JP4169432B2 - 被加工物の保持具、研磨装置及び研磨方法 - Google Patents

被加工物の保持具、研磨装置及び研磨方法 Download PDF

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Publication number
JP4169432B2
JP4169432B2 JP12351199A JP12351199A JP4169432B2 JP 4169432 B2 JP4169432 B2 JP 4169432B2 JP 12351199 A JP12351199 A JP 12351199A JP 12351199 A JP12351199 A JP 12351199A JP 4169432 B2 JP4169432 B2 JP 4169432B2
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Prior art keywords
polishing
workpiece
polishing pad
wafer
holding
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Japanese (ja)
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JP2000317817A5 (enrdf_load_stackoverflow
JP2000317817A (ja
Inventor
喜弘 寺野
敏二 滝川
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP12351199A 1999-04-30 1999-04-30 被加工物の保持具、研磨装置及び研磨方法 Expired - Fee Related JP4169432B2 (ja)

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JP12351199A JP4169432B2 (ja) 1999-04-30 1999-04-30 被加工物の保持具、研磨装置及び研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12351199A JP4169432B2 (ja) 1999-04-30 1999-04-30 被加工物の保持具、研磨装置及び研磨方法

Publications (3)

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JP2000317817A JP2000317817A (ja) 2000-11-21
JP2000317817A5 JP2000317817A5 (enrdf_load_stackoverflow) 2005-11-24
JP4169432B2 true JP4169432B2 (ja) 2008-10-22

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JP12351199A Expired - Fee Related JP4169432B2 (ja) 1999-04-30 1999-04-30 被加工物の保持具、研磨装置及び研磨方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5267918B2 (ja) * 2008-07-15 2013-08-21 株式会社ニコン 保持装置および研磨装置
JP2017127938A (ja) * 2016-01-21 2017-07-27 信越半導体株式会社 ウェーハの研磨方法、バックパッドの製造方法、バックパッド、及びそのバックパッドを具備する研磨ヘッド

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JP2000317817A (ja) 2000-11-21

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