JP4168006B2 - Carrier tape manufacturing method and carrier tape manufactured by the manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing a carrier tape used for transporting small electronic components and a carrier tape manufactured by the manufacturing method.

  Conventionally, various carrier tape manufacturing methods and carrier tape shapes have been proposed. For example, in a manufacturing apparatus constituted by a compression mold having a convex part, a restraining frame mold in which a compression mold insertion hole is formed, and a support frame mold having an engagement hole that engages with the convex part, first, restraining is performed. A cardboard is placed between the frame mold and the support frame mold. Next, holding the compression mold and moving from the frame mold side to the support frame mold side, the cardboard is compressed to form the accommodating portion, and the through hole is formed at the bottom of the accommodating portion to manufacture the carrier tape. (For example, refer to Patent Document 1).

Japanese Patent No. 3373420

  However, in the conventional carrier tape manufacturing method, the accommodating portion is formed in the cardboard by only one compression of the compression mold, so there is no escape space for air existing inside the cardboard during compression, and the compressed air is compressed into the compression mold. After the mold was removed from the housing, the mold expanded and a spring back was generated at the bottom of the housing. For this reason, even if it is going to accommodate an electronic component in an accommodating part, the accommodation defect in which the upper part of the electronic component did not fit inside the accommodating part occurred. In addition, in the shape having the through hole in the housing portion, there are cases where the electronic component cannot be taken out due to foreign matter mixed in or generation of water droplets due to humidity fluctuations.

  Then, an object of this invention is to provide the carrier tape manufactured by the manufacturing method of the carrier tape which improves the accommodating property of an electronic component, and its manufacturing method.

In order to achieve the above object, the present invention provides a method for manufacturing a paper carrier tape having storage portions for storing electronic components in rows, comprising a step of preparing a long paper, The step of compressing a predetermined place in one direction, which is the thickness direction of the paper, to a predetermined depth to form a recess, the step of forming a through hole in the region of the recess, and the inside of the region of the recess including the through hole A method of manufacturing a carrier tape having a step of recompressing in a direction and closing a through hole by recompression to provide a receiving portion.

  Also, a method for manufacturing a paper carrier tape having storage portions for storing electronic components in rows, the step of preparing a long paper, and the step of forming a through-hole in a predetermined location of the paper And a first mold penetrating the through hole and a second mold for compressing the paper region including the through hole in one direction which is the thickness direction of the paper, And forming a recess by compressing it to a predetermined depth, and recompressing the inside of the recess including the through hole in one direction, and closing the through hole by recompression to provide a receiving portion. The manufacturing method is provided.

  Here, it is preferable that the first mold or the second mold has a spacer for contacting the second mold or the first mold to provide an air reservoir.

  Further, the first mold has a spacer extending in a direction opposite to one direction, and the tip of the spacer has a sharp shape, and the through-hole is moved when the first mold moves in the direction opposite to the one direction. The second mold is formed with a recess facing the spacer and recessed in the opposite direction, and the second mold moves in one direction so that the spacer abuts the recess to define an air reservoir chamber. It is preferable. The paper is preferably laminated paper.

  Moreover, this invention provides the carrier tape for electronic component accommodation produced with the manufacturing method of said carrier tape.

  According to the method for manufacturing a carrier tape of the present invention, the carrier tape includes a step of forming a through hole, and a step of closing the through hole by compressing a paper region including the through hole to provide a storage portion. The accommodating portion is formed while discharging the air inside the paper to the outside through the through hole. Therefore, the spring back generated in the housing part can be reduced, and the housing property of the electronic component in the housing part can be improved.

  According to the carrier tape manufacturing method of the present invention, the method includes a step of compressing to a predetermined depth to form a recess, a step of forming a through-hole, and a step of closing the through-hole by recompression to provide a receiving portion. Therefore, the accommodating portion is formed while discharging the air inside the paper compressed at the time of recompression to the outside through the through hole. The spring back can be made smaller than the method for manufacturing the carrier tape according to claim 1 by the two compressions, and the housing property of the electronic component in the housing portion can be improved.

  According to the carrier tape manufacturing method of the present invention, a step of forming a through hole, a step of forming a recess by compressing while providing an air retaining chamber by the first mold and the second mold, and recompression The step of closing the through hole and providing the accommodating portion is provided, so that the air inside the paper to be compressed can flow into the air reservoir chamber and the amount of air near the recess can be reduced. Then, after the second compression, the housing portion is formed while the air remaining in the vicinity of the recess is discharged to the outside through the through hole, so that the spring back generated in the housing portion can be almost eliminated, and the housing portion has an electron. Parts can be easily accommodated.

  According to the carrier tape manufacturing method of the present invention, the first mold or the second mold has the spacer for abutting against the second mold or the first mold to provide the air reservoir chamber. Therefore, the first mold and the second mold can be moved in conjunction with each other, and an air reservoir can be easily provided.

  According to the carrier tape manufacturing method of the present invention, the first mold has the spacer extending in the direction opposite to the one direction, and the tip of the spacer has a pointed shape, so the through hole is easily formed. can do. Also, the second mold is formed with a recess, the second mold moves in one direction, and the spacer contacts the recess to define the air reservoir chamber. Therefore, the first mold and the second mold are formed. The mold can be moved in conjunction with each other, and an air reservoir can be easily provided.

  According to the method for manufacturing a carrier tape of the present invention, since the paper is a laminated paper, the storage portion can be easily formed.

  According to the carrier tape of the present invention, the ability to accommodate electronic components in the accommodating portion is improved. Moreover, if a cover tape is affixed so as to cover the accommodation surface of the carrier tape, there are no holes communicating with the outside, so foreign matters can be prevented from being mixed in and humidity fluctuations in the accommodation portion can be suppressed.

  A carrier tape according to an embodiment of the present invention will be described with reference to FIGS. The carrier tape 1 is composed of a laminated paper 2 in which a plurality of papers are laminated, and has a thin and long elongated shape. The carrier tape 1 is formed with a plurality of recessed storage portions 2a that are recessed in the thickness direction of the carrier tape 1 side by side in the longitudinal direction. The thickness t of the bottom 2b of the housing 2a is about 1/10 of the thickness (0.4 to 1.0 mm) of the carrier tape 1. In FIG. 1, for convenience of explanation, a carrier tape 1 is shown in which two accommodating portions 2 a adjacent to each other are formed.

  FIG. 2 is a plan view of the carrier tape 1 in which the electronic component is accommodated in the accommodating portion 2a as viewed from the direction of the arrow II in FIG. The vertical width A and the horizontal width B of the housing portion 2a are A = (1.05 to 1.07) × a, B = (1.05 to 1.07) with respect to the vertical width a and the horizontal width b of the electronic component 3. It is formed so as to satisfy the relationship xb. FIG. 3 shows an electronic component continuous tape 5 in which an electronic component 3 is accommodated in the accommodating portion 2a, and a peelable cover tape 4 is attached to the carrier tape 1 to prevent the electronic component 3 from coming out of the accommodating portion 2a. FIG. In the state shown in FIG. 3, the electronic component 3 is transported, and the cover tape 3 is peeled from the electronic component continuous tape, whereby the electronic component 3 is taken out from the carrier tape 1 and mounted on the substrate.

  Next, the manufacturing method of the carrier tape by the 1st Embodiment of this invention is demonstrated based on Fig.4 (a)-(c). First, an apparatus for executing the manufacturing method of the present embodiment will be described. As shown in FIG. 4 (a), the apparatus is arranged on a production line and includes a 1-1 unit 13 having a punching die 10, a first holding frame die 11, and a first support frame die 12, and FIG. As shown in (c), the compression mold 14 and the second restraining frame are arranged downstream from the 1-1 unit 13 at a distance that is an integral multiple of the pitch of the accommodating portion 2a from the 1-1 unit 13. The first and second units 17 having the mold 15 and the second support frame mold 16 are configured.

  The perforating mold 10 of the 1-1 unit 13 has a substantially cylindrical shape, and its diameter is about 50% of the vertical width A in FIG. 2, and is provided so as to be movable in the thickness direction of the laminated paper 2. Yes. The first holding frame mold 11 is formed with a first holding frame mold hole 11a through which the punching mold 10 is slidably inserted. Further, the first holding frame mold 11 has a first surface 11 </ b> A that contacts the laminated paper 2. The first support frame mold 12 is formed with a first support frame mold hole 12a through which the drilling mold 10 is slidably inserted. In addition, the first support frame mold 12 has a second surface 12A that faces the first surface 11A and supports the laminated paper 2.

  The compression mold 14 of the first-second unit 17 has a substantially rectangular cross-sectional shape perpendicular to the thickness direction of the laminated paper 2 (size of vertical width A × horizontal width B in FIG. 2) and faces the laminated paper 2. It has a planar first plane 14A. The second holding frame mold 15 has a second holding frame mold hole 15a through which the compression mold 14 is slidably inserted. Further, the second holding frame mold 15 has a third surface 15 </ b> A that contacts the laminated paper 2. The second support frame mold 16 has a flat second plane 16A that faces the third surface 15A and supports the laminated paper 2.

  In order to manufacture the carrier tape 1, first, the laminated paper 2 is prepared, and the laminated paper 2 is arranged between the first holding frame mold 11 and the first support frame mold 12 as shown in FIG. . Next, as shown in FIG. 4B, the punching mold 10 is moved from the first holding frame mold 11 side to the first support frame mold hole 12 a to form the through hole 2 c at a predetermined position of the laminated paper 2. . Next, the punching die 10 is removed from the through hole 2c, and the laminated paper 2 is moved by the integral multiple pitch to be arranged between the second holding frame die 15 and the second support frame die 16 of the 1-2 unit 17. To do. Next, the compression mold 14 is moved in the direction in which the thickness of the laminated paper 2 decreases, and the region including the through hole 2c of the laminated paper 2 is compressed until the thickness becomes t. By compression, the through hole 2c is closed to form a bottomed accommodating portion 2a as shown in FIG. 4C, and the carrier tape 1 is completed.

  In the manufacturing method described above, the through hole 2c is formed in the laminated paper 2 and then compressed to form the accommodating portion 2a. Therefore, the air interposed between the papers constituting the laminated paper 2 to be compressed is passed through the through hole 2c. The accommodating portion 2a is formed while being discharged to the outside. Therefore, the spring back generated in the vicinity of both ends of the bottom 2b of the housing 2a can be reduced, and the housing of the electronic component 3 can be improved. Further, if the cover tape 4 is affixed as shown in FIG. 3, there are no holes communicating with the outside, so foreign matter can be prevented from being mixed, and humidity fluctuations in the housing portion 2 a can be suppressed. Moreover, since the carrier tape 1 is manufactured from the laminated paper 2, the housing portion 2a can be easily formed. This manufacturing method is particularly effective for manufacturing a small carrier tape for electronic parts of 1.0 (horizontal width) × 0.5 (vertical width) × 0.5 (height) mm or less.

  Next, the manufacturing method of the carrier tape by the 2nd Embodiment of this invention is demonstrated based on Fig.5 (a)-(e). First, an apparatus for executing the manufacturing method of the present embodiment will be described. As shown in FIG. 5A, the apparatus is arranged on the production line, and includes a compression mold 114 having a first plane 114A, a first restraining frame mold hole 115a, and a first restraining frame having a first surface 115A. A second unit 117 including a first support frame mold 116 having a mold 115 and a second plane 116A is provided. The compression mold 114, the first holding frame mold 115, and the first support frame mold 116 correspond to the compression mold 14, the second holding frame mold 15 and the second support frame mold 16 of the first embodiment, respectively. is doing.

  Further, as shown in FIG. 5 (c), the apparatus is a punching metal disposed downstream of the 2-1 unit 117 at a distance that is an integral multiple of the pitch of the accommodating portion 2a from the 2-1 unit 117. A 2-2 unit 121 having a mold 118, a second holding mold 119, and a second support frame mold 120 is provided. Further, as shown in FIG. 5 (e), the apparatus is a compressed gold disposed downstream of the 2-2 unit 121 at a distance that is an integral multiple of the pitch of the accommodating portion 2a from the 2-2 unit 121. A compression mold 122 having the same shape as the mold 114; a first holding frame mold 123 having the same shape as the first holding frame mold 115; and a first support frame mold 124 having the same shape as the first support frame mold 116. A unit 125 is provided.

  The punching die 118 has a substantially cylindrical shape, and its diameter is about 30% of the vertical width A in FIG. 2, and is provided so as to be movable in the thickness direction of the laminated paper 2. The second holding mold 119 is formed with a second holding mold hole 119a through which the drilling mold 118 is slidably inserted. The second holding mold 119 has a second surface 119 </ b> A that contacts the laminated paper 2. The second support frame mold 120 is formed with a second support frame mold hole 120a through which the drilling die 118 is slidably inserted. The second support frame mold 120 has a third surface 120A that faces the second surface 119A and supports the laminated paper 2. The compression mold 122 has a first plane 122A similar to the first plane 114A of the compression mold 114, and the first suppression frame mold 123 is a first suppression frame mold hole 115a of the first suppression frame mold 115. The first holding frame mold hole 123a and the first surface 123A are the same as the first surface 115A, and the first support frame mold 124 is a second plane 124A similar to the second plane 116A of the first support frame mold 116. have.

  In order to manufacture the carrier tape 1, first, the laminated paper 2 is prepared, and the laminated paper 2 is arranged between the first holding frame mold 115 and the first support frame mold 116 as shown in FIG. . Next, as shown in FIG. 5B, the compression mold 114 is moved in the direction in which the thickness of the laminated paper 2 decreases, and the laminated paper 2 is compressed from the initial thickness to a thickness of about 1/3. The first pocket 2d is formed. After the compression mold 114 is removed from the first pocket 2d and moved by the integral multiple pitch, the laminated paper 2 is moved to the second holding mold 119 and the second holding mold 119 of the 2-2 unit 121 as shown in FIG. It arrange | positions between the support frame types 120.

Next, as shown in FIG. 5 (d), the punching die 118 is moved from the second restraining die 119 side to the second support frame die hole 120 a to form a through hole 2 e at a predetermined location of the laminated paper 2. To do. Next, the punching die 118 is removed from the through hole 2e, and the laminated paper 2 is moved by the integral multiple pitch to be arranged between the first holding frame die 123 and the first support frame die 124 of the 2-3 unit 125. To do. Then, the compression mold 122 is moved in the direction in which the thickness of the laminated paper 2 decreases, and the region including the through hole 2e of the laminated paper 2 is compressed until the thickness becomes t. By compression, the through hole 2e is closed to form a bottomed housing portion 2a as shown in FIG. 5 (e), and the carrier tape 1 is completed.

  In the above-described manufacturing method, the laminated paper 2 is first compressed, and then the through-hole 2e is formed and compressed to form the accommodating portion 2a. Therefore, between the papers constituting the laminated paper 2 to be compressed in the second compression The accommodating portion 2a is formed while discharging the air intervening to the outside through the through hole 2e. Then, since the compression is performed twice to form the accommodating portion 2a, the springback generated near both ends of the bottom portion 2b of the accommodating portion 2a is made smaller than the carrier tape manufacturing method according to the first embodiment. And the capacity of the electronic component 3 can be improved. Further, if the cover tape 4 is affixed as shown in FIG. 3, there are no holes communicating with the outside, so foreign matter can be prevented from being mixed, and humidity fluctuations in the housing portion 2 a can be suppressed. Moreover, since the carrier tape 1 is manufactured from the laminated paper 2, the housing portion 2a can be easily formed. This manufacturing method is particularly effective for manufacturing a small carrier tape for electronic parts of 1.0 (horizontal width) × 0.5 (vertical width) × 0.5 (height) mm or less.

  Next, the manufacturing method of the carrier tape by the 3rd Embodiment of this invention is demonstrated based on Fig.6 (a)-(f). First, an apparatus for executing the manufacturing method of the present embodiment will be described. As shown in FIGS. 6 (a) to 6 (c), the apparatus includes a punching mold 226 (corresponding to the first mold in the claims), a restraining / supporting frame mold 227, and a first compression. A 3-1 unit 230 having a mold 228 (FIG. 6C, corresponding to the second mold in the claims) and a support / restraining frame mold 229, and a 3-1 as shown in FIG. A second compression mold 214 having a first plane 214A disposed downstream of the third unit 230 at a distance that is an integral multiple of the pitch of the accommodating portion 2a from the unit 230, a holding frame mold hole 215a and the first The holding frame mold 215 having the surface 215A and the support frame mold 216 having the second flat surface 216A are provided. The second compression mold 214, the holding frame mold 215, and the support frame mold 216 correspond to the compression mold 14, the second holding frame mold 15 and the second support frame mold 16 of the first embodiment, respectively. Yes.

  The punching die 226 has a substantially cylindrical shape, and its diameter is about 25% of the vertical width A in FIG. 2, and is provided so as to be movable in the thickness direction of the laminated paper 2. A perforated portion 226B having a sharp tip is provided at the approximate center of the end surface 226A perpendicular to the center axis of the punching die 226 on the laminated paper 2 side of the punching die 226. As shown in FIG. 6D, the outer edge portion 226C of the end surface 226A is shaped to be chamfered so as to form an angle of 45 ° with respect to the end surface 226A. The restraining / supporting frame mold 227 is formed with a restraining / supporting frame mold hole 227a through which the drilling mold 226 is slidably inserted. Further, the holding / supporting frame mold 227 has a third flat surface 227A for contacting the laminated paper 2 and supporting the laminated paper 2.

  The first compression mold 228 has a substantially rectangular cross-sectional shape perpendicular to the thickness direction of the laminated paper 2 (size of vertical width A × horizontal width B in FIG. 2), and has a planar first shape that contacts the laminated paper 2. It has four planes 228A. Furthermore, a concave portion 228a that is opposed to the perforated portion 226B and that is recessed in the direction away from the laminated paper 2 is formed at a substantially longitudinal center of the laminated paper 2 on the fourth plane 228A. The cross-sectional shape orthogonal to the thickness direction of the laminated paper 2 of the concave portion 228a is circular, and the diameter thereof is configured to be approximately equal to the diameter of the punching die 226. The support / restraining frame mold 229 has a second surface 229 </ b> A that contacts the laminated paper 2. The support / holding frame mold 229 is formed with a support / holding frame mold hole 229a through which the first compression mold 228 is slidably inserted.

  In order to manufacture the carrier tape 1, first, the laminated paper 2 is prepared, and the laminated paper 2 is arranged between the holding / supporting frame mold 227 and the supporting / holding frame mold 229 as shown in FIG. 6 (a). . Next, as shown in FIG. 6 (b), the perforation mold 226 is restrained and moved from the support frame mold 227 side to the support / restraint frame mold 229 side, and a through hole 2 f is formed at a predetermined location of the laminated paper 2. . Next, as shown in FIG. 6C, the fourth flat surface 228A of the first compression mold 228 is brought into contact with the laminated paper 2, and the concave portion 228a is brought into contact with the tip of the punched portion 226B.

  At this time, as shown in FIG. 6 (d), the perforated part 226B functions as a spacer between the main body of the punching mold 226 and the first compression mold 228, and air is retained by the concave part 228a, the perforated part 226B, and the end face 226A. Chamber S is defined. In addition, a gap a is formed between the end of the concave portion 228a on the laminated paper 2 side and the outer edge portion 226C.

  Next, as shown in FIG. 6 (e), the first compression mold 228 is moved in the direction in which the thickness of the laminated paper 2 is reduced while the perforated portion 226B and the concave portion 228a are kept in contact with each other. Is compressed from the initial thickness to a thickness of about ¼ to form the second pocket 2g in the laminated paper 2. At this time, the air intervening between the sheets constituting the compressed laminated paper 2 flows into the air reservoir chamber S from the gap a. Next, the first compression mold 228 is pulled out from the second pocket 2g and the punching mold 226 is pulled out from the through hole 2f, and the laminated paper 2 is moved by the predetermined pitch, so that the holding frame mold of the 3-2 unit 217 is moved. It arrange | positions between 215 and the support frame type | mold 216. FIG. Next, the second compression mold 214 is moved in the direction in which the thickness of the laminated paper 2 decreases, and the region including the through hole 2f of the laminated paper 2 is compressed until the thickness reaches t. By compression, the through hole 2f is closed to form a bottomed housing portion 2a as shown in FIG. 6 (f), and the carrier tape 1 is completed.

  In the above manufacturing method, when compression is performed by the second compression mold 214, air interposed between the sheets constituting the laminated paper 2 to be compressed is caused to flow into the air reservoir chamber S, and the vicinity of the second pocket 2g. The amount of air can be reduced. Then, the second compression is performed to form the accommodating portion 2a while discharging the air remaining in the vicinity of the second pocket 2g to the outside through the through-hole 2f, so that the spring generated near both ends of the bottom portion 2b of the accommodating portion 2a The back can be almost eliminated, and the electronic component 3 can be easily accommodated in the accommodating portion 2a.

  Moreover, since the punching die 226 has the perforated part 226B having a sharp tip, the through hole 2f can be easily formed. Since the perforated part 226B is in contact with the recess 228a, the punching mold 226 and the second compression mold 228 can be moved in conjunction with each other, and the air chamber S can be easily provided. Further, if the cover tape 4 is affixed as shown in FIG. 3, there are no holes communicating with the outside, so foreign matter can be prevented from being mixed, and humidity fluctuations in the housing portion 2 a can be suppressed. Moreover, since the carrier tape 1 is manufactured from the laminated paper 2, the housing portion 2a can be easily formed. This manufacturing method is particularly effective for manufacturing a small carrier tape for electronic parts of 1.0 (horizontal width) × 0.5 (vertical width) × 0.5 (height) mm or less.

  The carrier tape manufacturing method according to the embodiment of the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made within the scope described in the claims.

Sectional drawing along the longitudinal direction of the carrier tape manufactured by the manufacturing method of the carrier tape by this invention. The top view which looked at the state which accommodated the electronic component in the accommodating part of the carrier tape manufactured by the manufacturing method of the carrier tape by this invention from the arrow II direction of FIG. The figure which showed the electronic component continuous tape which accommodated the electronic component in the accommodating part of the carrier tape manufactured by the manufacturing method of the carrier tape by this invention, and affixed the cover tape on the surface of the opening side of the accommodating part of a carrier tape. The figure which showed the state which has arrange | positioned the laminated paper between the 1st holding | suppressing frame type | mold and the 1st support frame type | mold in the manufacturing method of the carrier tape by the 1st Embodiment of this invention. The figure which showed the state which formed the through-hole in the laminated paper with the punching die in the manufacturing method of the carrier tape by the 1st Embodiment of this invention. The figure which showed the state which formed the accommodating part in the laminated paper with the compression die in the manufacturing method of the carrier tape by the 1st Embodiment of this invention. The figure which showed the state which has arrange | positioned the laminated paper between the 1st holding | suppressing frame type | mold and the 1st support frame type | mold in the manufacturing method of the carrier tape by the 2nd Embodiment of this invention. The figure which showed the state which formed the 1st pocket in the laminated paper with the compression die in the manufacturing method of the carrier tape by the 2nd Embodiment of this invention. The figure which showed the state which has arrange | positioned the laminated paper between the 2nd suppression metal mold | die and the 2nd support frame type | mold in the manufacturing method of the carrier tape by the 2nd Embodiment of this invention. The figure which showed the state which formed the through-hole in the laminated paper with the punching die in the manufacturing method of the carrier tape by the 2nd Embodiment of this invention. The figure which showed the state which formed the accommodating part in the laminated paper with the compression die in the manufacturing method of the carrier tape by the 2nd Embodiment of this invention. In the manufacturing method of the carrier tape by the 3rd Embodiment of this invention, the figure which showed the state which has arrange | positioned the laminated paper between the restraining / supporting frame type | mold and the supporting / holding frame type | mold. The figure which showed the state which formed the through-hole in the laminated paper with the punching die in the manufacturing method of the carrier tape by the 3rd Embodiment of this invention. In the manufacturing method of the carrier tape by the 3rd Embodiment of this invention, the figure which showed the state which contact | abutted the perforation part of the drilling die and the recessed part of the 1st compression mold. In the manufacturing method of the carrier tape by the 3rd Embodiment of this invention, the enlarged view of the perforation part periphery of FIG.6 (c). The figure which showed the state which formed the 2nd pocket in the laminated paper with the 1st compression metal mold | die in the manufacturing method of the carrier tape by the 3rd Embodiment of this invention. The figure which showed the state which formed the accommodating part in the laminated paper with the 2nd compression metal mold | die in the manufacturing method of the carrier tape by the 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Carrier tape 2 Laminated paper 2a Housing | casing part 2c, 2e, 2f Through-hole 2d 1st pocket 2g 2nd pocket 3 Electronic component 226 Drilling die 226A Perforation part 228 1st compression mold 228a Recess S Swell chamber

Claims (6)

A method for manufacturing a paper carrier tape having a receiving portion for storing electronic components in a row,
Preparing a long sheet of paper,
Compressing a predetermined location of the paper to a predetermined depth in one direction which is the thickness direction of the paper to form a recess;
Forming a through hole in the region of the recess;
And a step of recompressing the inside of the concave portion including the through hole in the one direction, and closing the through hole by the recompression to provide the accommodating portion. . A method for manufacturing a paper carrier tape having a receiving portion for storing electronic components in a row,
Preparing a long sheet of paper,
Forming a through-hole at a predetermined location of the paper;
While providing an air reservoir chamber by a first mold penetrating the through hole and a second mold for compressing the paper region including the through hole in one direction which is the thickness direction of the paper, Compressing to a predetermined depth in the one direction to form a recess;
And a step of recompressing the inside of the concave portion including the through hole in the one direction, and closing the through hole by the recompression to provide the accommodating portion. . The said 1st metal mold | die or this 2nd metal mold | die has a spacer for contact | abutting to this 2nd metal mold | die or this 1st metal mold | die, and providing this air pocket chamber. 2. A method for producing the carrier tape according to 2. The first mold has a spacer extending in a direction opposite to the one direction, and a tip of the spacer has a pointed shape, and the first mold moves in a direction opposite to the one direction. The through hole is formed in
The second mold is formed with a recess facing the spacer and recessed in the opposite direction. The second mold moves in the one direction so that the spacer abuts the recess and the air reservoir chamber is formed. The carrier tape manufacturing method according to claim 2, wherein the carrier tape is defined. The method for manufacturing a carrier tape according to claim 1, wherein the paper is a laminated paper. The carrier tape for electronic component accommodation produced by the manufacturing method of the carrier tape as described in any one of Claims 1-5.

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