JP4172243B2 - Method for manufacturing plasma display panel - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a plasma display panel used for a display display or the like.
[0002]
[Prior art]
In order to reduce the cost of a plasma display panel (hereinafter referred to as PDP), it is required to shorten the lead time, reduce fixed costs, and improve productivity of each manufacturing facility.
[0003]
In particular, in manufacturing equipment, the time required for substrate handling and positioning can be shortened, and the mass productivity of small panels can be improved. Therefore, a so-called multi-panel manufacturing method of PDP is considered as an effective means. (For example, refer nonpatent literature 1).
[0004]
This is because a structure to be formed on the front plate of the PDP is formed for each of a plurality of regions of a so-called mother substrate, and then the mother substrate is divided into a plurality of regions, thereby forming a plurality of front plates. Similarly, a structure to be manufactured in a lump, and similarly, a structure to be formed on the back plate of the PDP is formed for each of a plurality of regions of another mother substrate, and then the mother substrate is formed for each of the plurality of regions. By dividing, a plurality of back plates are manufactured at once, and there is an advantage that a front plate or a back plate can be manufactured with high productivity.
[0005]
Here, for dividing the mother substrate, for example, a method of providing a groove for dividing each divided region in the mother substrate and cleaving according to the groove is adopted.
[0006]
[Non-Patent Document 1]
Published by Nikkei BP, "Flat panel display 2002, strategy", p138
[0007]
[Problems to be solved by the invention]
However, the PDP manufactured by the manufacturing method as described above is more likely to have a lighting failure or a breakdown voltage failure than a PDP manufactured by separately manufacturing a front plate and a back plate for each unit. A problem occurred.
[0008]
As a result of various experiments and examinations by the present inventors for this problem, the above-mentioned defects are caused by foreign matters mixed in the PDP even though the manufacturing process of the PDP is performed in a clean room. As a result of analysis, the foreign material is the same material as the mother board, that is, a part of the mother board, and the mixing route is a cullet by chipping or the like when the back plate is taken from the mother board. It was found that it was attached to the PDP structure such as the barrier ribs and phosphor layers formed on the mother substrate, and was brought into the PDP as the manufacturing process proceeded. In particular, when the cullet is adhered on the phosphor layer, the adverse effect on the image display is increased, and at the same time, the phosphor layer is a soft structure with the material particles bound together, so it is very difficult to remove the cullet. There is a problem of being.
[0009]
The present invention has been made in view of the above problems, and an object of the present invention is to realize a method for manufacturing a PDP capable of manufacturing a PDP capable of performing good image display by multi-cavity. And
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the method of manufacturing a plasma display panel according to the present invention provides a back plate obtained by chamfering from a mother substrate having a plasma display panel structure. After cleaning and removing cullet, A phosphor layer is formed.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
That is, the invention according to claim 1 of the present invention provides a back plate obtained by taking multiple faces from a mother substrate provided with a plasma display panel structure. After cleaning and removing cullet, A method for producing a plasma display panel, comprising forming a phosphor layer.
[0012]
The invention described in claim 2 is characterized in that, in the invention described in claim 1, the multiple chamfering is performed by cleaving the mother substrate.
[0013]
Hereinafter, a method for manufacturing a PDP according to an embodiment of the present invention will be described.
[0014]
FIG. 1 is a plan view showing a schematic structure of a PDP manufactured by a method of manufacturing a PDP according to an embodiment of the present invention. FIG. 2 is a perspective view showing a partial cross section in the image display area of the PDP manufactured by the method of manufacturing a PDP according to the embodiment of the present invention.
[0015]
As shown in FIG. 1, the PDP 100 includes a front glass substrate 101 (not shown), a rear glass substrate 102, N display electrodes 103, and N display scan electrodes 104 ( A number), M address electrode group 107 (indicated by the number when M is shown), an airtight seal layer 121 indicated by diagonal lines, and the like. It has an electrode matrix, and discharge cells are formed at intersections between the display scan electrodes 104 and the address electrodes 107.
[0016]
As shown in FIG. 2, the PDP 100 includes a front plate 108 in which a display electrode 103, a display scan electrode 104, a dielectric glass layer 105, and an MgO protective layer 106 are arranged on one main surface of a front glass substrate 101, and a rear surface. An airtight seal layer 121 (FIG. 1) includes an address electrode 107, a dielectric glass layer 109, a partition 110, and a back plate 112 on which phosphor layers 111R, 111G, and 111B are arranged on one main surface of the glass substrate 102. The discharge gas is sealed in the discharge space 122 formed between the front plate 108 and the back plate 112 so as to form the display region 123 (FIG. 1).
[0017]
Here, one of the display electrode 103, the display scan electrode 104, the dielectric glass layer 105, the MgO protective layer 106, the address electrode 107, the dielectric glass layer 109, the partition 110, and the phosphor layers 111R, 111G, and 111B. The part or the whole is referred to as a PDP structure 113.
[0018]
The back plate 112 refers to the state of the back glass substrate 102, the state where the address electrode 107 is formed thereon, the state where the dielectric glass layer 109 is formed, the state where the partition 110 is further formed, and the phosphor layer 111R. , 111G, and 111B are shown.
[0019]
FIG. 3 shows a partial cross-sectional view of the PDP 100. The gap dimension W of the partition 110 is about 130 μm to 240 μm in the case of an HD-TV of 32 inches to 50 inches.
[0020]
The thickness L of the phosphor layers 111R, 111G, and 111B between the barrier ribs 110 and 110 in the stacking direction on the address electrodes 107 is approximately 8 to 25 times the average particle diameter of the respective color phosphor particles. Is desirable. That is, the phosphor layers 111R, 111G, and 111B transmit the ultraviolet rays generated in the discharge space in order to ensure luminance (light emission efficiency) when the phosphor layers 111R, 111G, and 111B are irradiated with constant ultraviolet rays. It is desirable to maintain a thickness in which at least 8 layers, preferably 20 layers, of phosphor particles are laminated in order to absorb them completely, and if the thickness exceeds this, the luminous efficiency of the phosphor layers 111R, 111G, and 111B is almost the same. This is because it saturates, and when the thickness of about 20 layers is exceeded, the size of the discharge space 122 cannot be secured sufficiently. In addition, if the particle size is sufficiently small and spherical, such as phosphor particles obtained by the hydrothermal synthesis method, even if the number of layers is the same as when using non-spherical particles, the layer structure As the filling degree increases, the total surface area of the phosphor particles increases, so that the surface area of the phosphor particles contributing to the actual light emission in the phosphor layers 111R, 111G, and 111B increases and the luminous efficiency further increases.
[0021]
As shown in FIG. 4, the PDP 100 is connected to the PDP driving device 150 to constitute a plasma display device 160.
[0022]
When the plasma display device 160 is driven, the display driver circuit 153, the display scan driver circuit 154, and the address driver circuit 155 are connected to the PDP 100, and the display scan electrode 104 and the address in the discharge cell to be lit according to the control of the controller 152. After applying an address discharge between the electrodes 107 by applying them to the electrodes 107, a pulse voltage is applied between the display electrodes 103 and the display scan electrodes 104 to perform a sustain discharge. Due to this sustain discharge, ultraviolet rays are generated in the discharge cells, and the phosphor layers 111R, 111G, and 111B excited by the ultraviolet rays emit light so that the discharge cells are turned on. Depending on the combination of lighting and non-lighting of each color discharge cell An image is displayed.
[0023]
Next, a manufacturing method for the above-described PDP 100 will be described.
[0024]
First, the front plate 108 forms N display electrodes 103 and display scan electrodes 104 (only two are shown in FIG. 2) alternately and in parallel with the front glass substrate 101 in stripes. After that, the dielectric glass layer 105 is coated thereon, and an MgO protective layer 106 is formed on the surface of the dielectric glass layer 105.
[0025]
Here, the display electrode 103 and the display scan electrode 104 are electrodes made of, for example, silver, and are formed by applying a silver paste for electrodes by screen printing and then baking. The dielectric glass layer 105 is coated with a paste containing a lead-based glass material by screen printing, and then baked at a predetermined temperature for a predetermined time (for example, 560 ° C. for 20 minutes) to thereby obtain a predetermined layer thickness (approximately 20 μm). Examples of the paste containing the lead-based glass material include PbO (70 wt%), B ₂ O _Three (15 wt%), SiO ₂ (10 wt%), and Al ₂ O _Three A mixture of (5 wt%) and an organic binder (10% ethyl cellulose dissolved in α-terpineol) is used. Here, the organic binder is obtained by dissolving a resin in an organic solvent. In addition to ethyl cellulose, an acrylic resin can be used as the resin, and butyl carbitol can be used as the organic solvent. Furthermore, you may mix a dispersing agent (for example, glyceryl trioleate) in such an organic binder. The MgO protective layer 106 is made of magnesium oxide (MgO), and is formed to have a predetermined thickness (about 0.5 μm) by, for example, sputtering or CVD (chemical vapor deposition).
[0026]
Further, the back plate 112 is obtained by taking a mother board with multiple faces. As a multi-chamfering method, for example, a case of cleaving will be described below. Here, the cleaving means that the groove is made of a brittle material such as glass in which grooves such as cracks and scribe marks are formed. A cutting method for dividing a material or the like shall be indicated.
[0027]
FIG. 5 is a schematic plan view of the mother substrate 1. The groove 2 can be divided into three regions 3a, 3b, and 3c, which are the screen size of the PDP 100 to be manufactured, and the material is, for example, a glass material. Then, with respect to the mother substrate 1, each of the regions 3a, 3b, and 3c after cleaving can function as the back plate 112, and each of the regions 3a, 3b, and 3c before cleaving is a PDP structure 113. After the address electrodes 107 are formed in parallel and in stripes, the top thereof is covered with a dielectric glass layer 109, and partition walls 110 are also formed in stripes in parallel between the address electrodes 107.
[0028]
Here, the address electrode 107 is an electrode made of silver, and is formed by applying a silver paste for an electrode by screen printing and baking it. The dielectric glass layer 109 is formed by applying a paste containing a lead-based glass material by a screen printing method and baking the paste. The partition 110 is also formed by repeatedly applying a paste containing a lead-based glass material at a predetermined pitch by a screen printing method and then baking the paste.
[0029]
Then, the mother substrate 1 on which the PDP structure 113 is formed is cleaved according to the grooves 2 to obtain three back plates 112 each having the back glass substrate 102 in each of the regions 3a, 3b, and 3c.
[0030]
As described above, the above explanation is for the case of cleaving as an example of multi-chamfering, and the groove 2 is not required in the mother substrate 1 when the multi-chamfering is performed without laser cutting, for example, by laser cutting. There is a case.
[0031]
Here, immediately after the cleaving, the cullet generated by the cleaving may adhere to the PDP structure 113 including the partition 110 formed on the back plate 112. Therefore, the back plate 112 obtained by cleaving the mother substrate 1 is cleaned. For the vicinity of the end of the back plate 112, brush cleaning and water cleaning with a megasonic ultrasonic nozzle are effective. For the cullet entering the region sandwiched between the partition walls 110, ultrasonic cleaning is performed in a state where the substrate is immersed in pure water or cleaning liquid, or flowing water cleaning using a megasonic ultrasonic nozzle is effective. Further, removal by blowing compressed air is also effective, and this may be combined with the above-described cleaning method.
[0032]
Thus, after removing the cullet adhering to the back plate 112, it is dried as necessary. Further, for example, if the presence or absence of cullet is confirmed by a laser type foreign substance inspection apparatus or the like and then put into the PDP manufacturing process, the yield can be improved. In addition, if a defect inspection of the partition 110 is performed at this stage, defects in the partition 110 can be found before the phosphor layers 111R, 111G, and 111B are formed in the next process, and the yield can be improved. .
[0033]
Then, phosphor layers 111R, 111G, and 111B, which are PDP structures 113, are applied between the partition walls 110 on the back plate 112 treated as described above.
[0034]
For the phosphors 110R, 110G, and 110B, paste-like phosphor ink made of red (R), green (G), and blue (B) phosphor particles and an organic binder is used between the partition walls 110, for example, using a nozzle. This is fired at a temperature of 400 ° C. to 590 ° C. to burn off the organic binder, thereby forming a structure in which phosphor particles are bound.
[0035]
Here, the phosphor ink is prepared by mixing phosphor particles of each color, a binder, and a solvent so as to be 1500 to 30000 centipoise (CP). If necessary, a plasticizer, a dispersant ( 0.1 to 5 wt%) may be added.
[0036]
As red phosphors to be prepared in this phosphor ink, (Y, Gd) _1-X BO _Three : Eu _X Or Y _2-X O _Three : Eu _X The compound represented by these is used. These are compounds in which part of the Y element constituting the base material is substituted with Eu. Here, the substitution amount X of the Eu element with respect to the Y element is preferably in the range of 0.05 ≦ X ≦ 0.20. If the substitution amount is larger than this, the luminance is increased, but the luminance is significantly deteriorated. On the other hand, when the amount is less than this substitution amount, the composition ratio of Eu, which is the emission center, is lowered, the luminance is lowered, and the phosphor cannot be used.
[0037]
As the green phosphor, Ba _1-X Al ₁₂ O ₁₉ : Mn _X Or Zn _2-X SiO _Four : Mn _X The compound represented by these is used. Ba _1-X Al ₁₂ O ₁₉ : Mn _X Is a compound in which a part of the Ba element constituting the base material is substituted with Mn, and Zn _2-X SiO _Four : Mn _X Is a compound in which a part of Zn element constituting the base material is substituted with Mn. Here, the substitution amount X of Mn element with respect to Ba element and Zn element is preferably in the range of 0.01 ≦ X ≦ 0.10 for the same reason as described for the red phosphor.
[0038]
As the blue phosphor, Ba _1-X MgAl _Ten O ₁₇ : Eu _X Or Ba _1-X MgAl ₁₆ O ₂₇ : Eu _X The compound represented by these is used. Ba _1-X MgAl _Ten O ₁₇ : Eu _X , Ba _1-X MgAl ₁₆ O ₂₇ : Eu _X Is a compound in which a part of the Ba element constituting the base material is substituted with Eu. Here, the substitution amount X of Eu element with respect to Ba element is 0.03 ≦ X ≦ 0.20 for the former blue phosphor and 0.03 ≦ X ≦ 0 for the latter blue phosphor for the same reason as above. .20 is preferable.
[0039]
As the binder to be prepared in the phosphor ink, hydroxypropyl cellulose, hydroxyethyl cellulose, ethyl hydroxyethyl cellulose, carboxymethyl cellulose, polyvinyl alcohol, polyvinyl ether, ethyl cellulose, acrylic resin, etc. having an average molecular weight of 30,000 to 100,000 are used. 0.1 to 10 wt% is mixed), the solvent is an insoluble solvent such as α-terpineol and butyl carbitol, and the polyhydric alcohol derivative is ethylene glycol, ethylene glycol monoacetate, ethylene Glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, 3-methoxy-3-methylbutano , Allyl alcohol, isopropyl alcohol, ethanol, glycidol, tetrahydrofurphylyl alcohol, t-butanol, furfuryl alcohol, propargyl alcohol, 1-propanol, methanol, 3-methyl-1-butyn-3-ol, 15-crown -5,18-crown-6, propylene oxide, 1,4-dioxane, dipropyl ether, dimethyl ether, tetrahydrafuran, acetaldehyde, diacetone alcohol, methyl lactate, γ-butyrolactone, glycerin, glycerin 1,2-dimethyl ether, Glycerol 1,3-dimethyl ether, glycerin 1-acetate, 2-chloro-1,3-propanediol, 3-chloro-1,2-propanediol, diethylene glycol, diethylene glycol Free mixing with water like ruethyl methyl ether, diethylene glycol chlorohydrin, diethylene glycol diacetate, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, dipropylene glycol, dipropylene glycol monomethyl ether, triethylene glycol, etc. Solvents that can be used can be used. A polymer such as PMA or PVA can be used as the binder, and water of an organic solvent such as diethylene glycol or methyl ether can be used as the solvent. If necessary, dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diheptyl phthalate, di-n-octyl phthalate, di-2-ethylhexyl phthalate, octyldecyl phthalate, diisodecyl phthalate, phthalic acid Butyl benzyl, butyl oleate, diethylene glycol dibenzoate, butyl phthalyl butyl glycolate, tributyl acetyl citrate, methyl abietate, dibutyl sebacate, 2-ethylhexine sebacate, 2-nitrobiphenyl, dinonylnaphthalene, diazeylate Any one or more plasticizers of 2-ethylhexyl may be added.
[0040]
The front plate 108 and the back plate 112 obtained as described above are overlapped so that the display electrode 103 and the display scan electrode 104 of the front plate 108 and the address electrode 107 of the back plate 112 are orthogonal to each other, and the peripheral edge of the panel The glass for sealing is inserted, and this is baked at, for example, about 450 ° C. for 10 to 20 minutes to form the hermetic seal layer 121 (FIG. 1).
[0041]
Then, the inside of the discharge space 122 is once vacuumed (for example, 1.1 × 10 10 ^-Four After exhausting to Pa), the PDP 100 is completed by enclosing a discharge gas (for example, He—Xe-based or Ne—Xe-based inert gas) at a predetermined pressure.
[0042]
According to the PDP manufacturing method described above, the structure of the PDP formed on the back plate 112 is the cullet that causes the PDP failure, which occurs when the back plate 112 is obtained from the mother substrate 1. Even if it adheres to the object 113, it is before the formation of the phosphor layers 111R, 111G, and 111B, so that it can be removed by sufficiently washing without worrying about damage to the phosphor layers 111R, 111G, and 111B. Is possible. Then, after sufficient cleaning, the phosphor layers 111R, 111G, and 111B are formed and overlapped with the front plate 108 to produce a PDP. Therefore, no cullet is brought into the PDP, and the phosphor Since no cullet adheres to the layers 111R, 111G, and 111B, a PDP capable of displaying an excellent image can be realized. That is, it is possible to realize a PDP manufacturing method capable of manufacturing a PDP capable of performing good image display by multi-cavity.
[0043]
The back plate 112 is, for example, in a state in which the partition 110 is integrally formed on the back glass substrate 102 in advance. After the address electrode 107 and the dielectric glass layer 109 are formed between the partitions 110, the back plate 112 is cleaved. Then, even if the phosphor layers 111R, 111G, and 111B are formed on the back plate 112 obtained by cleaning, the address electrodes 107, the dielectrics, and the like are formed on the mother substrate 1 as PDP structures. Even if the partition glass 110 and the phosphor layers 111R, 111G, and 111B are formed after cleaving with the body glass layer 109 formed, the phosphor layers 111R, 111G, and 111B are formed on the back plate 112. Since it is after the multiple chamfering from the mother substrate 1 is formed, it is clear that it is within the scope of the present invention.
[0044]
Further, in the above description, cleaving is given as an example of multiple chamfering. However, even when cleaving other than cleaving, for example, by laser cutting, a cullet that adversely affects the PDP from the mother substrate 1 at the time of chamfering. The same effect can be obtained by the present invention if the cutting method is such that the dust is generated.
[0045]
Further, examples of the material of the mother substrate 1 include a glass material. However, the material is not particularly limited to this, and is a material that generates dust such as cullet that adversely affects the PDP when multi-sided. Then, the same effect can be acquired by this invention.
[0046]
Further, the front plate 108 may be produced by multi-chamfering similarly to the back plate 112.
[0047]
Hereinafter, experiments conducted for evaluating the performance of the PDP manufactured by the method of manufacturing the PDP of the present invention will be described.
[0048]
First, the address electrode 107, the dielectric layer 109, and the partition 110 were formed on the mother substrate 1. On the mother substrate 1, grooves 2 for cutting out the plurality of back plates 112 by cleaving were formed on the surface opposite to the surface on which the partition walls 110 were formed.
[0049]
The mother substrate 1 was cleaved by pressing the opposite surface on which the groove 2 was formed with an indenter or the like to apply a force. When the mother substrate 1 is cleaved, brittle fracture of the glass occurs, and dust such as cullet is generated, which adheres to the dielectric layer 109 covering the address electrodes 107 and the partition 110 on the back plate 112.
[0050]
In addition, there is a microcrack due to chipping at the edge of the cleaved back plate 112, and if the firing process is performed as it is, cracks may occur in the back glass substrate 102 starting from the microcrack. As a countermeasure, for example, the end face was chamfered.
[0051]
Next, the cullet generated by cleaving and end polishing was removed by dipping for about 3 minutes in an ultrasonic water tank in which an ultrasonic wave of about 100 kHz was generated. Here, in order to facilitate the removal of the cullet sandwiched between the partition walls 110, for example, it is effective to cause a water flow in the water tank or to swing the back plate 112 in the water tank.
[0052]
In this manner, the ultrasonically cleaned back plate 112 was dried for about 5 to 20 minutes in hot air at 100 to 120 ° C. after being simply dried with dry air, and cooled to about room temperature.
[0053]
At this time, the presence or absence of cullet was confirmed using a laser type foreign matter inspection apparatus, and when a cullet that could not be removed was found, it was effective to improve the quality of the panel. In addition, it is also effective to perform the shape inspection of the partition wall 110 and provide only the non-defective back plate 112 for the phosphor coating process, which is the next process, which improves the material usage rate of the expensive phosphor material. Met.
[0054]
Next, a method for forming a phosphor film by applying phosphor ink between the partition walls 110 by screen printing will be described.
[0055]
A screen plate having an opening corresponding to the shape of the partition wall 110 was disposed through the partition wall 110 and a slight gap. Then, the red phosphor ink was spread on the screen plate and spread with a squeegee, and ink was poured from the opening to fill the space between the partition walls 110 with the ink. Then, it was dried at a temperature of 100 ° C. to 120 ° C. for about 5 to 15 minutes and cooled to room temperature. Similarly, a green phosphor ink and a blue phosphor ink were applied and dried to form a red phosphor film, a green phosphor film, and a blue phosphor film.
[0056]
Here, before the formation of the phosphor layers 111R, 111G, and 111B, the cullet generated in the cleaving and polishing steps is sufficiently removed by washing, and there is no cullet between the barrier ribs 110 that causes a PDP defect. Therefore, the phosphor layers 111R, 111G, and 111B formed by pouring phosphor ink between the partition walls 110 have a uniform layer thickness. Further, it was confirmed that the screen plate was not torn due to cullet, and that the stability of the phosphor coating process could be ensured.
[0057]
It was also confirmed that no cullet was deposited on the formed phosphor layers 111R, 111G, and 111B.
[0058]
Then, it was confirmed that the PDP manufactured using the back plate 112 described above can display a good image.
[0059]
Here, the phosphor layers 111R, 111G, and 111B are formed by cleaving the plurality of back plates 112 from the mother substrate 1, performing cleaning for removing cullet, and then applying phosphor ink as shown in FIG. Application is performed while discharging or spraying from a dispenser nozzle using an apparatus.
[0060]
FIG. 6 is a schematic configuration diagram of the phosphor coating apparatus 200 used when forming the phosphor layers 111R, 111G, and 111B.
[0061]
As shown in the figure, the phosphor coating apparatus 200 includes a server 210, a pressure pump 220, a header 230, and the like, and the phosphor ink supplied from the server 210 that stores the phosphor ink is sent to the header by the pressure pump 220. 230 is pressurized and supplied. The header 230 is provided with an ink chamber 230 a and a nozzle 240, and the fluorescent plate ink that is pressurized and supplied to the ink chamber 230 a is continuously discharged from the nozzle 240. The diameter D of the nozzle 240 is desirably 30 μm or more for preventing clogging of the nozzle, and preferably not more than the interval W (about 130 μm to 200 μm) between the partition walls 110 for preventing protrusion from the partition wall during coating. It is set to 30 μm to 130 μm.
[0062]
The header 230 is configured to be linearly driven by a header scanning mechanism (not shown). By scanning the header 230 and continuously ejecting the phosphor ink 250 from the nozzle 240, the header 230 is placed on the rear glass substrate 102. The phosphor ink is uniformly applied to the grooves between the partition walls 110. Here, the viscosity of the phosphor ink used is maintained in the range of 1500 to 30000 CP at 25 ° C.
[0063]
The server 210 is provided with a stirring device (not shown), and the stirring prevents the precipitation of particles in the phosphor ink. The header 230 is integrally formed including the ink chamber 230a and the nozzle 240, and is manufactured by machine processing and electric discharge processing of a metal material.
[0064]
The method for forming the phosphor layer is not limited to the above method, and various methods such as a photolithographic method and a method of disposing a film mixed with phosphor particles can be used. it can.
[0065]
【The invention's effect】
As described above, according to the present invention, it is possible to realize a PDP manufacturing method capable of manufacturing a PDP capable of performing good image display by multi-cavity.
[Brief description of the drawings]
FIG. 1 is a plan view showing a schematic structure of a plasma display panel manufactured by a method for manufacturing a plasma display panel according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a partial cross section in the image display region of the plasma display panel manufactured by the plasma display panel manufacturing method according to the embodiment of the present invention.
3 is a partial cross-sectional view of the plasma display panel manufactured by the plasma display panel manufacturing method according to the embodiment of the present invention. FIG.
FIG. 4 is a block diagram showing a schematic configuration of a plasma display device.
FIG. 5 is a schematic plan view of a mother substrate used in a method for manufacturing a plasma display panel according to an embodiment of the present invention.
FIG. 6 is a schematic cross-sectional view of a phosphor coating apparatus used in a method for manufacturing a plasma display panel according to an embodiment of the present invention.
[Explanation of symbols]
1 Mother board
100 Plasma display panel
107 Address electrode
108 Front plate
109 Dielectric glass layer
110 Bulkhead
111R, 111G, 111B phosphor layer
112 Back plate
113 Structure of plasma display panel

Claims (2)

A method of manufacturing a plasma display panel, comprising: forming a phosphor layer after cleaning and removing a cullet from a back plate obtained by multi-chatting from a mother substrate having a plasma display panel structure .   The method for manufacturing a plasma display panel according to claim 1, wherein the multiple chamfering is performed by cleaving the mother substrate.

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