JP3633778B2 - Electronic device and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device such as an FM tuner used in communication devices such as a television and a radio.
[0002]
[Prior art]
This type of electronic device that has been conventionally used in tuners such as televisions and radios will be described with reference to FIGS.
As shown in FIG. 10, this type of electronic device is configured such that a printed circuit board on which a predetermined circuit pattern is formed is housed in a case made of a metal material.
And the frame which comprises a case bends an iron flat plate, and as shown to the substantially rectangular parallelepiped frame 22 shown in FIG. 11, side surface 28a, 28b, 28c, 28d surrounding four sides, and the upper opening part 30a, A lower opening 30b. And the upper part of 2 side surface 28a, 28b which opposes among side surfaces is cut off in the substantially rectangular shape, and the notch parts 31a and 31b are formed. Both the notches 31a and 31b are exactly the same in position, shape and size on the side surfaces 28a and 28b.
[0003]
Next, a printed circuit board to be attached to the frame 22 will be described with reference to FIG.
In FIG. 12, a plurality of (four in this example) printed circuit boards 21a are integrally formed on a resin mother board 21 for taking a plurality of pieces. Each printed circuit board 21a is framed by providing a long hole 24 in the mother board 21, and is connected by connecting portions 25a and 25b.
The long hole 24 has a shape along the outer edge portion of the frame 22, and holes 25 c and 25 d are provided in the central portions of the connecting portions 25 a and 25 b, and an easily split portion for making it easy to split the printed board 21 a from the mother board 21. It has become.
[0004]
Although not shown, a predetermined circuit pattern is formed on the surface of the printed circuit board 21a and electronic components are attached.
[0005]
In the mother board 21, the number of printed boards 21a is four, but the number of printed boards can be increased or decreased.
[0006]
Next, the upper and lower covers constituting the case will be described with reference to FIG.
The upper cover 23a is formed by bending a flat plate made of iron, a substantially rectangular flat upper wall 23b, and a plurality of attachment pieces 23c having spring properties that are bent from the ends of the four sides of the upper wall 23b and extend downward. ing. The upper cover 23 a is attached by covering the opening 30 a on the upper surface side of the frame 22 with the upper wall 23 b and sandwiching the attachment piece 23 c between the side surfaces 28 a, 28 b, 28 c, 28 d of the frame 22.
Similarly to the upper cover 23a, the lower cover 23d is also formed by bending a flat plate made of iron, a substantially rectangular flat lower wall 23e, and a plurality of spring properties that are bent upward from the ends of the four sides of the lower wall and extend upward. A mounting piece 23f is provided. The lower cover 23d is attached by covering the opening 30b on the lower surface side of the frame 22 with the lower wall 23e and sandwiching the attachment piece 23f between the side surfaces 28a, 28b, 28c, 28d of the frame 22.
[0007]
Next, an operation for attaching the printed circuit board 21a to the frame 22 will be described.
First, the long hole 24 of the mother board 21 is positioned right above the side surfaces 28 a to 28 d of the frame 22, and the upper portions of the side surfaces 28 a to 28 d of the frame 22 are inserted into the long hole 24. Then, the frame 22 is inserted into the long hole 24 until the easy division parts (connecting parts) 25a and 25b of the printed circuit board 21a abut on the end surfaces 26a and 26b of the cutout parts 31a and 31b, respectively.
FIG. 13 shows a state in which the printed circuit board 21a is attached to the frame 22 in this way. As described above, the easy division portions 25a and 25b of the printed circuit board 21a are located above the end surfaces 26a and 26b of the side surfaces 28a and 28b facing the notch portions.
[0008]
Although FIG. 13 shows the case where one printed board 21a is attached to the frame 22, in the manufacturing process, the work of attaching the frame to the four printed boards 21a on the mother board 21 is performed at the same time.
[0009]
Next, an operation of breaking the printed board 21a and mounting the printed board 21a in the frame 22 will be described.
FIG. 14 is a cross-sectional view of the main part showing a state where the printed circuit board 21 a is attached to the frame 22. In FIG. 14, the printed circuit board 21a is not yet broken. The printed circuit board 21a is cracked by applying pressure from above to the outside of the easy-to-divide parts 25a and 25b with a jig (not shown). At this time, since the easy division parts 25a and 25b are located above the end faces 26a and 26b, the easy division parts 25a and 25b are broken along the corners of the end faces 26a and 26b, so that the work of breaking the substrate is easy. Can be.
FIG. 15 shows a state in which the printed circuit board 21a is broken in this way.
[0010]
Finally, the upper cover 23a and the lower cover 23d are attached to the frame 22 to which the printed circuit board 21a is attached, and the assembly of the electronic device is completed.
[0011]
[Problems to be solved by the invention]
By the way, in the above conventional example, as shown in FIG. 16, when the printed circuit board 21a is broken, the cut portion 27 which is a jagged fracture surface of the board protrudes outside the side surface 28a of the frame 22, When the cover 23a is put on, the protruding portion of the cutting portion 27 prevents the attachment piece 23c of the upper cover 23a and the side surface 28a of the frame 22 from coming into close contact with each other. As a result, the connection between the upper cover 23a and the frame 22 is incomplete. As a result, the shield is incomplete and the upper cover 23a is removed.
[0012]
The present invention solves the above problem, and prevents the cut portion of the substrate from protruding outside the frame, and when the cover is put on, the cover and the frame are completely brought into close contact with each other to completely connect the cover and the frame. It is an object of the present invention to provide an electronic device that secures a shield and prevents a cover from coming off, and a method for manufacturing the electronic device.
[0013]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides, as a first means, an electronic apparatus according to the present invention, which includes a frame, a printed circuit board attached and fixed to the inside of the frame, and a cover for closing the frame. A part of the side surface of the printed circuit board is bent inward to form a bent part, and the easy-divided part of the printed circuit board is positioned on the end surface of the bent part.
[0014]
In addition, as a second means for solving the above-described problem, the electronic apparatus of the present invention is configured such that the easy-to-divide part of the printed circuit board is positioned at a corner of the end face.
[0015]
Further, as a third means for solving the above-described problem, the electronic device of the present invention forms a bent portion by bending a part of the side surface of the frame inward, and forms an elongated hole and an easily split portion on the mother board. The printed board is framed, the side surface of the frame is inserted into the slot, the easy-to-divide part is brought into contact with the end surface of the bent part, and the easy-to-divide part is divided using the end surface as a fulcrum. In the manufacturing method, the printed circuit board is attached to the frame, and the frame is closed with a cover.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an electronic device according to an embodiment of the present invention will be described with reference to FIGS.
[0017]
First, as shown in FIG. 1, the frame 2 of the case used in the electronic device of the present invention is made of a flat iron material, bent into a substantially rectangular parallelepiped, and side surfaces 8a, 8b, 8c, 8d surrounding the four sides, It has an upper opening 10a and a lower opening 10b, and the inside is hollow.
Similarly to the frame 22 of the conventional example, the upper part of the opposing two side surfaces 8a and 8b of the side surfaces 8a to 8d is also cut into a substantially rectangular shape to form notches 11a and 11b. The notches 11a and 11b have the same position, shape and size on the side surfaces 8a and 8b.
In addition, you may vary the magnitude | size etc. of notch part 11a, 11b as needed.
[0018]
However, in the cutout portions 11a and 11b, the side surfaces 8a and 8b corresponding to the bottom sides of the cutout portions are formed with a bendable portion by making two cuts in the vertical downward direction in the drawing, and the portions are directed toward the inside of the frame 2. In addition, linear bent portions 9a and 9b formed by bending at an acute angle with respect to the side surfaces 8a and 8b are provided.
[0019]
Next, a printed circuit board to be attached to the frame 2 will be described with reference to FIG.
In the figure, a plurality (four in this example) of printed circuit boards 1a are integrally formed on a resin mother board 1 for taking a large number. Each printed circuit board 1a is framed by providing a long hole 4 in the mother board 1, and is connected by connecting portions 5a and 5b.
The elongated hole 4 has a shape along the outer edge portion of the frame 2, and holes 5 c and 5 d are provided in the central portions of the connecting portions 5 a and 5 b, and an easy-to-divide portion for easily dividing the printed board 1 a from the mother board 1. It has become.
Note that the number of holes 5c and 5d is not limited to one, and a plurality of holes 5c and 5d may be provided side by side in the connecting portions 5a and 5b.
[0020]
Here, both ends of the elongated hole 4 having a substantially rectangular shape along the outer edge portion of the frame 2 are bent into a V shape or a reverse V shape toward the inside of the printed circuit board 1a at the short side of the substantially rectangular shape. As a result, the connecting portions 5a and 5b provided between the ends of the two long holes 4 are positioned inside the substantially rectangular shape.
In addition, holes 5c and 5d are provided in the central portions of the connecting portions 5a and 5b, which are easy-to-divide portions for making it easier to split the printed board 1a from the mother board 1.
Therefore, the easy division parts 5 a and 5 b are located inside a substantially rectangular shape formed by the outer edge part of the long hole 4.
[0021]
Next, an operation for attaching the printed circuit board 1a to the frame 2 will be described.
First, the long hole 4 of the mother board 1 is positioned right above the side surfaces 8 a to 8 d of the frame 2, and the upper portions of the side surfaces 8 a to 8 d of the frame 2 are inserted into the long hole 4. The easy-dividing parts (connecting parts) 5a and 5b of the printed circuit board 1a pass through the notches 11a and 11b, respectively, and contact the corners of the end surfaces 6a and 6b of the bent parts 9a and 9b positioned inside the frame 2. The frame 2 is inserted into the long hole 4 until it comes into contact.
FIG. 3 shows a state in which the printed circuit board 1a is attached to the frame 2 in this way. As described above, the easy division parts 5a and 5b are located on the corners of the end faces 6a and 6b of the bent parts 9a and 9b.
[0022]
In the above description, the case where the printed circuit board 1a is attached to one frame 2 has been described. However, an operation of attaching four frames to four printed circuit boards on the mother board 1 at the same time is performed.
[0023]
Next, an operation of breaking the printed board 1a and mounting the printed board 1a in the frame 2 will be described.
FIG. 4 shows a state where the printed circuit board 1 a is attached to the frame 2. In FIG. 4, the printed circuit board 1a is not yet broken. In order to break the printed circuit board 1a, a jig (not shown) is used to apply pressure from above to the outside of the easy-to-divide part 5a. At this time, since the easy-to-separate part 5a is located above the corner of the end surface 6a of the bent part 9a, the easy-to-separate part 5a breaks along the corner of the end surface 6a. Easy to do.
FIG. 5 shows a state in which the printed circuit board 1a is broken in this way.
[0024]
Then, as shown in FIG. 6, the electronic device of the present invention is completed by attaching the upper cover 3a and the lower cover (not shown) having the same shape as the conventional example to the frame 2 to which the printed board 1a is attached. . The upper wall 3b of the upper cover 3a closes the opening 10a on the upper surface of the frame 2, and a plurality of attachment pieces 3c having spring properties that are bent from the ends of the four sides of the upper wall 3b and extend downward are side surfaces 8a of the frame 2. , 8b, 8c, and 8d.
[0025]
Therefore, in the electronic device of the present invention, the end faces 6a and 6b of the bent portions 9a and 9b in the frame 2 and the division easy portions 5a and 5b of the printed circuit board 1a are inside the frame 2, and the easy division portions 5a, The place where 5b is broken is inside the frame 2. Therefore, the jagged cut portion 7 generated on the cut surface of the board when the printed circuit board 1a is broken fits inside the frame 2 and does not protrude outside the frame.
[0026]
Even if the upper cover 3a is placed on the frame 2 as described above, the cut surface of the substrate that protrudes outside the frame as in the conventional substrate does not prevent the frame and the cover from coming into close contact with each other. As shown, the frame 2 and the cover can be closely adhered.
[0027]
Further, since the easy-to-divide parts 5a and 5b are located above the corners of the end faces 6a and 6b of the bent parts 9a and 9b (that is, sharp edges), the corners serve as fulcrums. Since the printed circuit board 1a is cracked, the printed circuit board 1a is easily cracked and the position is constant, so that there is no variation in the position where the circuit board is broken.
[0028]
Another embodiment of the present invention will be described with reference to FIGS.
The frame 12 is the same in material, shape, and size as the frame 2 of the above embodiment except for a portion corresponding to the bent portion 19. The bent portion 19 in the frame 12 is formed as follows.
First, two cuts are made in the bottom side of the cutout portion 14 obtained by cutting a part of the side surface 18 into a substantially rectangular shape so that it can be bent, and that portion is directed toward the inside of the frame 12 with respect to the side surface 18. Bend it to a right angle. Then, a part of the bent portion is bent again upward in the figure to form a substantially L-shaped bent portion 19.
Also in the frame 12, the end surface 16 of the bent portion 19 is inside the frame 12.
[0029]
FIG. 8 shows the frame 12 formed in this way with the same printed circuit board 1a as that of the first embodiment attached thereto by the same method. As illustrated, the easy-to-divide part 5 a of the printed circuit board 1 a is located above the end surface 16 of the bent part 19.
[0030]
When this printed circuit board 1a is divided with the end face 16 of the bent portion 19 as a fulcrum, the cut portion 17 does not protrude outside the frame 12 as shown in FIG. Therefore, the frame 12 and the upper cover can be closely adhered, and the same effect as when the frame 2 is used can be obtained.
[0031]
【The invention's effect】
In the electronic device and the manufacturing method thereof according to the present invention, the frame includes the frame, the printed circuit board that is attached and fixed to the inside of the frame, and the cover that closes the frame. Since the bent portion is formed by bending and the easy-to-divide portion of the printed circuit board is positioned on the end surface of the bent portion, the position where the substrate is split is inside the frame, and the jagged substrate cutting portion is the frame. The cover and the frame are completely brought into close contact with each other when the cover is put on the frame, so that the shield is ensured and the cover can be made difficult to come off.
[0032]
In addition, since the easy-to-divide part is positioned at the corner of the end surface, the corner of the end surface serves as a fulcrum, and the substrate is cracked. It can prevent variation.
[Brief description of the drawings]
FIG. 1 is a perspective view of a frame used in an electronic apparatus of the present invention.
FIG. 2 is a plan view of a mother board provided with a plurality of printed boards used in the electronic apparatus of the present invention.
FIG. 3 is a perspective view of essential parts showing a state in which the mother board is attached to the frame of the electronic apparatus of the invention.
FIG. 4 is a cross-sectional view of the main part showing a state where the mother board is attached to the frame of the electronic apparatus of the present invention.
FIG. 5 is a cross-sectional view of a principal part showing a state where a printed circuit board is cracked in the electronic apparatus of the invention.
FIG. 6 is a cross-sectional view of a principal part showing a state in which a cover is placed on a frame on which a printed circuit board is mounted in the electronic apparatus of the present invention.
FIG. 7 is a perspective view of a frame used in another embodiment of the electronic apparatus of the invention.
8 is a cross-sectional view of a main part showing a state in which a mother board is attached to the frame of FIG. 7;
FIG. 9 is a cross-sectional view of a principal part showing a state in which the printed board of FIG. 8 is cracked.
FIG. 10 is a perspective view of a conventional electronic apparatus.
FIG. 11 is a perspective view of a frame used in a conventional electronic device.
FIG. 12 is a plan view of a mother board provided with a plurality of printed boards used in a conventional electronic apparatus.
FIG. 13 is a perspective view of a principal part showing a state in which a mother board is attached to a frame in a conventional electronic device.
FIG. 14 is a cross-sectional view of a main part showing a state in which a mother board is attached to a frame in a conventional electronic device.
FIG. 15 is a cross-sectional view of a principal part showing a state in which a printed circuit board is broken in a conventional electronic device.
FIG. 16 is a cross-sectional view of a principal part showing a state where a cover is placed on a frame on which a printed circuit board is mounted in a conventional electronic device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Mother board 1a Printed circuit board 2 Frame 3a Upper cover 3b Upper wall 3c Mounting piece 4 Elongate hole 5a, 5b Divided easy part (connecting part)
5c, 5d Holes 6a, 6b End surface 7 Cutting portions 8a, 8b, 8c, 8d Side surface 9a, 9b Bending portion 10a, 10b Opening portion 11a, 11b Notching portion 12 Frame 14 Notching portion 16 End surface 17 Cutting portion 18 Side surface 19 Bending Part 21 Mother board 21a Printed circuit board 22 Frame 23a Upper cover 23b Upper wall 23c Mounting piece 23d Lower cover 23e Lower wall 23f Mounting piece 24 Slots 25a, 25b Easy-to-divide parts (connecting parts)
25c, 25d Hole 26a, 26b End face 27 Cutting part 28a, 28b, 28c, 28d Side face 30a, 30b Opening part 31a, 31b Notch part

Claims (3)

A frame, a printed circuit board attached and fixed to the inside of the frame, and a cover for closing the frame, a part of the side surface of the frame is bent inward to form a bent portion, An electronic apparatus characterized in that is positioned on an end surface of the bent portion. The electronic device according to claim 1, wherein the division easy part of the printed circuit board is positioned at a corner of the end face. A part of the side of the frame is bent inward to form a bent portion, a long hole and an easy-to-divide part are provided in the mother board, the printed board is framed, and the side of the frame is inserted into the long hole An electronic device comprising: an end surface of the bent portion abutting on the easy-to-divide portion; splitting the easy-to-divide portion with the end surface as a fulcrum; attaching the printed circuit board to the frame; Device manufacturing method.

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