JP4215250B2 - Chip-type solid electrolytic capacitor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a chip-type solid electrolytic capacitor and a method for manufacturing the same.

  Conventionally, solid electrolytic capacitors using tantalum, niobium or the like as a valve action metal are small, have a large capacitance, are excellent in frequency characteristics, and are widely used in power supply circuits for CPUs.

  In order to further improve the frequency characteristics, an equivalent series resistance (hereinafter referred to as ESR) is reduced to 1/10 using a conductive polymer for the cathode layer, compared with the one using manganese dioxide for the cathode layer. The following improvements have been developed.

  However, as the operating frequency of the CPU increases, the demand for improving the noise characteristics of the power supply circuit and the demand for increasing the ripple allowable current increase, so that a capacitor having a lower ESR is required. became.

  Since devices equipped with such CPUs are being developed in the direction of miniaturization and high functionality, capacitors that satisfy the requirements for compactness, large capacity, and thinness are required in addition to lowering ESR. It has become.

  For example, in the following Patent Document 1, a manufacturing method of a chip capacitor is disclosed in which a connecting tongue piece formed by bending a substrate mounting portion of an anode terminal is welded to an anode lead wire by laser light. . A cross-sectional view of this chip capacitor is shown in FIG. 201 is a capacitor element, 202 is an anode lead wire, 203 is an anode terminal, 208 is a connecting tongue, and 204 is a cathode terminal. Such a connecting tongue piece connects the anode lead wire and the board mounting portion with the shortest distance, and contributes to the reduction of ESR and the downsizing of the product.

  However, when trying to obtain a high capacity, it is not sufficient to use a single capacitor element. When a multilayer capacitor is formed by connecting a plurality of capacitor elements in parallel, the capacity increases in proportion to the number of capacitors. In addition, the ESR can be reduced in proportion to the inverse of the number.

  For example, in Patent Document 2 below, a plurality of single plate capacitor elements are laminated and fixed on an anode side lead frame with their anode portions aligned in the same direction, and the cathode portion is connected to the cathode tip portion from the anode portion side. A multilayer solid electrolytic capacitor is disclosed in which a conductive adhesive layer is formed on a cathode lead frame in a divergent shape and laminated and fixed, and the periphery thereof is covered and sealed with an exterior resin.

JP 2002-158142 A JP 2000-68158 A

  In the above-mentioned Patent Document 2, a single plate capacitor element having a cathode portion with a thickness larger than that of the cathode base is used as a shape suitable for lamination. A suitable multilayer solid electrolytic capacitor has been obtained. However, in the structure, there is a problem that it is difficult to increase the ratio of the volume of the capacitor element that bears the capacity of the capacitor to the total volume of the product, that is, the volume efficiency.

  In this situation, when a plate-like capacitor element is stacked and connected in parallel, it is easy to realize low ESR as one capacitor element. It is important to realize a highly reliable structure. In addition, shortening the current path between the anode terminal and the cathode terminal in consideration of the skin effect in the high frequency band is important for realizing low ESR, and forming an equivalent current path between different capacitor elements. Further preferred.

  Briefly, an object of the present invention is to provide a chip-type solid electrolytic capacitor having low ESR and high capacity, small size, high volumetric efficiency, and high reliability, and a method for manufacturing the same.

  The first chip-type solid electrolytic capacitor of the present invention is formed by laminating two capacitor elements using a valve metal in a direction perpendicular to the substrate mounting surface, and from the anode body of the capacitor element to the substrate mounting surface. Anode lead wires led in parallel are connected to the anode terminal, a cathode layer on the dielectric oxide film of the anode body is connected to the cathode terminal, and a part of the anode terminal and a part of the cathode terminal are exposed. A chip-type solid electrolytic capacitor covered with resin, wherein the capacitor element is plate-shaped, and the anode lead wire is decentered from a center line parallel to the substrate mounting surface of the capacitor element, and the two capacitors The elements are arranged at symmetrical positions overlapping each other by rotating 180 ° around a straight line parallel to the substrate mounting surface, and the tip of the anode terminal on the anode lead wire side is a slip. First and second branches of substantially the same shape separated by each, each branch forming an anode lead wire of one capacitor element and a weld, and one of the welds is the first branch The branch is provided on a surface opposite to the board mounting side, and the other of the welds is provided on the board mounting side of the second branch.

  The anode lead wire may be led out from the capacitor element eccentrically in a direction parallel to and perpendicular to a substrate mounting surface.

  And the connection part of the said cathode terminal and the cathode layer of the said capacitor | condenser element is good to be provided between two capacitor | condenser elements.

  The second chip-type solid electrolytic capacitor of the present invention is formed by laminating two capacitor elements using a valve metal in a direction perpendicular to the substrate mounting surface, from the anode body of the capacitor element to the substrate mounting surface. The anode lead wire led in parallel is connected to the anode terminal, the cathode layer on the dielectric oxide film of the anode body is connected to the cathode terminal, and a part of the anode terminal and a part of the cathode terminal are exposed. A chip-type solid electrolytic capacitor covered with resin, wherein the capacitor element is plate-shaped, and the anode lead wire is decentered from a center line parallel to the substrate mounting surface of the capacitor element, and the two capacitors The elements are arranged at symmetrical positions where they overlap each other by being rotated by 180 ° around a straight line parallel to the substrate mounting surface, and are cut perpendicular to the anode lead wire at the anode terminal. Each of the first and second branches forming the tip of the T-shape forms an anode lead wire and a welded portion of one capacitor element, and one of the welded portions is the first shape. The first branch is provided on the surface opposite to the substrate mounting side, and the other of the welds is provided on the substrate mounting side surface of the second branch.

  The anode lead wire may be led out from the capacitor element eccentrically in a direction parallel to and perpendicular to a substrate mounting surface.

  And the connection part of the said cathode terminal and the cathode layer of the said capacitor | condenser element is good to be provided between two capacitor | condenser elements.

  The third chip-type solid electrolytic capacitor of the present invention is formed by laminating two capacitor elements using a valve action metal in a direction perpendicular to the substrate mounting surface, and from the anode body of the capacitor element to the substrate mounting surface. The anode lead wire led in parallel is connected to the anode terminal, the cathode layer on the dielectric oxide film of the anode body is connected to the cathode terminal, and a part of the anode terminal and a part of the cathode terminal are exposed. A chip-type solid electrolytic capacitor covered with resin, wherein the capacitor element is plate-shaped, and the anode lead wire is decentered from a center line parallel to the substrate mounting surface of the capacitor element, and the two capacitors The elements are disposed at symmetrical positions that overlap each other by rotation of 180 ° around a straight line parallel to the substrate mounting surface, and the anode terminal has a substantially quadrangular prism shape. In the two side surfaces are parallel to the straight and anode lead, characterized in that it is welded to the anode lead.

  And the connection part of the said cathode terminal and the cathode layer of the said capacitor | condenser element is good to be provided between two capacitor | condenser elements.

  The fourth chip-type solid electrolytic capacitor of the present invention is formed by laminating three capacitor elements using a valve metal in a direction perpendicular to the substrate mounting surface, from the anode body of the capacitor element to the substrate mounting surface. The anode lead wire led in parallel is connected to the anode terminal, the cathode layer on the dielectric oxide film of the anode body is connected to the cathode terminal, and a part of the anode terminal and a part of the cathode terminal are exposed. A chip-type solid electrolytic capacitor packaged with a resin, wherein the capacitor elements are plate-shaped, and anode lead wires in two of the capacitor elements are eccentric from a center line parallel to the substrate mounting surface. The anode terminal has a substantially quadrangular prism shape, and has two side surfaces perpendicular to the substrate mounting surface and parallel to the anode lead wire, and an upper surface parallel to the substrate mounting surface. Characterized in that it is welded to the lead wire.

  The cathode terminal has two branches, the first branch is connected to the cathode layer between the first and second capacitor elements, and the second branch is the second and third capacitor elements. It is good to connect with a cathode layer in between.

  Further, the anode terminal has a notch so that the width and height of the fillet forming surface, which is the exposed surface of the anode terminal and the cathode terminal on the product side surface, are substantially equal on the anode terminal side and the cathode terminal side. It is good to be provided.

  In addition, the manufacturing method of the chip type solid electrolytic capacitor of the present invention includes two capacitor elements in which an anode lead wire is led out from an anode body made of a valve metal and a cathode layer is formed on a dielectric oxide film of the anode body. Is a method of manufacturing a chip-type solid electrolytic capacitor that is laminated in a direction perpendicular to the substrate mounting surface and electrically connected in parallel, and the step of producing a capacitor element by decentering the anode lead wire, A step of forming first and second anode terminal tips on the anode terminal connected to the anode lead wire, and the two capacitor elements are laminated so that the anode lead wires are in a rotationally symmetric position, Welding the first anode lead wire to the upper side of the first anode terminal tip and welding the second anode lead wire to the lower side of the second anode terminal tip; Part of and And exposing a portion of the terminal, characterized in that it comprises a step of performing molding.

  Next, the operation of the present invention will be described.

  In the chip-type solid electrolytic capacitor of the first configuration of the present invention, the tip of the anode terminal on the anode lead wire side includes first and second branches having substantially the same shape and separated by a slit. Welded to the first anode lead at the top of the branch and welded to the second anode lead at the bottom of the second branch, so that the two welds are separated and close in distance Even when the two anode lead wires are welded to the anode terminal, there is no interference between the two nuggets (penetrating portions), and the welding strength does not vary.

  In addition, when the anode lead wire is welded to the upper and lower surfaces of the two branches of the anode terminal, the welded portion is formed in a symmetrical structure rotated by 180 ° and disposed between the two capacitor elements. In combination with this connection structure, the current paths are formed equally for the two capacitor elements, so that the ESR characteristics are substantially equal.

  In addition, by adjusting the thickness of the two branches at the tip of the anode terminal, the difference in height between the two anode lead wires that occurs when the plate-shaped capacitor elements are stacked together is determined by the appropriate welding strength during welding. Can be adjusted to the height required to obtain.

  Further, after the resin molding, the anode terminal and the cathode terminal are not formed, that is, the outer resin is not bent along the side surface and the bottom surface of the exterior resin. Or since the exposed surface of a cathode terminal can be made into the same surface, it contributes to size reduction.

  And since the welding part with the anode lead wire in the front-end | tip part of an anode terminal and the bottom face which is a board | substrate mounting part were connected by short distance, it contributes to low ESR.

  Further, in the chip type solid electrolytic capacitor of the second configuration of the present invention, a T-shaped anode terminal is used, and an anode lead wire is welded to each of the two T-shaped tip portions, so that connection reliability is high. There is no variation in ESR characteristics.

  Further, in the chip-type solid electrolytic capacitor of the third configuration of the present invention, a substantially quadrangular columnar anode terminal is used, and on the opposite side surface, it is connected to the anode lead wire, so that the connection reliability is high, There is no variation in ESR characteristics.

  Further, in the chip type solid electrolytic capacitor of the fourth configuration of the present invention, a substantially quadrangular prism-shaped anode terminal is used and connected to the anode lead wire on the two opposite side surfaces and the upper surface thereof. The capacity is high by connecting three capacitor elements in parallel.

  Furthermore, in the chip-type solid electrolytic capacitor of the present invention, when a notch is provided in the upper part of the side surface of the anode terminal, the fillet forming surface can be made the same shape on the anode side and the cathode side. The inclination from the board mounting surface can be suppressed.

  As already described in the section of operation, according to the present invention, it is possible to provide a chip-type solid electrolytic capacitor having a low ESR, a high capacity, a small size and good volume efficiency, and a method for manufacturing the same.

  Further, according to the present invention, there is no interference between the welded portions in the anode connecting portion, and as a result, there is little variation in electrical characteristics for each capacitor element, and the chip-type solid electrolytic capacitor excellent in connection reliability and a method for manufacturing the same Can be provided.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 shows a chip-type solid electrolytic capacitor of the present invention. FIG. 1A is a cross-sectional view seen from the front, and is based on the BB cross section indicated in FIG. 1B is a cross-sectional view taken along the line AA indicated in FIG. 1A, and FIG. 1C is a side view. In the sectional view of the present specification, the portion on the other side of the section is drawn as if the exterior resin 17 is transparent.

  In FIG. 1, 11a is a first capacitor element, 11b is a second capacitor element, 12a is a first anode lead wire, 12b is a second anode lead wire, 13 is an anode terminal, 14 is a cathode terminal, and 17 Is an exterior resin.

  FIG. 2 is a perspective view showing the chip-type solid electrolytic capacitor of the present invention. The outer shape of the exterior resin 17 is drawn with a dotted line, and a part of the cathode terminal 14 and a part of the second anode lead wire 12b are broken lines. It is drawn.

  FIG. 3 is a perspective view showing terminals in the chip-type solid electrolytic capacitor of the present invention. FIG. 3 (a) shows an anode terminal and FIG. 3 (b) shows a cathode terminal.

First, the fabrication of the capacitor element will be briefly described because it is a known technique. Tantalum, niobium, aluminum, titanium or the like can be used as the valve action metal. Further, a solid electrolyte such as MnO ₂ or a conductive polymer such as polythiophene or polypyrrole can be used for the cathode layer. Moreover, ESR in a high frequency band can be reduced by making the capacitor element into a thin plate-like pellet. Further, the anode lead wire is led out of the center line of the capacitor element.

  Next, a process of stacking capacitor elements and connecting them to terminals will be described. As shown in FIG. 3, the anode terminal 13 is formed with a first branch 18 a and a second branch 18 b separated by the slit 39. Further, as shown in FIG. 2, the anode lead wire 12a of the first capacitor element 11a is led out of the center position in a direction parallel to the bottom surface, and the anode lead wire 12b of the second capacitor element 11b is also located at the center position. Are decentered in a direction parallel to the bottom surface. The two capacitor elements are produced as capacitor elements having the same shape, and are arranged so that the eccentric directions are reversed by rotating 180 ° during lamination.

  With this shape, as shown in FIGS. 1 and 2, welding is performed with the first anode lead wire 12a on the upper surface of the first branch 18a, and the second anode is formed on the lower surface of the second branch 18b. Welding with the lead wire 12b is performed. Because of this connection structure, the welded portions at the time of welding do not interfere with each other, and the welded portion is further separated by the slit 39, so that interference effects such as thermal influence and deformation can be avoided.

  On the other hand, the cathode terminal 14 has an L shape as shown in FIG. 3B, and the tip is thinned by crushing or the like. Then, as shown in FIG. 1 and FIG. 2, the tip portion is disposed between the first capacitor element 11a and the second capacitor element 11b, and is connected to the two cathode layers by a conductive adhesive or the like.

  Here, when the path of the high-frequency current is compared with respect to the two capacitor elements, the symmetrical structure is overlapped between the anode welded portion and the cathode connecting portion by 180 ° rotation around the central straight line between the two capacitor elements. Is realized. Thus, equal ESR is provided for the two capacitor elements.

  Further, as shown in FIG. 3, the anode terminal 13 is provided with a notch 16 at the outer edge of the upper surface. This is because when a mold is formed with an exterior resin while leaving a part of the anode terminal and a part of the cathode terminal, the height of the exposed part of the anode terminal formed on the side surface of the product is set as the fillet forming surface. This is because the height is adjusted to the height of the exposed portion. Further, as a result of making the widths of the anode terminal 13 and the cathode terminal 14 equal, a fillet forming surface having the same shape is produced on the anode side and the cathode side. Will not be implemented.

  Next, embodiments of the present invention will be described with reference to the drawings. Since the chip-type solid electrolytic capacitor according to the first embodiment of the present invention has the same structure as that already described in the best mode for carrying out the present invention, it will be described with reference to FIGS.

First, production of a capacitor element will be described. A tantalum powder was molded around a tantalum wire with a press machine and sintered at high vacuum and high temperature. Next, an oxide film of Ta ₂ O ₅ is formed on the surface of the tantalum metal powder. Furthermore, it was immersed in manganese nitrate and then thermally decomposed to form MnO ₂ , and subsequently a cathode layer made of graphite and Ag was formed to obtain a capacitor element. At this time, by reducing the shape of the capacitor element to a thin plate-like pellet, the ESR of the capacitor element alone in the high frequency band was reduced. Further, the anode lead wire was led out from the center of the capacitor element.

  Next, a process of stacking capacitor elements and connecting them to terminals will be described. As shown in FIG. 3, the anode terminal 13 was provided with a slit 39 at the center, and the first branch 18a and the second branch 18b were formed on both sides thereof. Further, as shown in FIG. 2, the anode lead wire 12a of the first capacitor element 11a is led out of the center position in a direction parallel to the bottom surface, and the anode lead wire 12b of the second capacitor element 11b is also located at the center position. Are decentered in a direction parallel to the bottom surface. The two capacitor elements were produced as capacitor elements having the same shape, and were arranged so that the eccentric directions were reversed by rotating 180 ° during lamination.

  Subsequently, as shown in FIGS. 1 and 2, welding is performed with the first anode lead wire 12a on the upper surface of the first branch 18a, and the second anode lead wire is performed on the lower surface of the second branch 18b. Welding with 12b was performed. Because of this connection structure, the melted portions at the time of welding do not interfere with each other, and the welded portion is separated by the slit 39, so that interference effects such as thermal influence and deformation can be avoided. .

  On the other hand, the cathode terminal 14 has an L shape as shown in FIG. 3B, and the tip is thinned by crushing. Then, as shown in FIG. 1 and FIG. 2, the tip portion was disposed between the first capacitor element 11a and the second capacitor element 11b, and connected to the two cathode layers by a conductive adhesive.

  Due to such a symmetrical connection structure, equal ESR characteristics could be obtained for the two capacitor elements.

  Further, as shown in FIG. 3, the anode terminal 13 is provided with a notch 16 at the outer edge of the upper surface. This is because when the outer resin is molded while leaving a part of the anode terminal and a part of the cathode terminal, the height of the exposed portion of the anode terminal formed on the side surface is set as the fillet forming surface. This is to match the height of the exposed part. At the same time, as a result of making the widths of the anode terminal 13 and the cathode terminal 14 equal, the same shape fillet forming surface is formed on the anode side and the cathode side, and it is easy to keep the chip mounting posture correctly in the soldering process at the time of mounting. became.

  4 shows a chip-type solid electrolytic capacitor according to Example 2 of the present invention, FIG. 4 (a) is a DD sectional view as seen from the front, and FIG. 4 (b) is a CC sectional view. FIG. 4 (c) is a side view.

  In FIG. 4, 41a is a first capacitor element, 41b is a second capacitor element, 42a is a first anode lead wire, 42b is a second anode lead wire, and 43 is an anode terminal.

  FIG. 5 is a perspective view showing the capacitor element according to the second embodiment. FIG. 5A is a perspective view showing the first capacitor element, and FIG. 5B is a perspective view showing the second capacitor element. FIG.

  In the second embodiment, as shown in FIG. 5, the anode lead wires 42a and 42b of the first and second capacitor elements 41a and 41b are not only in the direction parallel to the bottom surface of the plate pellet but also perpendicular to the bottom surface. The direction is also eccentric. As a result, the thickness of the first branch 48a and the second branch 48b of the anode terminal 43 can be made thinner than in the first embodiment. Other constituent members are the same as those in the first embodiment, and common members are denoted by common reference numerals.

  Thus, if the branches 48a and 48b of the anode terminal 43 are thinned, the difference in length in the path of the two high-frequency currents from the substrate mounting portion of the anode terminal 43 to the anode lead wires 42a and 42b can be reduced. . Therefore, the difference in ESR value can be reduced for the two capacitor elements.

  The point that the current path is vertically symmetrical between the anode weld and the cathode connection is the same as in Example 1. Further, the first and second capacitor elements have the same shape, and the first and second capacitor elements are also common to the first embodiment in that they are stacked so as to overlap each other by 180 ° rotation.

  6 shows a chip-type solid electrolytic capacitor according to Example 3 of the present invention. FIG. 6 (a) is a cross-sectional view taken along the line FF as viewed from the front, and FIG. 6 (b) is a cross-sectional view taken along the line EE. FIG. 6C is a side view.

  FIG. 7 is a perspective view showing the chip-type solid electrolytic capacitor according to the third embodiment.

  FIG. 8 shows components of the third embodiment. FIG. 8A is a perspective view showing the first capacitor element, FIG. 8B is a perspective view showing the second capacitor element, and FIG. c) is a perspective view showing an anode terminal.

  In FIG. 6, 61a is a first capacitor element, 61b is a second capacitor element, 62a is a first anode lead wire, 62b is a second anode lead wire, and 63 is an anode terminal.

  Further, as shown in FIG. 8C, the anode terminal 63 has a T-shape and has a first T-shaped tip portion 68a and a second T-shaped tip portion 68b.

  Further, the anode lead wires 62a and 62b in the capacitor elements 61a and 61b used in the third embodiment are eccentric in a direction parallel to the bottom surface of the plate-like pellet.

  In the third embodiment, a welded portion with the first anode lead wire is formed on the upper surface of the first T-shaped tip portion 68a, and the second anode lead is formed on the lower surface of the second T-shaped tip portion 68b. A weld with the wire is formed. Therefore, since the two welds are at different positions on different surfaces, there is no interference during welding, and at the same time, a symmetrical structure that overlaps with a 180 ° rotation around the central line located between the two capacitor elements. None, a highly reliable anode connection.

  The connection structure between the cathode terminal 14 and the first and second capacitor elements 61a and 61b is the same as in the first and second embodiments.

  When such a T-shaped anode terminal is used, the ESR value can be reduced because the mounting portion on the substrate and the anode lead wire are connected at a short distance.

  9 shows a chip-type solid electrolytic capacitor according to Example 4 of the present invention. FIG. 9A is a cross-sectional view taken along the line HH as viewed from the front, and FIG. 6B is a cross-sectional view taken along the line GG. FIG. 6C is a side view.

  In Example 4, as shown in FIG. 9, the anode lead wires 92a and 92b of the first and second capacitor elements 91a and 91b are not only in the direction parallel to the bottom surface of the plate-like pellet but also perpendicular to the bottom surface. The direction is also eccentric. As a result, the thickness of the first T-shaped tip portion 98a and the second T-shaped tip portion 98b of the anode terminal 93 can be made thinner than in the case of the third embodiment. Other constituent members are the same as those in the third embodiment, and common members are denoted by common reference numerals.

  Thus, when the T-shaped tip portions 98a and 98b of the anode terminal 93 are thinned, the difference in the passing distance is reduced with respect to two high-frequency currents from the substrate mounting portion of the anode terminal 93 to the anode lead wires 92a and 92b. be able to. Therefore, the difference in ESR value can be reduced for the two capacitor elements. Other effects are the same as those in the third embodiment.

  FIG. 10 shows a chip-type solid electrolytic capacitor in Example 5 of the present invention. 10A is a schematic view seen from the front, FIG. 10B is a JJ sectional view, and FIG. 10C is a side view.

  In FIG. 10, 101a is a first capacitor element, 101b is a second capacitor element, 102a is a first anode lead wire, 102b is a second anode lead wire, and 103 is an anode terminal.

  FIG. 11 is a perspective view showing the chip-type solid electrolytic capacitor according to the fifth embodiment.

  In the fifth embodiment, a substantially quadrangular prism-shaped anode terminal 103 is used, and a notch 106 is provided on the upper portion of one side surface thereof. Further, the anode lead wire 102a in the first capacitor element 101a and the anode lead wire 102b in the second capacitor element 101b are eccentric in a direction parallel to the bottom surface of the plate-like pellet.

  In the fifth embodiment, since the welded portion with the anode lead wire 102a or 102b is formed on the opposing side surface of the quadrangular columnar anode terminal 103, there is no interference during welding. Further, the cathode terminal 14 is the same as in the first to third embodiments, and the current path between the anode welded portion and the cathode connecting portion is equal to the upper and lower capacitor elements.

  Further, since the notch 106 is formed on the upper side surface on the outer side of the anode terminal 103, the fillet forming surface can have the same shape on the anode side and the cathode side, and the tilt of the chip during mounting can be suppressed.

  FIG. 12 shows a chip-type solid electrolytic capacitor in Example 6 of the present invention. 12A is a schematic view seen from the front, FIG. 12B is a KK sectional view, and FIG. 10C is a side view.

  In FIG. 12, 121a is a first capacitor element, 121b is a second capacitor element, 121c is a third capacitor element, 122a is a first anode lead wire, 122b is a second anode lead wire, and 122c is a third capacitor element. , And 123 is an anode terminal.

  FIG. 13 is a perspective view showing the chip-type solid electrolytic capacitor according to the sixth embodiment.

  In the sixth embodiment, the anode terminal 123 having a substantially quadrangular prism shape is used, the anode lead wire 122a in the first capacitor element 121a is not eccentric, the anode lead wire 122b in the second capacitor element 121b, and the third The anode lead wire 122c in the capacitor element 121c is eccentric in a direction parallel to the bottom surface of the plate-like pellet.

  Since the welded portion with the anode lead wires 122a, 122b or 122c is formed on the upper surface of the quadrangular columnar anode terminal 123 and the two opposing side surfaces using the member having such a shape, there is no interference during welding. Further, the cathode terminal 124 has two connecting portions at the tip, and the cathode terminal 124 is connected between the first and second capacitor elements 121a and 121b and between the second and third capacitor elements 121b and 121c, respectively. Connected with layer.

  In the embodiments described so far, the fillet forming surfaces have the same shape on the anode side and the cathode side, and the inclination of the chip at the time of mounting can be suppressed. However, the chip size or the terminal size hardly causes the inclination. In some cases, different shapes are possible.

The figure which shows the chip-type solid electrolytic capacitor of this invention. 1A is a cross-sectional view along BB, FIG. 1B is a cross-sectional view along AA, and FIG. 1C is a side view. The perspective view of the chip type solid electrolytic capacitor of the present invention. The perspective view which shows the terminal in the chip type solid electrolytic capacitor of this invention. FIG. 3A shows an anode terminal, and FIG. 3B shows a cathode terminal. FIG. 4 is a diagram showing a chip-type solid electrolytic capacitor of Example 2. 4A is a DD sectional view from the front, FIG. 4B is a CC sectional view, and FIG. 4C is a side view. FIG. 6 shows a capacitor element in Example 2. FIG. 5A is a perspective view showing the first capacitor element, and FIG. 5B is a perspective view showing the second capacitor element. FIG. 6 is a diagram showing a chip-type solid electrolytic capacitor in Example 3. Fig.6 (a) is FF sectional drawing from the front. 6B is a cross-sectional view taken along line EE, and FIG. 6C is a side view. FIG. 6 is a perspective view showing a chip-type solid electrolytic capacitor of Example 3. FIG. 10 is a diagram illustrating constituent members of Example 3. 8A is a perspective view showing the first capacitor element, FIG. 8B is a perspective view showing the second capacitor element, and FIG. 8C is a perspective view showing the anode terminal. FIG. 6 is a diagram showing a chip-type solid electrolytic capacitor in Example 4. 9A is a HH cross-sectional view from the front, FIG. 6B is a GG cross-sectional view, and FIG. 6C is a side view. FIG. 6 is a diagram showing a chip-type solid electrolytic capacitor in Example 5. 10A is a schematic view from the front, FIG. 10B is a JJ sectional view, and FIG. 10C is a side view. FIG. 10 is a perspective view of a chip-type solid electrolytic capacitor of Example 5. FIG. 10 is a diagram showing a chip-type solid electrolytic capacitor of Example 6. 12A is a schematic view from the front, FIG. 12B is a KK sectional view, and FIG. 10C is a side view. FIG. 10 is a perspective view of a chip-type solid electrolytic capacitor according to Example 6. Sectional drawing of the conventional chip-type solid electrolytic capacitor.

Explanation of symbols

11a, 11b, 41a, 41b, 61a, 61b, 91a, 91b, 101a, 101b, 121a, 121b, 121c Capacitor elements 12a, 12b, 42a, 42b, 62a, 62b, 92a, 92b, 102a, 102b, 122a, 122b 122c Anode lead wire 13, 43, 63, 93, 103, 123 Anode terminal 14, 124 Cathode terminal 16, 106 Notch 17 Exterior resin 18a, 18b, 48a, 48b Branch 39 Slit 68a, 68b, 98a, 98b T-shaped tip

Claims (12)

  Two capacitor elements using valve action metal are stacked in a direction perpendicular to the substrate mounting surface, and an anode lead wire led out substantially parallel to the substrate mounting surface from the anode body of the capacitor element is connected to the anode terminal A chip-type solid electrolytic capacitor in which a cathode layer on the dielectric oxide film of the anode body is connected to a cathode terminal, and a part of the anode terminal and a part of the cathode terminal are exposed and covered with a resin. The capacitor element is plate-shaped, the anode lead wire is led out of a center line parallel to the substrate mounting surface of the capacitor element, and the two capacitor elements are arranged around a straight line parallel to the substrate mounting surface. The tip of the anode terminal on the anode lead wire side is arranged at symmetrical positions overlapping each other by rotation of 180 °, and the first and second branches having substantially the same shape separated by a slit. Each branch forms an anode lead wire and a welded portion of one capacitor element, and one of the welded portions is provided on a surface of the first branch opposite to the substrate mounting side, The other of the parts is provided on the surface of the second branch on the substrate mounting side.   2. The chip-type solid electrolytic capacitor according to claim 1, wherein the anode lead wire is led out from the capacitor element in an eccentric manner in a direction parallel to and perpendicular to a substrate mounting surface.   3. The chip-type solid electrolytic capacitor according to claim 1, wherein a connecting portion between the cathode terminal and the cathode layer of the capacitor element is provided between two capacitor elements.   Two capacitor elements using valve action metal are stacked in a direction perpendicular to the substrate mounting surface, and an anode lead wire led out substantially parallel to the substrate mounting surface from the anode body of the capacitor element is connected to the anode terminal A chip-type solid electrolytic capacitor in which a cathode layer on the dielectric oxide film of the anode body is connected to a cathode terminal, and a part of the anode terminal and a part of the cathode terminal are exposed and covered with a resin. The capacitor element is plate-shaped, the anode lead wire is led out of a center line parallel to the substrate mounting surface of the capacitor element, and the two capacitor elements are arranged around a straight line parallel to the substrate mounting surface. It is disposed at symmetrical positions overlapping each other by rotating 180 °, and the shape of the cross section perpendicular to the anode lead wire in the anode terminal is T-shaped, and the tip of the T-shape is Each of the first and second branches forms an anode lead wire of one capacitor element and a welded portion, and one of the welded portions is on a surface opposite to the board mounting side in the first branch. A chip-type solid electrolytic capacitor, wherein the other of the welded portions is provided on a surface of the second branch on the substrate mounting side.   5. The chip-type solid electrolytic capacitor according to claim 4, wherein the anode lead wire is led out from the capacitor element while being eccentric in a direction parallel to and perpendicular to a substrate mounting surface.   6. The chip-type solid electrolytic capacitor according to claim 4, wherein a connection portion between the cathode terminal and the cathode layer of the capacitor element is provided between two capacitor elements.   Two capacitor elements using valve action metal are stacked in a direction perpendicular to the substrate mounting surface, and an anode lead wire led out substantially parallel to the substrate mounting surface from the anode body of the capacitor element is connected to the anode terminal A chip-type solid electrolytic capacitor in which a cathode layer on the dielectric oxide film of the anode body is connected to a cathode terminal, and a part of the anode terminal and a part of the cathode terminal are exposed and covered with a resin. The capacitor element is plate-shaped, the anode lead wire is led out of a center line parallel to the substrate mounting surface of the capacitor element, and the two capacitor elements are arranged around a straight line parallel to the substrate mounting surface. Arranged at symmetrical positions overlapping each other by rotating 180 °, the anode terminal has a substantially quadrangular prism shape, and is formed on two side surfaces that are perpendicular to the substrate mounting surface and parallel to the anode lead wire. There are, chip-type solid electrolytic capacitor characterized in that welded to the anode lead.   8. The chip-type solid electrolytic capacitor according to claim 7, wherein a connection portion between the cathode terminal and the cathode layer of the capacitor element is provided between two capacitor elements.   Three capacitor elements using valve action metal are stacked in a direction perpendicular to the substrate mounting surface, and an anode lead wire led out substantially parallel to the substrate mounting surface from the anode body of the capacitor element is connected to the anode terminal A chip-type solid electrolytic capacitor in which a cathode layer on the dielectric oxide film of the anode body is connected to a cathode terminal, and a part of the anode terminal and a part of the cathode terminal are exposed and covered with a resin. The capacitor element is plate-shaped, and anode lead wires in two of the capacitor elements are led out from the capacitor element eccentric from a center line parallel to the substrate mounting surface, and the anode terminal is substantially quadrangular prism-shaped. A chip that is welded to the anode lead wire on two side surfaces that are perpendicular to the substrate mounting surface and parallel to the anode lead wire, and an upper surface parallel to the substrate mounting surface. Solid electrolytic capacitor.   The cathode terminal has two branches, the first branch is connected to the cathode layer between the first and second capacitor elements, and the second branch is between the second and third capacitor elements. The chip-type solid electrolytic capacitor according to claim 9, wherein the chip-type solid electrolytic capacitor is connected to a cathode layer.   The anode terminal is provided with a notch so that the width and height of the fillet forming surface that is the exposed surface of the anode terminal and the cathode terminal on the product side surface are substantially equal on the anode terminal side and the cathode terminal side. The chip-type solid electrolytic capacitor according to any one of claims 1 to 10, wherein   An anode lead wire is led out from the anode body made of a valve metal, and on the other hand, two capacitor elements each having a cathode layer formed on a dielectric oxide film of the anode body are stacked in a direction perpendicular to the substrate mounting surface and arranged in parallel. A method of manufacturing a chip-type solid electrolytic capacitor that is electrically connected to an anode lead wire, and a step of producing a capacitor element by decentering the anode lead wire; and an anode terminal connected to the anode lead wire; Forming the two anode terminal tips, and laminating the two capacitor elements so that the anode leads are in rotationally symmetric positions, and the first anode lead is connected to the first anode terminal tip. And welding the second anode lead wire to the lower side of the tip of the second anode terminal, and the exterior resin to expose a part of the anode terminal and a part of the cathode terminal. Including the step of Method for manufacturing a chip type solid electrolytic capacitor according to claim.

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