JP4171371B2 - Double-sided groove processing method for thin plate - Google Patents

Description

  The present invention relates to a double-sided groove processing method for a thin plate material including a V-groove substrate of an optical fiber array used in an optical switch.

As a V-groove substrate of an optical fiber array used in a conventional optical switch, for example, there are many ones having a single-sided groove disclosed in FIG. 2 of Patent Document 1, for example, but light having a double-sided groove as shown in FIG. In some cases, the V-groove substrates 1 and 2 of the fiber array are used in an overlapping manner, and the space 5 between the double-sided grooves 3a and 3b is used as an optical fiber housing groove. In this case, it is necessary to align the center lines 4 between the double-sided V-grooves 3a and 3b with the overlapping substrates 1 and 2. In general, as a conventional V-groove processing method for an optical fiber array having such a double-sided groove, for example, as shown in FIG. 4, first, the surface of the workpiece 10 in FIG. 3a was ground, and then the workpiece 10 was turned over, and the back surface of the workpiece 10 in (b) was ground into a number of back V-grooves 3b with reference to the end face edge 11b. The shape of the V-groove substrate workpiece 10 of the optical fiber array is, for example, 30 mm to 150 mm square, the thickness is about 1 mm, and the material is mostly silicon or glass.
Japanese Patent Laid-Open No. 2002-287052

  However, in the conventional V-groove processing method for an optical fiber array having double-sided grooves as shown in FIG. 4, the front and back surfaces of the workpiece 10 are made to have a number of front V-grooves 3a on the basis of the surface end face edge 11a and back face end face edge 11b. Since the back V-groove 3b has been ground, if there is an edge chip 12 as shown in the enlarged view of (c) on the back end edge 11b of the workpiece 10 in (b) (the top end edge 11a has However, the processing positions da and db at a predetermined distance with respect to the front V-groove 3a and the back V-groove 3b are shifted from the work end surface between the front surface and the back surface of the work 10, resulting in poor recognition of the edge of the image processing apparatus.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a workpiece machining reference position for a front V-groove and a back V-groove in common on the front and back surfaces of the workpiece in a method of machining an optical fiber array having a double-sided groove. Both sides of the thin plate material including the V-groove substrate of the optical fiber array, in which the processing positions of a predetermined distance from the front V-groove to the front V-groove are not shifted, and the edge recognition failure of the image processing apparatus does not occur. It is to provide a groove processing method.

  For this reason, the present invention provides a V-groove processing method for an optical fiber array having a double-sided groove, which is a block jig having a suction chuck surface on a vertical surface and includes a V-groove substrate of an optical fiber array sucked in a vertically upright state. A workpiece of a plate material is machined with two V-grooves for a workpiece machining reference position perpendicular to the vertical surface on the upper surface of the workpiece with a V-groove grinding wheel, and set on a V-grooving surface grinder of another optical fiber array, The image processing apparatus is made to recognize the lower end positions of the two workpiece machining reference position V-grooves as the workpiece machining reference positions on the surface of the workpiece, and the two lower end positions recognized by the image processing apparatus are set as the workpiece machining reference positions. After grinding a number of front V-grooves, the workpiece is turned upside down, and the lower end position of the same two workpiece machining reference position V-grooves on the back of the workpiece 10 is used as the workpiece machining reference position. A plurality of V-grooves are ground by using the lower end position recognized by the image processing apparatus as a workpiece processing reference position, and thereafter, to the lower end positions of the two workpiece processing reference position V-grooves. The problems of the conventional method described above have been solved by providing a method for processing a double-sided groove of a thin plate material including a V-groove substrate of an optical fiber array, which is characterized by being cut off.

With this configuration, according to the double-sided groove processing method of the present invention, a thin plate workpiece including a V-groove substrate of an optical fiber array adsorbed in a vertically upright state is perpendicular to the upper surface of the workpiece with a V-groove grinding wheel. Since the two V-grooves for workpiece machining reference position are machined, there is no chipping of the V-groove, and both the front and back surfaces of the workpiece are subjected to image processing with the lower end position of each machined workpiece machining reference position V-groove as the workpiece machining reference position. The machine recognizes and aligns the machining positions da and db at a predetermined distance from the common workpiece machining reference position at the lower end position to each front V-groove and back V-groove. Therefore, the present invention provides a double-sided groove processing method for a thin plate material including a V-groove substrate of an optical fiber array, in which an edge recognition failure of an image processing apparatus does not occur.
The double-sided groove processing method of the present invention has become a processing method in which the lower end position of each workpiece processing reference position V-groove can reduce the difference in processing reference position between the front and back surfaces of the thin plate material. The difference between the processing reference positions of the front and back surfaces due to the perpendicularity of the workpiece chucking chuck surface of the block jig having the chucking chuck surface on the vertical surface is the ratio h / L between the workpiece thickness h and the workpiece width L. Since it is reduced, it can be almost zero. For example, if the perpendicularity of the workpiece chucking chuck surface is 2 μm, the workpiece width L is 50 mm, and the workpiece thickness h is 2 mm, the difference in processing reference position between the front and back surfaces is 0.08 μm (2 μm × [2 mm / 50 mm] = 0.08 μm).

An example of the best mode for carrying out the present invention will be described with reference to FIGS. FIG. 1 is a partially enlarged side view showing an example of a finished product processed by the double-sided groove processing method for a thin plate material according to the present invention. The substrate 1 and 2 having double-sided grooves are used in an overlapping manner, and between the double-sided grooves 3a and 3b. The space 5 is used as each optical fiber accommodation groove. FIG. 2A is an example of the best mode for carrying out the present invention . As shown in FIG. 1, substrates 1 and 2 having double-sided grooves are used in an overlapping manner, and a space between double-sided grooves 3a and 3b is used. 5 is a schematic side block diagram showing a V-groove processing method for an optical fiber array in which 5 is each optical fiber housing groove, and (b) is a left side block diagram as viewed from arrow B in (a), showing two workpiece processing reference positions after processing A V-groove 8 for use is illustrated. FIG. 3 (a) shows two workpiece machining reference positions after machining in FIG. 2 (b) supported by suction on a V-grooving surface grinder of another optical fiber array having a vacuum suction surface (not shown) on the upper surface . The surface of the workpiece | work 10 which has the V groove | channel 8 for an object is shown, (b) shows the back surface of the workpiece | work 10 by which the workpiece | work was turned over after that and it was adsorbed and supported on the V-groove surface grinding machine.

  As shown in FIG. 2 (a), a V-groove processing method for an optical fiber array having double-sided grooves, which is an example of the best mode for carrying out the present invention, is a block jig 7 having a suction chuck surface 6 on a vertical surface. Then, a workpiece 10 made of a thin plate including a V-groove substrate of an optical fiber array adsorbed in a vertically upright state is applied to two workpiece machining reference positions V perpendicular to the workpiece upper surface 14 by a V-groove grinding wheel 13. The groove 8 is machined, and as shown in FIG. 2 (b), the lower end positions 9 of the two workpiece machining reference position V-grooves 8 are used as workpiece machining reference positions.

As shown in FIG. 3 (a) , a thin plate material in which substrates 1 and 2 having double-sided grooves as shown in FIG. 1 are used in an overlapping manner, and the space 5 between the double-sided grooves 3a and 3b is used as an optical fiber housing groove. 2b is set on the V-groove surface grinder of another optical fiber array on the surface of the workpiece 10 made of a thin plate material in which the V-grooves 8 for workpiece machining reference positions in FIG. An image processing apparatus (not shown) recognizes the lower end positions 9 of the V groove 8 for workpiece machining reference positions at two positions on the surface of the workpiece as the workpiece machining reference position, and the lower end positions 9 at the two positions recognized by the image processing apparatus are machined. A number of front V grooves 3a are ground at a processing position da at a predetermined distance from the two lower end positions 9 to each front V groove as a reference position. Thereafter, as shown in FIG. 3B , the workpiece 10 is turned over, and the lower end positions 9 of the V machining groove 8 for the same two positions on the back surface of the workpiece 10 are used as the workpiece processing reference position in the image processing apparatus. A number of back V-grooves 3b are ground at a processing position db at a predetermined distance from the two lower end positions 9 to each front V-groove using the lower end position 9 recognized by the image processing apparatus as a workpiece processing reference position. To do. Thereafter, the lower end position 9 of the V-grooves 8 for the workpiece machining reference position was cut off.

As described above, as shown in Figure 1 of the best embodiment of the present invention, using superimposed substrates 1 and 2 having a two-sided groove, double-sided groove 3a, the optical fiber receiving groove space 5 between 3b According to the double-sided groove processing method of a thin plate material, a workpiece of a thin plate material including a V-groove substrate of an optical fiber array adsorbed in a vertically upright state is perpendicular to the vertical surface of the workpiece upper surface with a V-groove grinding wheel. Since the V-groove 8 for the workpiece machining reference position is machined, there is no chipping of the V-groove, and both the front and back surfaces of the workpiece are imaged with the lower end position 9 of each machined workpiece machining reference position V-groove 8 as the workpiece machining reference position. The processing position is recognized and aligned by the processing device, and the machining positions da and db at a predetermined distance from the workpiece machining reference position at the common lower end position 9 to each front V-groove and back V-groove are the front and back surfaces of the workpiece 10. There is no deviation and the edge of the image processing device is recognized. Failure does not occur, were intended to provide a double-sided groove processing method of a thin plate material including a V-groove substrate of the optical fiber array.

FIG. 2 is a partially enlarged side view showing an example of a finished product processed by the double-sided groove processing method of the thin plate material of the present invention. Each optical fiber housing groove is used. (A) is an example of the best mode for carrying out the present invention . As shown in FIG. 1, substrates 1 and 2 having double-sided grooves are used in an overlapping manner, and spaces 5 between the double-sided grooves 3a and 3b are provided. Schematic side block diagram showing a V groove processing method of an optical fiber array used as an optical fiber housing groove , (b) is a left side block diagram as viewed from arrow B of (a), and two workpiece processing reference position V grooves after processing 8 is illustrated. (A) shows the surface of the workpiece 10 sucked and supported on a V-grooving surface grinder of another optical fiber array provided with a vacuum suction surface (not shown) on the upper surface, and (b) shows the workpiece turned upside down. The back surface of the workpiece | work 10 adsorbed and supported on the V-groove surface grinder is shown. A conventional V-groove processing method for an optical fiber array having a double-sided groove will be described. First, a large number of workpieces 10 adsorbed and supported on a V-groove surface grinder (not shown) shown in FIG. The front V-groove 3a was ground, and then the workpiece 10 was turned over, and the back surface of the workpiece 10 in (b) was ground with respect to the end surface edge 11b.

Explanation of symbols

1, 2 Substrate with double-sided grooves in finished product example
3a Front V-groove 3b Back V-groove 6 Suction chuck surface 7 Block jig with suction chuck surface on the vertical surface 8 Two workpiece machining reference position V-grooves 9 Two bottom workpiece machining reference position V-groove positions
10 work
13 V-grooving grinding wheel
14 Work surface
da Machining position at a predetermined distance from workpiece machining reference position to Table V groove
db Machining position at a predetermined distance from the workpiece machining reference position to the back V-groove

Claims (1)

In a V-groove processing method for an optical fiber array having a double-sided groove, a workpiece made of a thin plate material including a V-groove substrate of an optical fiber array sucked vertically upright by a block jig having a suction chuck surface on a vertical surface Two workpiece machining reference position V-grooves perpendicular to the vertical surface are machined on the workpiece upper surface with a grooving grinding wheel, set on a V-grooving surface grinder of another optical fiber array, and the surface of the workpiece is The image processing apparatus recognizes the lower end positions of the two V-grooves for workpiece machining reference positions as workpiece machining reference positions, and a plurality of table V-grooves using the two lower end positions recognized by the image processing apparatus as workpiece machining reference positions. After that, the workpiece is turned over, and the image processing apparatus recognizes the lower end positions of the two workpiece machining reference position V-grooves on the back surface of the workpiece 10 as the workpiece machining reference position. A number of back V-grooves were ground using the lower end position recognized by the image processing apparatus as a workpiece machining reference position, and then the lower end positions of the two workpiece machining reference position V-grooves were cut off. A double-sided groove processing method for a thin plate material including a V-groove substrate of an optical fiber array.

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