体と、この枠体に取り付けられ、前記枠体に位置する肩部、及びこの肩部から前記開放部に向かって突出し、前記肩部に連なる基部分の幅が前記回路基板に形成された孔の幅よりも狭い突片を有するシールド板と、前記孔に挿通された前記突片に半田付けされて、前記枠体内に取り付けられるセラミック基板からなる回路基板とを備え、前記回路基板を前記枠体内に収容して、前記突片を前記回路基板に挿通する挿通工程と、この挿通工程の後、前記肩部から前記回路基板を離した状態で、前記回路基板が前記突片から抜け出るのを防止する抜け防止工程と、この抜け防止工程の後、前記回路基板が前記肩部から離れた状態で、前記回路基板を前記突片に半田付けする半田付工程とを有したことを特徴とする電子機器における回路基板の取付方法。A box-shaped frame member having an opening, attached to the frame body, shoulders, and protrudes toward the opening from the shoulder portion, the width of the base portion continuing to the shoulder portion located in said frame A shield plate having a projecting piece narrower than the width of the hole formed in the circuit board, and a circuit board made of a ceramic substrate that is soldered to the projecting piece inserted into the hole and attached to the frame body, The circuit board is housed in the frame body, and the circuit board is separated from the shoulder portion after the insertion process of inserting the protruding piece into the circuit board and after the insertion process. A step of preventing the board from slipping out of the projecting piece, and a soldering step of soldering the circuit board to the projecting piece after the step of preventing the slipping, with the circuit board being separated from the shoulder. An electronic device characterized by having Method of attaching the definitive circuit board. 前記挿通工程の後、前記枠体、又は前記突片には、前記抜け防止工程を行うための抜け止め部が形成され、前記抜け止め部によって、前記回路基板の前記抜け防止工程を行うようにしたことを特徴とする請求項６記載の電子機器における回路基板の取付方法。After the insertion step, the frame body or the projecting piece is formed with a retaining portion for performing the retaining step, and the retaining portion performs the retaining step for the circuit board. A method for mounting a circuit board in an electronic device according to claim 6. 前記挿通工程は、前記枠体の前記開放部を上方に位置させた状態で、前記回路基板を前記枠体内に収容することによって行い、前記挿通工程の後、前記枠体の前記開放部が下方に位置するように前記枠体を裏返して、前記肩部から前記回路基板を離すと共に、前記抜け止め部を前記回路基板に当接させることによって前記抜け防止工程を行うようにしたことを特徴とする請求項７記載の電子機器における回路基板の取付方法。The insertion step is performed by accommodating the circuit board in the frame body with the opening portion of the frame body positioned upward. After the insertion step, the opening portion of the frame body is downward The frame body is turned upside down so as to be positioned at a distance from the shoulder portion, and the removal prevention step is performed by bringing the retaining portion into contact with the circuit board. A method for mounting a circuit board in an electronic device according to claim 7. 前記回路基板は、挿通された前記突片によって位置決めされ、前記回路基板の全外周縁部が前記枠体から離れた状態で、前記半田付工程が行われるようにしたことを特徴とする請求項６から８の何れかに記載の電子機器における回路基板の取付方法。The circuit board is positioned by the inserted projecting piece, and the soldering step is performed in a state where the entire outer peripheral edge of the circuit board is separated from the frame. A circuit board mounting method in an electronic device according to any one of 6 to 8. 前記回路基板と前記突片の半田付けがクリーム半田を用いた前記半田付工程によって行うようにしたことを特徴とする請求項６から９の何れかに記載の電子機器における回路基板の取付方法。10. The method for mounting a circuit board in an electronic device according to claim 6, wherein the soldering of the circuit board and the protruding piece is performed by the soldering process using cream solder. 前記回路基板に前記クリーム半田を設けた後、前記挿通工程を行うようにしたことを特徴とする請求項１０記載の電子機器における回路基板の取付方法。11. The method for mounting a circuit board in an electronic device according to claim 10, wherein the insertion step is performed after the cream solder is provided on the circuit board.
JP2003192730A 2003-07-07 2003-07-07 Circuit board mounting structure in electronic equipment and mounting method thereof Expired - Fee Related JP4233401B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003192730A JP4233401B2 (en) 2003-07-07 2003-07-07 Circuit board mounting structure in electronic equipment and mounting method thereof
CNB2004100621662A CN1317927C (en) 2003-07-07 2004-07-06 Mounting structure for circuit board in electronic device and mounting method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003192730A JP4233401B2 (en) 2003-07-07 2003-07-07 Circuit board mounting structure in electronic equipment and mounting method thereof

Publications (2)

Publication Number Publication Date
JP2005032748A JP2005032748A (en) 2005-02-03
JP4233401B2 true JP4233401B2 (en) 2009-03-04

Family

ID=34204434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003192730A Expired - Fee Related JP4233401B2 (en) 2003-07-07 2003-07-07 Circuit board mounting structure in electronic equipment and mounting method thereof

Country Status (2)

Country Link
JP (1) JP4233401B2 (en)
CN (1) CN1317927C (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4626457B2 (en) * 2005-09-14 2011-02-09 パナソニック株式会社 Case and electronic device using the same
JP4649378B2 (en) * 2006-07-26 2011-03-09 アルプス電気株式会社 Circuit board manufacturing method and electronic circuit unit using the circuit board
CN102497730B (en) * 2011-12-08 2014-05-07 无锡华测电子系统有限公司 Ceramic substrate assembly and grounding welding method thereof
CN103273154B (en) * 2013-04-25 2015-08-19 西安空间无线电技术研究所 A kind of microwave multi-cavity partition wall welding technique
CN104411140A (en) * 2014-11-20 2015-03-11 李军安 Circuit board blocking structure of LED (light-emitting diode) light-emitting device
JP2019149520A (en) * 2018-02-28 2019-09-05 ファナック株式会社 Electronic apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07212069A (en) * 1994-01-19 1995-08-11 Hitachi Ltd Forming method of shield case
JPH07336070A (en) * 1994-06-14 1995-12-22 Murata Mfg Co Ltd Frame of circuit module
KR0109583Y1 (en) * 1994-09-06 1997-11-19 Samsung Electronics Co Ltd Jointer for pcb of monitor
JPH08222881A (en) * 1995-02-10 1996-08-30 Hitachi Denshi Ltd Method for mounting printed board
JPH10303590A (en) * 1997-04-28 1998-11-13 Mitsubishi Electric Corp Component mounting apparatus
JP2000183564A (en) * 1998-12-21 2000-06-30 Sharp Corp Electronic apparatus having circuit board and chassis and manufacture thereof
JP3190643B2 (en) * 1999-07-06 2001-07-23 シャープ株式会社 High frequency unit and method of manufacturing the same
JP3924122B2 (en) * 2000-12-19 2007-06-06 アルプス電気株式会社 Electronics

Also Published As

Publication number Publication date
CN1578609A (en) 2005-02-09
JP2005032748A (en) 2005-02-03
CN1317927C (en) 2007-05-23

Similar Documents

Publication Publication Date Title
JP2003179323A (en) Attaching structure for electronic circuit unit
JPH10189177A (en) Electric connector
JP4233401B2 (en) Circuit board mounting structure in electronic equipment and mounting method thereof
JP4500726B2 (en) Mounting structure for high frequency equipment
JPH11260521A (en) Electric connector
EP1758208B1 (en) A connector and a mounting method therefor
EP0957665B1 (en) Electronic device
JP2006245497A (en) High-frequency module
JP4007851B2 (en) Electronic circuit unit
JPH11214864A (en) Connector mounting structure
JPH11307978A (en) Electronic apparatus
JP4448495B2 (en) connector
JP3853029B2 (en) Electronic components
JP2007299998A (en) High-frequency unit manufacturing method and high-frequency unit manufactured by the same
JP4242220B2 (en) Electronic device cover structure
JP3623637B2 (en) Electronics
JP3963238B2 (en) Board holder
JP3187863U (en) Electronic circuit module
JP2002261486A (en) Electronic circuit unit
JP3633778B2 (en) Electronic device and manufacturing method thereof
JPH08288687A (en) Shield structure of printed board
JPH04158598A (en) Grounding structure of circuit board
JPH10233592A (en) Method of attaching shield plate, and attachment structure
JP2006013279A (en) Manufacturing method of frame body for high-frequency equipment
JP2000101343A (en) Electronic circuit unit and manufacture of the electronic circuit unit

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060303

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20080306

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080807

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080812

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080919

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20081203

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20081209

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111219

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees