JP2020088108A - Cooler and structure - Google Patents

Abstract

To provide a cooler capable of liquid-cooling multiple electrical heating elements simultaneously, while improving cooling efficiency of the multiple electrical heating elements.SOLUTION: In a cooler including a metal cooling panel 9 for cooling electrical heating elements, and a resin duct 8 joined to the metal cooling panel 9, and feeding cooling medium, the resin duct 8 includes at least a first duct unit 2 and a second duct unit 3, the first duct unit 2 includes a duct A (17) for introducing the cooling medium from the first duct unit 2 to the second duct unit 3, and a duct B (18) for introducing the cooling medium throughout the first duct unit 2. Out of the branch point of the duct A (17) and the duct B (18), a branch point C (19) located just before the exit (cooling medium shunt 82) of the duct A (17) is provided with a guide part 16 for restraining flow of the cooling medium to the duct B (18) side.SELECTED DRAWING: Figure 1

Description

The present invention relates to a cooling device and a structure.

In recent years, batteries have attracted attention as a power source for electric vehicles and the like. It is known that a battery with a high output and a large capacity generates a large amount of heat during the charge/discharge process, and this heat causes deterioration of the battery. Therefore, the battery needs a cooling system.
In addition, heat countermeasures have been conventionally emphasized for electronic parts equipped with a semiconductor element that is a heat generating element. In particular, with the recent trend toward miniaturization and high-density mounting of electronic components, or the speeding up of microprocessors, the power consumption per electronic component has significantly increased, and an efficient cooling system is important. Is becoming

In recent years, liquid cooling type cooling devices have been adopted as cooling systems for heating elements such as batteries and electronic components. A liquid-cooling type cooling device is a device in which heat generated by a heating element is generated by a refrigerant that has passed through a metal plate, a so-called cold plate, which has a flow path for circulating a refrigerant, in contact with the heating element. The heating element is cooled by being conveyed to a heat sink on the heat radiation side provided outside (for example, refer to Patent Document 1).
Patent Document 1 discloses a battery block in which a plurality of battery cells are arranged with a spacer interposed between the battery cells, and end plates are arranged at both ends in the arrangement direction. A cooling plate that extends in a direction and contacts one surface of each of the battery cells directly or through a heat conduction layer, and the cooling plate has a wall thickness that extends in the arrangement direction of the plurality of battery cells. And a battery block that is a hollow portion of the thick portion and has a cooling through hole through which a refrigerant flows.

In addition, an electronic device equipped with a plurality of electronic components is also known for the purpose of guaranteeing operation when an electronic component such as an integrated circuit fails and further improving performance. Regarding a liquid cooling system of an electronic device having a plurality of electronic components mounted therein, a method of causing a refrigerant having passed through an upstream electronic component cooling jacket to flow into a downstream electronic component cooling jacket is disclosed (for example, Patent Document 2). reference).

JP, 2016-29624, A JP-A-5-315488

However, in the method of simultaneously liquid-cooling a plurality of heating elements as disclosed in Patent Document 2, the refrigerant that has been heated by the heating element on the upstream side is used for cooling the heating element on the downstream side. The cooling efficiency of the heating element on the side is reduced. That is, the method of simultaneously liquid-cooling a plurality of heating elements has a problem that the amount of heat generated by the heating element on the downstream side is limited as compared with the amount of heat generated by the heating element on the upstream side.
That is, in the conventional technology, there is room for improvement in the cooling device that simultaneously liquid-cools a plurality of heating elements in order to improve the cooling efficiency of the plurality of heating elements.

The present invention has been made in view of the above circumstances, and provides a cooling device capable of simultaneously liquid cooling a plurality of heating elements and improving the cooling efficiency of the plurality of heating elements.

According to the present invention, the following cooling device and structure are provided.

[1]
A cooling device comprising a metal cooling panel for cooling the heating element, and a resin flow path for joining the metal cooling panel, and flowing a refrigerant,
The resin flow path includes at least a first flow path unit and a second flow path unit,
The first flow channel unit has a flow channel A for guiding the coolant from the first flow channel unit to the second flow channel unit, and the coolant over the entire first flow channel unit. A flow path B for guiding,
Among the branch points of the flow path A and the flow path B, a guide part for suppressing the flow of the refrigerant to the flow path B side is provided at a branch point C located immediately before the outlet of the flow path A. Cooling device provided.
[2]
In the cooling device described in [1] above,
The cooling device having the bottom part and the side wall part standing on the bottom part.
[3]
In the cooling device described in [1] or [2] above,
A cooling device in which the metal cooling panel and the resin flow path are joined by one or more means selected from an adhesive method, a heat welding method, and a mechanical fastening method.
[4]
In the cooling device according to any one of [1] to [3] above,
A fine concavo-convex structure is formed on at least a part of the surface of the metal cooling panel,
A cooling device in which a side wall portion of the resin flow path is located on the fine concavo-convex structure.
[5]
In the cooling device according to any one of [1] to [4] above,
The said guide part is a cooling device containing the protrusion part which protruded to the inner side of the said 1st flow path unit from the side wall part in which the exit of the said flow path A was provided.
[6]
In the cooling device according to any one of the above [1] to [5],
A cooling device in which the metal cooling panel is composed of at least one member selected from the group consisting of an aluminum member, an aluminum alloy member, a copper member, and a copper alloy member.
[7]
A heating element,
A cooling device according to any one of the above [1] to [6],
Equipped with
A structure in which the heating element is arranged on the surface of the metallic cooling panel in the cooling device.

According to the present invention, it is possible to provide liquid cooling for a plurality of heating elements at the same time, and it is possible to provide a cooling device with improved cooling efficiency for a plurality of heating elements.

It is the perspective view which showed typically an example of the structure of the resin-made flow path which concerns on this embodiment. It is the perspective view which showed typically an example of the structure of the resin-made flow path which concerns on this embodiment. It is a perspective view which showed typically an example of the structure of the channel unit which constitutes the resin channel concerning this embodiment, and is drawing showing an example of arrangement of a refrigerant inlet and a refrigerant diversion port with which a channel unit is provided. .. It is sectional drawing which showed typically an example of the structure of the cooling unit and structure which comprise the cooling device which concerns on this embodiment. The flow channel formed inside the resin flow channel is not shown. It is a perspective view which showed typically an example of the structure of the resin-made flow path which concerns on this embodiment, and the refrigerant|coolant which flows through the flow path A formed in the 1st flow path unit on the river side goes to the flow path B. It is the drawing which showed the image which divides into the flow and the flow which goes to the downstream 2nd flow path unit arrange|positioned in series. It is the perspective view which showed typically an example of the structure of the guide part provided just before the refrigerant distribution port of the 1st flow path unit on the river side. It is a top view which showed typically an example of the structure of the resin-made flow path which concerns on this embodiment.

Embodiments of the present invention will be described below with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be appropriately omitted. Moreover, the figure is a schematic view and does not match the actual dimensional ratio. Unless otherwise specified, "~" between the numbers in the sentence represents the following from the above.

The cooling device according to the present embodiment includes a metal cooling panel 9 for cooling a heating element, and a resin flow path 8 that is joined to the metal cooling panel 9 and flows a refrigerant. The resin flow path 8 includes at least the first flow path unit 2 and the second flow path unit 3, and the first flow path unit 2 includes the first flow path unit 2 to the second flow path unit 2. The flow path A(17) includes a flow path A(17) for guiding the refrigerant to the path unit 3 and a flow path B(18) for guiding the refrigerant throughout the first flow path unit 2. Of the branch points of the flow path B(18) and the branch point C(19) located immediately before the outlet of the flow path A(17) (the refrigerant distribution port 82). The guide part 16 for suppressing the flow of the is provided.

Here, in the cooling device according to the present embodiment, the resin flow path 8 includes a plurality of flow path units, and the first flow path unit 2 includes the first flow path unit 2 to the second flow path. By including the flow path A (17) for guiding the refrigerant to the unit 3 and the flow path B (18) for guiding the refrigerant over the entire first flow path unit 2, the cooling unit on the upstream side is provided. Since the refrigerant not yet heated by the upper heating element can be sent to the cooling unit on the downstream side, the cooling efficiency of the cooling unit on the downstream side can be improved. As a result, it is possible to simultaneously liquid-cool a plurality of heating elements and improve the cooling efficiency of the heating elements. Further, by including the plurality of flow passage units and the plurality of flow passages as described above, the injection pressure of the refrigerant into the cooling device can be lowered.

1 and 2 are perspective views schematically showing an example of the structure of the resin flow path 8 according to the present embodiment. FIG. 3 is a perspective view schematically showing an example of the structure of the flow path unit that constitutes the resin flow path 8 according to the present embodiment, and shows the refrigerant inlet 81 and the refrigerant distribution port 82 provided in the flow path unit. It is drawing which shows an example of arrangement|positioning. In this embodiment, each flow path unit is joined and integrated with the metallic cooling panel 9 to form a cooling unit 1', and an assembly of a plurality of cooling units 1'is a cooling device.
The resin flow path 8 includes at least a first flow path unit 2 and a second flow path unit 3.
In the mode shown in FIG. 1, the first flow path unit 2 and the second flow path unit 3 are arranged in series, and the first flow path unit 2 is on the upstream side, The channel unit 3 of 2 is on the downstream side. In the present embodiment, "arranged in series" refers to an arrangement in which the refrigerant flow system in the two flow path units is such that a part of the refrigerant that has passed through the upstream flow path unit flows into the downstream flow path unit. To tell.
Here, the resin flow path 8 may have a configuration in which the first flow path unit 2 and the second flow path unit 3 are integrated as shown in FIG. 1, or the first flow path unit The second and second flow path units 3 may be divided. When the first flow path unit 2 and the second flow path unit 3 are divided, the first flow path unit 2 and the second flow path unit 3 may be, for example, a refrigerant pipe through which a refrigerant flows. Can be connected.

As shown in FIG. 2, the resin flow path 8 includes a third flow path unit 4 and a fourth flow path unit 5 in addition to the first flow path unit 2 and the second flow path unit 3. You may prepare. In this case, the first flow path unit 2 and the third flow path unit 4, and the second flow path unit 3 and the fourth flow path unit 5 are arranged in parallel, respectively.
Further, the third flow path unit 4 and the fourth flow path unit 5 are arranged in series.
Here, the resin flow path 8 may have a configuration in which each flow path unit is integrated as shown in FIG. 2, or may have a configuration in which each flow path unit is divided. When each flow path unit is divided, the flow path units are connected to each other by, for example, a refrigerant pipe through which a refrigerant flows.
The number of flow path units forming the resin flow path 8 is not particularly limited, and can be arbitrarily set depending on the size and number of heating elements to be cooled.

The first flow path unit 2 includes a flow path A (17) for guiding the refrigerant from the first flow path unit 2 to the second flow path unit 3, and a refrigerant over the entire first flow path unit 2. And a flow path B (18) for guiding. Further, the first flow path unit 2 is provided with a plurality of liquid passage ports for inflow and outflow of the refrigerant. In a preferred mode of the cooling device according to the present embodiment, as will be described later, the resin flow path 8 is composed of a bottom portion and a side wall portion standing on the bottom portion, and the flow passage is formed on the bottom portion.
The number of liquid passage ports provided in the first flow path unit 2 is not particularly limited, but is, for example, four, and specifically, both end positions of one side wall portion and both end positions of opposing side wall portions. .. One such example is shown in FIG. The refrigerant entering from the refrigerant inlet 81 is divided into the refrigerant flow dividing port 82 for the flow path B (18) and for the conveyance to the second flow path unit 3, and the refrigerant flow combining port 83 is used for the second flow path unit. It joins with the refrigerant transferred from No. 3, and is returned to the heat exchanger at the refrigerant recovery port 84.
More specifically, the refrigerant supplied from the heat exchanger that lowers the temperature of the refrigerant and imparts a cooling function is boosted by the pump to flow from the refrigerant inlet 81 to the flow path A (17) of the first flow path unit 2. ), and then a part of the inflowing refrigerant flows from the branch point C (19) to the flow path B (18) and then to the entire first flow path unit 2. As a result, the entire first flow path unit 2 is cooled. The remaining refrigerant flows from the refrigerant distribution port 82 to the second flow path unit 3 and flows to the entire second flow path unit 3. As a result, the entire second flow path unit 3 is cooled. The refrigerant that has flowed through the entire second flow path unit 3 returns to the first flow path unit 2 from the refrigerant merge port 83, and returns to the heat exchanger from the refrigerant recovery port 84.
It should be noted that in FIGS. 1 to 3 and 5, the metal cooling panel 9 constituting the cooling unit 1 ′ is omitted in order to make the flow channels formed in the resin flow channel 8 easy to visually recognize. Usually, as shown in FIG. 4, a metal cooling panel 9 is arranged on the resin flow path 8. Further, white arrows in FIGS. 3 and 5 conceptually show the circulation state of the refrigerant.
The flow channel units other than the first flow channel unit 2 have basically the same structure as the first flow channel unit 2.

FIG. 4 is a cross-sectional view that schematically shows an example of the structure of the unit 20 (cooling unit 1′) and the structure 20 that form the cooling device according to the present embodiment. The flow path formed inside the resin flow path 8 is not shown.
The structure 20 according to the present embodiment includes the heating element 10, the cooling unit 1 ′ according to the present embodiment, and a case that accommodates the heating element 10 as necessary, and the metal cooling in the cooling unit 1 ′. The heating element 10 is arranged on the surface of the panel 9. The heating element 10 is, for example, a battery or an electronic component. The metal cooling panel 9 and the heating element 10 may be in direct contact with each other, but a heat conductive sheet is preferably interposed at the contact portion. Instead of the heat conductive sheet, a so-called thermal interface material (TIM) may be used. Specifically, thermal grease, phase change material (PCM), gel, high heat conductive adhesive, thermal tape, etc. Can be illustrated.
The cooling unit 1'shown in FIG. 4 has a resin-made flow path 8 (the internal flow path is not shown) joined to the peripheral edge of a flat metal-made cooling panel 9. A heating element 10 such as a battery or an electronic component is mounted on the surface of the cooling element 9 opposite to the refrigerant circulation surface, and the heating element 10 is housed in a case as required. A side surface of the resin flow path 8 is provided with a refrigerant inlet port 81 and a refrigerant diversion port 82 which are liquid passage ports for the inflow and outflow of the refrigerant (refrigerant merging port 83 and refrigerant recovery port 84 are not shown). No).

Since the entire metal cooling panel 9 is cooled by the refrigerant flowing through the flow passage formed inside the resin flow passage 8, the metal cooling panel 9 is not joined to the resin flow passage 8. The cooling efficiency of the heating element 10 in contact with the opposite surface can be increased. In addition, since the resin-made flow path 8 in which the flow path of the refrigerant is formed is made of a material that is lightweight and has excellent heat insulating properties, it is possible to contribute to, for example, reducing the weight of the entire structure 20 and improve the cooling efficiency. it can.

FIG. 5 is a perspective view schematically showing an example of the structure of the resin flow path 8 according to the present embodiment, and the flow path A (17) formed in the first flow path unit 2 on the river side. It is the drawing which showed the image which the refrigerant which flows through divides into the flow which goes to the flow path B (18), and the flow which goes to the downstream 2nd flow path unit 3 which is in series.
In the cooling device according to the present embodiment, as shown in FIG. 5, at the branch point C (19), the flow 13 before the diversion to the refrigerant diversion port 82 of the first flow path unit 2 on the upstream side is the downstream side. Of the second flow path unit 3 and a flow 15 toward the flow path B (18).

In the related art related to a cooling device (for example, a cooling jacket or a cold plate) for cooling the heating element, the flow 14 toward the second flow path unit 3 on the downstream side and the flow 15 toward the flow path B (18) are controlled. Then, a method for uniformly cooling the first channel unit 2 on the upstream side and the second channel unit 3 on the downstream side has not been known.
According to the cooling device according to the present embodiment, as shown in FIG. 6, a guide portion for dividing the flow 14 toward the downstream second flow path unit 3 and the flow 15 toward the flow path B (18). By installing 16 at a branch point C (for example, next to the refrigerant distribution port 82) located immediately before the outlet of the flow path A among the branch points of the flow path A and the flow path B, the downstream side first The flow rate ratio of the flow 14 toward the second flow path unit 3 and the flow 15 toward the flow path B (18) is controlled. More specifically, the guide portion 16 suppresses the flow 15 toward the flow path B (18) and increases the amount of the refrigerant in the flow 14 toward the downstream second flow path unit 3.
As a result of this control, the amount of refrigerant flowing into the second flow path unit 3 can be increased, and the cooling efficiency of the entire cooling device, that is, each cooling unit can be increased. With this, when a plurality of cooling units are connected to simultaneously liquid-cool a plurality of heating elements, it is possible to suppress a decrease in cooling efficiency of the cooling unit on the downstream side, and as a result, improve the cooling efficiency of the plurality of heating elements. be able to. That is, according to the cooling device of the present embodiment, it is possible to simultaneously liquid-cool a plurality of heating elements and improve the cooling efficiency of the heating elements.
Here, when the guide portion 16 is provided, the present inventors improve the maximum flow velocity and the average flow velocity of the refrigerant to the second flow path unit 3 by 10% or more as compared with the case where the guide portion 16 is not provided. This has been confirmed by CFD (Computational Fluid Dynamics) calculation.

Regarding the shape factor such as the detailed installation place of the guide portion 16, its size, and the height occupied in the flow path, for example, the optimum shape can be designed based on the optimization study using the CFD calculation or the like.

Further, as the structure of the guide portion 16, for example, a structure including a protruding portion protruding from the side wall portion provided with the outlet of the flow passage A to the inner side of the first flow passage unit 2 can be cited. By disposing the guide portion 16 including such a protruding portion at the branch point C, the flow 15 toward the flow passage B (18) can be suppressed, and the second flow passage unit 3 on the downstream side can be suppressed. The amount of refrigerant in stream 14 towards can be increased.

Further, as the structure of the guide portion 16, for example, a structure including a protruding portion protruding in the vertical direction from the bottom of the branch point C can be cited. By disposing the guide portion 16 including such a protruding portion at the branch point C, the flow 15 toward the flow passage B (18) can be suppressed, and the second flow passage unit 3 on the downstream side can be suppressed. The amount of refrigerant in stream 14 towards can be increased.

The arrangement shape of the guide portion 16 does not depend on the shape of the refrigerant flow passage formed inside the resin flow passage 8. In the present embodiment, as the refrigerant flow passage (flow passage B) formed inside, as will be described later, a forward manifold portion and a reverse manifold portion formed at edges of two opposing sides, and both manifolds. A comb-tooth type flow path system consisting of a plurality of linear flow paths arranged in between, and a refrigerant inlet at one end of the meandering flow path on the opposite side of the first straight flow path forming the meandering flow path. The meandering flow path system in which the refrigerant distribution port to the adjacent second flow path unit is formed can be mentioned as a preferred embodiment. It is preferable that the guide portion 16 is disposed near the refrigerant distribution port 82 so as to obstruct the flow 15 toward the flow path B (18).
In the comb-tooth-shaped flow passage according to the present embodiment, as to the threshold height, the threshold width, and the flow passage width of the plurality of comb-tooth-shaped flow passages branched from the forward manifold as described later, It is appropriately set according to the amount of heat generation. However, if you want to strongly cool a specific position in the metal cooling panel 9 of the unit cooling unit, if you want to push the surface of the metal cooling panel 9 of the unit cooling unit to cool at a uniform temperature, or arrange multiple units with one pump. The sill height, the sill width, and the flow passage width can be arbitrarily adjusted for a specific purpose such as when a cooling device including the cooling unit is cooled between the cooling units without uneven temperature. For example, in the case of a cooling device including a configuration in which two cooling units are arranged in series according to the present embodiment, a plurality of comb teeth of the cooling unit of the former stage are provided in order to prevent the cooling ability of the cooling unit of the latter stage from being deteriorated. The flow channel can have an aspect in which the flow channel width is narrowed at the flow channel inlet, preferably in all comb-shaped channels.

The cooling device according to the present embodiment has a metal cooling panel 9 and a flow path unit or a resin flow path in order to ensure strict water tightness in which the refrigerant does not leak even when used in a severe environment. 8 is preferably tightly and firmly joined. A preferable joining method is a method selected from an adhesive method, a heat welding method and a mechanical fastening method, or a method of combining two or more kinds. For example, a method of joining the flow path unit or the resin flow path 8 and the metal cooling panel 9 via an adhesive is a bonding using an adhesive method. After forming a resin bank portion on the surface of the metal cooling panel 9 by means of insert molding or the like, and then joining a resin flow path on the resin bank portion by welding means, a resin-metal heat treatment method is used. This is a method of combining and using a welding method and a resin-resin heat welding method. A method of joining the resin flow path 8 and the metal cooling panel 9 via an adhesive and further mechanically fastening is a joining means that combines a heat welding method and a mechanical fastening method.
As the adhesive used in the above-mentioned joining means, known natural adhesives and synthetic adhesives can be used without limitation, but synthetic adhesives are preferable from the viewpoint of the durability of the adhesive force.
Synthetic adhesives can be classified into thermoplastic adhesives, thermosetting adhesives, and elastomers, but thermosetting adhesives are preferable from the viewpoint of adhesive strength. The thermosetting adhesive may be a room temperature reaction type adhesive (one component type) or a heat curing type adhesive (two component type).
What kind of adhesive is used is a matter for a person skilled in the art to arbitrarily determine depending on circumstances such as what kind of material a cooling device having what kind of characteristics is formed.

In the cooling device according to the present embodiment, the mechanical fastening between the metal cooling panel 9 and the flow channel unit or the resin flow channel 8 is specifically mechanical fastening by rivets or screwing. In this case, it is preferable that at least the outer peripheral end of the metal cooling panel 9 and the flow path unit or the resin flow path 8 be riveted or screwed. It is also possible to rivet or screw not only the outer peripheral end of the metal cooling panel 9 but also the periphery of the central part of the metal cooling panel 9 to the extent that the flow of the flow path is not disturbed. When mechanically joining the outer peripheral ends of the metal cooling panel 9, for example, when the metal cooling panel 9 has a rectangular shape in plan view, at least the four corners of the outer peripheral portion are preferably mechanically joined. After forming a resin base for mechanical joining not only on the outer peripheral edge of the metal cooling panel 9 but also in the vicinity of the central portion of the metal cooling panel 9, the machine of the metal cooling panel 9 and the resin flow path 8 is formed. You may join them. In this case, by arranging the position of the resin base portion in the flow channel so that the flow channel causes turbulence, it is possible to contribute to equalizing the temperature of the refrigerant passing through the flow channel. There are cases.
Further, in the cooling device according to the present embodiment, in addition to being bonded (adhesive method) via the adhesive layer 12 as described above, the metal cooling panel 9 and the flow channel unit or the resin flow channel 8 are provided. It is preferable that and are mechanically joined by rivets or screwing. By firmly joining the resin-made flow passage 8 and the metal-made cooling panel 9 in this manner, it is possible to more effectively suppress the liquid leakage of the refrigerant flowing through the flow passage unit or the resin-made flow passage 8.

In this embodiment, the average thickness of the adhesive layer 12 in the case of joining using an adhesive method is, for example, 0.5 to 5000 μm, preferably 1.0 to 2000 μm, and more preferably 10 to 1000 μm. When the average thickness is equal to or more than the above lower limit value, the adhesive strength between the metal cooling panel 9 and the resin flow channel 8 can be further improved, and when the average thickness is equal to or less than the above upper limit value, during the curing reaction. The amount of residual strain that occurs can be suppressed.

In the cooling device according to the present embodiment, a primer layer may be provided between the flow path unit or the resin flow path 8 and the adhesive layer 12, and between the adhesive layer 12 and the metal cooling panel 9. The primer layer is not particularly limited, but is usually made of a resin material containing a resin component forming the resin layer. The resin material for the primer layer is not particularly limited, and known materials can be used. Specific examples include polyolefin-based primers, epoxy-based primers, urethane-based primers and the like. These primers may be used in combination of two or more kinds including the multi-layer mode.

The cooling device according to the present embodiment is manufactured by superposing the flow path forming surface of the flow path unit or the resin flow path 8 and the peripheral edge portion of the metal cooling panel 9 and joining them by, for example, the adhesive layer 12. can do. Specifically, there is a method in which an adhesive is applied to the adhesive surface on the resin flow path 8 side and/or the adhesive surface on the metal cooling panel 9 side, and then both are adhered. The bonding conditions vary depending on what type of adhesive is used, but for example, conditions of about 0.1 minutes to 7 days at room temperature to 150° C. can be exemplified. The bonding may be performed under pressure. When adhering under pressure, the pressure is, for example, about 0.01 to 1 MPa.

The resin flow path 8 according to the present embodiment is preferably a molded body of a thermoplastic resin composition. The thermoplastic resin composition contains a thermoplastic resin as a resin component, and may further contain a filler if necessary.
The thermoplastic resin is not particularly limited, for example, polyolefin resin, polar group-containing polyolefin resin, polymethacrylic resin such as polymethyl methacrylate resin, polyacrylic resin such as polymethyl acrylate resin, polystyrene resin, Polyvinyl alcohol-polyvinyl chloride copolymer resin, polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl formal resin, polymethylpentene resin, maleic anhydride-styrene copolymer resin, polycarbonate resin, polyphenylene ether resin, polyether ether ketone resin , Aromatic polyetherketone such as polyetherketone resin, polyester resin, polyamide resin, polyamideimide resin, polyimide resin, polyetherimide resin, styrene elastomer, polyolefin elastomer, polyurethane elastomer, polyester elastomer, polyamide -Based elastomer, ionomer, aminopolyacrylamide resin, isobutylene maleic anhydride copolymer, ABS, ACS, AES, AS, ASA, MBS, ethylene-vinyl chloride copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl acetate-vinyl chloride graft polymer, Ethylene-vinyl alcohol copolymer, chlorinated polyvinyl chloride resin, chlorinated polyethylene resin, chlorinated polypropylene resin, carboxyvinyl polymer, ketone resin, amorphous copolyester resin, norbornene resin, fluoroplastic, polytetrafluoroethylene resin, fluorine Ethylene polypropylene resin, PFA, polychlorofluoroethylene resin, ethylene tetrafluoroethylene copolymer, polyvinylidene fluoride resin, polyvinyl fluoride resin, polyarylate resin, thermoplastic polyimide resin, polyvinylidene chloride resin, polyvinyl chloride resin, polyacetic acid Vinyl resin, polysulfone resin, polyparamethylstyrene resin, polyallylamine resin, polyvinyl ether resin, polyphenylene oxide resin, polyphenylene sulfide (PPS) resin, polymethylpentene resin, oligoester acrylate, xylene resin, maleic acid resin, polyhydroxybutyl Examples thereof include rate resins, polysulfone resins, polylactic acid resins, polyglutamic acid resins, polycaprolactone resins, polyethersulfone resins, polyacrylonitrile resins, and styrene-acrylonitrile copolymer resins. These thermoplastic resins may be used alone or in combination of two or more.

Among these, as the thermoplastic resin, the adhesive strength between the resin flow path 8 and the adhesive layer 12 and the adhesive strength between the metal cooling panel 9 and the adhesive layer 12 can be more effectively obtained, or the refrigerant is From the viewpoint of effectively expressing resistance to chemicals contained, one or more selected from polyolefin resins, polyester resins, polyamide resins, fluorine resins, polyarylene ether resins and polyarylene sulfide resins or Two or more types of thermoplastic resins are preferably used.

In the thermoplastic resin composition according to the present embodiment, an arbitrary component and a filler can be used together from the viewpoint of improving the mechanical properties of the resin flow path 8 and adjusting the difference in linear expansion coefficient. As the filler, for example, one kind or two or more kinds can be selected from the group consisting of glass fiber, carbon fiber, carbon particles, clay, talc, silica, mineral and cellulose fiber. Of these, one or more selected from glass fiber, carbon fiber, talc, and mineral are preferable. Further, a heat dissipation filler typified by alumina, forsterite, mica, alumina nitride, boron nitride, zinc oxide, magnesium oxide and the like can be used. The shape of these fillers is not particularly limited and may be any shape such as fibrous, particulate or plate-like, but as will be described later, a fine concavo-convex structure is formed on the surface of the metallic cooling panel 9. In this case, it is preferable to use a filler having a size that allows it to enter the recess.
When the thermoplastic resin composition contains a filler, the content thereof is preferably 1 part by mass or more and 100 parts by mass or less, more preferably 5 parts by mass or more and 90 parts by mass with respect to 100 parts by mass of the thermoplastic resin. It is not more than 10 parts by mass, and particularly preferably not less than 10 parts by mass and not more than 80 parts by mass.

It is also possible to use a thermosetting resin composition as the resin flow path 8 according to the present embodiment. The thermosetting resin composition is a resin composition containing a thermosetting resin. Examples of the thermosetting resin include phenol resin, epoxy resin, unsaturated polyester resin, diallyl phthalate resin, melamine resin, oxetane resin, maleimide resin, urea (urea) resin, polyurethane resin, silicone resin, and benzoxazine ring. Resins, cyanate ester resins and the like are used. These may be used alone or in combination of two or more.
Among these, a thermosetting resin containing one or more selected from the group consisting of a phenol resin, an epoxy resin and an unsaturated polyester resin from the viewpoints of heat resistance, processability, mechanical properties, adhesiveness, rust resistance and the like. The composition is preferably used. The content of the thermosetting resin in the thermosetting resin composition is preferably 15 parts by mass or more and 60 parts by mass or less, more preferably 25 parts by mass or more and 50 parts by mass, when the total amount of the resin composition is 100 parts by mass. It is below the mass part. The residual component is, for example, a filler, and as the filler, for example, the above-mentioned filler can be used.

Any known method can be used without limitation as a method for molding the resin flow path 8, and examples thereof include injection molding, extrusion molding, heat press molding, compression molding, transfer molding, cast molding, laser welding molding, and reaction injection molding (RIM). Molding), rim molding (LIM molding), thermal spray molding and the like. Among these, the injection molding method is preferable as the molding method of the resin flow path 8 from the viewpoint of productivity and quality stability.

The resin flow path 8 according to the present embodiment has, for example, a bottom portion and a side wall portion provided upright on the bottom portion. The shape of the resin-made flow path 8 is preferably composed of a bottom portion having a rectangular shape in plan view and four side wall portions having a rectangular frame shape in plan view, which are erected on the bottom portion, and a plurality of flow paths for the coolant are formed on the bottom portion. Is formed with a threshold barrier and a guide portion 16 for dividing the refrigerant. The top surface of the barrier is preferably in contact with the surface of the metal cooling panel 9 opposite to the surface on which the heating element 10 is mounted. Then, the top surface and the metal cooling panel 9 may be joined by an adhesive.
A plurality of groove portions are formed on the entire bottom surface of the resin-made flow passage 8 on the metal cooling panel 9 side according to the present embodiment, and the groove portions serve as a coolant flow passage by closely contacting with the metal cooling panel 9 surface. Create a function.

The present invention is not limited to the structure of the flow passage in the flow passage unit, but as a preferable example, the refrigerant passage formed inside has a forward manifold portion and a reverse manifold portion formed on two opposing sides. And a system consisting of a plurality of flow channels arranged in both manifolds (may be referred to as "comb-shaped flow channel system" in the following description), and a single coolant flow channel formed inside. The method including the above-mentioned flow path (which may be referred to as “a meandering flow path method” in the following description).
Further, examples of other structures of the flow path in the flow path unit include the structures (a) to (e) shown in FIG. 7, for example. 7A to 7E, the flow path at the right end is the flow path A, and the other flow paths are the flow path B.

The resin flow path 8 according to the present embodiment is provided with a refrigerant inlet 81 and a refrigerant distribution port 82. Usually, in the comb-tooth type flow path system, a coolant inlet port 81 is formed at one end of the forward direction manifold portion, and a coolant distribution port 82 to the second flow channel unit 3 is formed at the other end of the forward direction manifold. On the other hand, in the meandering flow path system, the refrigerant inlet 81 is provided at one end of the meandering passage, and the side of the first straight passage forming the meandering passage, that is, the passage A where the refrigerant inlet 81 is provided. A refrigerant distribution port 82 is formed on the opposite side.

It is preferable that a comb-shaped or lattice-shaped reinforcing rib is formed on the surface of the resin flow path 8 according to the present embodiment that is opposite to the surface on the metal cooling panel 9 side. Such reinforcing ribs are preferably made of the same material as the resin flow path 8. By providing the reinforcing ribs, it is possible to protect the structure of the resin flow path 8 from external stress. Further, by setting the rib height of the reinforcing rib to be high, a sufficient space can be created between the reinforcing channel and the ground surface of the resin flow path 8, and as a result, the heat insulating effect of the resin flow path 8 can be further improved. , It may be possible to extend the duration of the cooling function. Alternatively, it may be possible to further improve the heat insulating effect of the resin flow path 8 by narrowing the space between the reinforcing ribs, and as a result, to extend the duration of the cooling function.

The flow passage forming surface side of the resin flow passage 8 according to the present embodiment is covered with a metal cooling panel 9. Each flow path unit may be covered with one metal cooling panel 9 for each flow path unit, or a plurality of large area flow path units may be entirely covered with one metal cooling panel 9. May be covered with.
The metal cooling panel 9 according to the present embodiment has, for example, a rectangular shape in plan view. The metal cooling panel 9 plays two roles of diffusing the heat from the heating element and efficiently transmitting the heat to the refrigerant flowing in the resin flow path 8. Therefore, it is preferable that the material of the metal cooling panel 9 has excellent heat conductivity. From such a viewpoint, an aluminum-based metal or a copper-based metal is used as the metal species forming the metal cooling panel 9, and specifically, the metal cooling panel 9 is made of an aluminum member, an aluminum alloy member, or a copper member. It is preferable to be composed of at least one member selected from the group consisting of members and members made of copper alloy. The average thickness of the metal cooling panel 9 is, for example, 0.5 mm to 30 mm, preferably 0.5 mm to 20 mm, in consideration of heat transfer property, strength, and lightness.

It is preferable that at least the surface of the metal cooling panel 9 joined to the resin flow path 8 is degreased. Further, it is more preferable that a fine concavo-convex structure is formed on at least a part of the surface of the metallic cooling panel 9, or a hydrophilic group is formed, and a hydrophilic group is further formed on the surface on which the fine concavo-convex structure is formed. More preferably, it is formed.
Further, it is preferable that the side wall portion of the resin flow path 8 is located on the fine concavo-convex structure formed on at least a part of the surface of the metal cooling panel 9. By doing so, the bonding strength between the resin flow path 8 and the metal cooling panel 9 can be increased, and as a result, the leakage of the refrigerant can be further suppressed and the reliability of mechanical strength and durability can be further improved. An excellent cooling device can be obtained.

In the present embodiment, the size (depth, hole diameter, hole distance, etc.) of the fine concavo-convex structure formed on the surface of the metal cooling panel 9 is not particularly limited, but measured according to JIS B 0601. The ten-point average roughness R _zjis is, for example, 1 μm or more, preferably 1 μm or more and 1 mm or less, and more preferably 3 μm or more and 100 μm or less.
There is no particular limitation on the method of forming the fine concavo-convex structure on the surface of the metal cooling panel 9, but for example, an inorganic base aqueous solution such as sodium hydroxide and/or an inorganic acid aqueous solution such as hydrochloric acid or nitric acid is used to cool the metal. Method for immersing panel 9; Method for treating metal cooling panel 9 by anodizing method; Metal cooling panel with die punch having fine concavo-convex structure produced by mechanical cutting such as diamond abrasive grain grinding or blasting Method for forming a fine concavo-convex structure on the surface of the metal cooling panel 9 by pressing on the surface of 9; Method for forming a fine concavo-convex structure on the surface of the metal cooling panel 9 by sandblasting, knurling, or laser processing; International Publication Examples thereof include a method of immersing the metal cooling panel 9 in an aqueous solution of at least one selected from hydrated hydrazine, ammonia, and a water-soluble amine compound, as disclosed in Japanese Patent Publication No. 2009/31632.

In the method described above, when the dipping method is adopted, the fine concavo-convex structure is not limited to the joint surface of the metal cooling panel 9 with the resin flow path 8, but the entire surface of the metal cooling panel 9. Although a fine concavo-convex structure will be formed in the above, such an embodiment does not impair the effects of the present invention.

In the present embodiment, specific examples of the hydrophilic group that covers the surface of the metal cooling panel 9 include a hydroxyl group and a silanol group. The introduction of hydrophilic groups such as hydroxyl groups on the surface of the metal cooling panel 9 is performed by, for example, a plasma surface modification technique developed by Plasmatreat, which appropriately combines open air (trademark) and plasmaplus (trademark) techniques. It can be achieved by Further, the introduction of silanol groups onto the surface of the metal cooling panel 9 can be performed by, for example, an itro treatment (silica flame treatment) as described in Japanese Patent No. 3557194. In order to further introduce a hydroxyl group or a silanol group to the surface of the metal cooling panel 9 on which the fine concavo-convex structure is formed, once the fine concavo-convex structure is formed on the metal surface by the above method, plasma or itro treatment is performed. I'll do it.

1'Unit unit (cooling unit) that constitutes a cooling device
2 1st flow path unit 3 2nd flow path unit 4 3rd flow path unit 5 4th flow path unit 8 Resin flow path 81 Refrigerant injection port 82 Refrigerant distribution port (flow path A outlet)
83 Refrigerant Merge Port 84 Refrigerant Recovery Port 9 Metal Cooling Panel 10 Heating Element 12 Adhesive Layer 13 Flow Before Dividing 14 Flow toward Second Channel Unit on Downstream Side 15 Flow toward Flow Path B 16 Guide Part 17 Flow Path A
18 Channel B
19 Junction C
20 structures

Claims (7)

A cooling device comprising a metal cooling panel for cooling a heating element, and a resin flow path for joining the metal cooling panel and flowing a refrigerant,
The resin flow path includes at least a first flow path unit and a second flow path unit,
The first flow channel unit has a flow channel A for guiding the coolant from the first flow channel unit to the second flow channel unit, and the coolant over the entire first flow channel unit. A flow path B for guiding,
Of the branch points of the flow channel A and the flow channel B, a branch point C located immediately before the outlet of the flow channel A has a guide portion for suppressing the flow of the refrigerant toward the flow channel B. Cooling device provided. The cooling device according to claim 1,
The cooling device having the bottom part and the side wall part standing on the bottom part. The cooling device according to claim 1 or 2,
A cooling device in which the metal cooling panel and the resin flow path are joined by one or more means selected from an adhesive method, a heat welding method, and a mechanical fastening method. The cooling device according to any one of claims 1 to 3,
A fine concavo-convex structure is formed on at least a part of the surface of the metal cooling panel,
A cooling device in which a side wall portion of the resin flow path is located on the fine concavo-convex structure. The cooling device according to any one of claims 1 to 4,
The said guide part is a cooling device containing the protrusion part which protruded from the side wall part in which the exit of the said flow path A was provided to the inner side of the said 1st flow path unit. The cooling device according to any one of claims 1 to 5,
A cooling device in which the metal cooling panel is composed of at least one member selected from the group consisting of an aluminum member, an aluminum alloy member, a copper member, and a copper alloy member. A heating element,
A cooling device according to any one of claims 1 to 6,
Equipped with
A structure in which the heating element is arranged on the surface of the metallic cooling panel in the cooling device.