JP4172302B2 - Semiconductor module cooling device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling device for a semiconductor module that cools a semiconductor element used in an inverter of an electric vehicle.
[0002]
[Prior art]
Conventionally, a water cooling type cooling device is known as this type of cooling device (for example, refer to Patent Documents 1 and 2). According to this, the heat sink part made of metal is provided on the back surface of the insulating substrate on which the semiconductor element is mounted, the water channel is formed in the heat sink part, the cooling water is made to flow, and the plurality of cooling fins are arranged in the water channel. As a result, the area of the heat radiating portion is increased and the cooling performance of the semiconductor element is enhanced.
[0003]
[Patent Document 1]
JP 2002-158322 A [Patent Document 2]
JP 2002-222905 A
[Problems to be solved by the invention]
The heat sink part described in the above-mentioned patent document is formed of copper, aluminum, or an alloy thereof. Therefore, it becomes a factor of weight increase and cost increase.
[0005]
The present invention provides a semiconductor module cooling apparatus that suppresses weight increase and cost increase.
[0006]
[Means for Solving the Problems]
A cooling device for a semiconductor module according to the present invention is a water-cooled cooling system that is adjacent to a power module including a semiconductor element via a metal mounting member constituting a mounting surface of the power module, and cools the semiconductor element by circulation of cooling water. comprising a part, water-cooled cooling unit is a metallic housing surface facing the mounting surface is the opening of the power over the module, a metallic fin member projecting from the rear side of the mounting surface of the power module in a housing And a lid member that closes the opening surface of the housing, and is accommodated in the housing without gaps through the opening surface, and is disposed around the fin member , and flows the cooling water together with the fin member , the mounting member, and the lid member. It has the resin-made flow-path formation member which forms a path | route, It is characterized by the above-mentioned.
[0007]
【The invention's effect】
In the present invention, since at least a part of the cooling water flow path in the water-cooled cooling section for cooling the semiconductor element is made of the resin material, the weight increase can be suppressed, and the complicated flow path can be provided. It can be formed easily, and the cost associated with mold production can be reduced.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
-First embodiment-
A first embodiment of a semiconductor module cooling device according to the present invention will be described below with reference to FIGS.
FIG. 1 is a perspective view showing a semiconductor module 100 according to the first embodiment. In the following, the vertical direction is defined as illustrated, and the configuration of each unit will be described based on this definition. The semiconductor module 100 includes a power module PM composed of a semiconductor element such as an IGBT or MOSFET used for an inverter of an electric vehicle and a substrate on which the semiconductor element is mounted, and a heat sink HS (also referred to as a water-cooled cooling part) that cools the semiconductor element. ). The power module PM is joined to the upper surface of the heat sink part HS.
[0009]
FIG. 2 is an exploded perspective view showing the configuration of the heat sink portion HS, and is a view of the semiconductor module 100 as viewed from the upside down direction. The heat sink portion HS includes a metal case 1 having an open bottom surface, a lid 2 that closes the bottom surface of the case 1, and a flow path forming member 3 accommodated in the case 1. The case 1 has a rectangular cylindrical frame portion 1a and an upper cover portion 1b. The frame portion 1a has a hose joint 11 that guides cooling water into the case 1 and a hose joint that discharges cooling water from the case 1. 12 is provided. The contact surface between the case 1 and the lid 2 is sealed.
[0010]
A plurality of fins 4 are arranged in parallel on the lower surface (upper surface in FIG. 2) of the cover portion 1b. The fin 4 is made of a metal having good thermal conductivity such as aluminum or copper, and is formed integrally with the case 1 by, for example, casting. FIG. 3 is a view in which the flow path forming member 3 is accommodated in the case 1. There are two types of fins 4 (4a, 4b), and the length and width of the fin 4a are larger than the length and width of the fin 4b. In the figure, three fins 4a are arranged in parallel to each other, and two fins 4b are arranged in parallel to each other between the fins 4a and between the fin 4a and the frame 1b. Reference numeral 5 in FIG. 3 indicates a mounting position of the power module PM, and the power module is provided on the back side of the fin 4 via the case cover portion 1b.
[0011]
The flow path forming member 3 is formed of a resin material such as PE (polyethylene), PP (polypropylene), PA (polyamide), PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), and the like. The type of resin is selected in consideration of the type of cooling water flowing through the flow path and the cooling water temperature.
[0012]
The outer shape and thickness of the flow path forming member 3 are equal to the inner shape and depth of the frame portion 1a, and the flow path forming member 3 is accommodated in the case 1 without a gap. A through hole 3a is opened inside the flow path forming member 3 as shown in FIG. A convex portion 3b that protrudes inward is provided on the peripheral surface of the through hole 3a, and a curved concave portion 3c is provided on a surface that faces the convex portion 3b. Thus, when the flow path forming member 3 is accommodated in the case 1, as shown in FIG. 3, the convex portion 3b comes into contact with one end face of the fin 4a to close the gap between the fin 4a and the convex portion 3b, and the fin 4a. A gap is provided between the other end surface of the first and second recesses 3c. As a result, a zigzag channel PA1 is formed by the passage forming member 3 and the fins 4a as shown. The flow path forming member 3 is provided with through holes 3d (FIG. 2) corresponding to the positions of the hose joints 11 and 12.
[0013]
In this case, since the flow path forming member 3 is formed by resin molding, the curved concave portion 3c and the convex portion 3b forming a part of the flow channel PA1 can be easily and accurately formed. Further, since the flow path PA1 is formed by the resin flow path forming member 3 and the metal fin 4a, the casting mold (or die casting mold) can be simplified as compared with the case where the flow path PA1 is formed only by metal. . As a result, the yield is improved, the thickness of the fins 4 can be made uniform, and the mold cost is reduced.
[0014]
In FIG. 3, when water flows through the flow path PA <b> 1 via the hose joints 11 and 12, the heat from the power module PM is taken away by the water via the case cover portion 1 b and the fins 4. Thereby, the semiconductor element is cooled. In this case, since the plurality of fins 4 are arranged in the flow path PA1, the heat radiation area is increased and cooling is promoted. Further, since the fins 4 are arranged on the back side of the power module PM which is a heat generating component, the cooling effect is further increased.
[0015]
According to the cooling device of the first embodiment described above, the following operational effects can be obtained.
(1) Since the cooling water flow path PA1 is formed by the resin flow path forming member 3, the metal fin 4, the case cover portion 1b, and the lid 2, the heat sink portion HS can be reduced in weight. In addition, it is possible to easily form a complicated flow path by resin molding, simplify the casting mold, and achieve uniform thickness of the cast product and lower cost of the mold. .
(2) Since the upper wall surface of the cooling water flow path PA1, that is, the case cover portion 1b, is formed of metal, heat from the power module PM can be efficiently radiated.
(3) Since the plurality of fins 4 are disposed on the back side of the mounting position of the power module PM, the power module PM can be sufficiently cooled.
(4) Since the cooling water flow path PA1 is formed in a zigzag shape, the cross-sectional area of the flow path is reduced, the flow of water is increased, and the heat transfer rate from the case cover portion 1b and the fins 4 to the water is improved.
(5) Since the folded portion (the concave portion 3c and the convex portion 3b) in which the direction of the flow of water changes is formed of resin, the folded portion can be formed in a smooth curved surface shape. As a result, it is possible to prevent the high-stress from acting on the wall surface of the flow path and damage it, and the loss of water flow is reduced, so that the cooling effect can be enhanced.
[0016]
In the above description, the case 1 and the fin 4 are integrally cast. However, the fin 4 may be cast separately from the case 1. Although the folded portion of the flow path PA1 is formed by resin molding, other portions that are difficult to cast may be formed by resin molding. What is necessary is just to apply | coat an adhesive agent to the location (for example, between the flow path formation member 3 and the frame 1a) which does not affect heat dissipation when accommodating the flow path formation member 3 in the case 1, and to adhere both. You may adhere | attach using an adhesive tape. When a gap is provided between the case 1 and the flow path forming member 3, an uneven portion may be provided on the contact surface between the case 1 and the flow path forming member 3 other than the gap to engage the both.
[0017]
-Second Embodiment-
A second embodiment of the present invention will be described with reference to FIGS.
The second embodiment is different from the first embodiment in the shape of the cooling water flow path. That is, in the first embodiment, the flow path PA1 (first cooling water flow path) is formed on the back surface side of the power module PM by the flow path forming member 3 and the fins 4a. In the second embodiment, A flow path (second cooling water flow path) is formed by the flow path forming member 3 so as to communicate with the cooling water flow path PA1.
[0018]
FIG. 4 is a perspective view showing a configuration of the flow path forming member 3 according to the second embodiment, and FIG. 5 is a plan view showing a state in which the flow path forming member 3 is accommodated in the case 1. 2 and 3 are denoted by the same reference numerals, and the differences will be mainly described below. A zigzag groove 6 is formed on the upper surface of the flow path forming member 3, and both end portions of the groove 6 communicate with upstream and downstream folded portions (recesses 3c) of the flow path PA1, respectively. Thereby, the flow path PA2 is formed in parallel with the flow path PA1. In this case, since the flow path forming member 3 is made of a resin material, the complicated shape of the flow path PA2 can be easily formed. In addition, although illustration is abbreviate | omitted, the lower surface of the flow-path formation member 3 is formed in concave shape so that the back side of the groove | channel 6 may become a cavity, and the weight reduction of the flow-path formation member 3 is aimed at.
[0019]
In the second embodiment, a part of the cooling water that has flowed into the flow path PA1 via the hose joint 11 is branched into the flow path PA2 at the first turn-up portion 3b. Then, it flows through the flow path PA2, takes heat from the case cover 1b side, and merges with the flow path PA1 at the folded portion 3b on the downstream side. As a result, the flow passage area on the case cover 1b side is enlarged, and the case cover 1b can be cooled over a wide range. In this case, since the cross-sectional area of the flow path PA1 is smaller than the cross-sectional area of the flow path PA2, more cooling water flows through the flow path PA1, and the cooling effect on the flow path PA1 side becomes higher. The flow rate ratio between the flow path PA1 and the flow path PA2 can be adjusted by changing the depth of the groove 6 or the like.
[0020]
According to 2nd Embodiment, there exist the following effects.
(1) Since the flow path PA2 is formed by resin molding on the case cover 1b side of the flow path forming member 3, it is possible to form the flow path PA2 having a complicated shape over every corner of the flow path forming member 3. The case cover 1b can be cooled over a wide range.
(2) The cross-sectional area of the flow path PA2 is made smaller than the cross-sectional area of the flow path PA1, and the fins 4 are provided only in the flow path PA1, so that the cooling efficiency on the flow path P1 side can be increased from the flow path P2 side. . Therefore, if the flow path PA1 is formed in a place where the heat generation amount of the power module PM is large and the flow path PA2 is formed in a place where the heat generation amount is small, the power module PM can be efficiently cooled.
(3) Since the back side of the groove 6 of the flow path forming member 3 is made hollow, the flow path forming member 3 can be reduced in weight.
[0021]
In the above description, the flow path PA2 is provided in parallel to the flow path PA1, but may be provided in series. Further, a large number of flow paths may be provided. Although the flow path PA2 is provided on the case cover 1b side, it may be provided on the lid 2 side. Although the fins 4 are provided in the cooling water flow path PA1, the flow path PA1 may be formed only by resin molding without providing the fins 4 when the heat generation amount is not so large.
[0022]
-Third embodiment-
A third embodiment of the present invention will be described with reference to FIGS.
In the first embodiment, both ends of the fin 4a are opened in the flow path PA1, but in the third embodiment, the fin portion 7 is provided in the flow path forming member 3 as follows, and this fin The ends of the portion 7 and the fin 4a are connected to form a flow path.
[0023]
6 is a plan view showing a state in which the flow path forming member 3 according to the third embodiment is accommodated in the case 1, and FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG. In addition, the same code | symbol is attached | subjected to the location same as FIG. 3, and the difference is mainly demonstrated below. In the third embodiment, the vicinity of the folded portion of the flow path forming member 3 does not penetrate in the vertical direction, and the thin plate portion 3e is provided on the bottom surface of the folded portion. A substantially U-shaped fin portion 7 is formed on the upper surface of the thin plate portion 3e as shown in FIG. 6, and both ends of the fin portion 7 are connected to both ends of the fin 4a. Thereby, the cooling water flows along the fin portion 7 at the folded portion, and the flow velocity distribution can be made uniform. That is, it can suppress that the flow of the outer side (side near the recessed part 3c) of a folding | turning part becomes quicker than the flow of an inner side.
[0024]
As described above, in the embodiment of the younger brother 3, since the fin portion 7 is provided in the folded portion corresponding to the fin 4a and the flow path PA1 is divided at the folded portion, the flow velocity distribution of the cooling water is made uniform. Thus, the case cover portion 1b and the power module PM above the case cover portion 1b can be uniformly cooled. In this case, since the fin part 7 is resin-molded integrally with the flow path forming member 3, the fin part 7 can be easily formed. Further, the fin portion 7 can be formed into a smooth curved surface shape by resin molding, and the surface roughness can be reduced, and an increase in pressure loss of the flow path PA1 can be suppressed.
[0025]
In the above description, the thin plate portion 3e is provided on the bottom surface of the flow path forming member 3, and the fin portion 7 is provided on the top surface of the thin plate portion 3e. However, the thin plate portion 3e is provided on the top surface of the flow path forming member 3, You may make it provide the fin part 7 in the lower surface of the part 3e. You may make it provide the thin-plate part 3e over the whole bottom face of the flow-path formation member 3, without providing the through-hole 3a in the flow-path formation member 3. FIG.
[0026]
-Fourth embodiment-
A fourth embodiment of the present invention will be described with reference to FIGS.
In 4th Embodiment, a buffer member (accumulator) is provided in the middle of flow path PA1, and the pressure fluctuation of cooling water is absorbed. FIG. 8 is a plan view showing a state in which the flow path forming member 3 according to the fourth embodiment is accommodated in the case 1. In addition, the same code | symbol is attached | subjected to the location same as FIG. 3, and the difference is mainly demonstrated.
[0027]
As shown in FIG. 8, the flow path forming member 3 is provided with a recess 9 that branches off from the vicinity of the outlet of the flow path PA1. The concave portion 9 is formed in a substantially rectangular shape in plan view via the neck portion 9a (rectangular portion 9b), and the buffer member 8 is inserted into the rectangular portion 9b from the up and down direction. FIG. 9 is a plan view showing the configuration of the buffer member 8. The shock-absorbing member 8 has an outer peripheral member 21 and a pressure receiving portion 22 that is provided facing the passage PA1, is made of the same material as the outer peripheral member 21, and has a reduced film pressure so as to be easily subjected to pressure fluctuation. A compressible gas 23 made of air, nitrogen gas N2, or the like is sealed inside the pressure receiving portion 22. As the material of the outer peripheral material 21, it is preferable to use a rubber material such as silicone, NBR, EPDM or the like.
[0028]
In the fourth embodiment, since the buffer member 8 is provided so as to communicate with the flow path PA1, when the water pressure in the flow path PA1 fluctuates, the buffer member 8 is compressed and deformed accordingly and absorbs the pressure fluctuation. . Thereby, a rapid increase in the pressure in the flow path PA1 can be suppressed, and leakage of the cooling water from the joint surface can be easily prevented without increasing the sealing performance of the joint surface between the case 1 and the lid 2 so much. Further, since the buffer member 8 is provided inside the flow path forming member 3, the arrangement of the buffer member 8 does not hinder the arrangement of the peripheral devices, and the space efficiency is good.
[0029]
In the above description, the buffer member 8 is provided in the vicinity of the outlet of the cooling water flow path PA1, but it may be provided in another location. Moreover, you may provide the buffer member 8 in multiple places. The configuration of the buffer member 8 is not limited to that described above.
[0030]
-Fifth embodiment-
A fifth embodiment of the present invention will be described with reference to FIG.
In the fifth embodiment, a sealing member is provided on the joint surface between the case 1 and the lid 2 to enhance the sealing performance of the joint surface. FIG. 10 is an exploded perspective view showing the configuration of the heat sink portion HS according to the fifth embodiment. In addition, the same code | symbol is attached | subjected to the location same as FIG. 2, and the difference is mainly demonstrated below.
[0031]
A seal member 31 is provided on the lower surface of the flow path forming member 3, and a through hole 31 a having the same shape as the through hole 3 a of the flow path forming member 3 is opened in the seal member 31. The seal member 31 is made of a highly compressible rubber member, and is formed integrally with the flow path forming member 3 by, for example, insert molding. The peripheral edge 31 b of the seal member 31 protrudes outward from the peripheral surface of the flow path forming member 3. A groove 42 is provided on the entire inner periphery of the lower end surface (flange surface 41) of the case frame 1a, and the peripheral edge portion 31b of the seal member 31 is fitted into the groove 42. Although not shown, a female thread portion is provided on the outer flange surface 41 of the groove 42, and a through hole is opened in the lid 2 corresponding to the female thread portion. Then, the bolt is screwed into the female screw portion through the through hole, and the case 1 and the lid 2 are fastened through the seal member 31.
[0032]
As described above, in the fifth embodiment, the seal member 31 is provided on the lower surface of the case 1, and the case 1 and the lid 2 are placed in a state where the peripheral portion 31 b of the seal member 31 is sandwiched between the case 1 and the lid 2 and pressed. Since it fastens, the sealing performance of the joint surface of case 1 and the lid | cover 2 can be improved. Since the seal member 31 is provided integrally with the flow path forming member 3, there is no need to separately provide a sheet gasket or a liquid gasket. In addition, the flow path forming member 3 is fixed at the same time by fixing the seal member 31 therebetween. Since the groove 42 is provided in the flange surface 41 of the case 1 and the seal member 31 is fitted into the groove 42, the case 1 and the lid 2 are fastened in close contact. Thereby, it is possible to prevent the axial force of the bolt from being lowered due to the deterioration of the rubber constituting the sheet member 31 with time.
[0033]
When the material forming the flow path forming member 3 is a highly compressible resin material, the seal member 31 does not need to be a rubber material as in this embodiment, and the same material as the flow path forming member 3 is used. It can be. The through hole 31a may not be the same shape as the through hole 3a of the flow path forming member 3, but may be wider than the through hole 3a and the seal member 31 may be provided only in the vicinity of the seal surface.
[0034]
-Sixth embodiment-
A sixth embodiment of the present invention will be described with reference to FIG.
In the sixth embodiment, the shapes of the groove 42 and the seal member 31 are different from those of the fifth embodiment. FIG. 11 is a perspective view of the main part of the heat sink part HS according to the sixth embodiment (enlarged view of part A in FIG. 10). In addition, the same code | symbol is attached | subjected to the location same as FIG. 10, and the difference is mainly demonstrated below.
[0035]
11A shows a state before the flow path forming member 3 is housed in the case 1, and FIG. 11B shows a state after the housing. As shown in FIG. 11A, a protrusion 43 lower than the flange surface 41 is provided inside the groove 42, and the lower end surface of the case frame has a substantially U-shaped cross section. As shown in FIG. 11B, the peripheral edge 31b of the sealing member 31 bulges in the vertical direction, and a bulged portion 32 having a substantially circular cross section is formed. The bulging portion 32 is disposed in the groove portion 42 over the protruding portion 43, the upper end surface of the bulging portion 32 is in contact with the surface of the groove portion 42, and the lower end surface protrudes below the flange surface 41.
[0036]
As a result, when the lid 2 is fastened to the case 1 by bolt connection and a pressure is applied to the seal member 31, the bulging portion 32 is crushed. That is, the bulging portion 32 functions in the same manner as the O-ring, and the sealing performance is enhanced. Further, the position of the bulging portion 32 is regulated by the protrusion 43, and the positional deviation of the seal member 31 can be prevented. As a result, the reliability of the seal is increased.
[0037]
FIG. 12 is a diagram illustrating a modification of the sixth embodiment. As shown in FIG. 12A, the protrusion 44 is partially provided over the longitudinal direction of the groove 42 and protrudes downward from the protrusion 43 of FIG. As shown in FIG. 12B, a through hole is opened at the base of the bulging portion 32 of the seal member 31 corresponding to the protrusion 44, and the tip of the protrusion 44 is inserted into the through hole. As a result, the position of the bulging portion 32 is fixed, and the connection between the seal member 31 and the bulging portion 32 is partially cut off, so that the function of the bulging portion 32 as an O-ring is enhanced and the sealing performance is further improved.
[0038]
In the above description, the flow path forming member 3 is made of a resin material, but may be made of a highly compressible rubber member. Thereby, the flow path forming member 3 also functions as a seal member, and the seal member 31 can be omitted.
[0039]
In the above embodiment, the power module PM as the heat generating component is disposed on the upper surface of the flow path forming member 3, but may be disposed on the lower surface of the flow path forming member 3. The present invention is characterized in that at least a part of the cooling water flow path PA1 is made of a resin material, except for the case cover portion 1b as a heat transfer member that transfers heat from the power module PM to the cooling water, You may comprise the heat sink part HS with a resin material. When there is a curved portion (folded portion) in the flow channel shape, a complicated flow channel can be easily formed by forming the curved portion with resin. That is, the present invention is not limited to the cooling device of the embodiment as long as the features and functions of the present invention can be realized.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a semiconductor module according to a first embodiment of the present invention.
FIG. 2 is an exploded perspective view of a heat sink portion constituting the semiconductor module according to the first embodiment.
FIG. 3 is a plan view showing a state in which the flow path forming member according to the first embodiment is housed in a case.
FIG. 4 is a perspective view showing a configuration of a flow path forming member according to a second embodiment.
5 is a plan view showing a state in which the flow path forming member of FIG. 4 is housed in a case. FIG.
FIG. 6 is a plan view showing a state in which a flow path forming member according to a third embodiment is housed in a case.
7 is a sectional view taken along line VII-VII in FIG.
FIG. 8 is a plan view showing a state in which a flow path forming member according to a fourth embodiment is housed in a case.
FIG. 9 is a diagram showing details of the buffer member in FIG. 8;
FIG. 10 is an exploded perspective view showing a configuration of a heat sink part according to a fifth embodiment.
FIG. 11 is a perspective view showing the main configuration of a heat sink according to the sixth embodiment.
12 is a view showing a modification of FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Case 1a Frame 1b Cover part 2 Lid 3 Flow path forming member 3b Recessed part 4 Fin 7 Fin part 8 Buffer member 9 Recessed part 31 Seal member 31b Peripheral part 32 Swelling part 41 Flange surface 42 Groove 43, 44 Projection part PM Power module HS Heat sink PA1, PA2 Cooling water flow path

Claims (5)

A power module including a semiconductor element is adjacent to the power module through a metal mounting member that constitutes a mounting surface of the power module, and includes a water-cooled cooling unit that cools the semiconductor element by circulating cooling water.
The water-cooled cooling unit is
A metal housing having an opening on the surface facing the mounting surface of the power module;
A metal fin member projecting from the back side of the mounting surface of the power module in the housing ;
A lid member for closing the opening surface of the housing;
A resin-made resin that is accommodated in the housing without any gap through the opening surface and that is disposed around the fin member and forms a cooling water flow path together with the fin member , the attachment member, and the lid member . A cooling device for a semiconductor module, comprising a flow path forming member. In the cooling device of the semiconductor module according to claim 1,
The fin member, the cooling device of the semiconductor module and which are located before the member integral with Quito. In the cooling device of the semiconductor module according to claim 1 or 2,
The flow path has a straight flow path section and a curved flow path section, the fin member forms a straight flow path section, and the flow path forming member forms a curved flow path section. A cooling device for a semiconductor module. In the cooling device of the semiconductor module of any one of Claims 1-3,
The flow path forming member is provided with a recess communicating with the flow path,
A cooling device for a semiconductor module, wherein a buffer member for absorbing pressure fluctuation is inserted into the recess. In the cooling device of the semiconductor module according to any one of claims 1 to 4,
A seal member that is molded integrally with the flow path forming member and has a peripheral edge extending from the opening end surface of the housing to the contact surface of the lid member;
The peripheral portion of the seal member is accommodated in a step provided over the entire circumference of the opening end surface of the housing, and the contact surface is pressed by sandwiching the peripheral portion between the housing and the lid member. A cooling device for a semiconductor module, wherein the semiconductor module is sealed .

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