JP4172485B2 - Electronic component mounting structure - Google Patents

Description

According to the present invention, a first electronic component (for example, a transistor) and a second electronic component are arranged close to each other on a substrate, and a hole for inserting a terminal of the first electronic component is formed with respect to the second electronic component. The present invention relates to a mounting structure of an electronic component that is formed in a facing direction and is mounted on the substrate by inserting a terminal of the first electronic component into a hole in the substrate, and in particular, the first electronic component is oriented 90 degrees The electronic component mounting structure is configured so that the first electronic component does not come into contact with the second electronic component in the same direction as the second electronic component.

  In the conventional electronic component mounting structure, as shown in FIG. 3A, the three holes 103a of the substrate 103 on which the three terminals 102 of the transistor 101, which is an electronic component, are inserted are mounted close to each other. The other electronic component 104 is provided in a facing direction. For this reason, since the three terminals 102 of the transistor 101 shown in FIG. 3B face the other electronic component 104, the transistor 101 easily falls down toward the other electronic component 104 and contacts. There was a problem that there might be.

  The first prior art is shown in FIG. In this conventional electronic component, as shown in FIG. 4, a flat portion 204b is formed on a part of the lead wire 204a of the LED 204, and the flat portion 204b is bent twice at a right angle to form a holding portion 204d and an insertion portion 204e. Then, the lead wire 204a is inserted into the mounting hole 203b of the circuit board 203, the holding part 204d is brought into contact with the upper surface of the board 203, and the insertion part 204e is press-fitted into the mounting hole 203b. Since the holding portion 204d is in surface contact with the substrate 203, it is possible to prevent the right and left tilts from occurring, and the height of the LED 204 can be easily adjusted by adjusting the folding position. (For example, refer to Patent Document 1).

However, in this case, there is a problem that the lead wire 204a of the LED 204 is elongated and easily falls down, and the LED 204 may come into contact with the tact switch 222.
Japanese Patent Laid-Open No. 10-308571

  The present invention has been made in view of the above-described conventional problems, and the first electronic component (for example, a transistor) can be mounted in the same direction as the second electronic component by changing the direction by 90 degrees. The first electronic component can be prevented from falling to the second electronic component side, the first electronic component can be prevented from coming into contact with the second electronic component, and the pattern of the substrate can be changed. An object of the present invention is to provide an electronic component mounting structure that can mount the first electronic component in the same direction as the second electronic component by changing the direction by 90 degrees.

The present invention has been proposed in order to solve the above-mentioned problems. The invention according to claim 1 is characterized in that a transistor having three terminals in the main body and another electronic component are close to each other on the substrate. In the substrate, three holes for inserting the three terminals of the transistor are formed so as to face the other electronic components, and the three holes of the transistor are formed in the three holes of the substrate. in three of inserting the terminal mounting structure of an electronic component that transistors are mounted on the substrate, the pedestal is placed between the body portion and the substrate of the transistor, this pedestal, the Three through holes into which the three terminals of the transistors individually inserted into the three holes of the substrate are individually inserted are provided, and these three through holes are arranged on a straight line provided on the pedestal. One lower opening Are arranged at 90 degrees with respect to the arrangement direction of the three upper openings arranged on the straight line provided on the pedestal by the three insertion holes, and the three lower openings are arranged. The portion is individually communicated with the three holes of the substrate .

According to a second aspect of the present invention, a first electronic component and a second electronic component having two terminals on a main body portion are disposed close to each other on the substrate, and the first electronic component is disposed on the substrate. two holes for inserting the two terminals of the components have been formed in the direction facing to the second electronic component, two of said terminals of said first electronic component on the two holes of the substrate insert and the in mounting structure of the electronic component of the first electronic components are mounted on the substrate, the base is disposed between the main body portion of the first electronic component and the substrate, to the pedestal Is provided with two insertion holes into which the two terminals of the first electronic component inserted individually into the two holes of the substrate are individually inserted, and is provided in the pedestal by these two insertion holes. The two lower openings are arranged in the pedestal by the two insertion holes. That together are positioned 90 degrees displaced for two arrangement directions of the upper opening, two of the lower opening is characterized in that communicates separately into two of the holes of the substrate.

According to the invention described in claim 1, in a state where bets transistor is rotated 90 degrees, prevent that fall toward the other electronic component side of the transistor is close, that in contact with the other electronic components It can be avoided. Moreover, it is not necessary to change the pattern of a board | substrate by using a base.

According to the second aspect of the present invention , the first electronic component is rotated 90 degrees, and the first electronic component can be prevented from falling toward the adjacent second electronic component. It is possible to avoid contact with the two electronic components. Moreover, it is not necessary to change the pattern of a board | substrate by using a base.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component implementation structure according to the present invention will be described below with reference to the drawings.

  1A and 1B show a mounting structure of an electronic component according to a first embodiment of the present invention, in which FIG. 1A is a perspective view showing a state during the assembly, FIG. 1B is a perspective view of the transistor, and FIG. It is a perspective view at the time of attachment completion.

In the electronic component mounting structure of the first embodiment, as shown in FIGS. 1A, 1B, and 1C, the transistor 1 and another electronic component 2 are arranged close to the substrate 3. In the substrate 3, three holes 3 a into which the three terminals 1 a, 1 b, 1 c of the transistor 1 are inserted are formed so as to face the other electronic components 2. Seat 4 is disposed between the body portion of the substrate 3 and the transistor 1, arranged in a straight line with three upper opening 4a aligned in a straight line, 4b, 4c is provided in the pedestal 4 Three lower openings 4d, 4e, 4f are provided , and the arrangement direction of the three lower openings 4d, 4e, 4f is 90 with respect to the arrangement direction of the three upper openings 4a, 4b, 4c. It is displaced by degrees. In addition, a lower opening 4e in the center is provided at a position depending on the upper opening 4b in the center.

  The upper openings 4a, 4b, and 4c and the lower openings 4d, 4e, and 4f are communicated with insertion holes 4g, 4h, and 4i for inserting the terminals 1a, 1b, and 1c of the transistor 1, respectively. The pedestal 4 is arranged on the substrate 3 so that the three lower openings 4d, 4e, 4f of the pedestal 4 and the three holes 3a of the substrate 3 communicate with each other, and from the respective upper openings 4a, 4b, 4c of the pedestal 4 The terminals 1a, 1b and 1c of the transistor 1 are inserted, and the terminals of the transistor 1 are inserted into the holes 3a of the substrate 3 from the lower openings 4d, 4e and 4f through the insertion holes 4g, 4h and 4i of the base 4, respectively. 1a, 1b and 1c are inserted. As a result, the transistor 1 is mounted on the substrate 3 by changing its direction by 90 degrees so that it is in the same direction as the other electronic components 2.

  Therefore, according to the first embodiment, the transistor 1 is rotated by 90 degrees, and the transistor 1 can be prevented from falling toward the other electronic component 2 that is close to the transistor 1. The contact of 1 can be avoided. Moreover, it is not necessary to change the pattern of a board | substrate by using the base 4.

  FIG. 2 is a perspective view of a pedestal in the electronic component mounting structure of the second embodiment.

In the electronic component mounting structure of the second embodiment, the pedestal 4A is provided with two upper openings 4j and 4k, two lower openings 4m and 4n, and two lower openings 4m and 4n. Are aligned 90 degrees with respect to the alignment direction of the two upper openings 4j, 4k. The upper openings 4j and 4k and the lower openings 4m and 4n communicate with each other through insertion holes 4p and 4q. As in the first embodiment, the first electronic component (not shown) and the second electronic component (not shown) are arranged close to each other on the substrate and face the second electronic component on the substrate. The first electronic component disposed on the pedestal 4A is disposed on the substrate by changing the direction by 90 degrees in the hole provided in.

  Therefore, the first electronic component can be prevented from falling toward the second electronic component side in the state where the first electronic component is rotated 90 degrees, and the first electronic component is the second electronic component. Can be avoided. Moreover, it is not necessary to change the pattern of a board | substrate by using the base 4A.

The electronic component mounting structure of the first embodiment of the present invention is shown, (a) is a perspective view showing a state during the assembly, (b) is a perspective view of the transistor, and (c) is when the assembly is completed. FIG. It is a perspective view of the base in the mounting structure of the electronic component of 2nd Embodiment. 2 shows a conventional electronic component mounting structure, in which (a) is a plan view and (b) is a perspective view of the transistor. It is side surface sectional drawing of the conventional electronic component.

Explanation of symbols

1 Transistor 1a Terminal 1b Terminal 1c Terminal 2 Other Electronic Components 3 Substrate 3a Hole 4 Base 4A Base 4a Upper Opening 4b Upper Opening 4c Upper Opening 4d Lower Opening 4e Lower Opening 4f Lower Opening 4g Insertion Hole 4h Insertion hole 4i Insertion hole 4j Upper opening 4k Upper opening 4m Lower opening 4n Lower opening 4p Insertion hole 4q Insertion hole

Claims (2)

A transistor having three terminals in the main body and another electronic component are arranged close to each other on the substrate, and the substrate has three holes for inserting the three terminals of the transistor in the other electronic component. In the mounting structure of the electronic component in which the three terminals of the transistor are inserted into the three holes of the substrate and the transistor is mounted on the substrate .
A pedestal is disposed between the main body of the transistor and the substrate, and three pedestals of the transistor individually inserted into the three holes of the substrate are individually inserted into the pedestal. An insertion hole is provided, and the alignment direction of the three lower openings arranged on the straight line provided on the pedestal by these three insertion holes is arranged on the straight line provided on the pedestal by the three insertion holes. An electronic component, wherein the electronic component is positioned 90 degrees displaced with respect to the direction in which the three upper openings are arranged, and the three lower openings are individually connected to the three holes of the substrate. Implementation structure. A first electronic component having two terminals on the main body and a second electronic component are arranged close to each other on the substrate, and the two terminals of the first electronic component are inserted into the substrate. Two holes are formed in a direction facing the second electronic component, and the two terminals of the first electronic component are inserted into the two holes of the substrate, and the first electronic In the mounting structure of the electronic component in which the component is mounted on the substrate ,
A pedestal is disposed between the main body of the first electronic component and the substrate, and the two terminals of the first electronic component are individually inserted into two holes of the substrate on the pedestal. Are provided through two insertion holes, and the two lower openings provided in the base by the two insertion holes are arranged in two directions in the base by the two insertion holes. Electronic component mounting, wherein the electronic device is located 90 degrees displaced with respect to the direction in which the upper openings are arranged, and the two lower openings individually communicate with the two holes of the substrate. Construction.