JP4173915B2 - 静電容量型間隙測定装置 - Google Patents
静電容量型間隙測定装置 Download PDFInfo
- Publication number
- JP4173915B2 JP4173915B2 JP52909697A JP52909697A JP4173915B2 JP 4173915 B2 JP4173915 B2 JP 4173915B2 JP 52909697 A JP52909697 A JP 52909697A JP 52909697 A JP52909697 A JP 52909697A JP 4173915 B2 JP4173915 B2 JP 4173915B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- layer
- shielding material
- insulator
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 40
- 239000000919 ceramic Substances 0.000 claims description 22
- 239000012212 insulator Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 238000000151 deposition Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 238000007740 vapor deposition Methods 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 6
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- 229910052752 metalloid Inorganic materials 0.000 claims description 2
- 150000002738 metalloids Chemical class 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 239000000523 sample Substances 0.000 description 62
- 239000010410 layer Substances 0.000 description 37
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052809 inorganic oxide Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- FIPWRIJSWJWJAI-UHFFFAOYSA-N Butyl carbitol 6-propylpiperonyl ether Chemical compound C1=C(CCC)C(COCCOCCOCCCC)=CC2=C1OCO2 FIPWRIJSWJWJAI-UHFFFAOYSA-N 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- HHFAWKCIHAUFRX-UHFFFAOYSA-N ethoxide Chemical compound CC[O-] HHFAWKCIHAUFRX-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910003455 mixed metal oxide Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- 238000002294 plasma sputter deposition Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/615,372 US5760593A (en) | 1996-02-14 | 1996-02-14 | Gap measurement device |
| US08/615,372 | 1996-02-14 | ||
| PCT/GB1997/000403 WO1997030326A1 (en) | 1996-02-14 | 1997-02-13 | Capacitive gap measurement device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000504836A JP2000504836A (ja) | 2000-04-18 |
| JP2000504836A5 JP2000504836A5 (enExample) | 2004-11-18 |
| JP4173915B2 true JP4173915B2 (ja) | 2008-10-29 |
Family
ID=24465075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52909697A Expired - Fee Related JP4173915B2 (ja) | 1996-02-14 | 1997-02-13 | 静電容量型間隙測定装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5760593A (enExample) |
| EP (1) | EP0880672B1 (enExample) |
| JP (1) | JP4173915B2 (enExample) |
| AU (1) | AU1801197A (enExample) |
| CA (1) | CA2244886C (enExample) |
| DE (1) | DE69715156T2 (enExample) |
| WO (1) | WO1997030326A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2750489B1 (fr) * | 1996-06-26 | 1998-08-28 | Philips Electronics Nv | Dispositif du type capteur capacitif composite |
| WO1998049427A1 (de) * | 1997-04-28 | 1998-11-05 | Siemens Aktiengesellschaft | Vorrichtung zur wärmeisolierung für eine dampfturbine |
| FR2811422B1 (fr) * | 2000-07-06 | 2002-08-30 | Snecma Moteurs | Capteur de mesure de jeux par abrasion multiprofondeur |
| US6400162B1 (en) * | 2000-07-21 | 2002-06-04 | Ade Corporation | Capacitive displacement sensor for measuring thin targets |
| US6575011B1 (en) | 2001-04-19 | 2003-06-10 | The United States Of America As Represented By The Secretary Of The Navy | Blade tip clearance probe and method for measuring blade tip clearance |
| US7618712B2 (en) * | 2002-09-23 | 2009-11-17 | Siemens Energy, Inc. | Apparatus and method of detecting wear in an abradable coating system |
| US8151623B2 (en) | 2002-09-23 | 2012-04-10 | Siemens Energy, Inc. | Sensor for quantifying widening reduction wear on a surface |
| US7582359B2 (en) * | 2002-09-23 | 2009-09-01 | Siemens Energy, Inc. | Apparatus and method of monitoring operating parameters of a gas turbine |
| GB2406381B (en) * | 2003-09-27 | 2005-10-12 | Future Technology | Sensors |
| US8742944B2 (en) * | 2004-06-21 | 2014-06-03 | Siemens Energy, Inc. | Apparatus and method of monitoring operating parameters of a gas turbine |
| US7511516B2 (en) * | 2006-06-13 | 2009-03-31 | General Electric Company | Methods and systems for monitoring the displacement of turbine blades |
| GB2449709A (en) * | 2007-06-02 | 2008-12-03 | Rolls Royce Plc | Method and apparatus for determining a clearance between relatively movable components |
| DE102008006833A1 (de) * | 2008-01-30 | 2009-08-06 | Mtu Aero Engines Gmbh | Sonde für eine kapazitive Sensoreinrichtung und Spaltmesssystem |
| US8344741B2 (en) * | 2008-10-16 | 2013-01-01 | General Electric Company | Systems, methods, and apparatus for monitoring clearance in a rotary machine |
| US8056606B2 (en) | 2009-10-26 | 2011-11-15 | General Electric Company | Methods of making and using ceramic metallic interlocked components |
| US8571813B2 (en) * | 2010-03-16 | 2013-10-29 | Siemens Energy, Inc. | Fiber optic sensor system for detecting surface wear |
| EP2442077A1 (en) * | 2010-10-12 | 2012-04-18 | Future Technology (Sensors) Ltd | Sensor assemblies |
| US9279336B2 (en) * | 2012-09-05 | 2016-03-08 | United Technologies Corporation | High temperature split-face probe |
| US9417048B2 (en) | 2012-10-31 | 2016-08-16 | General Electric Company | Capacitive sensor device and method of manufacture |
| CN105982650B (zh) | 2015-03-04 | 2019-02-15 | 百略医学科技股份有限公司 | 红外线温度计 |
| GB2544751B (en) * | 2015-11-24 | 2017-11-22 | Future Tech (Sensors) Ltd | Multi-Layer Electrically Conductive Sensors |
| US10619998B2 (en) * | 2016-05-26 | 2020-04-14 | Rolls-Royce Corporation | Method of measuring clearance between rotating and static components |
| US10551220B2 (en) | 2016-06-27 | 2020-02-04 | Rolls-Royce Corporation | Capacitive measurement device |
| GB2566053A (en) | 2017-08-31 | 2019-03-06 | Weston Aerospace Ltd | Sensor and method of manufacturing same |
| US10641595B2 (en) * | 2018-04-09 | 2020-05-05 | United Technologies Corporation | Low profile triaxial blade tip clearance probe assembly with driven guard |
| GB2579671B (en) * | 2018-12-12 | 2022-12-14 | Weston Aerospace Ltd | A probe for monitoring a moving engine element |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3706919A (en) * | 1970-08-17 | 1972-12-19 | Ade Corp | Capacitive gauge |
| JPS5735320A (en) * | 1980-08-11 | 1982-02-25 | Telmec Co Ltd | Structure of mask for baking of semiconductor integrated circuit |
| GB2131176B (en) * | 1982-10-07 | 1986-02-19 | Rolls Royce | Method of manufacturing a capacitance distance measuring probe |
| JPS6020552A (ja) * | 1983-07-14 | 1985-02-01 | Seiko Epson Corp | 半導体装置 |
| JPS6425555A (en) * | 1987-07-22 | 1989-01-27 | Matsushita Electronics Corp | Trench forming method |
| JPH0437106A (ja) * | 1990-06-01 | 1992-02-07 | Matsushita Electric Ind Co Ltd | 薄膜コンデンサ |
| EP0657718B1 (en) * | 1993-12-07 | 1998-08-26 | Matsushita Electric Industrial Co., Ltd. | Capacitance sensor and method of manufacturing the same |
-
1996
- 1996-02-14 US US08/615,372 patent/US5760593A/en not_active Expired - Lifetime
-
1997
- 1997-02-13 JP JP52909697A patent/JP4173915B2/ja not_active Expired - Fee Related
- 1997-02-13 DE DE69715156T patent/DE69715156T2/de not_active Expired - Lifetime
- 1997-02-13 EP EP97903454A patent/EP0880672B1/en not_active Expired - Lifetime
- 1997-02-13 AU AU18011/97A patent/AU1801197A/en not_active Abandoned
- 1997-02-13 CA CA002244886A patent/CA2244886C/en not_active Expired - Fee Related
- 1997-02-13 WO PCT/GB1997/000403 patent/WO1997030326A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP0880672B1 (en) | 2002-09-04 |
| EP0880672A1 (en) | 1998-12-02 |
| WO1997030326A1 (en) | 1997-08-21 |
| JP2000504836A (ja) | 2000-04-18 |
| CA2244886C (en) | 2005-12-20 |
| AU1801197A (en) | 1997-09-02 |
| DE69715156T2 (de) | 2003-04-17 |
| DE69715156D1 (de) | 2002-10-10 |
| CA2244886A1 (en) | 1997-08-21 |
| US5760593A (en) | 1998-06-02 |
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